JP2003094411A - Woody plate and method for manufacturing woody plate - Google Patents

Woody plate and method for manufacturing woody plate

Info

Publication number
JP2003094411A
JP2003094411A JP2001293588A JP2001293588A JP2003094411A JP 2003094411 A JP2003094411 A JP 2003094411A JP 2001293588 A JP2001293588 A JP 2001293588A JP 2001293588 A JP2001293588 A JP 2001293588A JP 2003094411 A JP2003094411 A JP 2003094411A
Authority
JP
Japan
Prior art keywords
wood
layer
core layer
mat
raw material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001293588A
Other languages
Japanese (ja)
Inventor
Takuji Okazaki
拓司 岡崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichiha Corp
Original Assignee
Nichiha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiha Corp filed Critical Nichiha Corp
Priority to JP2001293588A priority Critical patent/JP2003094411A/en
Publication of JP2003094411A publication Critical patent/JP2003094411A/en
Withdrawn legal-status Critical Current

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  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily manufacture a light-weighted woody plate of high strength. SOLUTION: The woody plate 1 comprising a core layer 3 in which wood chips F are linked with thermoplastic woody resin; a front layer 2 in which a woody content is linked with thermoset resin and/or a rear layer, is provided. A raw material mixture for front layer M1 containing a woody content and the thermoset resin is sprayed on a substrate 6 to form a front layer mat 2A. A raw material mixture for core layer M2 of thermoplastic woody resin melt R and the wood chips F are accumulated by feeding on the front layer mat 2A to form a core layer mat 3A. A raw material mixture for rear layer M1 containing the woody content and the thermoset resin is sprayed thereon to form a rear layer mat 4A. The woody plate 1 is manufactured by forming by pressing the three layer mat.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は例えば建築材料とし
て使用される木質板および該木質板の製造方法に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wood board used as a building material and a method for manufacturing the wood board.

【0002】[0002]

【従来の技術】従来、この種の木質板にあっては、芯層
として木質細割材に樹脂を混合して蒸気噴射プレスを行
って芯層を成形し、該芯層の表裏面に接着剤によって合
板、中密度繊維板、薄物パーチクルボード等の木質成形
板を積層したものが提供されている(特開2000−1
17709号公報)。
2. Description of the Related Art Conventionally, in this type of wood board, a resin is mixed as a core layer into a wood finely divided material, steam injection pressing is performed to form the core layer, and the core layer is adhered to the front and back surfaces of the core layer. There is provided a laminate of wood molding boards such as plywood, medium density fiber board, and thin particle board according to the agent (Japanese Patent Laid-Open No. 2000-1.
17709).

【0003】[0003]

【発明が解決しようとする課題】上記木質板にあっては
一たん芯層を成形し、そして該芯層の表裏面に接着剤に
よって木質成形板を接着する方法によって製造されるの
で、工程が多く手間がかゝり、また接着剤も必要とな
る。
The above wooden board is manufactured by a method in which a core layer is formed once and the wood formed board is adhered to the front and back surfaces of the core layer with an adhesive. A lot of work is required, and an adhesive is also required.

【0004】[0004]

