JP2003071731A - Dimple structure abrasive material - Google Patents
Dimple structure abrasive materialInfo
- Publication number
- JP2003071731A JP2003071731A JP2001265612A JP2001265612A JP2003071731A JP 2003071731 A JP2003071731 A JP 2003071731A JP 2001265612 A JP2001265612 A JP 2001265612A JP 2001265612 A JP2001265612 A JP 2001265612A JP 2003071731 A JP2003071731 A JP 2003071731A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive
- binder
- holes
- dimples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は研磨材料に関し、特
に、樹脂、塗膜等の有機材料製品の仕上げ加工に適した
シート状の研磨材料に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an abrasive material, and more particularly to a sheet-like abrasive material suitable for finishing organic material products such as resins and coating films.
【０００２】[0002]
【従来の技術】研磨面が平坦な研磨製品を用いて研磨を
行なうと安定した研磨及び研磨精度が得られない。この
原因は研磨時、研磨製品と被研磨面との間に研磨屑がた
まり、その研磨屑により被研磨面が傷ついたり、研磨屑
が被研磨面に付着し研磨精度を低下させることにある。2. Description of the Related Art Stable polishing and polishing accuracy cannot be obtained when polishing is performed using a polishing product having a flat polishing surface. The cause of this is that during polishing, polishing debris accumulates between the polishing product and the surface to be polished, the polishing debris damages the surface to be polished, and the polishing debris adheres to the surface to be polished, lowering the polishing accuracy.
【０００３】この問題を解消するため、研磨製品の表面
に凹凸を形成し、研磨屑や脱落した研磨材粒子を凹部に
集めて除く技術が知られている。In order to solve this problem, there is known a technique in which irregularities are formed on the surface of an abrasive product to collect and remove polishing debris and fallen abrasive particles in the recess.
【０００４】例えば、第３０１２２６１号特許掲載公報
には、研磨層が立体構造を有する研磨材料が記載されて
いる。この研磨材料は、基材と基材上に設けられた担持
層と担持層上に被覆された研磨層とを有し、該担持層が
均一で規則的な凹凸形状に賦形されたものである。For example, Japanese Patent No. 3012261 discloses an abrasive material in which an abrasive layer has a three-dimensional structure. This polishing material has a base material, a carrier layer provided on the base material, and a polishing layer coated on the carrier layer, and the carrier layer is shaped in a uniform and regular uneven shape. is there.
【０００５】特開昭６３−１６９８０号公報には、基材
へバインダー及び砥粒を塗布し、乾燥した後、凹凸パタ
ーンを有するロールでエンボス加工を施し、凹凸版胴つ
きのカレンダーロールでプレスする等して、研磨層の表
面に凹凸を形成した研磨材料が記載されている。In Japanese Patent Laid-Open No. 63-16980, a base material is coated with a binder and abrasive grains, dried, and then embossed with a roll having a concavo-convex pattern, and pressed with a calendar roll having a concavo-convex cylinder. Then, a polishing material in which unevenness is formed on the surface of the polishing layer is described.
【０００６】特開平１−１７１７７１号公報には、あら
かじめエンボス加工して凹凸パターンのついた基材の表
面に、バインダーと、該バインダーにより基材に接着さ
れた砥粒とを有する研磨材料が記載されている。Japanese Unexamined Patent Publication (Kokai) No. 1-171771 describes an abrasive material having a binder and abrasive grains adhered to the substrate by the binder on the surface of the substrate which is embossed in advance and has an uneven pattern. Has been done.
【０００７】これらの研磨材料では、研磨層に形成され
た凹凸は、一の凸部に対し、凹部はその周りを取り囲む
か又は平行して、連続溝を形成するような構造になって
いる。上述のように、研磨層に凹凸を形成するのは研磨
屑や脱落した研磨材粒子を凹部に集めて除くためである
が、凹部が連続溝状であるとそのエッジにより、又収集
された研磨屑等が比較的自由に移動することで、被研磨
面に傷が生じる可能性が高い。In these polishing materials, the unevenness formed on the polishing layer has a structure in which one concave portion surrounds the concave portion or is parallel to the concave portion to form a continuous groove. As described above, the unevenness is formed in the polishing layer in order to collect and remove the polishing dust and the removed abrasive particles in the concave portion, but if the concave portion is a continuous groove, the edge and the collected polishing Since the scraps and the like move relatively freely, the surface to be polished is likely to be scratched.
【０００８】また、上記研磨層では凸部に接着された砥
粒によって研磨が行われるが、突出した凸部には負荷が
かかり易く、砥粒の磨耗が促進されて研磨材料の寿命が
短くなる。Further, in the above-mentioned polishing layer, polishing is performed by the abrasive grains adhered to the convex portions, but the protruding convex portions are likely to be loaded, the abrasion of the abrasive grains is accelerated, and the life of the polishing material is shortened. .
【０００９】[0009]
【発明が解決しようとする課題】本発明は上記従来の問
題を解決するものであり、その目的とするところは、被
研磨面を傷つけず平滑精密に研磨することが可能であ
り、研磨効率に優れ、研磨寿命が長い研磨材料を提供す
ることにある。SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems of the prior art. The object of the present invention is to enable smooth and precise polishing without damaging the surface to be polished, and to improve the polishing efficiency. It is to provide an abrasive material which is excellent and has a long polishing life.
【００１０】[0010]
【課題を解決するための手段】本発明は、基材と、基材
の表面上に被覆されたバインダーと、該バインダーによ
り基材に接着された砥粒とを有するシート状の研磨材料
において、研磨面の全体にわたって配置され、相互に独
立した形状である複数のディンプル又は貫通穴を有し、
研磨面の被研磨体に対する有効接触面積が５０〜９６％
である研磨材料を提供するものであり、そのことにより
上記目的が達成される。The present invention provides a sheet-like polishing material having a substrate, a binder coated on the surface of the substrate, and abrasive grains adhered to the substrate by the binder, Arranged over the entire polishing surface, having a plurality of dimples or through holes that are independent of each other,
The effective contact area of the polishing surface with the object to be polished is 50-96%
The above object is achieved thereby.
