JP2003068805A - Method of manufacturing film carrier tape for mounting multithread electronic part and exposure processor for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simultaneously realize exposure processing for the width of a film carrier tape for mounting multithread electronic parts even on the carrier pattern of the same width or the carrier pattern of different width in accordance with the product wiring patterns of the multiple carrier patterns without exchanging an exposure device. SOLUTION: When a photoresist is exposed, the photoresist is exposed by dislocating it in the transportation direction of an insulating film in accordance with the type of the product wiring pattern of the film carrier for mounting electronic parts, which is to be formed on the surface of the insulating film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier tape for mounting electronic parts (TAB (Tape Automated Bondin) which has a wiring pattern formed on a very thin insulating film.
g) Tape, T-BGA (Tape Ball Grid Array) tape,
CSP (Chip Size Package) tape, ASIC (Appli
cation Specific Integrated Circuit) tape, COF
(Chip On Film) tape (hereinafter simply referred to as “electronic component mounting film carrier tape”), a method for manufacturing a film carrier tape for mounting multiple components (plural rows), and a method therefor Exposure processing apparatus.

[0002]

2. Description of the Related Art With the development of the electronics industry, I
The demand for printed wiring boards on which electronic components such as C (integrated circuit) and LSI (large-scale integrated circuit) are mounted is rapidly increasing. However, recent electronic devices include electronic devices such as mobile phones. Compact and lightweight equipment, high functionality, high reliability,
There is a demand for lower prices.

As an electronic component mounting method for realizing such characteristics as reduction in size and weight of electronic equipment, it is preferable to mount the device on a film carrier tape for mounting electronic components such as a TAB tape. Conventionally, when manufacturing such a film carrier tape for mounting electronic parts, a base film having the same width as the film carrier tape for mounting electronic parts to be obtained in advance is used. Then, a conductor pattern is formed on this base film to obtain a film carrier tape for mounting electronic components.

That is, a photoresist layer is formed by screen printing on the surface of a conductive metal layer formed on a base film, and a photoresist mask is used to expose and develop the conductive metal layer for etching and plating. The film carrier tape for mounting electronic parts was obtained by performing solder resist printing on the parts other than the parts and plating the exposed conductive metal layer.

However, in the conventional manufacturing method using the base film having the same width as the electronic component mounting film carrier tape to be obtained in advance, one electronic component mounting film is always used in one production line. Only carrier tapes could be manufactured, and there was a limit to improvement in productivity. In addition, when there are multiple types of widths of the electronic component mounting film carrier tape to be obtained, in the production in one series of production lines, these widths are obtained for each width of the electronic component mounting film carrier tape to be obtained. Must be replaced with various parts adapted to. On the other hand,
Various parts corresponding to the width not manufactured are not used and are in a dormant state. Further, since it is difficult to replace such parts in a short time, the production efficiency is not always good.

In order to deal with such a problem, the present inventors have already proposed in Japanese Patent Application No. 2001-100329 a plurality of articles (a plurality of rows) on one and the same wide film.
A method of manufacturing a film carrier tape for mounting electronic components, comprising forming a film carrier tape on the insulating film, wherein the insulating film is formed at least at an integral multiple of a desired carrier pattern width and in the vicinity of both edges of the insulating film. Film width that is the sum of the width of the positioning hole forming part, for example,
Provided is a method for producing a film carrier tape for mounting electronic parts, which is suitable for mass production as an insulating film having a width of 156 mm.

[0007]

However, although this method is suitable for mass production, it is not suitable for small volume production. That is, in a film carrier tape for mounting electronic parts, which is formed of an insulating film such as a conventional TAB tape, an adhesive layer and a conductive metal foil, in addition to a sprocket hole for transporting a tape, a device hole for mounting IC, A die for forming a flex slit or the like is required for each product type, and a small amount of a wide variety of products will be costly.

By the way, recently, as a film carrier tape for mounting electronic parts, a two-layer tape composed of a resin film called COF (Chip On Film) and a conductive metal foil has been used. 2. Description of the Related Art Film carrier tapes for mounting electronic parts of the type that are mounted are widely used. In this COF, a device hole as in the past is not necessary, and since only a sprocket hole for tape transportation needs to be formed, a mold for pressing the device hole or the like is unnecessary. Therefore, even if the type of product is different, it is possible to deal with it by using a standard mold for forming the sprocket hole.

