JP2003060104A - Package for housing semiconductor element and semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor package which is superior in transmission efficiency and airtightness of high-frequency signals, and suppresses the influence of distortion due to stress. SOLUTION: The holding member 11 of a coaxial connector 3 is fitted to the fitting part 2a of the side part of a frame 2 through the inside/outside of the frame 2, has a through-hole 11b piercing through to the inside of the frame 2, formed so that the connector 3 is inserted and fitted from the outside of the frame 2, and is provided with a shelf part 11a having a circuit board 6 installed on its upper surface at a site under the through-hole 11b at a surface inside of the frame 2. On the surface of the circuit board 6, a line conductor 6a, connecting the end of a center conductor 3b projecting from the face inside the frame 2 and a semiconductor element 5, is formed. In addition, on a lower side, a small width part 11d where a width in the line direction of a line conductor 6a is reduced toward the inside of the frame is formed, the lower surface of the small width part 11d is connected to the main face of the upper side of a substrate 1, and a side face facing the outside of the frame 2 of the small width part 11d is connected to the inner face of the frame 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element housing package equipped with a coaxial connector as a signal input / output unit for a semiconductor element.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element housing package (hereinafter referred to as a semiconductor package) for storing various semiconductor elements used in the field of optical communication or using high frequency signals such as a microwave band and a millimeter wave band is a semiconductor. A coaxial connector is provided as an input / output terminal for electrically connecting the element and the external electric circuit board. A semiconductor package equipped with this coaxial connector is shown in a sectional view in FIG. In the figure, 21 is a base, 22 is a frame, 23 is a coaxial connector,
24 is a lid.

The base 21 is iron (Fe) -nickel (Ni).
-A substantially rectangular plate-like body made of a sintered material such as a cobalt (Co) alloy or copper (Cu) -tungsten (W), and an IC, LSI, semiconductor laser ( A mounting portion 21a for mounting a circuit board 26 on which a semiconductor element 25 such as an LD) or a photodiode (PD) is mounted is provided. The mounting portion 21a includes the semiconductor element 25.
For example, it is mounted and fixed on the circuit board 26 made of alumina (Al ₂ O ₃ ) ceramics or the like.

The semiconductor element 25 mounted on the circuit board 26 has its electrodes electrically connected to the line conductor 26a formed on the circuit board 26 by bonding wires 27 and the like.

The mounting portion 2 is provided on the outer peripheral portion of the upper main surface of the base 21.
A frame 22 is erected so as to surround 1a,
The frame body 22 is formed with the semiconductor element 25 inside the base body 21.
To form a void for housing The frame body 22 is made of a sintered material such as Fe—Ni—Co alloy or Cu—W like the base body 21, and is formed integrally with the base body 21 or via a brazing material such as silver braze on the base body 21. It is erected on the outer peripheral portion of the upper main surface of the base body 21 by brazing or joining by a welding method such as a seam welding method.

In the coaxial connector 23, a cylindrical outer conductor 23a made of a metal such as Fe-Ni-Co alloy has a rod-shaped central conductor 23b made of a metal such as Fe-Ni-Co alloy on the central axis portion of an insulator 23c. It is fixed through.

A through hole 22a is formed in a side portion of the frame body 22 for inserting the coaxial connector 23 from the outside. The outer peripheral conductor 23a is inserted into the through hole 22a, and the sealing material 28 such as solder is inserted, and then heated to heat the sealing material 28.
And the molten sealing material 28 is filled in the gap between the outer peripheral conductor 23a and the inner surface of the through hole 22a by a capillary phenomenon, so that the coaxial connector 23 inserts the sealing material 28 such as solder into the through hole 22a. Be inserted. The outer peripheral conductor 23a as a ground potential portion is electrically connected to the frame 22 via the sealing material 28, and the center conductor 23b is connected to the line conductor 26a of the circuit board 26 via a conductive adhesive material 26b made of solder or the like. Electrically connected to.

In the semiconductor package provided with the coaxial connector 23, the screw-shaped outer peripheral surface of the coaxial connector plug 29 is screwed into the through hole 22b having a threaded inner peripheral surface, and the coaxial cable is connected to an external electric circuit. By mounting 30 on the coaxial connector plug 29, the semiconductor element 25 housed inside is electrically connected to the external electric circuit via the center conductor 23 b of the coaxial connector 23.

