JP2003082061A - Curable composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curable composition for forming an epoxy resin laminated board having high glass transition temperature, excellent electrical properties and mechanical properties and low water absorption. SOLUTION: The curable composition for an epoxy resin laminated board contains a polyvalent epoxy compound expressed by general formula (I) (R1 to R10 are each independently hydrogen atom, an alkyl group, a cycloalkyl group, a cycloalkenyl group or 4-glycidyloxyphenyl group or two adjacent substituents together form a bicyclohexene or two non-adjacent substituents together form a bicyclo structure; provided that either one of R1 to R10 is an alkyl group or 4-glycidyloxyphenyl group) in an amount of 3-100 mass% based on the epoxy resin.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a curable composition for epoxy resin laminates containing a specific epoxy compound, and more specifically, cyclohexane of 1,1-bis (4-glycidyloxyphenyl) cyclohexane is a substituent. The present invention relates to a curable composition for build-up, which comprises a curable composition having an epoxy compound as an essential component, has a high glass transition temperature, and has excellent electrical characteristics and mechanical strength.

[0002]

2. Description of the Related Art In the full additive method, which is a method for increasing the density of a printed wiring board, the plating resist used eventually becomes an insulating layer between the wirings, so that a multi-layered structure is required. This makes it possible to prevent wiring deviation and the like, and is suitable for multilayering a printed wiring board having wiring with a high aspect ratio.

The above plating resist remaining on the printed wiring board as an insulating layer is made of high glass capable of coping with heat generation due to highly integrated wiring, thinning of the insulating layer, and reduction in adhesive strength between the conductor layer and the insulating layer. Transition temperature, volume resistivity,
It is required to have mechanical properties and low water absorption.

It is widely known to use an epoxy resin for an insulating layer, and German Patent No. 107798 discloses that
A cured product of 2,2-bis (3,4-epoxycyclohexyl) propane and an acid anhydride is described. Also,
JP-A-2-225580 describes a cured product of 2,2-bis (3,4-epoxycyclohexyl) propane and a cationic photopolymerization initiator. However, 2,2-bis (3,4-epoxycyclohexyl)
When propane was cured with phthalic anhydride or a photopolymerization initiator, the cured product obtained was brittle and impractical.

A cured product of an epoxy compound having a polyhydric phenol skeleton such as diglycidyl ether of bisphenol A and an acid anhydride has a low glass transition temperature and is not practical for build-up.

Further, US Pat. No. 3,298,998 describes that 1,1-bis (4-glycidyloxyphenyl) cyclohexane is used as an epoxy resin. However, it is not described to be used for an epoxy resin laminated plate, and it was not expected at all that an excellent laminated plate could be obtained by having cyclohexane having a substituent.

Therefore, an object of the present invention is to provide a curable composition for epoxy resin laminates having a high glass transition temperature, excellent electrical properties, mechanical strength and low water absorption.

[0008]

Means for Solving the Problems As a result of intensive studies in view of the above situation, the present inventors have found that cyclohexane of 1,1-bis (4-glycidyloxyphenyl) cyclohexane has an epoxy compound having a substituent. By using
The inventors have found that the above objects can be achieved and have reached the present invention.

That is, the present invention is based on 3-10 epoxy resins.
The present invention provides a curable composition for an epoxy resin laminate, in which 0% by mass is a polyvalent epoxy compound represented by the following general formula (I).

[0010]

[Chemical 4]

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below.

R1 to R10 in the above general formula (I)
The alkyl group represented by is methyl, ethyl, propyl, butyl, sec-butyl, tert-butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl. , Octadecyl and the like. More specifically, the following structures may be mentioned.

[0013]

[Chemical 5]

Examples of the cycloalkyl group include cyclopropyl, cyclopentyl, cyclohexyl and the like, and examples of the cycloalkenyl include cyclohexenyl and the like. More specifically, the following structures may be mentioned.

[0015]

[Chemical 6]

When adjacent R1 to R10 are bonded to each other to represent a cyclohexenyl group, the following structures can be mentioned.

[0017]

[Chemical 7]

Examples of the bicyclo structure formed by combining R1 to R10 which are not adjacent to each other include the structures shown below.