【００１１】[0011]
【発明の実施の形態】図１は本発明の研磨材料の一実施
態様を示す断面図である。基材１１の表面上にバインダ
ー１２が被覆され、砥粒１３はバインダー１２により基
材１１に接着されている。1 is a sectional view showing an embodiment of an abrasive material of the present invention. A binder 12 is coated on the surface of the base material 11, and the abrasive grains 13 are bonded to the base material 11 by the binder 12.
【００１２】研磨材料には複数の貫通穴１４が設けられ
ている。貫通穴の代わりに基材の裏面まで貫通していな
いディンプルを設けてもよい。この貫通穴やディンプル
により、研磨屑や脱落した研磨材粒子が収集保持され
て、被研磨面に筋状の傷が入ることが有効に防止され
る。更に、貫通穴の場合は研磨面の塗装面に対する吸着
が効果的に防止されて研磨効率が向上する。A plurality of through holes 14 are provided in the polishing material. Instead of the through holes, dimples that do not penetrate to the back surface of the base material may be provided. The through holes and the dimples effectively collect and hold polishing dust and fallen abrasive particles, and effectively prevent streaky scratches from entering the surface to be polished. Further, in the case of the through hole, the adsorption of the polishing surface to the coating surface is effectively prevented, and the polishing efficiency is improved.
【００１３】ディンプル又は貫通穴の形状は、各々が相
互に独立しており、連続溝を形成しない形状であれば特
に限定されない。例えば、円形、楕円形、六角形、四角
形、菱形及び三角形のような多角形等が適宜選択され
る。The shapes of the dimples or the through holes are not particularly limited as long as they are independent of each other and do not form a continuous groove. For example, a circle, an ellipse, a hexagon, a quadrangle, a rhombus, and a polygon such as a triangle are appropriately selected.
【００１４】このディンプル又は貫通穴は、小さすぎる
と目詰まりを起こして研磨屑等を収集する機能が悪くな
り、大きすぎると研磨材料の強度や研磨効率が低下す
る。従って、ディンプル又は貫通穴の寸法は研磨材料の
外寸（直径比）を基準にして２〜８％程度とすることが
好ましい。If the dimples or the through holes are too small, they will be clogged to deteriorate the function of collecting polishing debris, and if too large, the strength and polishing efficiency of the polishing material will be reduced. Therefore, the size of the dimples or the through holes is preferably about 2 to 8% based on the outer size (diameter ratio) of the polishing material.
【００１５】具体的には、ディンプル又は貫通穴の寸法
は、ディンプル又は貫通穴が円形の場合はφ０．５〜φ
１０ｍｍ、好ましくはφ２〜φ６ｍｍ、方形の場合は□
０．２〜□１０ｍｍ、好ましくは□２〜□６ｍｍの範囲
の寸法とされる。Specifically, the dimensions of the dimples or through holes are φ0.5 to φ when the dimples or through holes are circular.
10 mm, preferably φ2 to φ6 mm, square for square
The size is in the range of 0.2 to 10 mm, preferably 2 to 6 mm.
【００１６】ディンプル又は貫通穴は研磨材料の研磨面
全体にわたって配置されることが好ましい。研磨面の一
部にディンプル又は貫通穴が無い領域があると、その領
域では研磨屑等の収集が行われず、また研磨材料が被研
磨体に対して吸着するため研磨効率が低下する。The dimples or through holes are preferably arranged over the entire polishing surface of the polishing material. If there is a region without dimples or through holes in a part of the polishing surface, polishing debris or the like will not be collected in that region, and the polishing material will be adsorbed to the object to be polished, resulting in a decrease in polishing efficiency.
【００１７】ディンプル又は貫通穴は全て同一形状、又
は同一寸法である必要はない。基材の表面全体にわたっ
て配置されていると判断できれば、異なる形状、異なる
寸法のものが混在していてもよい。但し、それらの配置
は規則性を有していることが好ましい。The dimples or through holes need not all have the same shape or size. Different shapes and different sizes may be mixed as long as it can be determined that they are arranged over the entire surface of the base material. However, it is preferable that their arrangement has regularity.
【００１８】ディンプル又は貫通穴の研磨面側の縁は面
取りされていることが好ましい。ディンプル又は貫通穴
の研磨面側の縁が鋭利であったり突出していると、被研
磨面を傷つける怖れがあるからである。It is preferable that the edge of the dimple or the through hole on the polishing surface side is chamfered. This is because if the edge of the dimple or the through hole on the side of the polishing surface is sharp or protrudes, the surface to be polished may be damaged.
【００１９】貫通穴は、好ましくは、研磨材料を打ち抜
き加工して形成される。研磨材料を打ち抜く際には、そ
の研磨面から基材の裏面へ向かう方向に刃を入れること
が好ましい。そのことによって貫通穴の研磨面側の縁が
面取りされるからである。また、貫通穴は基材を予め打
ち抜いて形成しておいてもよい。The through hole is preferably formed by punching an abrasive material. When punching out the polishing material, it is preferable to insert a blade in the direction from the polishing surface to the back surface of the substrate. This is because the edge of the through hole on the polishing surface side is chamfered. Further, the through hole may be formed by punching the base material in advance.
【００２０】ディンプルは、好ましくは、基材をエンボ
ス加工して形成される。また、ディンプルは、レプリカ
法で形成してもよい。これらの方法によれば、ディンプ
ル形状を均一かつ規則的に、再現性良く賦形することが
でき、研磨材料による研磨の精密性及び仕上がりが向上
し、更にディンプルの研磨面側の縁が面取りされるから
である。The dimples are preferably formed by embossing a base material. Further, the dimples may be formed by the replica method. According to these methods, the dimple shape can be uniformly and regularly formed with good reproducibility, the precision and finish of polishing by the polishing material are improved, and the edge of the dimple on the polishing surface side is chamfered. This is because that.
【００２１】本発明の研磨材料では、研磨面の被研磨体
に対する有効接触面積が５０〜９５％であることが好ま
しい。より好ましくは、水磨き手動研磨ブロックにおい
ては、有効接触面積は７５〜９０％、特に８０〜８５％
である。有効接触面積とは、ディンプル又は貫通穴がな
い場合の研磨材表面の面積に対するディンプル又は貫通
穴を除いた部分の研磨材表面の面積の割合（％）をい
う。In the polishing material of the present invention, the effective contact area of the polishing surface with the object to be polished is preferably 50 to 95%. More preferably, in a water-polished manual polishing block, the effective contact area is 75-90%, especially 80-85%.
