JP2003065462A - Integrated valve - Google Patents
Integrated valveInfo
- Publication number
- JP2003065462A JP2003065462A JP2001257804A JP2001257804A JP2003065462A JP 2003065462 A JP2003065462 A JP 2003065462A JP 2001257804 A JP2001257804 A JP 2001257804A JP 2001257804 A JP2001257804 A JP 2001257804A JP 2003065462 A JP2003065462 A JP 2003065462A
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- gas supply
- integrated valve
- supply device
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体製造装置等
で使用されるガス供給装置が設置された集積弁に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated valve provided with a gas supply device used in semiconductor manufacturing equipment and the like.
【０００２】[0002]
【従来の技術】従来から、半導体レーザや発光ダイオー
ド等は、例えば、有機金属気相成長法により形成され
る。有機金属気相成長法は、チャンバ内の基板を約１２
００℃程度に熱し、有機金属を含むガスをガス供給装置
からチャンバに所定量で供給し、基板上に蒸着させる。
有機金属気相成長法で使用されるガス供給装置は、有機
金属の水溶性が低いため、メンテナンス時に流路内を水
で洗い流される。流路内に水分が残存した状態でガス供
給装置を使用すると、有機金属が流路内に残存する水分
と化合して酸化し、製品品質を低下させる恐れがある。
そのため、メンテナンス時には、ガス供給装置を約２日
間程度加熱して、流路内の水分を完全に除去していた。
ガス供給装置の加熱方法としては、図７に示すものがあ
る。2. Description of the Related Art Conventionally, semiconductor lasers, light emitting diodes, etc. are formed by, for example, a metal organic chemical vapor deposition method. The metal-organic vapor phase epitaxy method uses a substrate in a chamber of about 12
The gas is heated to about 00 ° C., a gas containing an organic metal is supplied from the gas supply device to the chamber in a predetermined amount, and vapor is deposited on the substrate.
In the gas supply device used in the metal-organic vapor phase epitaxy, the water solubility of the metal is low, so that the inside of the flow path is washed with water during maintenance. If the gas supply device is used with water remaining in the flow channel, the organic metal may combine with the water remaining in the flow channel and oxidize, resulting in deterioration of product quality.
Therefore, at the time of maintenance, the gas supply device was heated for about 2 days to completely remove the water content in the flow path.
As a method of heating the gas supply device, there is one shown in FIG.
【０００３】図７のガス供給装置１００は、図中左か
ら、入力開閉弁１０１、パージ弁１０２、質量流量計付
き電磁弁１０３、出力開閉弁１０５、パージ出力弁１０
４が、入力ブロック１０６、継手ブロック１０７，１０
８、出力ブロック１０９にそれぞれ連結され、流路を形
成している。入力ブロック１０６，出力ブロック１０９
には、電圧を印加されて発熱する棒状ヒータ１１０，１
１１が装着されている。出力ブロック１０９には、ガス
供給装置１００の温度を測定するための温度センサ１１
２が装着されている。棒状ヒータ１１０，１１１及び温
度センサ１１２は、ガス供給装置１００の制御装置１１
３に接続され、棒状ヒータ１１０，１１１の印加電圧を
制御するようになっている。従って、ガス供給装置１０
０は、棒状ヒータ１１０，１１１により一定温度に加熱
される。A gas supply device 100 shown in FIG. 7 has an input opening / closing valve 101, a purge valve 102, a solenoid valve 103 with a mass flow meter, an output opening / closing valve 105, and a purge output valve 10 from the left in the figure.
4 is an input block 106 and joint blocks 107 and 10.
8 and output blocks 109, respectively, to form a flow path. Input block 106, output block 109
Is a rod-shaped heater 110, 1 that generates heat when a voltage is applied.
11 is attached. The output block 109 includes a temperature sensor 11 for measuring the temperature of the gas supply device 100.
2 is installed. The rod-shaped heaters 110 and 111 and the temperature sensor 112 are the control device 11 of the gas supply device 100.
3 and controls the voltage applied to the rod-shaped heaters 110 and 111. Therefore, the gas supply device 10
0 is heated to a constant temperature by the rod-shaped heaters 110 and 111.
【０００４】しかしながら、図７のガス供給装置１００
は、図示しない取付板に取り付けられて集積化されたと
きに、メンテナンスに非常に手間がかかっていた。すな
わち、メンテナンスをするために図示しない取付板から
ガス供給装置１００を取り外す場合には、棒状ヒータ１
１０，１１１及び温度センサ１１２を入力ブロック１０
６及び出力ブロック１０９から外す必要があった。ま
た、メンテナンス終了後にガス供給装置１００を図示し
ない取付板に取り付ける場合には、棒状ヒータ１１０，
１１１及び温度センサ１１２を入力ブロック１０６及び
出力ブロック１０９に装着する必要があった。この作業
は、集積弁に取り付けられるガス供給装置１００の全て
に行う必要があり、非常に手間がかかるものであった。However, the gas supply device 100 of FIG.
When it was mounted on a mounting plate (not shown) and integrated, maintenance took a lot of time. That is, when the gas supply device 100 is removed from the mounting plate (not shown) for maintenance, the rod-shaped heater 1
Input block 10 and temperature sensor 112
6 and the output block 109 had to be removed. Further, when the gas supply device 100 is mounted on a mounting plate (not shown) after the maintenance is completed, the rod-shaped heater 110,
It was necessary to mount the 111 and the temperature sensor 112 on the input block 106 and the output block 109. This work needs to be performed on all of the gas supply devices 100 attached to the integrated valves, which is very troublesome.
【０００５】この問題に対し、図８に示す集積弁１１５
は、ヒータを着脱せずにガス供給装置１１６を着脱でき
るようにしている。すなわち、図９に示すように、取付
板１２０には、ガス供給装置１１６の流路ブロック１１
７等を載置するためのベースプレート１１８が設けられ
ている。ベースプレート１１８の両側には、一対のクリ
ップ１２１，１２１が、内側に向かって弾性による付勢
力が作用するように取り付けられている。一対のクリッ
プ１２１，１２１には、ヒータブロック１２２がそれぞ
れ装着される。ヒータブロック１２２，１２２は、流路
ブロック１１７等に直接当接する内側ブロック１２３
と、テープヒータ１２５を内蔵する外側ブロック１２４
とが重ねられてネジ１２６，１２６で固定されて構成さ
れている。In response to this problem, the integrated valve 115 shown in FIG.