[0019]

[Chemical 8]

More specifically, the epoxy compound represented by the above general formula (I) is the following compound No. 1 to
8 is mentioned.

[0021]

[Chemical 9]

[0022]

[Chemical 10]

[0023]

[Chemical 11]

[0024]

[Chemical 12]

[0025]

[Chemical 13]

[0026]

[Chemical 14]

[0027]

[Chemical 15]

[0028]

[Chemical 16]

As the other epoxy compound used in the epoxy resin of the present invention, an aromatic epoxy compound, an alicyclic epoxy compound, an aliphatic epoxy compound and the like are used.

As the aromatic epoxy compound, for example,
Hydroquinone, resorcinol, bisphenol A,
Examples thereof include glycidyl ether compounds of polyhydric phenols such as bisphenol F, 4,4′-dihydroxybiphenyl, novolac, and tetrabromobisphenol A, and glycidyl ether compounds of the above polyhydric phenol ethylene oxide and propylene oxide-added polyether compounds.

Examples of the alicyclic epoxy compound include a polyglycidyl ether of a polyhydric alcohol having at least one alicyclic ring or cyclohexene oxide obtained by epoxidizing cyclohexene or a cyclopentene ring-containing compound with an oxidizing agent. A cyclopentene oxide containing compound is mentioned. For example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate. , 6-methyl-3,4-epoxycyclohexymethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxy Rate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis (3,4-epoxycyclohexylmethyl) adipate, methylenebis (3,4-epoxycyclohexane) , 2,2-bis (3,4-epoxycyclohexyl) propane, dicyclopentadiene diepoxide,
Examples thereof include ethylenebis (3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, and di-2-ethylhexyl epoxyhexahydrophthalate.

Examples of the aliphatic epoxy compound include polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof, polyglycidyl esters of aliphatic long-chain polybasic acids, and homopolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate. , A copolymer synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate and another vinyl monomer, and the like. As a typical compound, 1,4-butanediol diglycidyl ether,
1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, sorbitol tetraglycidyl ether, dipentaerythritol hexaglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl One or two of glycidyl ethers of polyhydric alcohols such as ether and aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane and glycerin.
Examples thereof include polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides, and diglycidyl esters of aliphatic long-chain dibasic acids. Furthermore, monoglycidyl ethers and phenols of aliphatic higher alcohols, cresols, butylphenols, monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxides to these, glycidyl esters of higher fatty acids, epoxidized soybean oil, epoxy Examples include octyl stearate, epoxy butyl stearate, and epoxidized polybutadiene.

Of the above-mentioned polyepoxy compounds, glycidyl ether compounds of polyphenols and polyepoxy compounds having a cyclohexene oxide or cyclopentene oxide structure are preferable because an epoxy resin having a high glass transition temperature can be obtained. Further, since an epoxy compound having a rubber component such as epoxidized polybutadiene imparts flexibility to the obtained epoxy resin, it is preferably used within a range in which other physical properties such as glass transition temperature are less affected. Further, the epoxy compound represented by the following general formula (II) is preferable because an epoxy resin having a particularly high glass transition temperature can be obtained.

[0034]

[Chemical 17]

Examples of the alkyl group represented by R ₁₁ and R ₁₂ include methyl, ethyl, propyl and butyl.

The compound represented by the general formula (I) is preferably 3 to 100% by mass of the epoxy resin used in the curable composition for epoxy resin laminates. If it is less than 3% by mass, the effect of using the compound represented by the general formula (I) cannot be obtained. Further, although the physical properties of the cured product change depending on the curing agent and other concomitant products, the compound represented by the above general formula (I)
It is particularly preferred to use 80% by weight. By using 10% by mass or more, the effect of using the compound represented by the general formula (I) becomes remarkable, and when more than 80% by mass, the obtained cured product becomes brittle, and when the substrate is assembled and the final product is used. The insulating layer may be peeled off or damaged due to impact or the like, which is not preferable.

The curable composition for epoxy resin laminates of the present invention is cured with a curing agent to give an epoxy resin laminate.
Examples of the curing agent include latent curing agents, acid anhydrides, polyamine compounds and polyphenol compounds.