【課題を解決するための手段】本発明は上記従来の課題
を解決するための手段として、木片Fを熱可塑性樹脂に
よって結着した芯層(3) と、木質分を熱硬化性樹脂によ
って結着した表層(2)および/または裏層(4) とからな
る木質板(1) を提供するものである。該表裏層(2,4) の
木質分は26メッシ全通の木粉および/または厚さ0.
1〜2mm、長さ1〜30mm、幅0.1〜5mmの木片Fで
あり、該芯層(3) の木片Fは厚さ0.1〜5mm、長さ1
〜50mm、幅0.5〜20mmであることが好ましく、更
に該熱可塑性樹脂は再生樹脂であり、そして該表裏層
(2,4) の木質分および/または該芯層(3) の木片Fは再
生品であることが好ましい。更に本発明では、基板(6)
上に木質分と熱硬化性樹脂とを含有する表層用原料混合
物M1 を散布して表層マット(2A)をフォーミングし、該
表層マット(2A)上に熱可塑性樹脂溶融物Rと木片Fとの
芯層用原料混合物M2 を供給堆積して芯層マット(3A)を
フォーミングし、その上に木質分と熱硬化性樹脂とを含
有する裏層用原料混合物M1 を散布して裏層マット(4A)
をフォーミングし、該三層マットをプレス成形すること
によって表裏層(2,4) と芯層(3) とを一体化する木質板
(1) の製造方法が提供される。
[Means for Solving the Problems] As a means for solving the above conventional problems, the present invention binds a core layer (3) formed by binding a piece of wood F with a thermoplastic resin and a wood layer with a thermosetting resin. The present invention provides a wood board (1) consisting of a front layer (2) and / or a back layer (4) which are put on. The wood content of the front and back layers (2,4) is 26 Messi all-through wood flour and / or a thickness of 0.
A wood piece F having a length of 1 to 2 mm, a length of 1 to 30 mm and a width of 0.1 to 5 mm. The wood piece F of the core layer (3) has a thickness of 0.1 to 5 mm and a length of 1
Preferably, the thermoplastic resin is a recycled resin, and the front and back layers are
The wood component (2,4) and / or the wood piece F of the core layer (3) is preferably a recycled product. Further in the present invention, the substrate (6)
The surface layer raw material mixture M 1 containing a wood component and a thermosetting resin is sprinkled on the surface layer mat (2A) to form a thermoplastic resin melt R and wood chips F on the surface layer mat (2A). Of the core layer raw material mixture M 2 is supplied and deposited to form the core layer mat (3A), and the back layer raw material mixture M 1 containing a wood component and a thermosetting resin is sprinkled thereon to form a back layer. Matte (4A)
And a three-layer mat is press-formed to integrate the front and back layers (2, 4) and the core layer (3) into a wooden board.
A manufacturing method of (1) is provided.

【0005】[0005]

【作用】本発明では、芯層(3) は木片Fを使用して粗構
造となるが、表層(2) および/または裏層(4) は木質分
を熱可塑性樹脂によって結着して緻密な構造とするの
で、軽量でも寸法安定性良く高強度が得られるし、また
ホットプレス時表裏層(2,4) の熱硬化性樹脂が硬化して
いれば、木質板(1) が完全に冷却しないうちでも容易に
プレス型から離型出来、また木質板(1) は完全に冷却し
ないうちでも取扱い容易な保形性を有する。また本発明
では、基板(6) 上に木質分と熱硬化性樹脂とを含有する
表層用原料混合物M1 を散布して表層マット(2A)をフォ
ーミングし、該表層マット(2A)上に熱可塑性樹脂溶融物
Rと木片Fとの芯層用原料混合物M2を供給堆積して芯
層マット(3A)をフォーミングし、その上に木質分と熱硬
化性樹脂とを含有する裏層用原料混合物M1 を散布して
裏層マット(4A)をフォーミングし、該三層マットをプレ
ス成形するので、表裏層(2,4) と芯層(3) とは、該表裏
層(2,4) に含まれる熱硬化性樹脂と該芯層(3) の熱可塑
性樹脂溶融物Rにより接着一体化される。したがって芯
層(3) と表裏層(2,4) との接着には接着剤が不要となる
し、また表裏層(2,4) のみに熱硬化性樹脂を使用してい
るので、樹脂分解物の発生も少ない。
In the present invention, the core layer (3) has a rough structure by using the wood chips F, but the surface layer (2) and / or the back layer (4) are made by binding the wood components with a thermoplastic resin to form a dense structure. Because of this structure, it is possible to obtain high strength with good dimensional stability even if it is lightweight, and if the thermosetting resin of the front and back layers (2,4) is hardened during hot pressing, the wood board (1) will be completely It can be easily released from the press mold even without cooling, and the wood board (1) has a shape retention property that is easy to handle even if it is not completely cooled. Further, in the present invention, the surface layer raw material mixture M 1 containing a wood component and a thermosetting resin is sprinkled on the substrate (6) to form the surface layer mat (2A), and the surface layer mat (2A) is heated. A core layer raw material mixture M 2 of a plastic resin melt R and a piece of wood F is supplied and deposited to form a core layer mat (3A), and a back layer raw material containing a wood component and a thermosetting resin thereon. Since the back layer mat (4A) is formed by spraying the mixture M 1 and the three-layer mat is press-molded, the front and back layers (2,4) and the core layer (3) are the front and back layers (2,4). ) And the thermoplastic resin melt R of the core layer (3) are bonded and integrated. Therefore, no adhesive is required to bond the core layer (3) to the front and back layers (2,4), and since the thermosetting resin is used only in the front and back layers (2,4), resin decomposition There are few things.