Allows the gas supply device 116 to be attached and detached without attaching and detaching the heater. That is, as shown in FIG. 9, the flow path block 11 of the gas supply device 116 is attached to the mounting plate 120.
A base plate 118 for mounting 7 or the like is provided. A pair of clips 121, 121 are attached to both sides of the base plate 118 so that an elastic biasing force acts toward the inside. A heater block 122 is attached to each of the pair of clips 121, 121. The heater blocks 122, 122 are inner blocks 123 that directly contact the flow path block 117 and the like.
And an outer block 124 containing a tape heater 125.
Are stacked and fixed by screws 126, 126.
【０００６】従って、図９及び図８に示す集積弁１１５
は、ガス供給装置１１６を取付板１２０に取り付ける場
合には、ヒータブロック１２２，１２２を一対のクリッ
プ１２１，１２１の付勢力に反して外側に押し広げる。
押し広げられたヒータブロック１２２，１２２の間にガ
ス供給装置１１６をはめ込み、ベースプレート１１８の
上に載置する。ヒータブロック１２２，１２２から離
し、ヒータブロック１２２，１２２を一対のクリップ１
２１，１２１の付勢力によりガス供給装置１１６の側面
に密着させる。そして、ガス供給装置１１６をベースプ
レート１１８にネジ等で固定する。この場合に、テープ
ヒータ１２５に発熱させてヒータブロック１２２を加温
すると、ヒータブロック１２２の熱が、流路ブロック１
１７等に伝達され、ガス供給装置１１６が加熱される。Therefore, the integrated valve 115 shown in FIG. 9 and FIG.
When the gas supply device 116 is attached to the attachment plate 120, the heater blocks 122, 122 are pushed outward against the biasing force of the pair of clips 121, 121.
The gas supply device 116 is fitted between the spread heater blocks 122, 122 and placed on the base plate 118. The heater blocks 122, 122 are separated from the heater blocks 122, 122 and the pair of clips 1
It is brought into close contact with the side surface of the gas supply device 116 by the urging force of 21, 121. Then, the gas supply device 116 is fixed to the base plate 118 with screws or the like. In this case, when the tape heater 125 is caused to generate heat to heat the heater block 122, the heat of the heater block 122 is changed to the flow path block 1
17 and the like, and the gas supply device 116 is heated.
【０００７】一方、ガス供給装置１１６を取付板１２０
から取り付ける場合には、ガス供給装置１１６とベース
プレート１１８の固定を解除する。ヒータブロック１２
２，１２２を一対のクリップ１２１，１２１の付勢力に
反して外側に押し広げ、ガス供給装置１１６を抜き出
す。従って、集積弁１１５では、ヒータブロック１２
２，１２２を外すことなく、ガス供給装置１１６を取付
板１２０に着脱することができる。On the other hand, the gas supply device 116 is attached to the mounting plate 120.
When mounting from above, the fixation of the gas supply device 116 and the base plate 118 is released. Heater block 12
2 and 122 are pushed outward against the biasing force of the pair of clips 121 and 121, and the gas supply device 116 is pulled out. Therefore, in the integrated valve 115, the heater block 12
The gas supply device 116 can be attached to and detached from the mounting plate 120 without removing the members 2, 122.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、図９に
示す集積弁１１５は、各ガス供給装置１１６の側面にヒ
ータブロック１２２，１２２が取り付けられていた。こ
こで、ガス供給装置１１６を個別的に加熱するのは、各
ガス供給装置１１６を一定温度に加熱し、気化温度が高
く、常温にて外部から熱を加えないと液化しやすいジク
ロールシラン等を高精度に制御することにより、チャン
バ等で生産される製品の品質を向上させるためである。
そのため、図８に示すようにガス供給装置１１６を複数
寄せ集めて集積化したときに、隣接するガス供給装置１
１６の間にヒータブロック１２２，１２２を配設するた
めの隙間Ｓを設ける必要があった。従って、従来の集積
弁１１５では、ラインピッチＱが大きいために幅寸法が
長くなり、集積弁の最大のメリットであるコンパクト化
が損なわれていた。However, in the integrated valve 115 shown in FIG. 9, the heater blocks 122, 122 are attached to the side surface of each gas supply device 116. Here, the gas supply devices 116 are individually heated by heating each of the gas supply devices 116 to a constant temperature, having a high vaporization temperature, and being easily liquefied unless external heat is applied at room temperature. This is to improve the quality of products produced in the chamber or the like by controlling the temperature with high precision.
Therefore, when a plurality of gas supply devices 116 are gathered together and integrated as shown in FIG.
It was necessary to provide a gap S between the 16 for disposing the heater blocks 122, 122. Therefore, in the conventional integrated valve 115, since the line pitch Q is large, the width dimension is long, and the compactness which is the greatest merit of the integrated valve is impaired.
【０００９】特に、半導体製造工程では、ガス流量の精
度が品質に直接与える影響が極めて大きく、集積弁をコ
ンパクトにして流量損失を小さくすることが強く望まれ
ている点で問題である。また、上述したように、水分を
完全に除去するためにガス供給装置１１６を加熱する場
合には、各ガス供給装置１１６を一定温度に加熱する必
要はなく、図８及び図９に示す集積弁１１５が適切にガ
ス供給装置１１６を加熱しているとはいえない。In particular, in the semiconductor manufacturing process, the accuracy of the gas flow rate has a great influence directly on the quality, and it is strongly desired to make the integrated valve compact to reduce the flow rate loss. Further, as described above, when heating the gas supply devices 116 to completely remove water, it is not necessary to heat each gas supply device 116 to a constant temperature, and the integrated valve shown in FIGS. 8 and 9 is used. It cannot be said that 115 properly heats the gas supply device 116.
【００１０】そこで、本発明は、ガス供給装置の設置間
隔を短くしたコンパクトな集積弁を提供することを目的
とする。Therefore, an object of the present invention is to provide a compact integrated valve in which the installation interval of the gas supply device is shortened.