Examples of the latent curing agent include dicyandiamide, hydrazide, imidazole compound, amine adduct, sulfonium salt, onium salt, ketimine, acid anhydride and tertiary amine. These latent curing agents are preferable because they give a one-pack type curable composition and are easy to handle.

Examples of the acid anhydride include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, maleic anhydride, succinic anhydride. Etc.

Examples of the polyamine compound include aliphatic polyamines such as ethylenediamine, diethylenetriamine and triethylenetetramine, menthenediamine, isophoronediamine, bis (4-amino-3-methylcyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9-bis (3-aminopropyl) 2,4
Aliphatic polyamines such as 8,10-tetraoxaspiro [5,5] undecane, aliphatic amines having an aromatic ring such as m-xylenediamine, m-phenylenediamine, 2,
2-bis (4-aminophenyl) propane, diaminodiphenylmethane, diaminodiphenylsulfone, α, α
Examples thereof include aromatic polyamines such as -bis (4-aminophenyl) -p-diisopropylbenzene.

As the polyphenol compound, for example,
Phenol novolac, o-cresol novolac, t
-Butylphenol novolac, dicyclopentadiene cresol, terpene diphenol, terpene dicatechol, 1,1,3-tris (3-tert-butyl-4-hydroxy-6-methylphenyl) butane, butylidenebis (3-tert-butyl- 4-hydroxy-6-methylphenyl) and the like. Phenol novolac is preferable because the obtained epoxy resin has electrical characteristics and mechanical strength suitable for a laminate.

It is preferable that the above-mentioned various curing agents have approximately equivalent reactive groups depending on the composition of the epoxy compound, and it is preferable to use 10 to 200 parts by mass with respect to 100 parts by mass of the epoxy resin.

The cationic photoinitiator used in the present invention is a compound capable of releasing a substance that initiates cationic polymerization upon irradiation with energy rays, and a particularly preferable one is to release a Lewis acid upon irradiation. It is a double salt which is an onium salt or a derivative thereof. Representative examples of such compounds include salts of cations and anions represented by the following general formula [A] ^{m +} [B] ^m- .

The cation [A] ^{m +} is preferably onium, and its structure can be represented by, for example, the following general formula, [(R ¹⁹ ) _a Q] ^{m +} .

Further, R ¹⁹ is an organic group having 1 to 60 carbon atoms and may contain any number of atoms other than carbon atoms. a is an integer of 1 to 5. Each a ¹⁹ R ¹⁹ may be the same or different. Further, at least one is preferably an organic group having an aromatic ring as described above. Q is S, N, Se, Te, P, As, S
It is an atom or atomic group selected from the group consisting of b, Bi, O, I, Br, Cl, F, and N = N. Further, when the valence of Q in the cation [A] ^{m +} is q, m = a−q
It is necessary that the following relation holds (however, N = N is treated as a valence of 0).

Further, the anion [B] ^{m −} is preferably a halide complex, and its structure can be represented by, for example, the following general formula [LX _b ] ^{m −} .

Further, L is a metal or metalloid which is the central atom of the halide complex, and B,
P, As, Sb, Fe, Sn, Bi, Al, Ca, I
n, Ti, Zn, Sc, V, Cr, Mn, Co and the like. X is a halogen atom. b is an integer of 3 to 7. Further, when the valence of L in the anion [B] ^m − is p, it is necessary that the relation of m = bp holds.

Anion [LX _b ] represented by the above general formula
Specific examples of ^m- include tetrafluoroborate (B
F ₄₎ ^-, hexafluorophosphate (PF ₆₎ ^-, hexafluoroantimonate (SbF ₆₎ ^-, hexafluoroarsenate (AsF ₆₎ ^-, hexachloroantimonate (SbCl ₆₎ ^-, and the like.

As the anion B ^m- , those having a structure represented by [LX _b-1 (OH)] ^m- can also be preferably used.
L, X and b are the same as above. Other anions that can be used include perchlorate ion (ClO).
₄₎ ^-, trifluoromethyl sulfite ion (CF ₃ SO ₃₎
^- , Fluorosulfonate ion (FSO ₃ ) ^- , toluenesulfonate anion, trinitrobenzenesulfonate anion and the like.

