JP2003077947A - Method of manufacturing circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of mass manufacturing a smaller and thinner circuit device which is installed on a supporting substrate such as a ceramic substrate, a flexible sheet or the like. SOLUTION: After a conductive pattern 51 for every block 62 is formed, a circuit device is installed and molded by an insulative resin 50, and a reverse surface of a conductive foil 60 is etched for formation of the conductive pattern 51 for every block. The remainder 57 of the conductive foil 60 is sandwiched by molds 58 such that the mold of the insulative resin 50 is transfer molded by the block 62. This enables to implement a circuit device manufacturing method suited to mass manufacturing with extremely saving resources.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit device, and more particularly to a method for manufacturing a thin circuit device which does not require a supporting substrate.

[0002]

2. Description of the Related Art Conventionally, a circuit device set in an electronic apparatus has been used in a mobile phone, a portable computer, etc., and thus has been required to be small, thin and lightweight.

For example, when a semiconductor device is taken as an example of a circuit device, there is a package type semiconductor device sealed by a conventional transfer mold as a general semiconductor device. This semiconductor device is mounted on a printed circuit board PS as shown in FIG.

Further, in this package type semiconductor device, the periphery of the semiconductor chip 2 is covered with a resin layer 3, and lead terminals 4 for external connection are led out from the side portions of the resin layer 3.

However, this package type semiconductor device 1 is
Since the lead terminal 4 is out of the resin layer 3, the overall size is large, and the reduction in size, thickness, and weight are not satisfied.

[0006] Therefore, each company has developed various structures in order to competitively realize downsizing, thinning, and weight reduction, and recently, a wafer scale CSP called a CSP (chip size package), which is equivalent to a chip size, Alternatively, a CSP having a size slightly larger than the chip size has been developed.

FIG. 13 shows a CS which uses a glass epoxy substrate 5 as a supporting substrate and is slightly larger than the chip size.
It shows P6. Here, glass epoxy substrate 5
The description will be made assuming that the transistor chip T is mounted on.

A first electrode 7, a second electrode 8 and a die pad 9 are formed on the front surface of the glass epoxy substrate 5, and a first back surface electrode 10 and a second back surface electrode 11 are formed on the back surface.
Are formed. And through the through hole TH,
The first electrode 7 and the first back surface electrode 10 are electrically connected, and the second electrode 8 and the second back surface electrode 11 are electrically connected. The bare transistor chip T is fixed to the die pad 9, and the emitter electrode of the transistor and the first electrode 7 are attached.
Are connected via a metal thin wire 12, and the base electrode of the transistor and the second electrode 8 are connected via a metal thin wire 12. Further, a resin layer 13 is provided on the glass epoxy substrate 5 so as to cover the transistor chip T.

The CSP 6 adopts the glass epoxy substrate 5, but unlike the wafer scale CSP, it has a simple structure of extending from the chip T to the backside electrodes 10 and 11 for external connection, and has an advantage that it can be manufactured at low cost. Have.

The CSP 6 is mounted on a printed circuit board PS as shown in FIG. The printed circuit board PS has
The CSP is provided with electrodes and wiring that form an electric circuit.
6, the package type semiconductor device 1, the chip resistor CR, the chip capacitor CC, etc. are electrically connected and fixed.

The circuit composed of this printed circuit board is mounted in various sets.

Next, a method of manufacturing this CSP will be described with reference to FIGS. 14 and 15.

First, a glass epoxy substrate 5 is prepared as a base material (supporting substrate), and C is formed on both surfaces of the glass epoxy substrate 5 via an insulating adhesive.
The u foils 20 and 21 are pressure bonded. (See FIG. 14A above) Subsequently, the first electrode 7, the second electrode 8, the die pad 9,
The Cu foils 20 and 21 corresponding to the first back surface electrode 10 and the second back surface electrode 11 are covered with an etching resistant resist 22, and the Cu foils 20 and 21 are patterned. The patterning may be performed separately for the front and back (see FIG. 14B above).
Next, a hole for the through hole TH is formed in the glass epoxy substrate by using a drill or a laser, and the hole is plated to form the through hole TH. Due to this through hole TH, the first electrode 7 and the first back surface electrode 1
0, the second electrode 8 and the second back surface electrode 10 are electrically connected. Although not shown in the drawing, the first electrode 7 and the second electrode 8 to be the bonding posts are plated with Ni, and the die pad 9 to be the die bonding post is Au-plated, although not shown in the drawing.
Plating is performed, and the transistor chip T is die-bonded.