【００１１】[0011]
【課題を解決するための手段】この課題を解決するため
に成された請求項１に記載の発明は、作用ガスを供給す
るガス供給装置を複数集めて取付板に固定した集積弁に
おいて、取付板を加温する取付板加温手段を有するこ
と、を特徴とする。The invention according to claim 1 made in order to solve this problem is an integrated valve in which a plurality of gas supply devices for supplying a working gas are collected and fixed to a mounting plate. It has a mounting plate heating means for heating the plate.
【００１２】よって、請求項１に記載の発明は、複数の
ガス供給装置が設置された取付板を取付板加温手段によ
り加温する。取付板が発生する熱は、ガス供給装置の底
面に伝達されて、ガス供給装置を加熱する。そのため、
ガス供給装置を加熱するためのヒータ等をガス供給装置
の側面等に取り付ける必要がない。従って、ガス供給装
置を近接させて取付板に取り付けることができる。Therefore, according to the first aspect of the invention, the mounting plate on which the plurality of gas supply devices are installed is heated by the mounting plate heating means. The heat generated by the mounting plate is transferred to the bottom surface of the gas supply device to heat the gas supply device. for that reason,
It is not necessary to attach a heater or the like for heating the gas supply device to the side surface or the like of the gas supply device. Therefore, the gas supply device can be mounted close to the mounting plate.
【００１３】また、請求項２に記載の発明は、請求項１
に記載の発明であって、平面状のヒータは、シート状の
加温部材と、加温部材が発生する熱を断熱する断熱部材
と、加温部材と断熱部材とを取付板に固定する固定部材
と、を有し、加温部材が取付板と断熱部材との間に密着
した状態で固定部材により取付板に固定されているこ
と、を特徴とする。The invention described in claim 2 is the same as claim 1
The flat heater is a sheet-shaped heating member, a heat insulating member for insulating heat generated by the heating member, and a fixing member for fixing the heating member and the heat insulating member to a mounting plate. And a heating member is fixed to the mounting plate by a fixing member in a state in which the heating member is in close contact with the mounting plate and the heat insulating member.
【００１４】よって、請求項２に記載の発明は、請求項
１に記載の発明の作用に加え、取付板に加温部材及び断
熱部材を重ねて固定部材で固定し、複数のガス供給装置
を取り付ける。加温部材を加温すると、その熱が取付板
に伝達されて取付板を加温する。取付板が発生する熱
は、ガス供給装置の底面に伝達され、ガス供給装置を加
熱する。ここで、加温部材が発生する熱は、断熱部材で
逃げを防止されるため、効率良く取付板に伝達される。Therefore, according to the invention described in claim 2, in addition to the function of the invention described in claim 1, the heating member and the heat insulating member are stacked on the mounting plate and fixed by the fixing member, and a plurality of gas supply devices are provided. Install. When the heating member is heated, the heat is transferred to the mounting plate to heat the mounting plate. The heat generated by the mounting plate is transferred to the bottom surface of the gas supply device and heats the gas supply device. Here, the heat generated by the heating member is efficiently transmitted to the mounting plate because the heat insulating member prevents the heat from escaping.
【００１５】また、請求項３に記載の発明は、請求項１
に記載の発明であって、取付板加温手段は、取付板に穿
設されたヒータ孔に装着される棒状ヒータであること、
を特徴とする。The invention according to claim 3 is the same as claim 1
The mounting plate heating means is a rod-shaped heater mounted in a heater hole formed in the mounting plate.
Is characterized by.
【００１６】よって、請求項３に記載の発明は、請求項
１に記載の発明の作用に加え、取付板のヒータ孔に棒状
ヒータを装着し、複数のガス供給装置を取付板に固定す
る。棒状ヒータを加温すると、その熱が取付板に伝達さ
れて取付板を加温する。取付板が発生する熱は、ガス供
給装置の底面に伝達されて、ガス供給装置を加熱する。Therefore, in the invention described in claim 3, in addition to the operation of the invention described in claim 1, a rod-shaped heater is mounted in the heater hole of the mounting plate to fix the plurality of gas supply devices to the mounting plate. When the rod-shaped heater is heated, the heat is transmitted to the mounting plate to heat the mounting plate. The heat generated by the mounting plate is transferred to the bottom surface of the gas supply device to heat the gas supply device.
【００１７】また、請求項４に記載の発明は、作用ガス
を供給するガス供給装置を複数集めて取付板に固定した
集積弁において、取付板は、インサート成形により棒状
のヒータと一体的に形成されていること、を特徴とす
る。According to a fourth aspect of the present invention, in the integrated valve in which a plurality of gas supply devices for supplying working gas are collected and fixed to a mounting plate, the mounting plate is integrally formed with a rod-shaped heater by insert molding. It is characterized by being.
【００１８】よって、請求項４に記載の発明は、取付板
に複数のガス供給装置を設置する。棒状のヒータを加熱
すると、棒状ヒータと一体的に形成された取付板が加温
される。取付板が発生する熱は、ガス供給装置の底面に
伝達されて、ガス供給装置を加熱する。そのため、ガス
供給装置を加熱するためのヒータ等をガス供給装置の側
面等に取り付ける必要がない。従って、ガス供給装置を
近接させて取付板に取り付けることができる。Therefore, according to the fourth aspect of the invention, a plurality of gas supply devices are installed on the mounting plate. When the rod-shaped heater is heated, the mounting plate integrally formed with the rod-shaped heater is heated. The heat generated by the mounting plate is transferred to the bottom surface of the gas supply device to heat the gas supply device. Therefore, it is not necessary to attach a heater or the like for heating the gas supply device to the side surface or the like of the gas supply device. Therefore, the gas supply device can be mounted close to the mounting plate.
【００１９】また、請求項５に記載の発明は、請求項１
乃至請求項４の何れか１つに記載の発明であって、ガス
供給装置が、有機金属を含むガスを供給すること、を特
徴とする。The invention described in claim 5 is the same as claim 1.
The invention according to any one of claims 4 to 4, wherein the gas supply device supplies a gas containing an organic metal.