【0006】[0006]

【発明の実施の形態】本発明を以下に詳細に説明する。 〔芯層〕本発明の芯層は木片を熱可塑性樹脂によって結
着したものである。上記木片は木材からフレーカーによ
る切削によって製造され、サイズとしては好ましくは厚
さ0.1〜5mm、長さ1〜50mm、幅0.5〜20mm、
更に好ましくは厚さ0.5〜1mm、長さ20〜25mm、
幅4〜8mmのものである。上記木片の原料となる木材
は、好ましくは建築物解体の際に発生する解体木材、木
材切断の際に発生する端切れ等を使用する。このような
再生品を使用することによって、木材廃棄物の高度利用
を図ることが出来る。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below. [Core Layer] The core layer of the present invention is obtained by binding wood chips with a thermoplastic resin. The above wood pieces are manufactured from wood by cutting with a flaker, and preferably have a thickness of 0.1 to 5 mm, a length of 1 to 50 mm, and a width of 0.5 to 20 mm.
More preferably, the thickness is 0.5 to 1 mm, the length is 20 to 25 mm,
It has a width of 4 to 8 mm. As the wood used as the raw material of the above-mentioned wood pieces, it is preferable to use dismantled wood generated when the building is dismantled, scraps generated when the wood is cut, and the like. By using such recycled products, advanced utilization of wood waste can be achieved.

【0007】上記木片を結着する熱可塑性樹脂として
は、例えばポリエチレン、ポリプロピレン、エチレン−
プロピレン共重合体、エチレン−酢酸ビニル共重合体、
ポリ塩化ビニル、ポリ塩化ビニリデン、ポリスチレン、
ポリ酢酸ビニル、フッ素樹脂、熱可塑性アクリル樹脂、
熱可塑性ポリエステル、熱可塑性ポリアミド、熱可塑性
ウレタン樹脂、アクリロニトリル−ブタジエン共重合
体、スチレン−ブタジエン共重合体、アクリロニトリル
−ブタジエン−スチレン共重合体、エチレン−プロピレ
ン共重合体、エチレン−プロピレンターポリマー、エチ
レン−酢酸ビニル共重合体等の熱可塑性合成樹脂等が使
用される。上記熱可塑性樹脂としては、上記熱可塑性樹
脂成形品の廃材の粉砕物、あるいは該粉砕物を溶融ペレ
ット化したものを使用することが好ましい。このような
再生樹脂を使用することによって樹脂廃棄物の高度利用
を図ることが出来る。
Examples of the thermoplastic resin for binding the wood chips include polyethylene, polypropylene, ethylene-
Propylene copolymer, ethylene-vinyl acetate copolymer,
Polyvinyl chloride, polyvinylidene chloride, polystyrene,
Polyvinyl acetate, fluororesin, thermoplastic acrylic resin,
Thermoplastic polyester, thermoplastic polyamide, thermoplastic urethane resin, acrylonitrile-butadiene copolymer, styrene-butadiene copolymer, acrylonitrile-butadiene-styrene copolymer, ethylene-propylene copolymer, ethylene-propylene terpolymer, ethylene -A thermoplastic synthetic resin such as a vinyl acetate copolymer is used. As the thermoplastic resin, it is preferable to use a pulverized product of the waste material of the thermoplastic resin molded product, or a product obtained by melting and pelletizing the pulverized product. By using such a recycled resin, it is possible to highly utilize the resin waste.