Therefore, the present inventors have found that such CO
In F, at least two separate exposure lenses are used as a method for producing a film carrier tape for mounting electronic parts, in which film carrier tapes having different product patterns are formed in a plurality of lines (a plurality of rows) on one same wide film. With the provided exposure apparatus, or at least two separate exposure apparatuses, in particular, if different photoresist masks are used, it is possible to deal with the standard mold only by exposing different product patterns. The inventors have completed the present invention by finding that they are suitable for small-quantity multi-product production.

The present invention has been made in view of the above conventional problems, and an object thereof is the same according to the types of product wiring patterns of a plurality of carriers without replacing the exposure apparatus. Whether the carrier pattern has a width or a carrier pattern with a different width, the exposure process can be performed over the width of the film carrier tape for mounting multiple electronic components at the same time, and the exposure device is complicated to replace. An object of the present invention is to provide a method of manufacturing a film carrier tape for mounting multiple electronic components, which does not require work, has good productivity, and can reduce cost, and an exposure processing apparatus therefor.

[0011]

The present invention has been made in order to achieve the problems and objects in the prior art as described above, and a method for manufacturing a film carrier tape for mounting electronic parts according to the present invention comprises: A method for manufacturing a film carrier tape for mounting multiple electronic components, wherein the film carriers for mounting electronic components having at least two different product wiring patterns are simultaneously formed on the same insulating film surface. A photoresist layer is formed on the surface of the conductive metal layer formed in, and the photoresist layer is formed on the surface of the insulating film in the step of exposing the photoresist to a desired pattern shape through a photoresist mask. Special exposure is performed according to the type of product wiring pattern of the electronic component mounting film carrier to be exposed. To.

Further, the exposure processing apparatus for a film carrier tape for mounting multiple electronic components according to the present invention is for mounting multiple electronic components in which at least two electronic component mounting film carriers are simultaneously formed on the same insulating film surface. In the method for producing a film carrier tape, an insulating film having a photoresist layer formed on the surface of a conductive metal layer formed on the insulating film, the photoresist layer, through a photoresist mask, to a desired pattern shape photo An exposure processing device for exposing a resist, wherein at the time of exposing the photoresist, the exposure is performed separately according to the type of a product wiring pattern of a film carrier for mounting electronic parts to be formed on the surface of the insulating film. It is characterized by having one exposure lens.

The exposure processing apparatus for a film carrier tape for mounting multiple electronic components according to the present invention is a device for mounting multiple electronic components in which at least two electronic component mounting film carriers are simultaneously formed on the same insulating film surface. In the method for producing a film carrier tape, an insulating film having a photoresist layer formed on the surface of a conductive metal layer formed on the insulating film, the photoresist layer, through a photoresist mask, to a desired pattern shape photo An exposure processing device for exposing a resist, wherein at the time of exposing the photoresist, the exposure is performed separately according to the type of a product wiring pattern of a film carrier for mounting electronic parts to be formed on the surface of the insulating film. One exposure device is provided.

With such a configuration, it is possible to perform exposure processing over the width of the film carrier tape for mounting multiple electronic components simultaneously according to the types of product wiring patterns of a plurality of carriers without replacing the exposure device. Moreover, complicated work such as replacement of the exposure device is not required, and the productivity is good and the cost can be reduced.

Further, in the structure in which at least two exposure devices are arranged, cost can be reduced because it is sufficient to arrange the conventional exposure devices side by side as they are even for a wide film carrier tape for mounting electronic parts. in this case,
Depending on the type of the product wiring pattern of the film carrier for mounting electronic parts to be formed on the surface of the insulating film, the insulating film may be displaced in the conveying direction and exposed separately, and may be exposed in the conveying direction of the film. At least two exposure lenses that shift and expose separately, or
At least two exposure devices may be provided.

When exposing the photoresist, depending on the type of the product wiring pattern of the film carrier for mounting electronic parts to be formed on the surface of the insulating film,
The insulating film may be separately exposed at the same position in the transport direction, or may be provided with at least two exposure lenses or at least two exposure devices that separately expose at the same position in the transport direction of the insulating film. .