【００２０】よって、請求項５に記載の発明は、請求項
１乃至請求項４の何れか１つに記載の発明の作用に加
え、ガス供給装置が有機金属を含むガスの流量を制御す
る。メンテナンス時には、ガス供給装置を水等で洗浄す
る。そして、取付板加温部材を加温して、ガス供給装置
を加熱する。この加熱により、ガス供給装置は、流路の
内壁等に付着する水分が完全に除去される。そのため、
有機金属を含むガスは、ガス供給装置を流れるときに酸
化しない。Therefore, according to the invention described in claim 5, in addition to the operation of the invention described in any one of claims 1 to 4, the gas supply device controls the flow rate of the gas containing an organic metal. At the time of maintenance, the gas supply device is washed with water or the like. Then, the mounting plate heating member is heated to heat the gas supply device. By this heating, the gas supply device completely removes the moisture adhering to the inner wall of the flow path and the like. for that reason,
The gas containing the organic metal does not oxidize when flowing through the gas supply device.
【００２１】[0021]
【発明の実施の形態】（第１の実施の形態）以下、本発
明の第１の実施の形態を図面を参照して説明する。図１
に示す集積弁１は、複数のガス供給装置２を取付板２１
に取り付けたものである。ガス供給装置２は、図中右側
から手動弁３、調圧弁（レギュレータ）４、圧力計５、
入力開閉弁６、パージ弁７、質量流量計付電磁弁８、出
力開閉弁９が、流路ブロック１０，１１，１２，１３，
１５，１８，１９及び継手ブロック１４，１６，１７を
介して連結され、作用ガスが流れる集積ラインが形成さ
れている。本実施の形態では、作用ガスとして有機金属
を含むガスが使用されている。BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings. Figure 1
The integrated valve 1 shown in FIG.
It is attached to. The gas supply device 2 includes a manual valve 3, a pressure regulating valve (regulator) 4, a pressure gauge 5, from the right side in the drawing.
The input opening / closing valve 6, the purge valve 7, the solenoid valve 8 with the mass flow meter, and the output opening / closing valve 9 are the flow path blocks 10, 11, 12, 13,
15, 18 and 19 and joint blocks 14, 16 and 17 are connected to form an integrated line through which the working gas flows. In this embodiment, a gas containing an organic metal is used as the working gas.
【００２２】取付板２１には、集積弁１を設置する設置
面との間に空間を形成するための脚が設けられている。
その空間には、取付板２１を加温するための取付板加温
部材２２が配設されている。図２に示すように、取付板
加温部材２２は、電圧を印加するための導線２０が接続
され、電圧を印加されたときに発熱するようになってい
る。図３に示すように、取付板加温部材２２は、略正方
形状をなし、取付板２１の表面に取り付けられた複数の
ガス供給装置２の設置面積と同程度の面積を有してい
る。The mounting plate 21 is provided with legs for forming a space between the mounting plate 21 and a mounting surface on which the integrated valve 1 is mounted.
A mounting plate heating member 22 for heating the mounting plate 21 is arranged in the space. As shown in FIG. 2, the mounting plate heating member 22 is connected to the conducting wire 20 for applying a voltage, and generates heat when a voltage is applied. As shown in FIG. 3, the mounting plate heating member 22 has a substantially square shape, and has an area approximately the same as the installation area of the plurality of gas supply devices 2 mounted on the surface of the mounting plate 21.
【００２３】取付板加温部材２２は、図４に示すよう
に、シート状のヒータ２３とスポンジ２４が固定板２５
に狭持されたものである。取付板加温部材２２は、取付
板２１に挿し通されたボルト２６に、中間部材２７と固
定板２５の貫通孔をはめ込み、ナット２８を締結するこ
とにより取付板２１に固定されている。中間部材２７を
取付板２１と固定板２５との間に配設したのは、各固定
箇所においてナット２８を一定の力で締結し、ヒータ２
３を取付板２１にほぼ均等の圧力で密着させるためであ
る。従って、取付板加温部材２２は、発生した熱を取付
板２１にほぼ均等に伝達するように取付板２１に固定さ
れている。As shown in FIG. 4, the mounting plate heating member 22 includes a sheet-shaped heater 23 and a sponge 24, and a fixing plate 25.
It was held in. The attachment plate heating member 22 is fixed to the attachment plate 21 by fitting the through holes of the intermediate member 27 and the fixing plate 25 into the bolts 26 inserted through the attachment plate 21 and fastening the nuts 28. The intermediate member 27 is arranged between the mounting plate 21 and the fixed plate 25 because the nut 28 is fastened with a constant force at each fixed position.
This is because the mounting plate 3 is closely attached to the mounting plate 21 with a substantially uniform pressure. Therefore, the mounting plate heating member 22 is fixed to the mounting plate 21 so that the generated heat is transferred to the mounting plate 21 substantially evenly.
【００２４】取付板２１には、複数のガス供給装置２を
ネジ固定するためのネジ孔が形成されている。このネジ
孔は、隣接するガス供給装置２の側面が近接するように
形成されている。従って、複数のガス供給装置２は、隣
り合うガス供給装置２と近接した状態で取付板２１に取
り付けられて集積化されている。The attachment plate 21 is formed with screw holes for fixing the plurality of gas supply devices 2 with screws. The screw holes are formed so that the side surfaces of the adjacent gas supply devices 2 are close to each other. Therefore, the plurality of gas supply devices 2 are mounted on the mounting plate 21 in a state of being adjacent to the adjacent gas supply devices 2 and integrated.
【００２５】このような集積弁１をメンテナンスする場
合には、各々のガス供給装置２に洗浄水を供給し、流路
内に付着する有機金属を含むガスを洗い流す。そして、
ヒータ２３に電圧を印加して、発熱させる。ヒータ２３
の熱は、取付板２１の裏面に直接伝達され、取付板２１
を加温する。取付板２１の熱は、表面に当接する各ガス
供給装置２の底面に伝達される。従って、複数のガス供
給装置２は、加温された取付板２１により一体的に加熱
される。ここで、ヒータ２３は、スポンジ２４により断
熱されているため、発熱した熱が効率よく取付板２１に
伝達される。そして、ガス供給装置２は、取付板２１に
よって２日間程度加熱され、流路内の水分が完全に除去
される。When performing maintenance on the integrated valve 1 as described above, cleaning water is supplied to each of the gas supply devices 2 and the gas containing the organic metal adhering to the inside of the flow path is washed away. And
A voltage is applied to the heater 23 to generate heat. Heater 23
Heat of the mounting plate 21 is directly transferred to the back surface of the mounting plate 21.