【0008】〔表裏層〕本発明の表裏層は木質分を熱硬
化性樹脂によって結着したものである。上記木質分とし
ては通常木粉および/または木片が使用され、該木粉は
26メッシュ全通の粒径を有することが好ましく、また
該木片は上記芯層に用いる木片よりも小サイズで、例え
ば厚さ0.1〜2mm、長さ1〜30mm、幅0.1〜5m
m、好ましくは厚さ0.2〜0.5mm、長さ6〜12m
m、幅0.5〜2.5mmのものが使用される。上記木質
分もまた芯層用木片と同様に再生品を使用することが好
ましい。上記木質分を結着する熱硬化性樹脂としては、
フェノール樹脂、メラミン樹脂、尿素樹脂、メラミン−
尿素共縮合樹脂、レゾルシノール樹脂等が使用される。
[Front and Back Layers] The front and back layers of the present invention are obtained by binding wood components with a thermosetting resin. As the wood component, wood flour and / or wood chips are usually used, and the wood powder preferably has a particle size of 26 mesh, and the wood chips have a smaller size than the wood chips used for the core layer, for example, Thickness 0.1-2mm, length 1-30mm, width 0.1-5m
m, preferably 0.2-0.5 mm thick, 6-12 m long
m, width 0.5-2.5 mm is used. It is preferable to use a recycled product for the above-mentioned wood component as well as the core layer wood piece. The thermosetting resin that binds the wood components,
Phenol resin, melamine resin, urea resin, melamine-
Urea co-condensation resin, resorcinol resin and the like are used.

【0009】〔木質板の製造〕本発明の木質板の製造に
おいては、まず基板上に木質分と熱硬化性樹脂とを混合
した表層用原料混合物を散布し表層マットをフォーミン
グし、該表層マット上に熱可塑性樹脂溶融物と木片との
芯層用原料混合物を供給堆積して芯層マットをフォーミ
ングする。この場合、表層用原料混合物における木質分
と熱硬化性樹脂との混合重量比は通常95/5〜80/
20(木質分/熱硬化性樹脂)とし、芯層用原料混合物
における木片と熱可塑性樹脂溶融物との混合重量比は、
通常80/20〜60/40(木片/熱可塑性樹脂)と
する。そしてその上から表層用原料混合物と同様な裏層
用原料混合物を散布して裏層マットをフォーミングし、
プレス成形を行う。この際のプレス圧は通常3〜10M
Pa である。
[Manufacture of Wood Board] In the manufacture of the wood board of the present invention, first, a surface layer raw material mixture in which a wood component and a thermosetting resin are mixed is sprinkled on a substrate to form a surface layer mat, and the surface layer mat is formed. A core layer raw material mixture of a thermoplastic resin melt and wood chips is supplied and deposited on the top to form a core layer mat. In this case, the mixing weight ratio of the wood component and the thermosetting resin in the surface raw material mixture is usually 95/5 to 80 /
20 (wood component / thermosetting resin), the mixing weight ratio of the wood chips and the thermoplastic resin melt in the core layer raw material mixture is
It is usually 80/20 to 60/40 (wood chips / thermoplastic resin). And a back layer raw material mixture similar to the surface layer raw material mixture is sprayed from above to form a back layer mat,
Perform press molding. Press pressure at this time is usually 3 to 10M
It is Pa.