Is. The effective contact area means the ratio (%) of the area of the surface of the abrasive material excluding the dimples or through holes to the area of the surface of the abrasive material when there are no dimples or through holes.
【００２２】有効接触面積が５０％未満になると、研磨
中に砥粒にかかる負荷が増大して脱粒等が増加するた
め、研磨効率が低下する。有効接触面積が９５％を越え
ると研磨効率の向上効果が得られない。When the effective contact area is less than 50%, the load applied to the abrasive grains during polishing increases and the shedding etc. increases, so that the polishing efficiency decreases. If the effective contact area exceeds 95%, the effect of improving the polishing efficiency cannot be obtained.
【００２３】本発明の研磨材料に用いる基材は、シート
状研磨材料の基材として通常使用される材料であればよ
い。具体的には、ポリマーフィルム、織布、不織布、
紙、含浸紙、ポリマー被覆紙等が使用できる。特に好ま
しい基材はオイル含浸紙、ポリマー被覆紙、ポリエチレ
ンテレフタレートのようなポリエステルフィルム、及び
これらの金属蒸着紙及びフィルムである。基材の厚さ
は、一般に１２〜１５０μｍ、好ましくは３８〜１００
μｍである。The substrate used for the polishing material of the present invention may be any material that is usually used as a substrate for a sheet-shaped polishing material. Specifically, polymer film, woven cloth, non-woven cloth,
Paper, impregnated paper, polymer-coated paper, etc. can be used. Particularly preferred substrates are oil impregnated papers, polymer coated papers, polyester films such as polyethylene terephthalate, and metallized papers and films thereof. The thickness of the substrate is generally 12 to 150 μm, preferably 38 to 100 μm.
μm.
【００２４】基材の表面には、バインダーにより砥粒が
接着される。バインダーとしては、接着強度が充分に確
保でき、精密機器、精密部品の仕上げ加工用研磨材料に
通常用いられるものを使用する。例えば、フェノール樹
脂、エポキシ樹脂、ポリエステル樹脂、ウレタン樹脂、
アクリル樹脂等が挙げられる。Abrasive grains are adhered to the surface of the base material by a binder. As the binder, a binder that can ensure a sufficient adhesive strength and is commonly used for polishing materials for finishing precision equipment and precision parts is used. For example, phenol resin, epoxy resin, polyester resin, urethane resin,
Acrylic resin etc. are mentioned.
【００２５】砥粒としては、精密機器、精密部品の仕上
げ加工用研磨材料に通常用いられるものを使用する。例
えば、材質としては、酸化アルミニウム、酸化セリウ
ム、シリコンカーバイド、ダイヤモンド、酸化アルミナ
についてさらに言えば溶融アルミナ、セラミックアルミ
ナ（ゾルゲルアルミナを含む）等が挙げられる。また、
砥粒はポリメタクリル酸エステル、ポリスチレン、ポリ
オレフィン等からなるプラスチック製微粒子であっても
良い。砥粒の寸法は、一般に平均粒径５３〜０．４５μ
ｍ程度である。すなわち、平均粒径５３μｍ（ＪＩＳ＃
２２０）〜０．４５μｍ（＃２００００）、好ましくは
平均粒径５μｍ（＃２５００）〜４０μｍ（＃３６０）
である。As the abrasive grains, those commonly used in polishing materials for finishing precision equipment and precision parts are used. For example, examples of the material include aluminum oxide, cerium oxide, silicon carbide, diamond, alumina oxide, and further, fused alumina, ceramic alumina (including sol-gel alumina), and the like. Also,
The abrasive grains may be plastic fine particles made of polymethacrylic acid ester, polystyrene, polyolefin or the like. The size of the abrasive grains is generally 53 to 0.45 μm in average grain size.
It is about m. That is, the average particle size is 53 μm (JIS #
220) to 0.45 μm (# 20000), preferably an average particle size of 5 μm (# 2500) to 40 μm (# 360).
Is.
【００２６】本発明の研磨材料は、まずディンプル又は
貫通穴を有しない基材を用いて研磨面が平坦な研磨材料
を製造し、その後、基材の表面全体にわたって、相互に
独立した形状である複数のディンプル又は貫通穴を形成
することにより製造できる。あるいは、基材の表面全体
にわたって相互に独立した形状である複数のディンプル
又は貫通穴を形成し、この基材にバインダー及び砥粒を
被覆し、そして加熱してバインダーを硬化させることに
より製造してもよい。The polishing material of the present invention is produced by first using a base material having no dimples or through holes to produce a polishing material having a flat polishing surface, and then forming the polishing material over the entire surface of the base material in mutually independent shapes. It can be manufactured by forming a plurality of dimples or through holes. Alternatively, it is prepared by forming a plurality of dimples or through holes having shapes independent from each other over the entire surface of the base material, coating the base material with a binder and abrasive grains, and heating the binder to cure the binder. Good.
【００２７】砥粒は基材の表面にほぼ一列に並ぶよう
に、単層にて被覆されることが好ましい。研磨材料の砥
粒の保持力及び砥粒の利用効率が良好になり、フィルム
表面に存在する凹凸をそのまま維持できるからである。The abrasive grains are preferably coated in a single layer so that they are lined up in a line on the surface of the base material. This is because the holding power of the abrasive grains of the polishing material and the utilization efficiency of the abrasive grains are improved, and the irregularities present on the film surface can be maintained as they are.
【００２８】砥粒は静電スプレー塗布法を用いて塗布す
ることが好ましい。砥粒の配置に配向性を持たせること
ができ、その結果、研磨材料の研磨効率が向上するから
である。図２（ａ）は静電スプレー塗布法の原理を示す
模式断面図である。スプレーノズル５４の正面に所定の
間隔をおいて被塗物５６を対向させる。砥粒５１やバイ
ンダー（非表示）は直流高圧電源５２により帯電させら
れ、空気流５３によりスプレーノズル５４から吐出され
る。The abrasive grains are preferably applied using an electrostatic spray coating method. This is because the arrangement of the abrasive grains can be made to have an orientation, and as a result, the polishing efficiency of the polishing material is improved. FIG. 2A is a schematic sectional view showing the principle of the electrostatic spray coating method. The object 56 to be coated is opposed to the front surface of the spray nozzle 54 at a predetermined interval. The abrasive grains 51 and the binder (not shown) are charged by the DC high-voltage power supply 52 and ejected from the spray nozzle 54 by the air flow 53.