To warm. The heat of the mounting plate 21 is transferred to the bottom surface of each gas supply device 2 that contacts the surface. Therefore, the plurality of gas supply devices 2 are integrally heated by the heated mounting plate 21. Here, since the heater 23 is thermally insulated by the sponge 24, the generated heat is efficiently transmitted to the mounting plate 21. Then, the gas supply device 2 is heated by the mounting plate 21 for about two days, and the water content in the flow path is completely removed.
【００２６】従って、第１の実施の形態の集積弁１によ
れば、取付板加温部材２２で取付板２１を加温し、複数
のガス供給装置２を一体的に加熱するので、各ガス供給
装置２にヒータ等の加熱部材を取り付ける必要がなく、
図８に示す従来の集積弁１１５のようにガス供給装置２
の間に隙間Ｓを設ける必要がない。そのため、例えば、
図８に示す従来の集積弁１１５では、ラインピッチＱが
約５０ｍｍであったのに対して、図２に示す第１の実施
の形態の集積弁１では、ラインピッチＰが約４０ｍｍに
なり、ラインピッチを約１０ｍｍも小さくすることがで
きた。よって、第１の実施の形態の集積弁１では、ガス
供給装置２の設置間隔を小さくして幅寸法を短くするこ
とができ、集積弁１全体をコンパクトにすることができ
た。この効果は、取付板２１に取り付けるガス供給装置
２の数が増加する程に顕著になることはいうまでもな
い。そして、集積弁１を半導体製造装置に使用した場合
には、作用ガスの流量損失を低減して、作用ガスを高精
度で制御することができ、製品品質を向上させることが
できる。Therefore, according to the integrated valve 1 of the first embodiment, the mounting plate 21 is heated by the mounting plate heating member 22 and the plurality of gas supply devices 2 are integrally heated. It is not necessary to attach a heating member such as a heater to the supply device 2,
As in the conventional integrated valve 115 shown in FIG.
There is no need to provide a gap S between them. So, for example,
In the conventional integrated valve 115 shown in FIG. 8, the line pitch Q is about 50 mm, whereas in the integrated valve 1 of the first embodiment shown in FIG. 2, the line pitch P is about 40 mm, The line pitch could be reduced by about 10 mm. Therefore, in the integrated valve 1 of the first embodiment, the installation interval of the gas supply device 2 can be reduced to reduce the width dimension, and the integrated valve 1 as a whole can be made compact. It goes without saying that this effect becomes more remarkable as the number of gas supply devices 2 attached to the attachment plate 21 increases. When the integrated valve 1 is used in a semiconductor manufacturing apparatus, the working gas flow loss can be reduced, the working gas can be controlled with high accuracy, and the product quality can be improved.
【００２７】また、第１の実施の形態の集積弁１によれ
ば、取付板加温部材２２が取付板２１に着脱可能に固定
されているので、取付板加温部材２２が故障等しても、
ガス供給装置２を取り外さずに取付板加温部材２２を交
換することができ、メンテナンスが容易である。Further, according to the integrated valve 1 of the first embodiment, since the mounting plate heating member 22 is detachably fixed to the mounting plate 21, the mounting plate heating member 22 may be damaged or the like. Also,
The mounting plate heating member 22 can be replaced without removing the gas supply device 2, and maintenance is easy.
【００２８】尚、従来、ガス供給装置を加熱するのは、
気化温度が高く、常温にて外部から熱を加えないと液化
しやすいジクロールシラン等を高精度に制御することに
より、チャンバ等で生産される製品の品質を向上させる
ためであった。そのため、各ガス供給装置２は、一定温
度に加熱することが前提とされており、複数のガス供給
装置２を一体的に加熱する技術的思想はなかった。それ
に対し、第１の実施の形態の集積弁１では、ガス供給装
置２の流路内の水分を完全に除去し、有機金属を含むガ
スの酸化を防止するために、ガス供給装置２を加熱して
いる。従って、各ガス供給装置２を一定温度に加熱する
必要はなく、一体的に加熱しても何ら問題はない。むし
ろ、近接するガス供給装置２が互いに熱を伝達し合って
相乗的に加熱され、効率が良い点で、好ましいと考えら
れる。Conventionally, heating the gas supply device is
This is to improve the quality of the product produced in the chamber or the like by controlling with high accuracy the dichlorosilane and the like, which have a high vaporization temperature and are easily liquefied unless external heat is applied at room temperature. Therefore, it is premised that each gas supply device 2 is heated to a constant temperature, and there is no technical idea of integrally heating a plurality of gas supply devices 2. On the other hand, in the integrated valve 1 of the first embodiment, the gas supply device 2 is heated in order to completely remove the water in the flow path of the gas supply device 2 and prevent the oxidation of the gas containing the organic metal. is doing. Therefore, it is not necessary to heat each gas supply device 2 to a constant temperature, and there is no problem even if they are integrally heated. Rather, it is considered preferable that the adjacent gas supply devices 2 transfer heat to each other and are synergistically heated, and the efficiency is high.
【００２９】（第２の実施の形態）続いて、本発明に係
り第２の実施の形態の集積弁について図面を参照して説
明する。図５に示す第２の実施の形態の集積弁は、図１
に示す第１の実施の形態の集積弁１の取付板２１を改良
したものである。従って、第２の実施の形態の集積弁の
概要は、第１の実施の形態の集積弁１のものと同じであ
るので、その詳細な説明は省略する。また、第１の実施
の形態の集積弁１に使用した符号は、第２の実施の形態
の集積弁の説明においても使用するものとする。(Second Embodiment) Next, an integrated valve according to a second embodiment of the present invention will be described with reference to the drawings. The integrated valve of the second embodiment shown in FIG.