Finally, the emitter electrode of the transistor chip T and the first electrode 7, and the base electrode of the transistor chip T and the second electrode 8 are connected via a thin metal wire 12 and covered with a resin layer 13. (Refer to FIG. 14D above) By the above manufacturing method, a CSP type electric element employing the supporting substrate 5 is completed. This manufacturing method is the same when a flexible sheet is used as the supporting substrate.

On the other hand, a manufacturing method using a ceramic substrate is shown in the flow chart of FIG. After preparing a ceramic substrate that is a supporting substrate, through holes are formed, and thereafter, a conductive paste is used to print electrodes on the front and back sides and sintering is performed. After that, the process shown in FIG.
Although it is the same as the manufacturing method of No. 4, the ceramic substrate is very brittle, and unlike a flexible sheet or a glass epoxy substrate, the ceramic substrate is easily chipped, so that there is a problem that molding using a mold cannot be performed. Therefore, the sealing resin is potted, cured, and then polished to flatten the sealing resin, and finally separated by a dicing device.
Further, even when a glass epoxy substrate is used, the substrate may be crushed if it is strongly sandwiched between transfer molds.

[0016]

In FIG. 13, the transistor chip T, the connecting means 7 to 12 and the resin layer 13 are provided.
Is a necessary component for electrical connection with the outside and protection of the transistor, but it was difficult to provide a circuit element that achieves downsizing, thinning, and weight saving with only these components. .

Further, the glass epoxy substrate 5 serving as the supporting substrate is essentially unnecessary as described above. However, because of the manufacturing method, since the electrodes are bonded together, they are used as a supporting substrate, and the glass epoxy substrate 5 cannot be eliminated.

Therefore, by adopting this glass epoxy substrate 5, the cost increases, and further, since the glass epoxy substrate 5 is thick, it becomes thick as a circuit element,
There were limits to miniaturization, thinning, and weight reduction.

Further, in the glass epoxy substrate and the ceramic substrate, the through hole forming step for connecting the electrodes on both sides is indispensable, and the manufacturing process becomes long, which is not suitable for mass production. And since the glass epoxy board has a variation in thickness and the ceramic board is easily broken, it collapses when pressure is applied, transfer molding cannot be performed, and there is a problem that sealing with inefficient resin potting is unavoidable. It was

Furthermore, there is a problem that a method for manufacturing the above-mentioned small circuit device without separating it into individual circuit devices until the end has not been established.

[0021]

According to the present invention, a step of forming a conductive pattern for forming a large number of circuit element mounting portions on a conductive foil for each block, and a step of forming the conductive pattern on each block for each conductive portion. The step of arranging the circuit element, and sandwiching the remaining portion of the conductive foil around the block with a molding die, arranging each mounting portion of the block in the same cavity to fill the separation groove. The method is characterized by including a step of transfer molding with an insulating resin and a step of separating the insulating resin for each of the mounting portions by dicing.

In the present invention, the conductive foil forming the conductive pattern is the starting material, the conductive foil has a supporting function until the insulating resin is molded, and the insulating resin has a supporting function after the molding. This can eliminate the need for a support substrate,
The conventional problem can be solved.

Further, according to the present invention, transfer molding is made possible by sandwiching the remaining portion of the conductive foil having a uniform thickness with a molding die, and transfer-molding each block with the strip-shaped conductive foil, followed by measurement and dicing. Since a plurality of blocks can be attached to the pressure-sensitive adhesive sheet in the steps such as the above, it is possible to mass-produce a large number of circuit devices and solve the conventional problems.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a method of manufacturing a circuit device according to the present invention will be described with reference to FIG.

