JP2003094412A - Woody plate and method for manufacturing woody plate - Google Patents
Woody plate and method for manufacturing woody plateInfo
- Publication number
- JP2003094412A JP2003094412A JP2001293587A JP2001293587A JP2003094412A JP 2003094412 A JP2003094412 A JP 2003094412A JP 2001293587 A JP2001293587 A JP 2001293587A JP 2001293587 A JP2001293587 A JP 2001293587A JP 2003094412 A JP2003094412 A JP 2003094412A
- Authority
- JP
- Japan
- Prior art keywords
- wood
- core layer
- plate
- board
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は例えば建築材料とし
て使用される木質板および該木質板の製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wood board used as a building material and a method for manufacturing the wood board.
【0002】[0002]
【従来の技術】従来、この種の木質板にあっては、芯層
として木質細割材に樹脂を混合して蒸気噴射プレスを行
って芯層を成形し、該芯層の表裏面に接着剤によって合
板、中密度繊維板、薄物パーチクルボード等の木質成形
板を積層したものが提供されている(特開2000−1
17709号公報)。2. Description of the Related Art Conventionally, in this type of wood board, a resin is mixed as a core layer into a wood finely divided material, steam injection pressing is performed to form the core layer, and the core layer is adhered to the front and back surfaces of the core layer. There is provided a laminate of wood molding boards such as plywood, medium density fiber board, and thin particle board according to the agent (Japanese Patent Laid-Open No. 2000-1.
17709).
【0003】[0003]
【発明が解決しようとする課題】上記木質板にあっては
一たん芯層を成形し、そして該芯層の表裏面に接着剤に
よって木質成形板を接着する方法によって製造されるの
で、工程が多く手間がかゝり、また接着剤も必要とな
る。The above wooden board is manufactured by a method in which a core layer is formed once and the wood formed board is adhered to the front and back surfaces of the core layer with an adhesive. A lot of work is required, and an adhesive is also required.
【0004】[0004]
【課題を解決するための手段】本発明は上記従来の課題
を解決するための手段として、木片Fを熱可塑性樹脂に
よって結着した芯層(3) に表層および/または裏層とし
て木質成形板(2,4) を積層した木質板(1) を提供するも
のである。該熱可塑性樹脂は再生樹脂であり、また該表
裏層の木質成形板(2,4) の木質成分および/または該芯
層(3) の木片Fは再生品であるであることが好ましく、
また該芯層(3) の木片Fは厚さ0.1〜5mm、長さ1〜
50mm、幅0.5〜20mmであることが好ましい。更に
本発明では、木質成形板(2) 上に熱可塑性樹脂溶融物R
と木片Fとの混合物Mを供給堆積し、その上に木質成形
板(4) を載置しプレス成形することによって表裏層(2,
4) と芯層(3) とを一体化する木質板(1) の製造方法が
提供される。Means for Solving the Problems As a means for solving the above-mentioned conventional problems, the present invention provides a wood molding board as a surface layer and / or a back layer on a core layer (3) in which a piece of wood F is bound by a thermoplastic resin. A wooden board (1) in which (2,4) is laminated is provided. It is preferable that the thermoplastic resin is a recycled resin, and that the wood component of the wood molding boards (2, 4) of the front and back layers and / or the wood piece F of the core layer (3) is a recycled product.
Further, the wood piece F of the core layer (3) has a thickness of 0.1 to 5 mm and a length of 1 to 5.
The width is preferably 50 mm and the width is 0.5 to 20 mm. Further, according to the present invention, the thermoplastic resin melt R is formed on the wood molding plate (2).
The mixture M of the wood and the wood pieces F is supplied and accumulated, and the wood forming plate (4) is placed on the mixture M and press-formed to form the front and back layers (2,
There is provided a method for manufacturing a wooden board (1) in which the core layer (3) and the core layer (3) are integrated.
【0005】[0005]
【作用】本発明では、芯層は木片を使用して粗構造とな
るが、表層および/または裏層に緻密な構造の木質成形
板を使用するので、軽量でも高強度が得られる。また本
発明では、木質成形板上に熱可塑性樹脂溶融物と木片と
の混合物を堆積し、その上に木質成形板を載置してプレ
スするので、表裏層である木質成形板と芯層とは、該芯
層の熱可塑性樹脂溶融物により接着一体化される。した
がって芯層と表裏層との接着には接着剤が不要となる。In the present invention, the core layer has a rough structure by using wood chips. However, since the wood molding plate having a fine structure is used for the front layer and / or the back layer, high strength can be obtained even if it is lightweight. Further, in the present invention, a mixture of a thermoplastic resin melt and wood chips is deposited on the wood molding board, and the wood molding board is placed and pressed on it, so that the wood molding board and the core layer are the front and back layers. Are bonded and integrated by the thermoplastic resin melt of the core layer. Therefore, an adhesive is not required for bonding the core layer and the front and back layers.