The mounting plate 21 of the integrated valve 1 according to the first embodiment shown in FIG. Therefore, the outline of the integrated valve of the second embodiment is the same as that of the integrated valve 1 of the first embodiment, and the detailed description thereof is omitted. Further, the reference numerals used for the integrated valve 1 of the first embodiment are also used in the description of the integrated valve of the second embodiment.
【００３０】第２の実施の形態の集積弁では、取付板３
１が複数のヒータ孔３１ａを穿設されている。ヒータ孔
３１ａは、各集積ラインのほぼ真下に形成されている。
よって、ヒータ孔３１ａは、集積ラインと平行に等間隔
で形成されている。各々のヒータ孔３１ａには、棒状ヒ
ータ３２が隙間なくはめ込まれて図示しない止めネジで
固定されている。In the integrated valve of the second embodiment, the mounting plate 3
1 has a plurality of heater holes 31a. The heater hole 31a is formed almost directly under each integrated line.
Therefore, the heater holes 31a are formed in parallel with the integration line at equal intervals. A rod-shaped heater 32 is fitted into each of the heater holes 31a without a gap and fixed by a set screw (not shown).
【００３１】そして、取付板３１に設置されたガス供給
装置２を加熱する場合には、棒状ヒータ３２に電圧を印
加して、発熱させる。棒状ヒータ３２が発生する熱は、
ヒータ孔３１ａの内壁に直接伝達されて、取付板３１を
加温する。取付板３１の熱は、ガス供給装置２の底面に
伝達され、ガス供給装置２を加熱する。ここで、棒状ヒ
ータ３２は、ガス供給装置２の真下で各々発熱するた
め、棒状ヒータ３２の発生した熱が効率よくガス供給装
置２に伝達される。When heating the gas supply device 2 installed on the mounting plate 31, a voltage is applied to the rod-shaped heater 32 to generate heat. The heat generated by the rod-shaped heater 32 is
It is directly transmitted to the inner wall of the heater hole 31a to heat the mounting plate 31. The heat of the mounting plate 31 is transferred to the bottom surface of the gas supply device 2 and heats the gas supply device 2. Here, since the rod-shaped heaters 32 each generate heat directly below the gas supply device 2, the heat generated by the rod-shaped heaters 32 is efficiently transmitted to the gas supply device 2.
【００３２】従って、第２の実施の形態の集積弁によれ
ば、棒状ヒータ３２が故障したときに、ガス供給装置装
置２を取り外さずに故障した棒状ヒータ３２を交換でき
るので、メンテナンスが容易である。また、故障した棒
状ヒータ３２のみを交換できるので、第１の実施の形態
の集積弁１と比較して、メンテナンスコストを抑えるこ
とができる。Therefore, according to the integrated valve of the second embodiment, when the rod-shaped heater 32 fails, the failed rod-shaped heater 32 can be replaced without detaching the gas supply device 2, so that maintenance is easy. is there. Further, since only the defective rod-shaped heater 32 can be replaced, maintenance cost can be suppressed as compared with the integrated valve 1 of the first embodiment.
【００３３】また、第２の実施の形態の集積弁によれ
ば、棒状ヒータ３２に電圧を個別的に印加して取付板２
１を局部的に加温することにより、任意のガス供給装置
２を加熱することができる。In addition, according to the integrated valve of the second embodiment, the voltage is individually applied to the rod-shaped heater 32 and the mounting plate 2 is attached.
By heating 1 locally, it is possible to heat any gas supply device 2.
【００３４】（第３の実施の形態）続いて、本発明に係
り第３の実施の形態の集積弁について図面を参照して説
明する。図６に示す第３の実施の形態の集積弁は、図１
に示す第１の実施の形態の集積弁１の取付板２１を改良
したものである。従って、図６に示す第３の実施の形態
の集積弁の概要は、図１に示す第１の実施の形態の集積
弁１のものと同じであるので、その詳細な説明は省略す
る。また、第１の実施の形態の集積弁１に使用した符号
は、第３の実施の形態の集積弁の説明においても使用す
るものとする。(Third Embodiment) Next, an integrated valve according to a third embodiment of the present invention will be described with reference to the drawings. The integrated valve of the third embodiment shown in FIG.
The mounting plate 21 of the integrated valve 1 according to the first embodiment shown in FIG. Therefore, the outline of the integrated valve of the third embodiment shown in FIG. 6 is the same as that of the integrated valve 1 of the first embodiment shown in FIG. 1, and therefore its detailed description is omitted. Further, the reference numerals used for the integrated valve 1 of the first embodiment are also used in the description of the integrated valve of the third embodiment.
【００３５】第３の実施の形態の集積弁では、取付板４
１はインサート成形されている。取付板４１は、電圧を
印加されて発熱する棒状のヒータ４２と一体的に形成さ
れている。ヒータ４２は、取付板４１に等間隔に配置さ
れるように折り曲げられており、両端部が電極に接続さ
れるように外部に露出している。In the integrated valve of the third embodiment, the mounting plate 4
1 is insert-molded. The mounting plate 41 is integrally formed with a rod-shaped heater 42 that is heated by being applied with a voltage. The heater 42 is bent so as to be arranged at equal intervals on the mounting plate 41, and both ends thereof are exposed to the outside so as to be connected to the electrodes.
【００３６】そして、第３の実施の形態の集積弁は、取
付板４１に取り付けられたガス供給装置２を加熱する場
合には、ヒータ４２に電圧を印加する。ヒータ４２は、
取付板４１に埋設されているので、ヒータ４２が発生す
る熱は取付板４１に直接伝達される。取付板４１が加温
されると、その熱が、ガス供給装置２の底面に伝達され
る。従って、複数のガス供給装置２は、取付板４１によ
り一体的に加熱される。The integrated valve of the third embodiment applies a voltage to the heater 42 when heating the gas supply device 2 mounted on the mounting plate 41. The heater 42 is
Since it is embedded in the mounting plate 41, the heat generated by the heater 42 is directly transferred to the mounting plate 41. When the mounting plate 41 is heated, the heat is transferred to the bottom surface of the gas supply device 2. Therefore, the plurality of gas supply devices 2 are integrally heated by the mounting plate 41.