According to the present invention, a conductive foil is prepared, and a separation groove shallower than the thickness of the conductive foil is formed in the conductive foil in a region except at least a conductive pattern for forming a large number of circuit element mounting portions. Forming a conductive pattern of
A step of fixing a circuit element to each of the mounting portions of the desired conductive pattern, and sandwiching the remaining portion of the conductive foil around the block with a molding die, placing each mounting portion of the block in the same cavity. Transfer molding with an insulating resin so that the separation groove is filled with the insulating resin, a step of removing the conductive foil in a thickness portion where the separation groove is not provided, and a plurality of blocks are covered with the insulating resin. A step of contacting and adhering to the adhesive sheet; a step of measuring characteristics of the circuit element of each mounting portion of the block in a state of being adhered to the adhesive sheet; and a state of adhering to the adhesive sheet And the step of separating the insulating resin of the block by dicing for each mounting portion.

Although the flow shown in FIG. 1 does not correspond to the above-mentioned process, the conductive pattern is formed by three flows of Cu foil, Ag plating and half etching. The circuit element is fixed to each mounting portion and the electrode of the circuit element and the conductive pattern are connected by two flows of die bonding and wire bonding. In the transfer molding flow, common molding is performed using an insulating resin. In the flow of removing the Cu foil on the back surface, the conductive foil in the thickness portion without the separation groove is etched. In the back surface processing flow, the electrode processing of the conductive pattern exposed on the back surface is performed. In the block separation flow, each block is mechanically separated from the connecting portion of the conductive foil. In the flow of the adhesive sheet, a plurality of blocks are attached to the adhesive sheet. In the measurement flow, the non-defective products and the characteristic ranks of the circuit elements incorporated in each mounting portion are determined. In the dicing flow, the insulating resin is separated into individual circuit elements by dicing.

Each step of the present invention will be described below with reference to FIGS. 2 to 5 show a process of forming a conductive pattern forming a mounting portion in each block and fixing a circuit element on the conductive pattern.

In the first step of the present invention, as shown in FIGS. 2 to 4, a conductive foil 60 is prepared and at least the circuit element 5 is provided.
In the conductive foil 60 in the region excluding the conductive pattern 51 that forms a large number of mounting portions of the second mounting portion 2, the separation groove 6 that is shallower than the thickness of the conductive foil 60 is formed.
1 to form the conductive pattern 51 for each block.

In this step, first, as shown in FIG. 2A, a sheet-shaped conductive foil 60 is prepared. The material of the conductive foil 60 is selected in consideration of the adhesiveness, the bonding property, and the plating property of the brazing material, and the material is a conductive foil containing Cu as a main material, a conductive foil containing Al as a main material, or Fe. -A conductive foil or the like made of an alloy such as Ni is adopted.

The thickness of the conductive foil is preferably about 10 μm to 300 μm in consideration of later etching.
A copper foil of 0 μm (2 ounce) was used. But 300μ
It is basically good if it is m or more or 10 μm or less. As described later, it suffices if the separation groove 61 that is shallower than the thickness of the conductive foil 60 can be formed.

The sheet-shaped conductive foil 60 has a predetermined width,
For example, it may be prepared by being rolled into a roll of 45 mm and conveyed to each step described below, or a strip-shaped conductive foil 60 cut into a predetermined size may be prepared and conveyed to each step described below. May be.

Specifically, as shown in FIG. 2B, 4 to 5 blocks 62, each having a large number of mounting portions, are arranged on a strip-shaped conductive foil 60 so as to be spaced apart from each other. Slits 63 are provided between the blocks 62 to absorb the stress of the conductive foil 60 generated by the heat treatment in the molding process or the like. In addition, the conductive foil 60
Index holes 64 are provided at the upper and lower peripheral ends at a constant interval and are used for positioning in each step.