In the present invention, among these onium salts, it is particularly effective to use the following aromatic onium salts a) to c). Of these, one type may be used alone, or two or more types may be mixed and used.

A) Aryldiazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate and 4-methylphenyldiazonium hexafluorophosphate.

B) Diphenyliodonium hexafluoroantimonate, di (4-methylphenyl) iodonium hexafluorophosphate, di (4-tert-
Butylphenyl) iodonium hexafluorophosphate and other diaryliodonium salts

C) Triphenylsulfonium hexafluoroantimonate, tris (4-methoxyphenyl)
Sulfonium hexafluorophosphate, diphenyl-4-thiophenoxyphenylsulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium hexafluorophosphate,
4,4'-bis (diphenylsulfonio) phenyl sulfide-bis-hexafluoroantimonate, 4,
4'-bis (diphenylsulfonyl) phenyl sulfide-bis-hexafluorophosphate, 4,4'-
Bis [di (6-hydroxyethoxy) phenylsulfonio] phenyl sulfide-bis-hexafluoroantimonate, 4,4'-bis [di (6-hydroxyethoxy) phenylsulfonio] phenyl sulfide-bis-
Hexafluorophosphate, 4- [4 '-(benzoyl) phenylthio] phenyl-di- (4-fluorophenyl) sulfonium hexafluoroantimonate, 4
Preferred are triarylsulfonium salts such as-[4 '-(benzoyl) phenylthio] phenyl-di- (4-fluorophenyl) sulfonium hexafluorophosphate.

Further, as other preferable ones,
(Η ⁵ -2,4-cyclopentadien-1-yl)
Iron-arene complexes such as [(1,2,3,4,5,6, -η)-(1-methylethyl) benzene] -iron-hexafluorophosphate, tris (acetylacetonato) aluminum, tris ( A mixture of an aluminum complex such as ethylacetonatoacetato) aluminum and tris (salicylaldehyde) aluminum and a silanol such as triphenylsilanol may be used.

Among these, aromatic iodonium salts, aromatic sulfonium salts, and iron-arene complexes are preferably used from the viewpoints of practical use and photosensitivity.

These photoinitiators may be used in combination with one or more known photopolymerization accelerators such as benzoic acid type or tertiary amine type. The photoinitiator is preferably contained in the composition of the present invention in an amount of 0.1 to 30% by mass. If it is less than 0.1% by mass, the effect of addition may not be obtained, and if it exceeds 30% by mass, the mechanical strength of the cured product may decrease.

As a light source used for polymerization when a photoinitiator is used, a known light source such as a high pressure mercury lamp, a metal halide lamp or a xenon lamp is used, and ultraviolet rays, an electron beam or X-ray is used.
The Lewis compound is released from the photoinitiator by irradiation with actinic rays such as rays, radiation, and high frequency to make the epoxy compound effective. These light sources are 400
A light source having a wavelength of nm or less is effective.

The curable composition for epoxy resin laminates of the present invention may be mixed in advance with a curing agent to give a one-pack type, or may be used as a two-pack type of an epoxy resin composition and a curing agent by mixing at the time of use. Is also good. The one-pack type is easy to handle,
The curing reaction requires heat, light, moisture, etc., and the two-component type has high reactivity, and it is necessary to form a laminated plate within a certain time after mixing, so there is a problem in handling. The one-pack type and the two-pack type are appropriately used depending on the curing / use conditions and the desired physical properties of the resin.

The curable composition for an epoxy resin laminate of the present invention contains various curing accelerators, other resins, inorganic fillers, screen printability improvers, flame retardants, flame retardant aids, dispersions in addition to the above epoxy compounds. It is preferable to use additives which are usually used in epoxy resin compositions, such as a property improving agent, if necessary.

Examples of the curing accelerator include triphenylphosphine, diazabicycloundecene, 2,4,6-tris (dimethylaminomethyl) phenol, 2-ethyl-4-methylimidazole and 1-benzyl-2-methyl. Imidazole compounds such as imidazole are included. These curing accelerators can be used alone or in combination of two or more kinds. The curing accelerator is used in a small enough amount to accelerate the curing of the epoxy resin.