【００３７】従って、第３の実施の形態の集積弁によれ
ば、第１，第２の実施の形態のように、取付板４１に取
付板加温部材２２や棒状ヒータ３２等を取り付ける必要
がなく、第１，第２の実施の形態と比較して、構造を単
純にすることができ、さらなるコンパクト化を図ること
ができる。Therefore, according to the integrated valve of the third embodiment, it is necessary to attach the attachment plate heating member 22, the rod-shaped heater 32, etc. to the attachment plate 41 as in the first and second embodiments. Instead, compared to the first and second embodiments, the structure can be simplified and further compactification can be achieved.
【００３８】尚、本発明は上記実施の形態に限定される
ものでなく、その趣旨を逸脱しない範囲で様々な変更が
可能である。The present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention.
【００３９】（１）例えば、上記第１の実施の形態の集
積弁１では、計温せずに、ガス供給装置２を加熱してい
る。それに対し、温度センサを設けて、流路内の温度等
を計測しながらガス供給装置２を加熱するようにしても
よい。(1) For example, in the integrated valve 1 of the first embodiment, the gas supply device 2 is heated without measuring the temperature. On the other hand, a temperature sensor may be provided to heat the gas supply device 2 while measuring the temperature in the flow path and the like.
【００４０】（２）例えば、上記第１の実施の形態の集
積弁１では、取付板加温部材２２を略正方形状に形成
し、複数のガス供給装置２の全てに熱を伝達するように
配設した。それに対し、取付板加温部材を短冊状に形成
し、集積ラインと平行に取付板加温部材を取付板２１に
それぞれ固定するようにしてもよい。この場合、ガス供
給装置２に温度センサを設け、温度センサの計測結果に
基づいて取付板加温部材への印加電圧を各々調整し、各
ガス供給装置２を一定温度に加熱するようにしてもよ
い。また、取付板加温部材を短冊状に形成し、集積ライ
ンと直交するように取付板加温部材を取付板２１に固定
してもよい。(2) For example, in the integrated valve 1 of the first embodiment, the mounting plate heating member 22 is formed in a substantially square shape so that heat is transferred to all of the plurality of gas supply devices 2. Arranged. On the other hand, the mounting plate heating member may be formed in a strip shape, and the mounting plate heating member may be fixed to the mounting plate 21 in parallel with the integration line. In this case, a temperature sensor may be provided in the gas supply device 2, and the voltage applied to the mounting plate heating member may be adjusted based on the measurement result of the temperature sensor to heat each gas supply device 2 to a constant temperature. Good. Alternatively, the mounting plate heating member may be formed in a strip shape, and the mounting plate heating member may be fixed to the mounting plate 21 so as to be orthogonal to the stacking line.
【００４１】（３）例えば、上記第１の実施の形態の集
積弁１では、ガス供給装置２に入力開閉弁３等が搭載さ
れている。それに対し、搭載する部材の種類や配置等を
変更してもよい。また、各部材を連結する流路ブロック
１０や継手ブロック１４等の種類や配置等を変更しても
よい。(3) For example, in the integrated valve 1 of the first embodiment, the gas supply device 2 is equipped with the input opening / closing valve 3 and the like. On the other hand, the type and arrangement of the mounted members may be changed. Further, the types and arrangements of the flow path block 10 and the joint block 14 that connect the respective members may be changed.
【００４２】（４）例えば、上記第２の実施の形態の集
積弁では、集積ラインと平行に棒状ヒータ３２を取付板
３１に装着した。それに対し、集積ラインと直交するよ
うに複数の棒状ヒータを配置してもよい。この場合、棒
状ヒータ３２を等間隔に配設して取付板３１を均等に加
熱してもよいし、ガス供給装置２が取付板３１に当接す
る部分（例えば、流路ブロックの真下など）に棒状ヒー
タを配置して取付板３１を局部的に加熱するようにして
もよい。(4) For example, in the integrated valve of the second embodiment, the rod-shaped heater 32 is attached to the mounting plate 31 in parallel with the integrated line. On the other hand, a plurality of rod-shaped heaters may be arranged so as to be orthogonal to the integrated line. In this case, the rod-shaped heaters 32 may be arranged at equal intervals to heat the mounting plate 31 evenly, or the portion where the gas supply device 2 abuts the mounting plate 31 (for example, directly below the flow path block). You may make it arrange | position a rod-shaped heater and heat the mounting plate 31 locally.
【００４３】（５）例えば、上記第３の実施の形態の集
積弁では、折り曲げたヒータ４２を取付板４１と一体的
に形成した。それに対し、ヒータ４２より短尺な棒状の
ヒータを等間隔に配置して、取付板４１と一体的に形成
するようにしてもよい。(5) For example, in the integrated valve of the third embodiment, the bent heater 42 is formed integrally with the mounting plate 41. On the other hand, rod-shaped heaters shorter than the heater 42 may be arranged at equal intervals and formed integrally with the mounting plate 41.
【００４４】[0044]
【発明の効果】以上詳細に説明したように、本発明の請
求項１に記載の集積弁によれば、ガス供給装置の設置間
隔を小さくして、幅寸法を短くすることができ、集積弁
全体をコンパクトにすることができる。As described above in detail, according to the integrated valve of the first aspect of the present invention, the installation interval of the gas supply device can be reduced and the width dimension can be shortened. The whole can be made compact.
【００４５】また、請求項２に記載の発明によれば、請
求項１に記載する発明の効果に加え、取付板を効率よく
加温することができるとともに、ガス供給装置を取り外
さずにヒータ、断熱部材、固定部材を交換することがで
き、メンテナンスが容易である。According to the invention described in claim 2, in addition to the effect of the invention described in claim 1, the mounting plate can be efficiently heated, and the heater can be heated without removing the gas supply device. The heat insulating member and the fixing member can be replaced, and maintenance is easy.
【００４６】また、請求項３に記載の発明によれば、請
求項１に記載する発明の効果に加え、取付板を効率よく
加温することができるとともに、ガス供給装置を取り外
さずに棒状ヒータを交換することができ、メンテナンス
が容易である。According to the invention described in claim 3, in addition to the effect of the invention described in claim 1, the mounting plate can be efficiently heated, and the rod-shaped heater can be used without removing the gas supply device. Can be replaced and maintenance is easy.