Then, the lid body 24 is joined to the upper surface of the frame body 22 by a welding method such as a brazing method or a seam weld method to form the base body 2.
A semiconductor device as a product is obtained by housing the semiconductor element 25 in an interior of a container composed of 1, the frame body 22 and the lid body 24 and hermetically sealing it.

In this semiconductor package, through holes 21b are provided at opposite ends of the base body 21.
It is mounted by passing a screw through b and fixing it to an external electric circuit board or the like.

[0011]

However, in the conventional semiconductor package, when the semiconductor package is mounted by screwing it through the through hole 21b and fixing it to an external electric circuit board or the like, warpage occurs during the manufacture of the semiconductor package. Since the warp of 21 is corrected, there is a problem that the circuit board 26 mounted and fixed on the base body 21 in a warped state is cracked, the line conductor 26a is cut off, and a high frequency signal cannot be transmitted.

When the warp of the base 21 is corrected, the frame 22
Is distorted, and stress is applied to the outer peripheral conductor 23a inserted into the through hole 22a, so that the outer peripheral conductor 23a and the central conductor 23
The insulator 23c that is interposed between the semiconductor device and the semiconductor device b is cracked, impairing the airtightness of the semiconductor package, and
There is a problem that the transmission efficiency of the high frequency signal transmitted through the central conductor 23b of the coaxial connector 23 is deteriorated. Further, due to the distortion of the frame body 22, the position of the through hole 22a is displaced from its original position, the outer peripheral conductor 23a inserted into the through hole 22a is displaced, and the coaxial connector 2
The entire position of 3 also shifts. Therefore, the central conductor 2
3b comes off from the conductive adhesive material 26b, which causes the transmission of high frequency signals.

Even if the amount of displacement of the center conductor 23b is small and the connection between the center conductor 23b and the conductive adhesive 26b is maintained, the circuit board 26 is placed on the base 21, and the coaxial connector 23 of the frame 22 is mounted. Since it is inserted into the through hole 22a provided in the side portion, the position at which the frame body 22 is joined to the upper main surface of the base body 21 is deviated at the time of manufacturing the semiconductor package, and the center conductor 23b and the line conductor 26a are displaced. The position of the connection part with was sometimes misaligned. Therefore, the impedance at the connection portion is not stable, and the transmission efficiency of the high frequency signal may be deteriorated at the connection portion.

Therefore, the present invention has been completed in view of the above problems, and an object of the present invention is to provide a semiconductor package excellent in high frequency signal transmission efficiency.

[0015]

A semiconductor package according to the present invention includes a base body having a mounting portion for mounting a semiconductor element on an upper main surface and an outer peripheral portion of the upper main surface surrounding the mounting portion. A frame body in which the mounting portion of the holding member of the coaxial connector formed of a through hole or a notch portion is formed on the side portion, and the holding member fitted to the mounting portion,
A package for storing a semiconductor element, comprising: a cylindrical outer peripheral conductor, a central conductor installed on a central axis thereof, and an insulator interposed therebetween, and the coaxial connector held by the holding member, The holding member is fitted so as to penetrate the inside and outside of the frame body, and a through hole penetrating to the inside of the frame body so that the coaxial connector is inserted from the outside of the frame body is formed and A shelf portion having a circuit board installed on the upper surface is provided in a region below the through hole on the inner surface of the frame body, and the end portion of the central conductor protruding from the inner surface of the frame body and the end portion of the center conductor on the surface of the circuit board. A line conductor that electrically connects to the semiconductor element is formed, and a narrow portion is formed below the line conductor, in which the width of the line conductor in the line direction decreases toward the inside of the frame. , It is joined the lower surface of the width narrow portion into the upper surface of the substrate, and the side surface facing the outside of the frame body of said narrow portion is characterized in that it is joined to the inner surface of the frame.

According to the semiconductor package of the present invention, the circuit board conventionally mounted and fixed on the upper main surface of the base body is cracked when it is screwed through the through hole at the end of the base body and mounted on the external electric circuit. The transmission line for high-frequency signals was cut off, but it was installed and fixed on the shelf of the holding member, and due to the stress buffering function of the holding member having a large effect in the narrow portion, almost no distortion was generated on the circuit board. It becomes a state where it does not join. As a result, the occurrence of cracks on the circuit board can be effectively prevented.