Subsequently, the conductive pattern 51 for each block is formed.

First, as shown in FIG. 3, a photoresist (etching resistant mask) PR is formed on a Cu foil 60, and the photoresist PR is patterned so that the conductive foil 60 except for the region to be the conductive pattern 51 is exposed. To do.
Then, as shown in FIG. 4A, the conductive foil 60 is selectively etched through the photoresist PR.

The depth of the separation groove 61 formed by etching is, for example, 50 μm, and the side surface thereof is a rough surface, so that the adhesiveness with the insulating resin 50 is improved.

Although the side wall of the separation groove 61 is schematically shown as straight, it has a different structure depending on the removing method. For this removing step, wet etching, dry etching, laser evaporation, or dicing can be adopted. In the case of wet etching, ferric chloride or cupric chloride is mainly used as the etchant, and the conductive foil is dipped in the etchant or showered with the etchant. Since the wet etching is generally non-anisotropic, the side surface has a curved structure.

In the case of dry etching, anisotropy,
Non-anisotropic etching is possible. At present, it is said that Cu cannot be removed by reactive ion etching, but it can be removed by sputtering. Moreover, anisotropic or non-anisotropic etching can be performed depending on the sputtering conditions.

In the case of a laser, the separation groove 61 can be formed by direct application of laser light. In this case, the side surface of the separation groove 61 is rather straight.

In FIG. 3, instead of the photoresist, a conductive film (not shown) having corrosion resistance to the etching solution may be selectively coated. When the conductive film is selectively deposited on the part to be the conductive path, the conductive film serves as an etching protection film, and the separation groove can be etched without using a resist. The material considered as the conductive coating is A
g, Ni, Au, Pt, or Pd. Moreover, these corrosion-resistant conductive coatings have the feature that they can be used as they are as die pads and bonding pads.

For example, the Ag coating adheres not only to Au but also to the brazing material. Therefore, if the back surface of the chip is covered with the Au film, the chip can be directly thermocompression-bonded to the Ag film on the conductive path 51, and the chip can be fixed via a brazing material such as solder. Further, since the Au thin wire can be adhered to the Ag conductive film, wire bonding is also possible. Therefore, there is a merit that these conductive coatings can be directly used as a die pad and a bonding pad.

FIG. 4B shows a specific conductive pattern 51. This figure corresponds to an enlargement of one of the blocks 62 shown in FIG. 2B. One of the portions painted in black is one mounting portion 65, which constitutes the conductive pattern 51, and a large number of mounting portions 65 are arranged in a matrix of 5 rows and 10 columns in one block 62. The same conductive pattern 51 is provided for each 65. A frame-shaped pattern 66 is provided around each block, and an alignment mark 67 for dicing is provided inside the pattern 66 with a slight distance therebetween. The frame-shaped pattern 66 is used for fitting with a molding die, and has a function of reinforcing the insulating resin 50 after the back surface of the conductive foil 60 is etched.

The second step of the present invention is as shown in FIG.
The circuit element 52 is attached to each mounting portion 65 of the desired conductive pattern 51.
To form a connection means for electrically connecting the electrode of the circuit element 52 of each mounting portion 65 and the desired conductive pattern 51.

The circuit element 52 is a semiconductor element such as a transistor, a diode or an IC chip, or a passive element such as a chip capacitor or a chip resistor. Although the thickness is increased, face-down semiconductor elements such as CSP and BGA can also be mounted.

Here, the bare transistor chip 52 is used.
A is die-bonded to the conductive pattern 51A, and the emitter electrode and the conductive pattern 51B, and the base electrode and the conductive pattern 51B are connected to each other through a metal thin wire 55A fixed by ball bonding by thermocompression bonding or wedge bonding by ultrasonic waves. . Further, 52B is a chip capacitor or a passive element, which is fixed by a brazing material such as solder or a conductive paste 55B.