【００４７】また、請求項４に記載の発明によれば、ガ
ス供給装置の設置間隔を小さくして、幅寸法を短くする
ことができ、集積弁全体をコンパクトにすることができ
る。Further, according to the invention described in claim 4, the installation interval of the gas supply device can be reduced, the width dimension can be shortened, and the integrated valve as a whole can be made compact.
【００４８】また、請求項５に記載の発明によれば、歩
留まり率を向上させることができる。According to the invention described in claim 5, the yield rate can be improved.
【図１】本発明に係る第１の実施の形態において、集積
弁の側面図である。FIG. 1 is a side view of an integrated valve in a first embodiment according to the invention.
【図２】同じく、集積弁の概略構成図である。FIG. 2 is likewise a schematic configuration diagram of an integrated valve.
【図３】同じく、取付板加温部材の配置を概念的に示し
た集積弁の平面図である。FIG. 3 is also a plan view of the integrated valve conceptually showing the arrangement of the mounting plate heating member.
【図４】同じく、図１に示すＡ部の拡大断面図である。FIG. 4 is an enlarged cross-sectional view of a portion A shown in FIG.
【図５】本発明に係る第２の実施の形態において、取付
板の構造を示す図である。FIG. 5 is a diagram showing a structure of a mounting plate according to a second embodiment of the present invention.
【図６】本発明に係る第３の実施の形態において、取付
板の構造を示す図である。FIG. 6 is a diagram showing a structure of a mounting plate in a third embodiment according to the present invention.
【図７】従来のガス供給装置の加熱構造を示す図であ
る。FIG. 7 is a view showing a heating structure of a conventional gas supply device.
【図８】従来の集積弁の平面図である。FIG. 8 is a plan view of a conventional integrated valve.
【図９】図８に示す集積弁におけるガス供給装置の加熱
構造を示す図である。9 is a diagram showing a heating structure of a gas supply device in the integrated valve shown in FIG.
１ 集積弁 ２ ガス供給装置 ２１ 取付板 ２２ 取付板加温部材 ３１ 取付板 ３１ａ ヒータ孔 ３２ 棒状ヒータ ４１ 取付板 ４２ ヒータ 1 Accumulation valve 2 gas supply device 21 Mounting plate 22 Mounting plate heating member 31 Mounting plate 31a heater hole 32 bar heater 41 Mounting plate 42 heater
───────────────────────────────────────────────────── フロントページの続き (72)発明者 宮本 忍 愛知県春日井市堀ノ内町850番地 シーケ ーディ株式会社春日井事業所内 Ｆターム(参考） 3H051 AA08 BB10 FF01 3H066 AA01 BA17 BA36 4K030 AA11 EA03 KA11 KA22 5F045 AA04 AC07 BB10 CA10 CA12 EB06 EE04 EK05 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Shinobu Miyamoto 850, Horinouchi Town, Kasugai City, Aichi Prefecture Hardy Co., Ltd. Kasugai Office F-term (reference) 3H051 AA08 BB10 FF01 3H066 AA01 BA17 BA36 4K030 AA11 EA03 KA11 KA22 5F045 AA04 AC07 BB10 CA10 CA12 EB06 EE04 EK05
Claims (5)
集めて取付板に固定した集積弁において、 前記取付板を加温する取付板加温手段を有すること、を
特徴とする集積弁。1. An integrated valve in which a plurality of gas supply devices for supplying a working gas are collected and fixed to a mounting plate, the integrated valve having mounting plate heating means for heating the mounting plate.
固定部材と、を有し、 前記加温部材が前記取付板と前記断熱部材との間に密着
した状態で前記固定部材により前記取付板に固定されて
いること、を特徴とする集積弁。2. The integrated valve according to claim 1, wherein the mounting plate heating means includes a sheet-shaped heating member, a heat insulating member that insulates heat generated by the heating member, and the heating member. A fixing member for fixing the temperature member and the heat insulating member to the mounting plate, wherein the heating member is attached to the mounting plate by the fixing member in a state of being in close contact between the mounting plate and the heat insulating member. An integrated valve characterized by being fixed.
孔に装着される棒状ヒータであること、を特徴とする集
積弁。3. The integrated valve according to claim 1, wherein the mounting plate heating means is a rod-shaped heater mounted in a heater hole formed in the mounting plate. valve.
集めて取付板に固定した集積弁において、 前記取付板は、インサート成形により棒状のヒータと一
体的に形成されていること、を特徴とする集積弁。4. An integrated valve in which a plurality of gas supply devices for supplying a working gas are collected and fixed to a mounting plate, wherein the mounting plate is integrally formed with a rod-shaped heater by insert molding. Integrated valve to do.
載する集積弁であって、 前記ガス供給装置が、有機金属を含むガスを供給するこ
と、を特徴とする集積弁。5. The integrated valve according to any one of claims 1 to 4, wherein the gas supply device supplies a gas containing an organic metal.
Priority Applications (1)
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|---|---|---|---|
| JP2001257804A JP4653358B2 (en) | 2001-08-28 | 2001-08-28 | Integrated valve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001257804A JP4653358B2 (en) | 2001-08-28 | 2001-08-28 | Integrated valve |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003065462A true JP2003065462A (en) | 2003-03-05 |
| JP4653358B2 JP4653358B2 (en) | 2011-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001257804A Expired - Fee Related JP4653358B2 (en) | 2001-08-28 | 2001-08-28 | Integrated valve |
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| US8651135B2 (en) | 2010-06-30 | 2014-02-18 | Kabushiki Kaisha Toshiba | Mass flow controller, mass flow controller system, substrate processing device, and gas flow rate adjusting method |
| WO2014084014A1 (en) * | 2012-11-29 | 2014-06-05 | 株式会社フジキン | Fluid control device |
| JP2021004669A (en) * | 2019-06-27 | 2021-01-14 | 株式会社フジキン | Fluid control device |
| WO2023120402A1 (en) * | 2021-12-22 | 2023-06-29 | 株式会社プロテリアル | Vaporizer |
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|---|---|---|---|---|
| WO2023220595A1 (en) * | 2022-05-09 | 2023-11-16 | Watlow Electric Manufacturing Company | Heater system for gas processing components |
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