【0006】[0006]
【発明の実施の形態】本発明を以下に詳細に説明する。
〔芯層〕本発明の芯層は木片を熱可塑性樹脂によって結
着したものである。上記木片は木材からフレーカーによ
る切削によって製造され、サイズとしては好ましくは厚
さ0.1〜5mm、長さ1〜50mm、幅0.5〜20mm、
更に好ましくは厚さ0.5〜1mm、長さ20〜25mm、
幅4〜8mmのものである。上記木片の原料となる木材
は、好ましくは建築物解体の際に発生する解体木材、木
材切断の際に発生する端切れ等を使用する。このような
再生品を使用することによって、木材廃棄物の高度利用
を図ることが出来る。BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below. [Core Layer] The core layer of the present invention is obtained by binding wood chips with a thermoplastic resin. The above wood pieces are manufactured from wood by cutting with a flaker, and preferably have a thickness of 0.1 to 5 mm, a length of 1 to 50 mm, and a width of 0.5 to 20 mm.
More preferably, the thickness is 0.5 to 1 mm, the length is 20 to 25 mm,
It has a width of 4 to 8 mm. As the wood used as the raw material of the above-mentioned wood pieces, it is preferable to use dismantled wood generated when the building is dismantled, scraps generated when the wood is cut, and the like. By using such recycled products, advanced utilization of wood waste can be achieved.
【0007】上記木片を結着する熱可塑性樹脂として
は、例えばポリエチレン、ポリプロピレン、エチレン−
プロピレン共重合体、エチレン−酢酸ビニル共重合体、
ポリ塩化ビニル、ポリ塩化ビニリデン、ポリスチレン、
ポリ酢酸ビニル、フッ素樹脂、熱可塑性アクリル樹脂、
熱可塑性ポリエステル、熱可塑性ポリアミド、熱可塑性
ウレタン樹脂、アクリロニトリル−ブタジエン共重合
体、スチレン−ブタジエン共重合体、アクリロニトリル
−ブタジエン−スチレン共重合体、エチレン−プロピレ
ン共重合体、エチレン−プロピレンターポリマー、エチ
レン−酢酸ビニル共重合体等の熱可塑性合成樹脂等が使
用される。上記熱可塑性樹脂としては、上記熱可塑性樹
脂成形品の廃材の粉砕物、あるいは該粉砕物を溶融ペレ
ット化したものを使用することが好ましい。このような
再生樹脂を使用することによって樹脂廃棄物の高度利用
を図ることが出来る。Examples of the thermoplastic resin for binding the wood chips include polyethylene, polypropylene, ethylene-
Propylene copolymer, ethylene-vinyl acetate copolymer,
Polyvinyl chloride, polyvinylidene chloride, polystyrene,
Polyvinyl acetate, fluororesin, thermoplastic acrylic resin,
Thermoplastic polyester, thermoplastic polyamide, thermoplastic urethane resin, acrylonitrile-butadiene copolymer, styrene-butadiene copolymer, acrylonitrile-butadiene-styrene copolymer, ethylene-propylene copolymer, ethylene-propylene terpolymer, ethylene -A thermoplastic synthetic resin such as a vinyl acetate copolymer is used. As the thermoplastic resin, it is preferable to use a pulverized product of the waste material of the thermoplastic resin molded product, or a product obtained by melting and pelletizing the pulverized product. By using such a recycled resin, it is possible to highly utilize the resin waste.
【0008】〔木質成形板〕本発明の木質板において、
表裏層として使用される木質成形板は、ハードボード、
合板、中密度繊維板、パーチクルボード、バガスボード
等であり、緻密構造を有するものである。[Wood Molded Plate] In the wood plate of the present invention,
The wood molding board used as the front and back layers is a hard board,
Plywood, medium density fiberboard, particle board, bagasse board and the like, which have a dense structure.