In this step, since a large number of conductive patterns 51 are integrated in each block 62, there is an advantage that the circuit element 52 can be fixed and wire bonded very efficiently.

The third step of the present invention is as shown in FIG.
The remaining portion 57 of the conductive foil 60 around the block 62 is sandwiched between the molding dies 58A and 58B, and the mounting portions 6 of the block 62 are mounted.
5 is arranged in the same cavity 59 and transfer molding is performed with the insulating resin 50 so that the separation groove 61 is filled with the resin.

In this step, as shown in FIG. 6A, the insulating resin 50 completely covers the circuit elements 52A, 52B and the plurality of conductive patterns 51A, 51B, 51C, and the isolation grooves 61 between the conductive patterns 51 are formed in the isolation grooves 61. The conductive patterns 51A, 51B, and 51C filled with the insulating resin 50 are fitted with the curved structures on the side surfaces and firmly coupled. And insulating resin 5
The conductive pattern 51 is supported by 0.

Further, this step is characterized in that transfer molding is performed using a thermosetting resin such as an epoxy resin. That is, as shown in FIG. 6B, each block 62 accommodates the mounting portion 65 in one common molding die,
Molding is performed in common with one insulating resin 50 for each block. Therefore, compared to the conventional method of individually molding each mounting portion such as transfer molding, the amount of resin can be significantly reduced, and the molding die can be shared.

Further, referring to FIG. 6C in detail, the remaining portion 57 of the conductive foil 60 around the block 62 is sandwiched between molding dies 58A and 58B, and the mounting portions 65 of the block 62 are placed in the same cavity 59. It is arranged. This residual part 5
Since 7 is formed of the conductive foil 60 made of metal, there is no problem because it is removed in a later step even if it is deformed by being pressed and clamped by the molding dies 58A and 58B. In addition, each mounting portion 65 of each block 62 is arranged in the cavity 59 so as to face downward, and the insulating resin 5 is filled so as to fill the separation groove 61.
Transfer mold 0.

Insulating resin 5 coated on the surface of the conductive foil 60
The thickness of 0 is the bonding wire 55 of the circuit element 52.
It is adjusted so that about 100 μm from the top of A is covered. This thickness can be increased or decreased in consideration of strength.

The feature of this step is that the conductive foil 60 which becomes the conductive pattern 51 serves as a supporting substrate until the insulating resin 50 is covered. Conventionally, as shown in FIG. 12, the conductive substrate 7 to 11 is formed by using the supporting substrate 5 which is not necessary originally, but in the present invention, the conductive foil 60 serving as the supporting substrate.
Is a material required as an electrode material. Therefore, there is a merit that the constituent materials can be omitted as much as possible, and the cost can be reduced.

Further, since the separation groove 61 is formed shallower than the thickness of the conductive foil, the conductive foil 60 is formed in the conductive pattern 51.
As not individually separated. Therefore, the sheet-shaped conductive foil 60 can be handled as a unit, and when the insulating resin 50 is molded, the work of transferring to the mold and mounting on the mold is very easy.

The fourth step of the present invention is as shown in FIG.
The purpose is to remove the conductive foil 60 in the thickness portion where the separation groove 61 is not provided. Specifically, at least a region of the block 62 of the conductive foil 60 where the separation groove 61 is not provided, in which the conductive pattern 51 is provided, is removed, and a connecting portion 90 that connects the blocks 62 (the remaining portion 57 in the previous step). The same as the above) is to selectively leave the conductive foil 60.

In this step, as shown in FIG. 7A, the conductive foil 6
At least the conductive pattern 5 of each block 62 on the back surface of 0
Except for the region 91 in which 1 is provided, it is covered so as to overlap with the peripheral end portion of the insulating resin 50. After that, the exposed conductive foil 60
The area 91 where the conductive pattern 51 is provided is selectively wet-etched by exposing the conductive solution 51 to expose the conductive pattern 51.