Further, in the narrow portion of the holding member, the side surface facing the outside of the frame body (side surface facing the inner surface of the frame body) is joined to the inner surface of the frame body by a brazing material such as silver solder, Since the thickness of the frame body is substantially the same at the joint with the narrow portion, the frame body is reinforced by the holding member. As a result, when the warp of the base body is corrected, it is possible to make the frame less likely to be deformed and suppress the distortion transmitted to the frame.

Also, the coaxial connector, which has been conventionally attached to the side of the frame, is also attached to the holding member to reduce the positional deviation between the center conductor and the line conductor during the manufacture of the semiconductor package and to reduce the semiconductor package. It is possible to reduce the stress transmitted to the coaxial connector when it is mounted on the external electric circuit board. By reducing the misalignment between the center conductor and the line conductor, it is possible to improve the transmission characteristics of high-frequency signals at the connection part between the center conductor and the line conductor, and by reducing the stress transmitted to the coaxial connector, the insulator of the coaxial connector can be used. It is possible to prevent the occurrence of cracks. Further, it is possible to effectively prevent the distortion transmitted to the coaxial connector, eliminate the positional displacement of the coaxial connector, and effectively prevent the center conductor from coming off the line conductor. As a result, the transmission characteristics of high frequency signals and the airtightness inside the semiconductor package are maintained well.

Further, a semiconductor device of the present invention includes the package for accommodating a semiconductor element of the present invention, the semiconductor element mounted and fixed on the mounting portion and electrically connected to the coaxial connector, and the frame. It has a lid joined to the upper surface of the body.

With this configuration, the present invention can provide a highly reliable semiconductor device using the semiconductor package of the present invention.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION The semiconductor package of the present invention will be described in detail below. 1 is a cross-sectional view showing an example of an embodiment of a semiconductor package of the present invention, 1 is a base, 2 is a frame, 3 is a coaxial connector, 6 is a circuit board, 11
Is a holding member.

The substrate 1 is made of Fe-Ni-Co alloy or Cu-W.
The ingot (lump) is made into a predetermined shape by subjecting the ingot (lump) to a conventionally known metal working method such as rolling or punching, or injection molding and cutting. At the center of the upper main surface, IC, L
A mounting portion 1a for mounting the semiconductor element 5 such as SI, LD, PD is provided, and the semiconductor element 5 is mounted and fixed on the mounting portion 1a by a bonding material such as solder. The electrodes of the semiconductor element 5 are electrically connected to the line conductor 6a formed on the circuit board 6 via the bonding wires 7 and the like.

A frame body 2 is joined and erected on the outer peripheral portion of the upper main surface of the base body 1 so as to surround the mounting portion 1a, and the frame body 2 is provided together with the base body 1 inside the semiconductor element. Form a void to accommodate 5. The frame 2 is made of a sintered material such as a Fe—Ni—Co alloy or Cu—W like the base 1, and is integrally molded with the base 1, or is brazed to the base 1 through a brazing material such as silver solder. By being attached or joined by a welding method such as a seam welding method, it is erected on the outer peripheral portion of the upper main surface of the base body 1.

A mounting portion 2a to which the holding member 11 is fitted is formed on a side portion of the frame body 2. The mounting portion 2a is a frame 2
It may be a through hole that penetrates the inside or the outside, or a notch that is cut out in a U shape from the joint surface side of the frame body 2 with the lid body 4 (the upper surface side of the frame body 2) to penetrate the inside and outside of the frame body 2. Is also good.

A holding member 11 made of a metal such as an iron-nickel-cobalt alloy is fitted into the mounting portion 2a, and a frame is formed on the contact surface of the holding member 11 with the mounting portion 2a via a brazing material such as silver solder. It is fitted and joined to the body 2.

The coaxial connector 3 is for electrically connecting the semiconductor element 5 housed inside the semiconductor package to the external coaxial cable 10, and is a cylindrical outer peripheral conductor 3a made of a metal such as Fe--Ni--Co alloy. A central conductor 3b, which is also made of a metal such as Fe—Ni—Co alloy, is fixed to the central axis of (3) through an insulator 3c.