【0009】〔木質板の製造〕本発明の木質板の製造に
おいては、まず木質成形板上に熱可塑性樹脂溶融物と木
片との混合物を供給堆積する。この場合、熱可塑性樹脂
溶融物と木片との混合重量比は、通常20/80〜40
/60(熱可塑性樹脂/木片)とする。そしてその上か
ら木質成形板を載置し、プレス成形を行う。この際のプ
レス圧は通常3〜8MPa である。[Production of Wood Board] In the production of the wood board of the present invention, first, a mixture of a thermoplastic resin melt and wood chips is supplied and deposited on a wood molding board. In this case, the mixing weight ratio of the thermoplastic resin melt and the wood chips is usually 20 / 80-40.
/ 60 (thermoplastic resin / wood chips). Then, a wood molding plate is placed on the top and press molding is performed. The pressing pressure at this time is usually 3 to 8 MPa.
【0010】具体的には、例えば図1に示すフォーミン
グ装置を使用し、該フォーミング装置の搬送コンベア
(5) 上に型板(6) を介して木質成形板(2) を載置し搬送
しつゝ、該コンベア(5) 上方に配置したダイス(7) のオ
リフィス(8) から熱可塑性樹脂溶融物Rを吐出流下さ
せ、両側から供給コンベア(9,9) 上の木片Fを供給ロー
ル(10,10) によって散布し、該樹脂溶融物R中に添加す
る。該樹脂溶融物Rは延伸細分化され、樹脂溶融物Rと
木片Fとが均一に混合された混合物Mが得られ、該混合
物Mは該木質成形板(2) 上に原芯層(3A)として供給堆積
する。Specifically, for example, the forming apparatus shown in FIG. 1 is used, and the conveying conveyor of the forming apparatus is used.
(5) While the wood forming plate (2) is placed and conveyed through the template (6) on top of it, the thermoplastic resin is fed from the orifice (8) of the die (7) arranged above the conveyor (5). The melt R is discharged and flowed down, and the wood chips F on the supply conveyors (9, 9) are sprayed from both sides by the supply rolls (10, 10) and added into the resin melt R. The resin melt R is stretched and subdivided to obtain a mixture M in which the resin melt R and the wood chips F are uniformly mixed, and the mixture M is provided on the wood molding plate (2) with a core layer (3A). Supply and deposit.
【0011】次いで原芯層(3A)が表面に堆積されている
木質成形板(2) を型板(6) と共にプレス成形装置(11)に
セットする。該プレス成形装置(11)は下盤(12)と上盤(1
3)とからなり、上盤(13)には吸引路(14)が連絡し、型面
には木質成形板(4) が吸引保持されている。そして下盤
(12)を上昇させ、木質成形板(2) 、原芯層(3A)、木質成
形板(4) とを重合しかつプレスする。このようにして図
3に示すように表裏層(2,4) が木質成形板からなり、芯
層(3) が木片Fを熱可塑性樹脂溶融物Rで結着したもの
からなる三層構造の木質板(1) が製造される。本発明で
は芯層と表層または裏層からなる二層構造としてもよ
い。Next, the wood molding plate (2) on which the raw core layer (3A) is deposited is set in the press molding device (11) together with the template (6). The press molding device (11) includes a lower plate (12) and an upper plate (1).
The upper plate (13) is connected to the suction passage (14), and the wood molding plate (4) is suction-held on the mold surface. And the lower board
(12) is raised to polymerize and press the wood molding plate (2), the core layer (3A) and the wood molding plate (4). In this way, as shown in FIG. 3, the front and back layers (2, 4) are made of a wood molding plate, and the core layer (3) is made of a wood piece F bound with a thermoplastic resin melt R to form a three-layer structure. A wood board (1) is manufactured. In the present invention, a two-layer structure including a core layer and a front layer or a back layer may be used.
【0012】〔実施例1〜3〕以下に本発明の実施例を
示す。表裏層用の木質成形板(2,4) として、表1に示す
厚さ2.5mmのハードボード、単板、MDFを準備し
た。芯層用木片Fとして、解体木材を粉砕しフレーカー
等で削片化し、平均厚さ0.5〜1mm、長さ20〜25
mm、幅4〜8mmの木片を得た。熱可塑性樹脂として、廃
ポリプロピレンを使用しペレット化し粉砕物とした。Examples 1 to 3 Examples of the present invention will be shown below. As the wood molding plates (2,4) for the front and back layers, 2.5 mm thick hard board, single plate and MDF shown in Table 1 were prepared. As the wood piece F for the core layer, demolition wood is crushed and fragmented with a flaker, etc., and has an average thickness of 0.5 to 1 mm and a length of 20 to 25.