Further, according to the present invention, the width of each of the product wiring patterns of the film carrier for mounting electronic parts of the film carrier tape for mounting electronic parts of the above-mentioned multi-row electronic carrier is the same width. Characterize. Further, in the present invention, the width of each type of product wiring pattern of the film carrier for mounting electronic parts of the film carrier tape for mounting electronic parts is a film carrier for mounting electronic parts having different widths. And

With such a configuration, the carrier patterns having the same width or different widths can be used according to the types of product wiring patterns of a plurality of carriers without replacing the exposure device. At the same time, it is possible to perform exposure processing across the width of the film carrier tape for mounting multiple-line electronic components.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments (examples) of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of a first embodiment of an exposure processing apparatus for a film carrier tape for mounting multiple-line electronic components of the present invention, and FIG. 3 is shown in FIG.
FIG. 3 is a plan view schematically showing an example of a film carrier tape for mounting multiple electronic components, which is manufactured based on the exposure processing apparatus of FIG.

According to the method for producing a film carrier tape for mounting a multi-row electronic component of the present invention, a conductive metal layer is formed on a base film, and a photoresist layer is formed on the surface of the conductive metal layer by screen printing as in the conventional method. Then, using a photoresist mask, exposing and developing, etching the conductive metal layer, solder-resist printing other than the plating portion, and plating the exposed conductive metal layer, It can be applied to a method for obtaining a film carrier tape for mounting electronic parts.

By the way, in such an exposure process,
When a predetermined wiring pattern is exposed on the photoresist, (1) as shown in FIG. 3A, for example, the product A part and the product B part are formed on the same insulating film 10. In the case of forming an electronic component film carrier having the same width of 35 mm, (2) as shown in FIG. 3B, even when the electronic component film carrier having the same width of 48 mm is formed, the product A And the product B have different wiring patterns, and the width of the product A is 48 mm and the width of the product B is 96 mm (48 × 2 =
96mm), if the width of each product is different, (3)
As shown in FIG. 3C, the wiring pattern is different between the product A portion and the product B portion, and the width of the product A portion is 35 × 2 = 70 mm, and the width of the product B portion is 70 mm.
In each case, the width of each product is different, and in each case, the wiring pattern must be replaced with an exposure apparatus suitable for each combination of wiring patterns. Is required, resulting in poor productivity and high cost.

Therefore, in the exposure process of the present invention, the exposure processing apparatus 1 as shown in FIG. 1 is used. In this exposure processing apparatus 1, after forming a conductive metal layer on the insulating film 10, a delivery reel 12 around which the insulating film 10 having a photoresist layer formed on the surface of the conductive metal layer is wound,
From the delivery reel 12, a pair of delivery rollers 14 that sandwich and deliver the insulating film 10, a pair of take-up rollers 16 that convey the insulating film delivered by the delivery roller 14, and an insulation that is delivered by the take-up roller A winding reel 18 for winding the film 10 is provided.

Then, these feed rollers 14 and
An exposure device 20 that exposes the photoresist to ultraviolet light in a desired pattern shape using a photoresist mask is arranged between the take-up roller 16 and the take-up roller 16. As shown in FIG. 1, the exposure device 20 includes an insulating film 10
The first exposure lens 22 and the second exposure lens 24, which are arranged at a constant interval in the transport direction of, are provided.

The first exposure lens 22 and the second exposure lens 24 are insulated according to the film carrier pattern for mounting electronic parts to be formed on the surface of the insulating film 10 when the photoresist is exposed. The exposure is performed by shifting the position in the transport direction of the film. That is, in this exposure apparatus 20, as shown in FIG. 2A, the same insulating film 10 is used.
Above, for example, in the part of product A and the part of product B, 35
When forming an electronic component film carrier having the same width of mm, as shown in FIG. 2B, for example, when forming an electronic component film carrier having the same width of 48 mm, the product A portion The wiring pattern differs from that of product B, and the width of product A is 48 mm.
In the case where the widths of the parts are 96 mm (48 × 2 = 96 mm) and the widths of the respective products are different, as shown in FIG. 2C, the wiring pattern is different between the product A part and the product B part. The width of the product A is 35 × 2 = 70 mm, and the width of the product B is 70 m.
In each of the cases where the width of each product is different as in m, the part of the product A is exposed by the first exposure lens 22 and the part of the product B is exposed by the second exposure lens 24. It is like this.