FIG. 7B is a cross-sectional view after the above-mentioned wet etching is completed, showing the upper and lower peripheral edges of the conductive foil 60 and each block 6.
The portion where the slit 63 of 2 is provided remains as the connecting portion 90 without the conductive foil 60 being etched, and each block 62
Has the function of maintaining the state as it is. By the action of the connecting portion 90, each block 62 can be taken out from the etching apparatus together with the connecting portion 90.

In this step, the region where the conductive pattern 51 is selectively provided on the conductive foil 60 is wet-etched before the insulating resin 50 shown by the dotted line in FIG. 6 is exposed. As a result, the conductive pattern 51 having a thickness of about 40 μm is separated, and the back surface of the conductive pattern 51 is exposed to the insulating resin 50. That is, the surface of the insulating resin 50 filled in the separation groove 61 and the surface of the conductive pattern 51 are
The structure is substantially the same. Therefore, the circuit device 53 of the present invention is the same as the conventional back surface electrodes 10 and 1 shown in FIG.
Since the step is not provided unlike in No. 1, it has a feature that it can be horizontally moved as it is by the surface tension of solder or the like during mounting and self-aligned.

Further, the back surface of the conductive pattern 51 is processed to obtain the final structure shown in FIG. That is, a conductive material such as solder is applied to the conductive pattern 51 exposed as necessary to form the back surface electrodes 56A, 56B, 56C, and the circuit device is completed.

The fifth step of the present invention is to separate the block 62 from the connecting portion 90 of the conductive foil 60, as shown in FIG. 7B.

In this step, each block 62 connected by the connecting portion 90 is pressed so as to be pushed up from the connecting portion 90 side as shown by an arrow, and the adhesive surface between the connecting portion 90 and the insulating resin 50 is mechanically peeled off. And each block 62 is separated. Therefore, in this step, no special cutting die is required, and there is an advantage that the work can be performed by an extremely simple method.

The sixth step of the present invention is as shown in FIG.
This is to attach the plurality of blocks 62 to the adhesive sheet 80 by bringing the insulating resin into contact therewith.

After the back surface of the conductive foil 60 is etched in the previous step, the blocks 62 are separated from the conductive foil 60.

In this step, the periphery of the pressure-sensitive adhesive sheet 80 is attached to a stainless steel ring-shaped metal frame 81, and four blocks 62 are provided in the central portion of the pressure-sensitive adhesive sheet 80 at intervals so that the blade does not hit the dicing blade. Is provided and the insulating resin 50 is brought into contact with and affixed. A UV sheet (manufactured by Lintec) is used as the adhesive sheet 80.
Since each block 62 is made of insulating resin 50 and has mechanical strength, an inexpensive dicing sheet can be used.

In the seventh step of the present invention, as shown in FIG. 10, the circuit element of each mounting portion 65 of each block 62, which is collectively molded with the insulating resin 50 while being adhered to the adhesive sheet 80. 52 to measure the characteristics.

As shown in FIG. 10, the back surface of each block 62 exposes the back surface of the conductive pattern 51, and the respective mounting portions 65 are arranged in a matrix exactly as when the conductive pattern 51 was formed. A probe 68 is applied to the back surface electrode 56 exposed from the insulating resin 50 of the conductive pattern 51, and characteristic parameters and the like of the circuit element 52 of each mounting portion 65 are individually measured to determine whether they are good or bad, and to determine defective products. Mark with magnetic ink.

In this process, the circuit device 53 of each mounting portion 65
Since the blocks are integrally supported by the insulating resin 50 for each block 62, they are not individually separated. Therefore, the plurality of blocks 62 attached to the adhesive sheet 80 are vacuum-sucked to the mounting table of the tester, and the blocks 6
By performing pitch feed in the vertical direction and the horizontal direction by the size of the mounting portion 65 for each 2 as shown by the arrow, the circuit devices 53 of the mounting portions 65 of the block 62 can be measured extremely quickly and in large quantities. That is, it is possible to eliminate the need for discrimination between the front and the back of the circuit device and the recognition of the electrode positions, which are conventionally required, and since a plurality of blocks 62 are processed at the same time, the measurement time can be greatly shortened.