【００２９】砥粒５１やバインダーは、高電圧をかけた
ガン尖端針電極５５から被塗物（研磨材料の基材に相
当）５６に向かって流れるコロナ放電流により、クーロ
ン力によって被塗物に付着させられる。この方法では、
ガン尖端針電極５５被塗物５６の間に静電界５７がで
き、静電スプレー先端部でイオン化された砥粒５１等は
静電界５７に沿って飛行し、被塗物の表面に均一に付着
する。The abrasive grains 51 and the binder are applied to the object by Coulomb force by the corona discharge current flowing from the gun tip needle electrode 55 to which high voltage is applied toward the object 56 (corresponding to the base material of the polishing material). Attached. in this way,
An electrostatic field 57 is created between the gun tip needle electrode 55 and the object 56 to be coated, and the abrasive grains 51 and the like ionized at the tip of the electrostatic spray flies along the electrostatic field 57 and uniformly adheres to the surface of the object to be coated. To do.
【００３０】その結果、図２（ｂ）に示すように、スラ
リー法による場合と比較して、基材の表面における砥粒
の配向性が適度に生じ、研磨力に優れる研磨材料が得ら
れる。更に、静電反発によって、付着した砥粒の上には
新たな砥粒は付着せず、基材の表面に砥粒がほぼ単層に
て被覆され、砥粒の保持力及び砥粒の利用効率が良好に
なる。As a result, as shown in FIG. 2B, as compared with the case of using the slurry method, the orientation of the abrasive grains on the surface of the substrate is appropriately generated, and a polishing material having excellent polishing power can be obtained. Furthermore, due to electrostatic repulsion, no new abrasive particles will adhere to the adhered abrasive particles, and the surface of the base material will be covered with the abrasive particles in a substantially single layer. Efficiency is good.
【００３１】バインダーと砥粒とは別々に塗布してもよ
いが、バインダーと砥粒との混合物（研磨塗液）を予め
調製し、これを静電スプレー塗布法により直接基材に塗
布してもよい。The binder and the abrasive grains may be applied separately, but a mixture of the binder and the abrasive grains (polishing coating liquid) is prepared in advance, and this is directly applied to the substrate by the electrostatic spray coating method. Good.
【００３２】基材にバインダー及び砥粒を塗布した後、
バインダーを硬化させて研磨材料が得られる。バインダ
ーの硬化は、一般に加熱により行なう。After coating the substrate with the binder and abrasive grains,
The binder is cured to obtain an abrasive material. The binder is generally cured by heating.
【００３３】基材に砥粒を塗布する方法として、スラリ
ー塗布法、及び静電スプレー塗布法に類似の静電塗布法
等を用いてもよい。As a method of applying the abrasive grains to the substrate, a slurry coating method, an electrostatic coating method similar to the electrostatic spray coating method, or the like may be used.
【００３４】図３（ａ）はスラリー塗布法の原理を示す
模式断面図である。砥粒とバインダーとを含有するスラ
リー状の塗液６１が、ブレードで平坦化され、図３
（ｂ）に示すような研磨材料が得られる。FIG. 3A is a schematic sectional view showing the principle of the slurry coating method. A slurry-like coating liquid 61 containing abrasive grains and a binder is flattened by a blade,
The polishing material as shown in (b) is obtained.
【００３５】図４（ａ）は静電塗布法の原理を示す模式
断面図である。ホットプレート７３の上に砥粒７１を乗
せ、一定間隔をおいて被塗物７４を対向させる。交流高
圧電源（２．５〜６０Ｈｚ、０〜６０ｋＶ）７２により
ホットプレート７３に電圧をかけ、砥粒７１は帯電させ
られる。同時にホットプレート７１と被塗物７４の間に
静電界７５ができ、砥粒７２はクーロン力によって被塗
物７４に引き寄せられ、その表面に付着して、図４
（ｂ）に示すような研磨材料が得られる。FIG. 4A is a schematic sectional view showing the principle of the electrostatic coating method. The abrasive grains 71 are placed on the hot plate 73, and the article 74 to be coated is opposed to the hot plate 73 at regular intervals. A voltage is applied to the hot plate 73 by an AC high-voltage power supply (2.5 to 60 Hz, 0 to 60 kV) 72 to charge the abrasive grains 71. At the same time, an electrostatic field 75 is created between the hot plate 71 and the object to be coated 74, and the abrasive grains 72 are attracted to the object to be coated 74 by the Coulomb force, and adhere to the surface thereof.
The polishing material as shown in (b) is obtained.
【００３６】本発明の研磨材料は樹脂等の有機材料の研
磨に適している。研磨材料の被研磨面に対する吸着が有
効に防止され、研磨効率が向上するからである。例え
ば、本発明の研磨材料を用いて、鈑金塗装された塗膜に
存在する塗膜欠陥を除去したり、塗装面の肌調整を行な
うことができる。その際、本発明の研磨材料は空砥ぎに
使用しても、水砥ぎに使用してもよい。The polishing material of the present invention is suitable for polishing organic materials such as resins. This is because adsorption of the polishing material to the surface to be polished is effectively prevented and polishing efficiency is improved. For example, the polishing material of the present invention can be used to remove coating film defects present in a coating film coated with sheet metal and to adjust the skin of the coated surface. At that time, the polishing material of the present invention may be used for the air grinding or the water grinding.
【００３７】かかる用途では、研磨材料は通常手動研磨
ブロック、又はサンダーに装着して使用される。手動研
磨ブロックについては、例えば、実開平５−６７４６５
号公報に記載されている。また、サンダーについては、
例えば、特開平７−３１４３１８号公報に記載されてい
る。In such an application, the polishing material is usually attached to a manual polishing block or a sander for use. As for the manual polishing block, for example, actual Kaihei 5-67465
It is described in Japanese Patent Publication No. Also, regarding Thunder,
For example, it is described in JP-A-7-314318.