【0010】具体的には、例えば図1に示すフォーミン
グ装置を使用し、該フォーミング装置の搬送コンベア
(5) 上の型板(6) 上に表裏層用原料混合物M1 を散布し
て表層マット(2A)をフォーミングする。この原料混合物
1 は原料輸送路(7) から原料供給コンベア(8A)によっ
て散布装置(9A)に供給され、該散布装置(9A)から該型板
(6) 上に散布される。更に、該コンベア(5) 上方に配置
したダイス(10)のオリフィス(11)から熱可塑性樹脂溶融
物Rを吐出流下させ、両側から供給コンベア(12A,12B)
上の木片Fを供給ロール(13,13) によって散布し、該樹
脂溶融物R中に添加する。該木片Fは木片輸送路(14)か
ら木片供給コンベア(15A,15B) によって該供給コンベア
(12A,12B) 上に供給される。該樹脂溶融物Rは延伸細分
化され、樹脂溶融物Rと木片Fとが均一に混合された芯
層用原料混合物M2 が得られ、該混合物M2 は該表層マ
ット(2A)上に芯層マット(3A)として供給堆積する。
Specifically, for example, the forming apparatus shown in FIG. 1 is used, and the conveying conveyor of the forming apparatus is used.
(5) The raw material mixture M 1 for the front and back layers is sprinkled on the upper template (6) to form the front mat (2A). This raw material mixture M 1 is supplied from the raw material transportation path (7) to the spraying device (9A) by the raw material supply conveyor (8A), and from the spraying device (9A) to the template.
(6) Sprinkled on top. Further, the thermoplastic resin melt R is discharged and flown from the orifice (11) of the die (10) arranged above the conveyor (5), and the supply conveyors (12A, 12B) are supplied from both sides.
The wood chips F above are sprinkled by the supply rolls (13, 13) and added into the resin melt R. The piece of wood F is fed from the piece of wood transportation path (14) by the piece of wood supply conveyor (15A, 15B).
Supplied on (12A, 12B). The resin melt R is stretched subdivided resin melt R and wood pieces F and uniformly mixed core layer material mixture M 2 is obtained, the mixture M 2 of the core on the surface layer mat (2A) Delivered and deposited as a layer mat (3A).

【0011】次いで芯層マット(3A)上に表裏層用原料混
合物M1 を散布して裏層マット(4A)をフォーミングす
る。この原料混合物M1 は原料輸送路(7) から原料供給
コンベア(8B)によって散布装置(9B)に供給され、該散布
装置(9B)から該芯層マット(3A)上に散布される。このよ
うにしてフォーミングされた三層構造のマットをプレス
装置によってホットプレスする。プレス温度は通常18
0℃〜230℃の範囲に設定する。このようにして図2
に示すように表裏層(2,4) が熱硬化性樹脂で木質分を結
着したものからなり、芯層(3) が木片Fを熱可塑性樹脂
溶融物Rで結着したものからなる三層構造の木質板(1)
が製造される。本発明では芯層(3) と表層(2) または裏
層(4) とからなる二層構造としてもよい。
Next, the raw material mixture M 1 for the front and back layers is sprinkled on the core mat (3A) to form the back mat (4A). This raw material mixture M 1 is supplied from the raw material transportation path (7) to the spraying device (9B) by the raw material supply conveyor (8B), and is sprayed from the spraying device (9B) onto the core layer mat (3A). The three-layer structured mat thus formed is hot-pressed by a pressing device. Press temperature is usually 18
Set in the range of 0 ° C to 230 ° C. Thus, FIG.
As shown in Fig. 3, the front and back layers (2, 4) are composed of a thermosetting resin and wood components bound to each other, and the core layer (3) is composed of a wood piece F bonded to a thermoplastic resin melt R. Layered wood board (1)
Is manufactured. In the present invention, a two-layer structure composed of the core layer (3) and the surface layer (2) or the back layer (4) may be used.