In the eighth step of the present invention, as shown in FIG. 11, the block 6 is attached to the adhesive sheet 80.
The second insulating resin 50 is separated for each mounting portion 65 by dicing.

In this step, the plurality of blocks 62 attached to the adhesive sheet 80 are vacuum-sucked to the mounting table of the dicing device, and each mounting portion 6 is moved by the dicing blade 69.
The insulating resin 50 in the separation groove 61 is diced along the dicing line 70 between the five to separate the individual circuit devices 53.

In this step, the dicing blade 69 completely cuts the insulating resin 50 and performs dicing with a cutting depth reaching the surface of the adhesive sheet, and completely separates each mounting portion 65. At the time of dicing, the alignment mark 67 integrated with the frame-shaped pattern 66 around each block previously provided in the first step is recognized, and dicing is performed based on this. As is well known, the dicing is performed by dicing all the dicing lines 70 in the vertical direction and then rotating the mounting table by 90 degrees to obtain the horizontal dicing lines 70.
Dicing according to.

Further, in this step, since only the insulating resin 50 with which the separation groove 61 is filled is present in the dicing line 70, the dicing blade 69 is less worn, and metal burrs do not occur, so that the dicing can be performed with an extremely accurate outer shape. There are features.

Furthermore, even after this step, the adhesive sheet 80 does not cause the individual circuit devices to fall apart after the dicing.
You can work efficiently in the subsequent taping process. That is, in the circuit device integrally supported by the adhesive sheet 80, only non-defective products can be identified and stored in the storage hole of the carrier tape by separating from the adhesive sheet 80 with the suction collet. For this reason, even a minute circuit device is characterized in that it is not separated into pieces even before taping.

[0071]

According to the present invention, the conductive foil itself, which is the material of the conductive pattern, functions as a supporting substrate, and the conductive foil is used as a whole until the formation of the separation groove, the mounting of the circuit element, and the deposition of the insulating resin. When supporting and separating the conductive foil as each conductive pattern, an insulating resin is used as a support substrate to function. Therefore, the circuit element, the conductive foil, and the insulating resin can be manufactured with the minimum necessary amount. As described in the conventional example, a supporting substrate is not required to originally configure a circuit device, and the cost can be reduced. In addition, a support substrate is not required, the conductive pattern is embedded in the insulating resin, and the thickness of the insulating resin and conductive foil can be adjusted. There is also.

Further, by sticking a plurality of blocks to the adhesive sheet 80, it is possible to process a minute circuit device without breaking it up to the end, and it is possible to realize a manufacturing method having an extremely high mass production effect.

Further, according to the present invention, since transfer molding can be realized for each block of the conductive foil, the blocks can be collectively molded, which is suitable for mass production. Further, by making the size of the block common in this molding die, the troublesomeness of designing the molding die for each product as in the conventional case is released.

Furthermore, in the dicing process, there is an advantage that the dicing line can be recognized quickly and surely by using the alignment mark. Further, dicing may be performed by cutting only the insulating resin layer, and by not cutting the conductive foil, the life of the dicing blade can be extended and metal burrs generated when cutting the conductive foil are not generated.

Further, as apparent from FIG. 14, since the through hole forming step, the conductor printing step (in the case of a ceramic substrate) and the like can be omitted, the manufacturing process can be greatly shortened as compared with the conventional one, and the entire process can be completed. It has the advantage of being made. In addition, no frame mold is required, and the manufacturing method is extremely short.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a manufacturing flow of the present invention.

FIG. 2 is a diagram illustrating a method of manufacturing a circuit device according to the present invention.

FIG. 3 is a diagram illustrating a method of manufacturing a circuit device according to the present invention.

FIG. 4 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.

FIG. 5 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.

FIG. 6 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.

FIG. 7 is a diagram illustrating a method of manufacturing a circuit device according to the present invention.

FIG. 8 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.

FIG. 9 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.