【００３８】図５及び６は本発明の研磨材料の実施態様
を示す正面図である。図５ａ〜ｄに示されているものは
手動ブロックに装着するための研磨ディスクである。中
心の開口部は研磨面に水等の潤滑液を供給するために設
けられた穴であり、研磨屑の収集機能は有しない。これ
らの研磨ディスクの仕様はそれぞれ以下の通りである。5 and 6 are front views showing an embodiment of the polishing material of the present invention. Shown in Figures 5a-d are abrasive discs for mounting on a manual block. The central opening is a hole provided for supplying a lubricating liquid such as water to the polishing surface, and does not have a polishing dust collecting function. The specifications of these polishing disks are as follows.
【００３９】[0039]
【表１】 [Table 1]
【００４０】図６ａ〜ｃに示されているものはサンダー
に装着するための研磨ディスクである。これらのディス
クの仕様はそれぞれ以下の通りである。Shown in Figures 6a-c is an abrasive disc for mounting on a sander. The specifications of these discs are as follows.
【００４１】[0041]
【表２】 [Table 2]
【００４２】尚、サンダーに装着するための研磨ディス
クについては、従来から貫通穴を複数設けた製品が市販
されている。例えば、スリーエム社製の「ＤＦ−２のり
つきディスクユニ（穴有り）」、「ＤＦ−２ワンタッチ
ペーパーディスクユニ（穴有り）」、「ＤＦ−２スティ
キットTMディスクロールプロダクションTM（穴有
り）」、及び「ＤＦ−２スティキットTMディスクロール
ユニ（穴有り）」等である。しかしながら、これらの研
磨ディスクに設けられた貫通穴は強制吸塵のための吸引
口として使用され、研磨材料の表面全体にわたって配置
されたものではない。従って、強制吸塵を行なわない場
合は、これらの貫通穴のみでは被研磨面から研磨屑を収
集する機能が不十分である。As for the polishing disk to be mounted on the sander, products having a plurality of through holes have been commercially available. For example, "DF-2 glued disc uni (with holes)", "DF-2 one-touch paper disc uni (with holes)", "DF-2 Stickit TM disc roll production TM (with holes)" manufactured by 3M. , And “DF-2 Stickit ™ Disc Roll Uni (with holes)”. However, the through holes provided in these polishing disks are used as suction ports for forced dust collection, and are not arranged over the entire surface of the polishing material. Therefore, when forced dust absorption is not performed, the function of collecting polishing debris from the surface to be polished is insufficient with only these through holes.
【００４３】[0043]
【実施例】以下の実施例により本発明を更に具体的に説
明するが、本発明はこれらに限定されない。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.
【００４４】実施例１〜４
基材として厚さ７５μｍのペットフィルムを準備した。
次いで、砥粒とバインダーとの混合物である研磨塗液と
して、南興セラミックス（株）製粒度＃２０００の酸化
アルミ粒子１００ｇと東都化成（株）製エポキシ樹脂
「エポトートＹＤ１２８Ｒ」２０ｇとヘンケル白水
（株）社製「バーサミド１２５」２０ｇとダウコーニン
グ社製プロピレングリコールモノメチルエーテル７５ｇ
とを混合したものを用意し、これを静電スプレー塗布法
によりペットフィルムの表面に塗布した。 Examples 1 to 4 A pet film having a thickness of 75 μm was prepared as a base material.
Then, as a polishing coating solution which is a mixture of abrasive grains and a binder, 100 g of aluminum oxide particles having a grain size of # 2000 manufactured by Nanko Ceramics Co., Ltd., 20 g of an epoxy resin “Epototo YD128R” manufactured by Toto Kasei Co., Ltd., and Henkel Shiramizu (stock) ) "Versamide 125" 20 g and Dow Corning propylene glycol monomethyl ether 75 g
A mixture of and was prepared and applied on the surface of the PET film by the electrostatic spray coating method.
【００４５】図７は静電スプレー塗布法に用いた塗布装
置の概要を示す模式図である。塗液はエアミキサー付き
ホールドタンク８１からダイアフラムポンプ８２に圧送
され、塗料レギュレーター８３とバックプレッシャーレ
ギユレーター８４の差圧で循環され、この差圧はゲージ
８５、及び８６の読みで０．１５Ｍｐｓ以上にする。FIG. 7 is a schematic view showing the outline of a coating apparatus used in the electrostatic spray coating method. The coating liquid is pressure-fed from a hold tank 81 with an air mixer to a diaphragm pump 82 and circulated by a differential pressure between a paint regulator 83 and a back pressure regulator 84, which is 0.15 mps or more when read by gauges 85 and 86. To
【００４６】静電スプレーガン８７へ送られた塗液はガ
ン入り口にある精密塗料レギュレーター８８により吐出
量が調整され空気によって霧化され、低電圧制御装置８
９によりガンの電極に電圧をかける事によりこの間に静
電界を作り、さらに電極先端部で空気をイオン化させこ
のイオン化圏域を通過した塗液の粒子は、負（−）に帯
電して静電界の方向のペットフィルム９０に塗布され
る。The coating liquid sent to the electrostatic spray gun 87 has its discharge amount adjusted by a precision paint regulator 88 at the gun entrance and is atomized by air.
By applying a voltage to the electrode of the gun by means of 9, an electrostatic field is created in the meantime, and air is ionized at the tip of the electrode, and the particles of the coating liquid that have passed through this ionization sphere are charged negatively (-) Is applied to the PET film 90 in the direction.
【００４７】塗布装置は、ランズバーグインダストリー
（株）製静電スプレーガン「７５７８５溶剤系塗料用Ｒ
ＥＡ―９０」、及び低電圧コントロールユニット「９０
４０カスケ―ド低電圧コントロールユニット」を用い
た。塗布条件は以下の通りとした。The coating device is an electrostatic spray gun "75785 R for solvent-based paint" manufactured by Randsburg Industry Co., Ltd.
EA-90 "and low voltage control unit" 90 "
40 Cascade Low Voltage Control Unit "was used. The coating conditions were as follows.
【００４８】[0048]
【表３】 [Table 3]
【００４９】その後、さらにフェノール樹脂（昭和高分
子社製）を用いて、サイズコート処理を行った。次い
で、被塗物を１４０℃で３分間保持して硬化させた。得
られた連続研磨シートを研磨面から基材の裏面へ向かう
方向に打ち抜くことによりその全体にわたって貫通穴を
形成した。最後にこの連続研磨シートを打ち抜いて直径
（φ）１００ｍｍの研磨ディスクとした。研磨ディスク
は貫通穴の数を変化させて４種類作製した（実施例１〜
４）。また、貫通穴を形成しない研磨ディスクを対照試
料として用いた。得られた研磨ディスクの仕様を表４に
示す。After that, a size coat treatment was further performed using a phenol resin (manufactured by Showa High Polymer Co., Ltd.). Then, the article to be coated was held at 140 ° C. for 3 minutes to be cured. The continuous polishing sheet thus obtained was punched in the direction from the polishing surface to the back surface of the substrate to form through holes throughout. Finally, this continuous polishing sheet was punched out to form a polishing disk having a diameter (φ) of 100 mm. Four types of polishing disks were produced by changing the number of through holes (Examples 1 to 1).