【0012】〔実施例1〜4〕以下に本発明の実施例1
〜4を示す。表裏層用の原料混合物として、木粉(26
メッシュ全通)と、粉末フェノール樹脂とを表1に示す
割合で混合し乾式攪拌した表裏層用原料混合物M1 を用
いた。芯層用原料の木片Fとして、解体木材を粉砕しフ
レーカー等で削片化し、平均厚さ0.5〜1mm、長さ2
0〜25mm、幅4〜8mmの木片を用い、熱可塑性樹脂と
して、廃ポリプロピレンを使用しペレット化し粉砕物を
用いた。
[Examples 1 to 4] Hereinafter, Example 1 of the present invention will be described.
~ 4 is shown. As a raw material mixture for the front and back layers, wood flour (26
All the mesh) and the powdered phenolic resin were mixed at a ratio shown in Table 1 and dry-stirred, and a raw material mixture M 1 for the front and back layers was used. As the wood piece F for the raw material for the core layer, demolition wood is crushed and fragmented with a flaker, etc., and has an average thickness of 0.5 to 1 mm and a length of 2
Wood pieces having a width of 0 to 25 mm and a width of 4 to 8 mm were used, and waste polypropylene was used as a thermoplastic resin to pelletize and use a pulverized product.

【0013】[0013]

【表1】 [Table 1]

【0014】これらの原料を使用して、図1に示すフォ
ーミング装置を使用して、まず搬送コンベア(5) 上を移
動する型板(6) 上に木粉と粉末フェノール樹脂とを混合
した表裏層用原料混合物M1 を散布し表層マット(2A)と
した。その上に、芯層用原料であるポリプロピレン成形
物の廃品粉砕物を200〜240℃で溶融しダイス(10)
のオリフィス(11)から溶融吐出させ、両側から上記木片
Fを散布して、ポリプロピレン溶融物Rを延伸細化させ
ながら混合した芯層用原料混合物M2 (木片F:ポリプ
ロピレン溶融物R=7:3)を堆積し芯層マット(3A)を
積載した。更にその上に表裏層用の原料混合物M1 を散
布し裏層マット(4A)を積載し三層構造の積層マットとし
た。その後熱圧プレスを施し(プレス圧3〜10MP
a)、木質板を成形した。
Using these raw materials, the forming apparatus shown in FIG. 1 was used to first mix wood powder and powdered phenolic resin on the front and back of a template (6) moving on a conveyor (5). The raw material mixture M 1 for layers was sprayed to obtain a surface mat (2A). On top of that, a waste crushed product of polypropylene molding, which is a raw material for the core layer, is melted at 200 to 240 ° C. to form a die (10).
Melted and discharged from the orifice (11) of the above, and the wood pieces F were sprinkled from both sides, and the polypropylene melt R was mixed while being drawn and thinned. The core layer raw material mixture M 2 (wood pieces F: polypropylene melt R = 7: 3) was deposited and the core mat (3A) was loaded. Further, the raw material mixture M 1 for the front and back layers was sprinkled thereon and the back layer mat (4A) was loaded to obtain a three-layered laminated mat. After that, hot press is applied (press pressure 3 to 10MP.
a), molded wood board.

【0015】〔実施例5〜6〕表裏層用の原料として、
木粉に代え木片(厚さ0.2〜0.5mm、長さ6〜12
mm、幅0.5〜2.5mm) を用いたこと以外は実施例1
〜4と同様に行った。
Examples 5 to 6 As raw materials for the front and back layers,
Wood pieces in place of wood flour (thickness 0.2-0.5 mm, length 6-12)
mm, width 0.5 to 2.5 mm)
The same procedure as in ~ 4 was performed.