FIG. 10 is a drawing for explaining the manufacturing method of the circuit device of the present invention.

FIG. 11 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.

FIG. 12 is a diagram illustrating a mounting structure of a conventional circuit device.

FIG. 13 is a diagram illustrating a conventional circuit device.

FIG. 14 is a diagram illustrating a conventional method for manufacturing a circuit device.

FIG. 15 is a diagram illustrating a conventional method for manufacturing a circuit device.

[Explanation of symbols]

50 Insulating resin 51 Conductive pattern 52 circuit elements 53 Circuit device 57 Residual part 58 Mold Dies 61 separation groove 62 blocks 80 Adhesive sheet

Continued front page    (72) Inventor Junji Sakamoto             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. (72) Inventor Yukio Okada             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. (72) Inventor Yusuke Igarashi             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. (72) Inventor Eiju Maehara             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. (72) Inventor Kouji Takahashi             29 Kita-cho, Isesaki-shi, Gunma Kanto Sanyoden             Child Co., Ltd. F-term (reference) 5F061 AA01 BA03 CA21

Claims (14)

[Claims] 1. A step of forming a conductive pattern for forming a large number of circuit element mounting portions on a conductive foil for each block, and a step of disposing the circuit element on each mounting portion of the conductive pattern of each block. A step of sandwiching the remaining portion of the conductive foil around the block with a molding die, placing each mounting portion of the block in the same cavity, and transfer-molding with an insulating resin so as to fill the separation groove. And a step of separating the insulating resin for each of the mounting parts by dicing. 2. A step of forming a conductive pattern for forming a plurality of circuit element mounting portions on a conductive foil for each block, and a step of disposing the circuit element on each mounting portion of the conductive pattern of each block. A step of forming a connecting means for electrically connecting the electrode of the circuit element of each of the mounting parts and the desired conductive pattern, and sandwiching the remaining part of the conductive foil around the block with a molding die, A step of placing each mounting portion of the block in the same cavity and transfer-molding it with an insulating resin so as to fill the separation groove; and a step of separating the insulating resin for each mounting portion by dicing. A method of manufacturing a circuit device, comprising: 3. The method for manufacturing a circuit device according to claim 1, wherein the conductive foil is made of any one of copper, aluminum and iron-nickel. 4. The method for manufacturing a circuit device according to claim 1, wherein the surface of the conductive foil is at least partially covered with a conductive film. 5. The method of manufacturing a circuit device according to claim 4, wherein the conductive coating is formed by nickel, gold or silver plating. 6. The method of manufacturing a circuit device according to claim 1, wherein either or both of a semiconductor bare chip and a chip circuit component are fixed to the circuit element. 7. The method of manufacturing a circuit device according to claim 2, wherein the connecting means is formed by wire bonding. 8. The conductive foil according to claim 1, wherein a plurality of blocks in which conductive patterns forming at least a large number of circuit element mounting portions are arranged in a matrix are arranged on the conductive foil. Circuit device manufacturing method. 9. The method for manufacturing a circuit device according to claim 8, wherein the insulating resin is formed by simultaneously transfer-molding all the blocks of the conductive foil. 10. The method of manufacturing a circuit device according to claim 8, wherein each of the blocks separated from the conductive foil is subjected to the subsequent steps while being attached to an adhesive sheet. 11. The manufacturing of the circuit device according to claim 10, wherein each of the blocks molded by the insulating resin attached to the adhesive sheet is separated into each mounting portion by dicing. Method. 12. The method of manufacturing a circuit device according to claim 11, wherein dicing is performed using a registration mark formed together with the conductive pattern. 13. The method of manufacturing a circuit device according to claim 11, wherein the pressure-sensitive adhesive sheet is vacuum-sucked to a mounting table to perform dicing. 14. The method for manufacturing a circuit device according to claim 11, wherein the cutting depth of the insulating resin during dicing is set to be equal to or larger than the thickness of the insulating resin, and the circuit device is completely separated. .