4). Also, a polishing disk that did not form through holes was used as a control sample. Table 4 shows the specifications of the obtained polishing disk.
【００５０】[0050]
【表４】 [Table 4]
【００５１】シェーファーテスト研磨機を用いて、研磨
ディスクの研磨テストを行った。被研磨体としてアクリ
ル板（直径１００ｍｍ、厚さ８ｍｍ）を用い、研磨荷重
は４．５ｋｇとした。被研磨体を回転させて被研磨体の
研磨量（ｇ）を測定した。結果を表５に示す。また、被
研磨面を目視で評価したところ、全ての研磨ディスクに
ついて筋状の傷は入っていなかった。A polishing test was performed on the polishing disk using a Shafer test polishing machine. An acrylic plate (diameter 100 mm, thickness 8 mm) was used as the object to be polished, and the polishing load was 4.5 kg. The object to be polished was rotated and the amount of polishing (g) of the object to be polished was measured. The results are shown in Table 5. Further, when the surface to be polished was visually evaluated, no streaky scratches were found on all the polishing disks.
【００５２】[0052]
【表５】 a：対照試料の研磨量に対する研磨量（％）[Table 5] a: Polishing amount (%) with respect to the polishing amount of the control sample
【００５３】この結果により、貫通穴を有する研磨材料
は、研磨面が平坦な研磨材料と比較して研磨効率が優れ
ていることが示された。From these results, it is shown that the polishing material having the through holes has excellent polishing efficiency as compared with the polishing material having a flat polishing surface.
【００５４】実施例５
基材として、表面の全体にわたりφ６５０μｍ、深さ１
００μｍのピンポイントディンプルが格子状に形成され
た厚さ３ミル（７５μｍ）のＰＥＴフィルムを用いるこ
と以外は実施例１〜４と同様にして研磨ディスクを得
た。研磨ディスクの有効接触面積は８３．６％であっ
た。 Example 5 As a base material, the entire surface was 650 μm in diameter and 1 in depth.
Abrasive disks were obtained in the same manner as in Examples 1 to 4 except that a PET film having a thickness of 3 mils (75 μm) in which 00 μm pinpoint dimples were formed in a grid pattern was used. The effective contact area of the abrasive disc was 83.6%.
【００５５】この研磨ディスクを用い、手動研磨ブロッ
クにより一方向往復運動によりアクリル板（直径１００
ｍｍ、厚さ２ｍｍ）を研磨した。研磨は、水砥ぎ及び空
砥ぎをそれぞれ行った。研磨性及び被研磨面の仕上がり
等を以下の基準によって評価した。評価結果を表９に示
す。Using this polishing disk, an acrylic plate (diameter 100
mm, thickness 2 mm). Polishing was carried out by water grinding and blank grinding, respectively. Polishability and finish of the surface to be polished were evaluated according to the following criteria. The evaluation results are shown in Table 9.
【００５６】水砥ぎ作業性Water grinding workability
【表６】 [Table 6]
【００５７】研磨性Polishability
【表７】 [Table 7]
【００５８】仕上がりFinished
【表８】 [Table 8]
【００５９】表面粗さ
三豊社製５２５シリーズフォトレーサー（高精度表面粗
さ測定機「ＳＶ−Ｃ６００」）を用いて、ＪＩＳに基づ
く測定法（ＪＩＳＢ０６０１−１９９４）により、平均
表面粗さＲａ（μｍ）を測定した。Surface Roughness The average surface roughness Ra (μm) was measured by a measuring method based on JIS (JISB0601-1994) using a 525 series photo racer manufactured by Santoyo Co. (high precision surface roughness measuring instrument “SV-C600”). ) Was measured.
【００６０】比較例１
基材として表面に凹凸を有しない厚さ３ミル（７５μ
ｍ）のＰＥＴフィルムを用いること以外は実施例５と同
様にして研磨ディスクを得た。この研磨ディスクを用い
ること以外は実施例５と同様にして研磨試験を行った。
評価結果を表９に示す。 Comparative Example 1 A base material having a thickness of 3 mils (75 μ
A polishing disk was obtained in the same manner as in Example 5 except that the PET film of m) was used. A polishing test was conducted in the same manner as in Example 5 except that this polishing disk was used.
The evaluation results are shown in Table 9.
【００６１】比較例２
実施例５で用いたＰＥＴフィルムのピンポイントディン
プルはエンボスによって形成されており、裏返すと表面
の全体にわたりφ６５０μｍ、高さ１００μｍのピンポ
イント突起が形成されている。 Comparative Example 2 The pinpoint dimples of the PET film used in Example 5 are formed by embossing, and when turned upside down, pinpoint protrusions having a diameter of 650 μm and a height of 100 μm are formed over the entire surface.
【００６２】基材として、実施例５用いたＰＥＴフィル
ムのピンポイント突起が形成されている面を用いること
以外は実施例５と同様にして研磨ディスクを得た。得ら
れた研磨ディスクの有効接触面積は１６．４％であっ
た。この研磨ディスクを用いること以外は実施例５と同
様にして研磨試験を行った。評価結果を表９に示す。A polishing disk was obtained in the same manner as in Example 5 except that the surface of the PET film used in Example 5 on which the pinpoint protrusions were formed was used as the substrate. The effective contact area of the resulting abrasive disc was 16.4%. A polishing test was conducted in the same manner as in Example 5 except that this polishing disk was used. The evaluation results are shown in Table 9.