Resins other than the epoxy resin used in the curable composition for epoxy resin laminates of the present invention include butadiene rubber, nitrile rubber, butadiene-styrene rubber, acrylonitrile-butadiene rubber, acrylonitrile-butadiene-styrene rubber, ethylene. -It is preferable to use rubber such as propylene rubber which has excellent elasticity and improves impact resistance in terms of mechanical strength.

The inorganic filler contained in the curable composition for epoxy resin laminates of the present invention is for imparting an additional flame retardant, heat resistance and moisture resistance to the epoxy resin composition. These fillers include talc, silica, alumina, aluminum hydroxide, magnesium hydroxide and the like, and they can be used alone or in combination of two or more kinds. Silica is particularly preferable because it has excellent electrical characteristics.

The flame retardant used in the curable composition for epoxy resin laminates of the present invention includes halogen flame retardants, phosphorus flame retardants, metal hydroxides and the like, and flame retardant aids such as antimony oxide. Examples thereof include antimony compounds, nitrogen-containing compounds such as melamine, boric acid compounds such as zinc borate, and anti-dripping agents such as polytetrafluoroethylene and silicon polymers. In order to impart high flame retardancy to these flame retardants and flame retardant aids, it is preferable to add 5 to 30% by mass of bromine and 3 to 10% by mass of antimony oxide to the curing agent. Phosphorus flame retardants that do not generate dioxin are particularly preferable in terms of both environmental consideration and flame retardancy, and a combination of nitrogen-containing compounds has a marked flame retarding effect.

As the phosphorus-based flame retardant, phenol and / or
Or an ester compound of an alkyl-substituted phenol and phosphoric acid or an ester compound of a phenol and / or an alkyl-substituted phenol and a polyhydric phenol (for example, hydroquinone, resorcinol, bisphenol A, biphenol, a condensate of phenols and formaldehyde, etc.) and a phosphoric acid. When a polyhydric phenol is used, a part of the OH group of phenol may be present unreacted. Further, the above phenol or polyhydric phenol may be replaced with an amine compound to form a phosphoric acid amide compound. The following general formula (II
The phosphoric acid amide compound represented by I) is preferable because the resulting resin has a high glass transition temperature and an excellent flame retarding effect. The phosphorus-based flame retardant is preferably used in an amount of 5 to 100 parts by mass with respect to 100 parts by mass of the epoxy resin. If it is less than 5 parts by mass, a sufficient flame retarding effect cannot be obtained, and if it exceeds 100 parts by mass, the glass transition temperature of the resin composition is significantly lowered.

[0065]

[Chemical 18]

The curable composition for epoxy resin laminates of the present invention described above is diluted with a suitable organic solvent such as propylene glycol monomethyl ether to form a varnish, which is used as a glass nonwoven fabric, a glass woven fabric or the like. A prepreg can be manufactured by a usual method of coating and impregnating a porous glass substrate and heating. Also, after laminating a plurality of these prepregs and laminating copper foil on one or both sides of the laminated structure, heat this under normal conditions.
A glass epoxy copper clad laminate can be obtained by pressing. At this time, if a copper foil is not used, a laminated board is obtained. The multilayer board forms a circuit on a copper clad laminate (inner layer board),
Then, after etching the copper foil, the prepreg and the copper foil are superposed on at least one surface of the inner layer plate, and this is heated at 170 ° C. and a pressure of 40 kg / cm ² for 90 minutes,
It can be manufactured by a usual method of applying pressure. Further, the printed wiring board can be manufactured by a usual method in which a through hole is formed in a copper clad laminate or a multilayer board, a through circuit is plated, and then a predetermined circuit is formed.

[0067]

EXAMPLES The epoxy resin composition of the present invention will be specifically described below. However, the present invention is not limited to the following examples.

[Examples 1-1 to 1-13 and Comparative Example 1-
1-1-2] 100 parts by mass of the epoxy resin described in Tables 1 to 3, a curing agent (described in Tables 1 to 3), and 2-ethyl-4-methylimidazole are sufficiently mixed with 80 parts by mass of ethylene glycol butyl ether acetate, The film thickness after drying on a surface-treated aluminum plate using a knife coater is 30μ
It was applied so that it would be m. After heat drying at 80 ° C. for 5 minutes, baking was further performed at 150 ° C. for 30 minutes to obtain a cured product. The obtained cured product was evaluated for glass transition temperature (hereinafter, Tg), tensile strength and tensile elongation. The results are shown in Tables 1 to 3. However, the compounding amount of each sample compound and the comparative compound is a compounding amount as a solid content excluding the solvent, and the compounding amount was adjusted so that the phosphorus content of the obtained resin composition was 2.0%. All compounding units are based on parts by mass.