The holding member 11 is fitted so as to penetrate the inside and outside of the frame body 2, and the through hole 11 penetrates from the outside of the frame body 2 to the inside of the frame body 2 so that the coaxial connector 3 is inserted.
b is formed and the through hole 2 on the inner surface of the frame 2 is formed.
Shelf 11 in which the circuit board 6 is installed on the upper surface in the lower part of a
a is provided, and a line conductor 6a is formed on the surface of the circuit board 6 to electrically connect the end of the central conductor 6b protruding from the inner surface of the frame 2 and the semiconductor element 5.

That is, the shelf 11a has a joining material 6d such as solder.
Then, the circuit board 6 having the line conductor 6a on the front surface and the ground conductor 6c on the back surface is placed on the bonding material 6d with the back surface facing the bonding material 6d. The through hole 11b is formed so as to penetrate the inside and outside of the frame body 2, the coaxial connector 3 is inserted into the through hole 11b from the outside, and a sealing material 8 such as solder is provided between the inner surface of the through hole 11b and the outer peripheral conductor 3a. insert. The tip of the center conductor 3b is projected onto the upper surface of the circuit board 6, and a conductive adhesive material 6b such as solder is placed between the tip of the center conductor 3b and the top surface of the line conductor 6a. After that, the bonding material 6d, the sealing material 8 and the conductive adhesive material 6b are heated to be melted, the circuit board 6 is firmly fixed to the shelf portion 11a by the bonding material 6d, and the molten sealing material 8 is caused by the capillary phenomenon. By filling the gap between the outer peripheral conductor 3a and the inner surface of the through hole 11b, the outer peripheral conductor 3b is joined into the through hole 11b via the sealing material 8 such as solder, and the central conductor 3b is connected by the conductive adhesive 6b. The line conductor 6a is connected.

Thus, the outer peripheral conductor 3 serving as the ground potential portion
a is electrically connected to the holding member 11 via the sealing material 8, and the central conductor 3b as a signal line is electrically connected to the line conductor 6a of the circuit board 6 via a conductive adhesive 6b made of solder or the like. Connected to.

The high frequency signal transmitted through the central conductor 3b is transmitted through the central axes of the through holes 11b and 11c in the through holes 11b and 11c, and is transmitted through the coaxial line. Next, after reaching the conductive adhesive 6b such as solder at one end of the line conductor 6a from the surface of the holding member 11 on the inner side of the frame body 2, it is transmitted on the line conductor 6a which is a microstrip line. . The coaxial line and the microstrip line are matched to a predetermined characteristic impedance value. The impedance of the signal line is set to a predetermined value depending on the position of the tip of the central conductor 3b, the position of the line conductor 6a, and the amount of the conductive adhesive 6b at the connection portion formed by the conductive adhesive 6b. In this way, a good signal line with small transmission loss such as reflection loss and transmission loss is formed in the semiconductor package.

The coaxial connector plug 9 inserted and fixed in the through hole 11c of the holding member 11 is for connecting the coaxial cable 10 connected to the external electric circuit and the coaxial connector 3 inserted in the holding member 11. It is a plug, the outer peripheral surface of which is a screw shape, and is screwed into a through hole 11c having a thread cut on the inner peripheral surface.

The holding member 11 is formed with a narrow portion 11d on the lower side in which the width of the line conductor 6a in the line direction is reduced toward the inside of the frame body 2, and the lower surface of the narrow portion 11d is the base 1. Bonded to the upper main surface with a brazing material such as silver brazing,
In addition, the side surface of the narrow portion 11d facing the outside of the frame body 2 (frame body 2
The side surface (opposite the inner surface) is joined to the inner surface of the frame body 2 by a brazing material such as silver brazing. Here, the total length L1 of the line conductor 6a of the narrow portion 11d in the line direction and the thickness T of the frame body 2 becomes smaller than the total length L2 of the line conductor 6a of the holding member 11 in the line direction. There is.

Therefore, since the side surface of the narrow portion 11d is joined to the inner surface of the frame body 2 to reinforce the frame body 2, the stress transmitted to the frame body 2 can be suppressed and the holding member 11 can be restrained.
Has a moderately low rigidity at the narrow portion 11d. As a result, the stress generated by correcting the warp of the base body 1 generated when the base body 1 is screwed to the external electric circuit board or the like is deformed preferentially in the narrow portion 11d, so that the coaxial connector 3 or the circuit board 6 is deformed. It exerts a remarkable cushioning function of absorbing the stress transmitted to the.