【００６３】比較例３
基材として短径１２２０μｍ、長径１７５０μｍ、高さ
４０μｍの菱形の突起、及びその周囲に幅５８０μｍの
連続溝が形成されているＰＥＴフィルムを用いること以
外は実施例５と同様にして研磨ディスクを得た。得られ
た研磨ディスクの有効接触面積は４２．７％であった。
この研磨ディスクを用いること以外は実施例５と同様に
して研磨試験を行った。評価結果を表９に示す。 Comparative Example 3 Similar to Example 5 except that a PET film having a rhombic projection having a short diameter of 1220 μm, a long diameter of 1750 μm and a height of 40 μm and a continuous groove having a width of 580 μm formed around it was used as a base material. To obtain a polishing disk. The effective contact area of the resulting abrasive disc was 42.7%.
A polishing test was conducted in the same manner as in Example 5 except that this polishing disk was used. The evaluation results are shown in Table 9.
【００６４】[0064]
【表９】 [Table 9]
【００６５】この結果により、研磨面にディンプルを有
する研磨材料は、凸部を有する研磨材料と比較して被研
磨面を傷つけ難く、作業性も優れていることが示され
た。The results show that the polishing material having dimples on the polishing surface is less likely to damage the surface to be polished and has better workability than the polishing material having convex portions.
【００６６】[0066]
【発明の効果】本発明のディンプル構造の研磨材料は被
研磨面を傷つけず平滑精密に研磨することが可能であ
り、研磨効率に優れ、研磨寿命が長い。EFFECTS OF THE INVENTION The polishing material of the present invention having a dimple structure can be polished smoothly and precisely without damaging the surface to be polished, has excellent polishing efficiency, and has a long polishing life.
【図１】 本発明の研磨材料の一実施態様を示す端面断
面図である。FIG. 1 is an end cross-sectional view showing an embodiment of a polishing material of the present invention.
【図２】 静電スプレー塗布法の原理を示す模式断面図
である。FIG. 2 is a schematic cross-sectional view showing the principle of the electrostatic spray coating method.
【図３】 スラリー塗布法の原理を示す模式断面図であ
る。FIG. 3 is a schematic cross-sectional view showing the principle of the slurry coating method.
【図４】 静電塗布法の原理を示す模式断面図である。FIG. 4 is a schematic cross-sectional view showing the principle of the electrostatic coating method.
【図５】 本発明の研磨材料の実施態様を示す正面図で
ある。FIG. 5 is a front view showing an embodiment of the polishing material of the present invention.
【図６】 本発明の研磨材料の実施態様を示す正面図で
ある。FIG. 6 is a front view showing an embodiment of the polishing material of the present invention.
【図７】 静電スプレー塗布法に用いた塗布装置の概要
を示す模式図である。FIG. 7 is a schematic diagram showing an outline of a coating device used in the electrostatic spray coating method.
１１…基材、 １２…バインダー、 １３…砥粒、 １４…貫通穴。 11 ... Base material, 12 ... binder 13 ... Abrasive grains, 14 ... Through hole.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 海老沢 一 神奈川県相模原市南橋本３−８−８ 住友 スリーエム株式会社内 Ｆターム(参考） 3C063 AB07 BA22 BC03 BG04 BG07 BG08 CC16 EE15 FF20 FF23 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Hajime Ebisawa Sumitomo 3-8-8 Minami-Hashimoto, Sagamihara City, Kanagawa Prefecture Within 3M Co., Ltd. F-term (reference) 3C063 AB07 BA22 BC03 BG04 BG07 BG08 CC16 EE15 FF20 FF23
Claims (6)
ンダーと、該バインダーにより基材に接着された砥粒と
を有するシート状の研磨材料において、 研磨面の全体にわたって配置され、相互に独立した形状
である複数のディンプル又は貫通穴を有し、研磨面の被
研磨体に対する有効接触面積が５０〜９５％である研磨
材料。1. A sheet-shaped abrasive material comprising a substrate, a binder coated on the surface of the substrate, and abrasive grains adhered to the substrate by the binder, the abrasive material being arranged over the entire polishing surface, A polishing material having a plurality of dimples or through holes each having an independent shape, and having an effective contact area of a polishing surface with respect to a polishing object of 50 to 95%.
φ０．５〜φ１０ｍｍの円形、又は寸法□０．２〜□１
０ｍｍの方形である請求項１記載の研磨材料。2. The shape of the dimple or the through hole is a circle having a dimension of φ0.5 to φ10 mm, or a dimension of □ 0.2 to □ 1.
The polishing material according to claim 1, wherein the polishing material has a rectangular shape of 0 mm.
縁が面取りされている請求項１又は２記載の研磨材料。3. The polishing material according to claim 1, wherein the edge of the dimple or the through hole on the polishing surface side is chamfered.
を除去するために使用される請求項１〜３のいずれか記
載の研磨材料。4. The polishing material according to any one of claims 1 to 3, which is used for removing coating film defects existing in a coating film coated with sheet metal.
して使用される請求項１〜４のいずれか記載の研磨材
料。5. The polishing material according to claim 1, which is used by being attached to a manual polishing block or a sander.