A piece of wood having a width of 4 to 8 mm was obtained. Waste polypropylene was used as the thermoplastic resin and pelletized into a pulverized product.
【0013】[0013]
【表1】 [Table 1]
【0014】これらの原料を使用して、図1に示すフォ
ーミング装置を使用して、まず搬送コンベア(5) 上を移
動する型板(6) 上に表層用の木質成形板(2) を載置し
た。その上に、ポリプロピレン成形物の廃品粉砕物を2
00〜220℃で溶融しダイス(7) のオリフィス(8) か
ら溶融吐出させ、両側から上記木片Fを散布(木片F:
ポリプロピレン溶融物R=7:3)して、ポリプロピレ
ン溶融物Rを延伸細化させながら混合した混合物Mを堆
積し、原芯層(3A)とした。その後下盤(12)を上昇させ、
吸引によりプレス上盤(13)に保持している裏層用木質成
形板(4) を原芯層(3A)の上にプレスして積層し、更にプ
レスを続けて一体成形して木質板(1) とした(プレス圧
3〜8MPa )。Using these raw materials, the forming apparatus shown in FIG. 1 is used to first mount the wood forming plate (2) for the surface layer on the template (6) moving on the conveyor (5). I put it. On top of that, 2 pieces of crushed polypropylene molding waste
It is melted at 00-220 ° C and melted and discharged from the orifice (8) of the die (7), and the wood pieces F are sprayed from both sides (wood piece F:
Polypropylene melt R = 7: 3) and polypropylene M melt R was mixed while stretching and thinning to deposit a mixture M, which was used as a raw core layer (3A). Then raise the lower board (12),
The wood molding plate (4) for the backing layer, which is held on the press upper plate (13) by suction, is pressed and laminated on the raw core layer (3A), and the press is continued to integrally mold the wood plate (4). 1) (pressing pressure 3 to 8 MPa).
【0015】〔比較例1〕上記実施例において表裏層用
の木質成形板(2,4) をもたない、原芯層(3A)のみを成形
した木質板を比較例1とした。上記実施例1〜3および
比較例1について各種物性を測定した結果を表2に示
す。[Comparative Example 1] A wooden board prepared by molding only the raw core layer (3A) without the wooden molded boards (2, 4) for the front and back layers in the above-mentioned Examples was designated as Comparative Example 1. Table 2 shows the results of measuring various physical properties of the above Examples 1 to 3 and Comparative Example 1.
【0016】[0016]
【表2】 [Table 2]
【0017】表2によれば、表裏層に木質成形板を有す
る実施例1〜3は芯層のみの比較例に比して高強度であ
るが、比重は余り差がなく軽量性が確保されていること
が認められる。また寸法安定性も比較例に比して大幅に
向上しており、釘保持力も大きいことが認められる。According to Table 2, Examples 1 to 3 having the wood molding plates on the front and back layers have higher strength than the comparative example having only the core layer, but there is no difference in specific gravity and light weight is secured. Is recognized. Also, the dimensional stability is significantly improved as compared with the comparative example, and it is recognized that the nail holding power is also large.
【0018】[0018]
【発明の効果】本発明では高強度軽量な木質板が簡単に
殆どワンショットで製造される。According to the present invention, a high-strength and lightweight wooden board can be easily manufactured in almost one shot.
図1〜図3は本発明の一実施例を示すものである。 1 to 3 show an embodiment of the present invention.
【図1】フォーミング装置説明図FIG. 1 is an explanatory diagram of a forming device
【図2】プレス成形装置説明図FIG. 2 is an explanatory view of a press molding device.