In this case, these exposure lenses 22 and 24
A common single photoresist mask may be used for this purpose, but in order to handle a wide variety of products, the first exposure lens 2
2 is a first photoresist mask 26, and the second exposure lens 24 is a second photoresist mask 28.
Are preferably used separately. In addition, in FIG.
The rectangular shaded area indicates the exposure range, and the size of this exposure range in the carrying direction and the width direction is adjusted by these photoresist masks 26 and 28.

In this case, the first exposure lens 22 and the second exposure lens 22
The distance between the exposure lens 24 and the exposure lens 24 is not particularly limited. With such a configuration, it is possible to simultaneously increase the number of carrier patterns having the same width or different widths according to the types of product wiring patterns of a plurality of carriers without replacing the exposure apparatus. Exposure processing can be performed across the width of the film carrier tape for mounting electronic components, and
No complicated work is required, productivity is good, and cost can be reduced.

Therefore, in particular, for example, a two-layer tape composed of a resin film called COF (Chip On Film) and a conductive metal foil, an electronic component of a type in which an IC is mounted without a device hole When applied to a mounting film carrier tape, different exposure products are provided with at least two separate exposure lenses, or at least two separate exposure devices, especially if different photoresist masks are used. Since it is possible to deal with the problem with a standard mold simply by exposing the pattern, it is suitable for small-quantity multi-product production.

In this embodiment, the insulating film 10 is used.
When there are two types of film carrier parts, product part A and product part B, the exposure device 20 is set to the first exposure lens 22.
The two exposure devices of the second exposure lens 24 are used, but it goes without saying that the number of exposure devices can be set according to the number of types of product parts of the film carrier part of the insulating film.

Further, as in this embodiment, when the area of the exposure lens or the photoresist mask is larger than the exposure area, the first exposure lens 22 and the second exposure lens 24 are transported by the insulating film. Although it is configured such that the exposure is performed by shifting the position in the direction, although not shown, the first exposure lens 22 and the second exposure lens 24 are connected to the insulating film 10.
It is also possible to arrange them in parallel at the same position in the transport direction of and expose separately.

Further, an exposure lens group in which a plurality of exposure lenses are arranged with their positions shifted in the transport direction of the insulating film,
It is of course possible to appropriately combine and use the exposure lens groups arranged in parallel at the same position in the transport direction of the insulating film 10. The conditions for disposing the exposure lens as described above can be similarly applied to the disposition of the exposure apparatus of the following embodiments.

FIG. 4 is a schematic diagram of a second embodiment of an exposure processing apparatus for a film carrier tape for mounting multiple-line electronic components of the present invention. In the exposure processing apparatus 1 of this embodiment, the same components as those of the exposure processing apparatus 1 of the first embodiment shown in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted.

In the exposure processing apparatus 1 of the first embodiment shown in FIG. 1, the exposure apparatus 20 itself has a first exposure lens 2 arranged at a constant distance in the transport direction of the insulating film 10.
2 and the second exposure lens 24, the exposure processing apparatus 1 of this embodiment has the first exposure apparatus 30 and the second exposure apparatus 30 which are arranged at a constant distance in the transport direction of the insulating film 10. The difference is that at least two exposure devices of the exposure device 40 are provided.

A common photoresist mask may be used also in these exposure apparatuses 30 and 40, but in order to cope with various types, the first exposure apparatus 30 is used.
It is preferable that the first photoresist mask 32 and the second photoresist mask 42 are separately used for the second exposure apparatus 40 and the second exposure apparatus 40, respectively. By arranging at least two exposure devices in this way, cost reduction can be achieved because it is sufficient to arrange conventional exposure devices side by side even for a wide film carrier tape for mounting electronic components.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to this. For example, in the above embodiment, COF (chip on film (Ch
ip On Film)), TAB (Tape Aut
omated Bonding) tape, T-BGA (Tape Ball Grid A)
rray) tape, CSP (Chip Size Package) tape, A
SIC (Application Specific Integrated Circuit)
The present invention can be applied to other film carrier tapes for mounting electronic parts such as tapes, and various modifications can be made without departing from the object of the present invention.