たって、相互に独立した形状である複数のディンプル又
は貫通穴を形成する工程を包含する研磨材料の製造方
法。6. A method of manufacturing an abrasive material, which comprises the step of forming a plurality of dimples or through holes having mutually independent shapes over the entire polishing surface of a sheet-like abrasive material.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001265612A JP2003071731A (en) | 2001-09-03 | 2001-09-03 | Dimple structure abrasive material |
| BR0212275-8A BR0212275A (en) | 2001-09-03 | 2002-09-03 | Abrasive material in sheet form |
| PCT/US2002/027811 WO2003020474A1 (en) | 2001-09-03 | 2002-09-03 | Sheet-form abrasive with dimples or perforations |
| EP02757524A EP1423239A1 (en) | 2001-09-03 | 2002-09-03 | Sheet-form abrasive with dimples or perforations |
| CNA028171586A CN1549757A (en) | 2001-09-03 | 2002-09-03 | Sheet-form abrasive with dimples or perforations |
| US10/485,792 US20040180618A1 (en) | 2001-09-03 | 2002-09-03 | Sheet-form abrasive with dimples or perforations |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001265612A JP2003071731A (en) | 2001-09-03 | 2001-09-03 | Dimple structure abrasive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003071731A true JP2003071731A (en) | 2003-03-12 |
Family
ID=19092051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001265612A Pending JP2003071731A (en) | 2001-09-03 | 2001-09-03 | Dimple structure abrasive material |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1423239A1 (en) |
| JP (1) | JP2003071731A (en) |
| CN (1) | CN1549757A (en) |
| BR (1) | BR0212275A (en) |
| WO (1) | WO2003020474A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006346853A (en) * | 2005-06-13 | 2006-12-28 | Kwh Mirka Ab Oy | Flexible polishing member and its method of manufacture |
| JP2009125864A (en) * | 2007-11-22 | 2009-06-11 | Nihon Micro Coating Co Ltd | Polishing sheet and method for producing polishing sheet |
| JP2009131909A (en) * | 2007-11-28 | 2009-06-18 | Nihon Micro Coating Co Ltd | Polishing sheet and manufacturing method of polishing sheet |
| US10245704B2 (en) | 2010-07-02 | 2019-04-02 | 3M Innovative Properties Company | Coated abrasive articles |
| WO2020054823A1 (en) * | 2018-09-14 | 2020-03-19 | 株式会社フジミインコーポレーテッド | Polishing pad, polishing tool, and polishing method |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7628829B2 (en) | 2007-03-20 | 2009-12-08 | 3M Innovative Properties Company | Abrasive article and method of making and using the same |
| US8142532B2 (en) * | 2008-12-17 | 2012-03-27 | 3M Innovative Properties Company | Shaped abrasive particles with an opening |
| CN104125876B (en) | 2011-12-31 | 2018-07-20 | 圣戈班磨料磨具有限公司 | The abrasive article of uneven distribution with opening |
| CN103144048A (en) * | 2013-02-20 | 2013-06-12 | 应永武 | Angle grinding wheel and preparation method thereof |
| CN109129224A (en) * | 2018-09-27 | 2019-01-04 | 东莞金太阳研磨股份有限公司 | A kind of disk sand paper and the grinding apparatus with the disk sand paper |
| CN115056150B (en) * | 2022-07-07 | 2023-05-16 | 杭州永杰研磨材料股份有限公司 | Double-sided sand paper and processing equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427863A (en) * | 1987-07-17 | 1989-01-30 | Katsuji Tsutsumi | Polishing sheet |
| JPH0283172A (en) * | 1988-09-20 | 1990-03-23 | Dainippon Printing Co Ltd | Abrasive tape and manufacture thereof |
| JPH06190725A (en) * | 1992-12-28 | 1994-07-12 | Agency Of Ind Science & Technol | Alumina type grinding wheel |
| JPH09123065A (en) * | 1995-10-31 | 1997-05-13 | Kobatsukusu:Kk | Polishing sheet and its manufacture |
| JPH11114833A (en) * | 1997-10-17 | 1999-04-27 | Mitsubishi Materials Corp | Sharp-edged grinding wheel and manufacture thereof |
| JPH11156727A (en) * | 1997-11-27 | 1999-06-15 | Noritake Co Ltd | Sol-gel sintered alumina-based grinding wheel |
| JP2980682B2 (en) * | 1993-06-02 | 1999-11-22 | 大日本印刷株式会社 | Polishing tape and method of manufacturing the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE530127A (en) * | 1953-11-25 | |||
| US3991527A (en) * | 1975-07-10 | 1976-11-16 | Bates Abrasive Products, Inc. | Coated abrasive disc |
| EP0940224B1 (en) * | 1993-06-02 | 2002-09-04 | Dai Nippon Printing Co., Ltd. | Abrasive tape |
| DE29520566U1 (en) * | 1995-12-29 | 1996-02-22 | Jöst, Peter, 69518 Abtsteinach | Abrasives that can be adapted directly or indirectly with a machine or a manually operated abrasive holder as well as a suitable adapter |
| US6634929B1 (en) * | 1999-04-23 | 2003-10-21 | 3M Innovative Properties Company | Method for grinding glass |
-
2001
- 2001-09-03 JP JP2001265612A patent/JP2003071731A/en active Pending
-
2002
- 2002-09-03 BR BR0212275-8A patent/BR0212275A/en not_active IP Right Cessation
- 2002-09-03 EP EP02757524A patent/EP1423239A1/en not_active Withdrawn
- 2002-09-03 WO PCT/US2002/027811 patent/WO2003020474A1/en not_active Application Discontinuation
- 2002-09-03 CN CNA028171586A patent/CN1549757A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6427863A (en) * | 1987-07-17 | 1989-01-30 | Katsuji Tsutsumi | Polishing sheet |
| JPH0283172A (en) * | 1988-09-20 | 1990-03-23 | Dainippon Printing Co Ltd | Abrasive tape and manufacture thereof |
| JPH06190725A (en) * | 1992-12-28 | 1994-07-12 | Agency Of Ind Science & Technol | Alumina type grinding wheel |
| JP2980682B2 (en) * | 1993-06-02 | 1999-11-22 | 大日本印刷株式会社 | Polishing tape and method of manufacturing the same |
| JPH09123065A (en) * | 1995-10-31 | 1997-05-13 | Kobatsukusu:Kk | Polishing sheet and its manufacture |
| JPH11114833A (en) * | 1997-10-17 | 1999-04-27 | Mitsubishi Materials Corp | Sharp-edged grinding wheel and manufacture thereof |
| JPH11156727A (en) * | 1997-11-27 | 1999-06-15 | Noritake Co Ltd | Sol-gel sintered alumina-based grinding wheel |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006346853A (en) * | 2005-06-13 | 2006-12-28 | Kwh Mirka Ab Oy | Flexible polishing member and its method of manufacture |
| JP2009125864A (en) * | 2007-11-22 | 2009-06-11 | Nihon Micro Coating Co Ltd | Polishing sheet and method for producing polishing sheet |
| JP2009131909A (en) * | 2007-11-28 | 2009-06-18 | Nihon Micro Coating Co Ltd | Polishing sheet and manufacturing method of polishing sheet |
| US10245704B2 (en) | 2010-07-02 | 2019-04-02 | 3M Innovative Properties Company | Coated abrasive articles |
| WO2020054823A1 (en) * | 2018-09-14 | 2020-03-19 | 株式会社フジミインコーポレーテッド | Polishing pad, polishing tool, and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003020474A1 (en) | 2003-03-13 |
| EP1423239A1 (en) | 2004-06-02 |
| BR0212275A (en) | 2004-10-19 |
| CN1549757A (en) | 2004-11-24 |
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