【図3】木質板側断面図[Fig. 3] Cross-sectional view of a wooden board
1 木質板 2,4 木質成形板 3 芯層 F 木片 M 混合物 R 熱可塑性樹脂溶融物 1 Wood board 2,4 wood molding board 3 core layer F piece of wood M mixture R Thermoplastic resin melt
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2B200 AA01 BA06 CA15 CA20 DA21 EF01 HA05 2B250 AA01 BA09 CA11 DA01 FA21 2B260 AA20 BA02 BA15 BA18 CB01 CB04 CD02 DA01 DA18 4F100 AK01B AK07 AP00A AP00B AP00C AP03 BA03 BA06 BA10A BA10C EJ17 GB07 JB16B JL16B ─────────────────────────────────────────────────── ─── Continued front page F term (reference) 2B200 AA01 BA06 CA15 CA20 DA21 EF01 HA05 2B250 AA01 BA09 CA11 DA01 FA21 2B260 AA20 BA02 BA15 BA18 CB01 CB04 CD02 DA01 DA18 4F100 AK01B AK07 AP00A AP00B AP00C AP03 BA03 BA06 BA10A BA10C EJ17 GB07 JB16B JL16B
Claims (5)
に表層および/または裏層として木質成形板を積層した
ことを特徴とする木質板1. A wood board characterized in that a wood molding board is laminated as a front layer and / or a back layer on a core layer obtained by binding wood pieces with a thermoplastic resin.
に記載の木質板2. The thermoplastic resin is a recycled resin.
Wood board described in
または該芯層の木片は再生品である請求項1または2に
記載の木質板3. A wood component of the front and back layers of a wood molded plate and / or
The wood board according to claim 1 or 2, wherein the wood piece of the core layer is a recycled product.
〜50mm、幅0.5〜20mmである請求項1〜3に記載
の木質板4. The wood piece of the core layer has a thickness of 0.1 to 5 mm and a length of 1.
The wooden board according to claims 1 to 3, which has a width of -50 mm and a width of 0.5-20 mm.
との混合物を供給堆積し、その上に木質成形板を載置し
プレス成形することによって表裏層と芯層とを一体化す
ることを特徴とする請求項1〜4に記載の木質板の製造
方法5. A front and back layer and a core layer are integrated by supplying and depositing a mixture of a thermoplastic resin melt and wood chips on a wood molding plate, and placing the wood molding plate thereon and press-molding. The method for manufacturing a wood board according to any one of claims 1 to 4, wherein
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JP2001293587A JP2003094412A (en) | 2001-09-26 | 2001-09-26 | Woody plate and method for manufacturing woody plate |
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JP2001293587A JP2003094412A (en) | 2001-09-26 | 2001-09-26 | Woody plate and method for manufacturing woody plate |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005319733A (en) * | 2004-05-11 | 2005-11-17 | Makoto Yamamoto | Laminated plate and its production method |
JP2007130860A (en) * | 2005-11-10 | 2007-05-31 | Daiken Trade & Ind Co Ltd | Woody composite board and its production method |
WO2007118389A1 (en) * | 2006-04-14 | 2007-10-25 | Hongji Chen | A process for manufacturing a composite board |
JP2008173809A (en) * | 2007-01-17 | 2008-07-31 | Matsushita Electric Works Ltd | Manufacturing method for woody composite building panel and woody composite building panel |
JP2015523916A (en) * | 2012-05-04 | 2015-08-20 | ウッド イノベーションズ リミティド | Core layer comprising zigzag wood elements and multilayer composite comprising core layer |
CN106808556A (en) * | 2016-12-10 | 2017-06-09 | 安徽宏翔自动化科技有限公司 | One kind insulation wood based panel and its processing technology |
-
2001
- 2001-09-26 JP JP2001293587A patent/JP2003094412A/en not_active Withdrawn
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005319733A (en) * | 2004-05-11 | 2005-11-17 | Makoto Yamamoto | Laminated plate and its production method |
JP4527438B2 (en) * | 2004-05-11 | 2010-08-18 | 埼玉県 | Laminate and manufacturing method thereof |
JP2007130860A (en) * | 2005-11-10 | 2007-05-31 | Daiken Trade & Ind Co Ltd | Woody composite board and its production method |
WO2007118389A1 (en) * | 2006-04-14 | 2007-10-25 | Hongji Chen | A process for manufacturing a composite board |
JP2008173809A (en) * | 2007-01-17 | 2008-07-31 | Matsushita Electric Works Ltd | Manufacturing method for woody composite building panel and woody composite building panel |
JP2015523916A (en) * | 2012-05-04 | 2015-08-20 | ウッド イノベーションズ リミティド | Core layer comprising zigzag wood elements and multilayer composite comprising core layer |
CN106808556A (en) * | 2016-12-10 | 2017-06-09 | 安徽宏翔自动化科技有限公司 | One kind insulation wood based panel and its processing technology |
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