【0016】〔比較例1〜4〕比較例1,2は芯層用原
料混合物M2 (木片F:ポリプロピレン溶融物R=7:
3) のみの単層マットを成形した板厚12mmの木質板で
あり、比較例3は表裏層用原料混合物M1 にもポリプロ
ピレン溶融物Rを添加したものを用い、芯層は各実施例
と同様の原料混合物M2 を用いて成形した木質板、比較
例4は表裏層の樹脂を5%以下(1.5%)にした木質
板である。上記実施例1〜6および比較例1〜4で得ら
れた木質板について各種物性を測定した結果を表2に示
す。
Comparative Examples 1 to 4 Comparative Examples 1 and 2 are core layer raw material mixture M 2 (wood piece F: polypropylene melt R = 7:
3) A wood board having a thickness of 12 mm obtained by molding only a single-layer mat, Comparative Example 3 uses a mixture of the raw materials M 1 for the front and back layers to which the polypropylene melt R is added, and the core layer is the same as that of each example. A wood board molded using the same raw material mixture M 2 , and Comparative Example 4 is a wood board in which the resin of the front and back layers is 5% or less (1.5%). Table 2 shows the results of measuring various physical properties of the wooden boards obtained in Examples 1 to 6 and Comparative Examples 1 to 4.

【0017】[0017]

【表2】 [Table 2]

【0018】表2によれば、ほぼ同比重の実施例1、
2、5、6と比較例1、そして実施例3,4と比較例2
とを比べてみると、各実施例の強度は2〜3割向上して
おり、また吸水伸び率や放湿収縮率のデータからも各実
施例における寸法安定性が大幅に向上していることがわ
かる。また表裏層の樹脂として熱可塑性樹脂であるポリ
プロピレンを使用した比較例3は、吸水伸び率、放湿収
縮率が実施例より大きくなり、表裏層のフェノール樹脂
を5%以下の1.5%で添加した比較例4は、曲げ強度
が実施例よりも小さくなる。
According to Table 2, Example 1 having almost the same specific gravity,
2, 5, 6 and Comparative Example 1, and Examples 3, 4 and Comparative Example 2
When compared with, the strength of each example is improved by 20 to 30%, and the dimensional stability in each example is significantly improved from the data of water absorption elongation rate and moisture release shrinkage rate. I understand. Further, in Comparative Example 3 in which polypropylene, which is a thermoplastic resin, is used as the resin for the front and back layers, the water absorption elongation rate and the moisture release shrinkage rate are higher than those of the examples, and the phenol resin for the front and back layers is 5% or less at 1.5%. The bending strength of the added Comparative Example 4 is smaller than that of the example.

【0019】[0019]

【発明の効果】本発明では高強度軽量でかつ吸水、吸放
湿によっても寸法変化の少ない木質板が簡単に殆どワン
ショットで製造される。
According to the present invention, a high-strength and light-weight wooden board having a small dimensional change due to absorption of water and moisture can be easily manufactured in almost one shot.

【図面の簡単な説明】[Brief description of drawings]

図1および図2は本発明の一実施例を示すものである。 1 and 2 show an embodiment of the present invention.

【図1】フォーミング装置説明図FIG. 1 is an explanatory diagram of a forming device

【図2】木質板側断面図[Fig. 2] Side view of a wooden board

【符号の説明】[Explanation of symbols]

1 木質板 2 表層 2A 表層マット 3 芯層 3A 芯層マット 4 裏層 4A 裏層マット 6 基板(型板) F 木片 R 熱可塑性樹脂溶融物 M1 表裏層用原料混合物 M2 芯層用原料混合物1 Wood board 2 Surface layer 2A Surface layer mat 3 Core layer 3A Core layer mat 4 Back layer 4A Back layer mat 6 Substrate (template) F Wood piece R Thermoplastic resin melt M 1 Raw material mixture for front and back layers M 2 Raw material mixture for core layer