[0035]

As described above, according to the present invention,
When exposing the photoresist, at least two separate exposures are performed by shifting the position in the transport direction of the insulating film according to the type of the product wiring pattern of the electronic component mounting film carrier pattern to be formed on the insulating film surface. Since exposure is performed with an exposure device equipped with a lens or at least two separate exposure devices, it is possible to use the same width carrier pattern according to the type of product wiring pattern of multiple carriers without replacing the exposure device. Even if there are carrier patterns of different widths, it is possible to perform exposure processing over the width of the film carrier tape for mounting multiple-line electronic components at the same time, and there is no need for complicated operations such as replacing the exposure device. , Good productivity,
The cost can also be reduced.

Therefore, in particular, for example, a two-layer tape composed of a resin film called COF (Chip On Film) and a conductive metal foil, an electronic component of a type in which an IC is mounted without a device hole When applied to a mounting film carrier tape, different exposure products are provided with at least two separate exposure lenses, or at least two separate exposure devices, especially if different photoresist masks are used. Since it is possible to deal with the problem with a standard mold simply by exposing the pattern, it is suitable for small-quantity multi-product production.

Further, in the structure in which at least two exposure devices are arranged, even for a wide film carrier tape for mounting electronic parts, it is sufficient to arrange the conventional exposure devices side by side as they are, so that the cost can be reduced. It is an extremely excellent invention that has a remarkable and distinctive effect.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a first embodiment of an exposure processing apparatus for a film carrier tape for mounting a multi-row electronic component of the present invention.

FIG. 2 is a schematic diagram illustrating an exposure method of the exposure processing apparatus of FIG.

FIG. 3 is a plan view schematically showing an example of a film carrier tape for mounting multiple electronic components, which is manufactured based on the exposure processing apparatus of FIG.

FIG. 4 is a schematic view of a second embodiment of an exposure processing apparatus for a film carrier tape for mounting multiple-line electronic components of the present invention.

[Explanation of symbols] 1 Exposure processing equipment 10 Insulating film 12 Delivery reel 14 Sending roller 16 Take-up roller 18 Take-up reel Reel 20 Exposure equipment 22 First exposure lens 24 Second exposure lens 26 First Photoresist Mask 28 Second Photoresist Mask 30 First exposure apparatus 32 First Photoresist Mask 40 Second exposure apparatus 42 Second Photoresist Mask

Claims (16)