The glass transition temperature was measured by the dynamic viscoelastic method.

The tensile test was performed according to JIS-K6911.

[0071]

[Table 1]

* 1: Bisphenol A type epoxy resin * 2: 1,6-bis (glycidyloxy) naphthalene * 3: 1,1,2,2, -tetrakis (4-glycidyloxyphenyl) ethane * 4: 2 2-bis (3,4-epoxycyclohexyl) propane * 5: Addition product of carboxylic acid-modified NBR and bisphenol A diglycidyl ether

[0073]

[Chemical 19]

[0074]

[Chemical 20]

[0075]

[Chemical 21]

[0076]

[Chemical formula 22]

[0077]

[Chemical formula 23]

[0078]

[Chemical formula 24]

* 12: 2-Ethyl-4-methylimidazole * 13: Ethylene glycol butyl ether acetate

[0080]

[Table 2]

[0081]

[Table 3]

Examples 1-1 to 1-13 and Comparative examples 1-1 to
When contrasted with 1-2, Examples 1-1 to 1-13 have higher glass transition temperatures of 25 to 40 ° C., and both tensile strength and tensile elongation are improved. In addition, Example 1
From the comparison between -1 to 1-10 and Examples 1-11 to 1-13, it is found that the glass transition temperature, the tensile strength and the tensile elongation can be improved by using the epoxy compound other than the general formula (I) together.

[0083]

EFFECT OF THE INVENTION By using the polyepoxy compound having a specific structure of the present invention in a curable composition for an epoxy resin laminate, an epoxy resin laminate having a high glass transition temperature and excellent tensile strength and tensile elongation is obtained. A curable composition for use can be provided.

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 T (72) Inventor Yoshihiro Fukuda 7-236 Higashiohisa, Arakawa-ku, Tokyo Asahi Denka Industry F-term (reference) 4J002 CD022 CD051 EW156 FD136 GF00 4J036 AB07 AD11 DA01 DB05 DC02 DC17 FA12 JA08 5E343 AA02 AA11 CC61 CC65 CC67 DD21 ER11 GG13 GG16 5E346 CC09 EE31 HH11

Claims (8)

[Claims] 1. A curable composition for an epoxy resin laminate, wherein 3 to 100% by mass of the epoxy resin is a polyvalent epoxy compound represented by the following general formula (I). [Chemical 1] 2. The epoxy resin according to claim 1, wherein 10 to 80% by mass of the polyvalent epoxy compound represented by the general formula (I) and 20 to 90% by mass of the epoxy compound other than the general formula (I) are used as the epoxy resin. Curable composition for laminated boards. 3. R1 to R1 in the above general formula (I)
The curable composition for an epoxy resin laminate according to claim 1, wherein any one of 0 is an alkyl group. 4. 100 parts by mass of an epoxy resin composed of 10 to 80% by mass of the epoxy compound represented by the general formula (I) and 20 to 90% by mass of an epoxy compound other than the general formula (I), and a curing agent. The curable composition for an epoxy resin laminate according to claim 2 or 3, which comprises 10 to 200 parts by mass. 5. The curable composition for an epoxy resin laminate according to claim 2, wherein the epoxy compound other than the general formula (I) is represented by the following general formula (II). [Chemical 2] 6. The method according to claim 1, wherein 5 to 100 parts by mass of a phosphorus-based flame retardant is mixed with 100 parts by mass of an epoxy resin containing the epoxy compound represented by the general formula (I). A curable composition for an epoxy resin laminate as described. 7. The phosphorus-based flame retardant is represented by the following general formula (II
The curable composition for epoxy resin laminates according to claim 6, which is a phosphoric acid amide compound represented by I). [Chemical 3] 8. An epoxy resin laminate using the curable composition for an epoxy resin laminate according to claim 1.