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】木片を熱可塑性樹脂によって結着した芯層
と、木質分を熱硬化性樹脂によって結着した表層および
/または裏層とからなることを特徴とする木質板
1. A wood board comprising a core layer formed by binding wood pieces with a thermoplastic resin, and a surface layer and / or back layer formed by binding wood components with a thermosetting resin.
【請求項2】該表裏層の木質分は26メッシ全通の木粉
および/または厚さ0.1〜2mm、長さ1〜30mm、幅
0.1〜5mmの木片であり、該芯層の木片は厚さ0.1
〜5mm、長さ1〜50mm、幅0.5〜20mmである請求
項1に記載の木質板
2. The wood component of the front and back layers is wood powder of 26 Messi and / or wood chips having a thickness of 0.1 to 2 mm, a length of 1 to 30 mm, and a width of 0.1 to 5 mm. The wood piece is 0.1 thick
The wood board according to claim 1, which has a length of -5 mm, a length of 1-50 mm, and a width of 0.5-20 mm.
【請求項3】該熱可塑性樹脂は再生樹脂である請求項1
または2に記載の木質板
3. The thermoplastic resin is a recycled resin.
Or the wood board described in 2.
【請求項4】該表裏層の木質分および/または該芯層の
木片は再生品である請求項1〜3に記載の木質板
4. The wood board according to claim 1, wherein the wood component of the front and back layers and / or the wood piece of the core layer is a recycled product.
【請求項5】基板上に木質分と熱硬化性樹脂とを含有す
る表層用原料混合物を散布して表層マットをフォーミン
グし、該表層マット上に熱可塑性樹脂溶融物と木片との
芯層用原料混合物を供給堆積して芯層マットをフォーミ
ングし、その上に木質分と熱硬化性樹脂とを含有する裏
層用原料混合物を散布して裏層マットをフォーミング
し、該三層マットをプレス成形することによって表裏層
と芯層とを一体化することを特徴とする請求項1〜4に
記載の木質板の製造方法
5. A surface layer mat is formed by spraying a surface layer raw material mixture containing a wood component and a thermosetting resin on a substrate to form a surface layer mat, and for the core layer of a thermoplastic resin melt and wood chips on the surface layer mat. A raw material mixture is supplied and deposited to form a core layer mat, and a back layer raw material mixture containing a wood component and a thermosetting resin is sprinkled on the core layer mat to form a back layer mat, and the three-layer mat is pressed. The method for manufacturing a wood board according to any one of claims 1 to 4, wherein the front and back layers and the core layer are integrated by molding.
JP2001293588A 2001-09-26 2001-09-26 Woody plate and method for manufacturing woody plate Withdrawn JP2003094411A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001293588A JP2003094411A (en) 2001-09-26 2001-09-26 Woody plate and method for manufacturing woody plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001293588A JP2003094411A (en) 2001-09-26 2001-09-26 Woody plate and method for manufacturing woody plate

Publications (1)

Publication Number Publication Date
JP2003094411A true JP2003094411A (en) 2003-04-03

Family

ID=19115344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001293588A Withdrawn JP2003094411A (en) 2001-09-26 2001-09-26 Woody plate and method for manufacturing woody plate

Country Status (1)

Country Link
JP (1) JP2003094411A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007130860A (en) * 2005-11-10 2007-05-31 Daiken Trade & Ind Co Ltd Woody composite board and its production method
JP2013505150A (en) * 2009-09-24 2013-02-14 エルジー・ハウシス・リミテッド Synthetic wood board with shrinkage
JP2013212693A (en) * 2013-05-29 2013-10-17 Dic Corp Method of manufacturing high strength particle board
JP2017511266A (en) * 2014-03-31 2017-04-20 セラロック、イノベーション、アクチボラグ Composite boards and panels

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007130860A (en) * 2005-11-10 2007-05-31 Daiken Trade & Ind Co Ltd Woody composite board and its production method
JP2013505150A (en) * 2009-09-24 2013-02-14 エルジー・ハウシス・リミテッド Synthetic wood board with shrinkage
JP2013212693A (en) * 2013-05-29 2013-10-17 Dic Corp Method of manufacturing high strength particle board
JP2017511266A (en) * 2014-03-31 2017-04-20 セラロック、イノベーション、アクチボラグ Composite boards and panels

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