[Claims] 1. A method for producing a film carrier tape for mounting multiple electronic components, wherein film carrier for mounting electronic components having at least two different product wiring patterns are simultaneously formed on the same insulating film surface. On the surface of the conductive metal layer formed on the insulating film, a photoresist layer is formed, and the photoresist layer is formed.
In the step of exposing the photoresist into a desired pattern shape through a photoresist mask, depending on the type of the product wiring pattern of the electronic component mounting film carrier to be formed on the surface of the insulating film, the exposure may be performed separately. A method for producing a film carrier tape for mounting a multi-row electronic component characterized. 2. The exposure is performed separately by shifting the position in the transport direction of the insulating film according to the type of the product wiring pattern of the film carrier for mounting electronic components to be formed on the surface of the insulating film. 1. A method for producing a film carrier tape for mounting a multi-row electronic component according to 1. 3. The exposure is performed separately at the same position in the transport direction of the insulating film according to the type of the product wiring pattern of the electronic component mounting film carrier to be formed on the surface of the insulating film. 3. A method for manufacturing a film carrier tape for mounting a multi-row electronic component according to any one of 1 and 2. 4. A film carrier for mounting electronic components, wherein the width of each film wiring pattern of the film carrier for mounting electronic components of the multi-section electronic component mounting film carrier tape is the same width. Item 4. A method for manufacturing a film carrier tape for mounting a multi-row electronic component according to any one of Items 1 to 3. 5. The film carrier for mounting electronic parts of the film carrier tape for mounting electronic parts, wherein the width of each type of product wiring pattern of the film carrier for mounting electronic parts is different. 5. A method for manufacturing a film carrier tape for mounting a multi-row electronic component according to claim 1. 6. A method for producing a film carrier tape for mounting multiple electronic components, wherein at least two electronic component mounting film carriers are simultaneously formed on the same insulating film surface, wherein a conductive metal is formed on the insulating film. An insulating film having a photoresist layer formed on the surface of the layer, the photoresist layer, through a photoresist mask, an exposure processing device for exposing the photoresist in a desired pattern shape, when exposing the photoresist And a film carrier for mounting multiple electronic components, characterized in that the film carrier for mounting electronic components to be formed on the surface of the insulating film is provided with at least two exposure lenses that are separately exposed in accordance with the type of product wiring pattern. Exposure processing equipment for tape. 7. When exposing the photoresist, the insulating film is separately moved by shifting the position in the conveying direction according to the type of the product wiring pattern of the film carrier for mounting electronic parts to be formed on the surface of the insulating film. 7. The exposure processing apparatus for a film carrier tape for mounting multiple electronic components according to claim 6, further comprising at least two exposure lenses for exposing. 8. When exposing the photoresist, the insulating film is separately provided at the same position in the transport direction of the insulating film depending on the type of the product wiring pattern of the electronic component mounting film carrier to be formed on the surface of the insulating film. 8. An exposure processing apparatus for a film carrier tape for mounting multiple electronic components according to claim 6, further comprising at least two exposure lenses for exposing. 9. A method for producing a film carrier tape for mounting multiple electronic components, in which at least two electronic component mounting film carriers are simultaneously formed on the same insulating film surface, wherein a conductive metal is formed on the insulating film. An insulating film having a photoresist layer formed on the surface of the layer, the photoresist layer, through a photoresist mask, an exposure processing device for exposing the photoresist in a desired pattern shape, when exposing the photoresist In addition, according to the type of the product wiring pattern of the electronic component mounting film carrier to be formed on the surface of the insulating film, at least two exposing device for exposing separately, multiple-line electronic component mounting film carrier, characterized in that Exposure processing equipment for tape. 10. When exposing the photoresist,
According to the type of the product wiring pattern of the film carrier for electronic component mounting to be formed on the surface of the insulating film, at least two exposure devices for shifting the position in the transport direction of the insulating film and exposing separately are provided. An exposure processing apparatus for a film carrier tape for mounting a multi-row electronic component according to claim 9. 11. When exposing the photoresist,
According to the type of the product wiring pattern of the electronic component mounting film carrier to be formed on the surface of the insulating film, at least two exposure device for separately exposing at the same position in the transport direction of the insulating film is provided. An exposure processing apparatus for a film carrier tape for mounting a multi-row electronic component according to any one of claims 9 to 10. 12. A film carrier for mounting electronic parts, wherein the width of each of the product wiring patterns of the film carrier for mounting electronic parts of the film carrier tape for mounting electronic parts is the same width. Item 6 to 1
1. An exposure processing apparatus for a film carrier tape for mounting a multi-row electronic component according to any one of 1. 13. A film carrier for mounting electronic parts, wherein the width of each of the product wiring patterns of the film carrier for mounting electronic parts of the film carrier tape for mounting electronic parts is different. 13. An exposure processing apparatus for a film carrier tape for mounting a multi-row electronic component according to any one of claims 6 to 12. 14. A film carrier tape for mounting electronic parts, wherein at least two film carrier films for mounting electronic parts are simultaneously formed on the surface of the same insulating film, and the film carrier tape for mounting electronic parts is formed on the surface of said insulating film. A film carrier tape for mounting multiple electronic components, wherein the film carrier patterns are different types of film carrier patterns for mounting electronic components. 15. The film carrier for mounting electronic parts, wherein the width of each film wiring pattern of the film carrier for mounting electronic parts of the multi-section electronic component mounting film carrier is the same width. Item 15. A film carrier tape for mounting a multi-row electronic component according to Item 14. 16. A film carrier for mounting electronic parts, wherein the width of each of the product wiring patterns of the film carrier for mounting electronic parts of the film carrier tape for mounting electronic parts is different. The film carrier tape for mounting a multi-row electronic component according to any one of claims 14 to 15.