In the semiconductor package of the present invention, the electrodes of the semiconductor element 5 and the line conductor 6a attached to the surface of the circuit board 6 are electrically connected by the bonding wires 7, and then the frame 2 is replaced. A lid 4 made of a metal such as Fe-Ni-Co alloy is joined to the upper surface by a soldering method or a seam weld method to obtain a semiconductor device as a product. This semiconductor device is mounted on an external circuit board by screwing through holes 1b provided at opposite ends of the base 1. Further, by connecting the coaxial connector plug 9 and the coaxial cable 10 connected to the external electric circuit, the semiconductor element 5 housed inside is electrically connected to the external electric circuit, and the semiconductor element 5 operates with a high frequency signal. Will be done.

When the through hole 1b of the base 1 is mounted on the external circuit board by screwing, the warpage of the base 1 which has occurred in the brazing process during the manufacture of the semiconductor package is corrected,
Extra stress and strain are applied to the base body 1 and the frame body 2. In the semiconductor package of the present invention, the side surface of the narrow portion 11d of the holding member 11 facing the outside of the frame body 2 (the side surface facing the inner surface of the frame body 2) is the inner surface of the frame body 2 and a brazing material such as silver solder. Are joined by. That is, the holding member 11 reinforces the frame body 2 because the frame body 2 becomes substantially thicker at the joint with the narrow portion 4d. As a result, when the warp of the substrate 1 is corrected, the frame 2
It is possible to prevent the deformation of the frame and suppress the distortion transmitted to the frame body 2.

Further, since the coaxial connector 3 and the circuit board 6 are provided on the frame body 2 via the holding member 11, even if extra stress or strain is applied to the frame body 2, the holding member 11 disperses them. And absorbed.

In the present invention, the coaxial connector 3, which has been conventionally inserted into the through hole provided on the side portion of the frame body 2, is inserted into the through hole 11b of the holding member 11, and also the upper main body of the conventional base body 1 is inserted. In the present invention, the circuit board 6 placed on the mounting portion 1 a on the surface is installed on the shelf 11 a of the holding member 11, and the coaxial connector 3 and the circuit board 6 are both provided on the holding member 11. Therefore, the positional displacement between the coaxial connector 3 and the circuit board 6 due to the displacement of the joint position between the frame 2 and the base body 1 is eliminated, and the position of the connecting portion between the central conductor 3b of the coaxial connector 3 and the line conductor 6a of the circuit substrate 6 is eliminated. Can be stabilized.

In the present invention, as shown in FIG. 2, the length of the line conductor 6a of the circuit board 6 in the line direction is A, the width of the circuit board 6 in the direction substantially perpendicular to the line direction is B, and the holding member 11 is When the length of the shelf portion 11a in the line direction is X and the width of the holding member 11 in the direction substantially perpendicular to the line direction is Y, A + 0.1 m
It is preferable that m ≦ X ≦ 2A and B + 0.1 mm ≦ Y ≦ 2B. In this case, when the semiconductor package is mounted on the external circuit board, the strain transmitted from the frame body 2 to the insertion portion of the outer peripheral conductor 3a of the coaxial connector 3 is effectively absorbed by the holding member 11, and the center conductor 3b of the coaxial connector 3 is removed. It is possible to reliably prevent the position conductor from being displaced and coming off the line conductor 6a.

X <A + 0.1 mm and Y <B + 0.1 m
When m is set, the circuit board 6 may protrude from the shelf 11a, and the circuit board 6 is likely to be cracked or cracked. Further, since the meniscus of the brazing material for joining the circuit board 6 is not formed, the joining strength becomes weak. Further, the brazing material may flow out to the side surface of the holding member 11 to form an unnecessary brazing material pool.

Substrate 1 if X> 2A and Y> 2B
The joining area between the holding member 11 and the holding member 11 becomes large, the warp at the time of manufacturing the semiconductor package becomes large due to the distortion of the difference in thermal expansion coefficient between them, and when mounting the semiconductor package by screwing,
Extra stress and strain are applied to the base body 1 and the frame body 2. Therefore, the strain transmitted to the holding member 11 cannot be sufficiently absorbed by the holding member 11, the strain is applied to the coaxial connector 3, and the center conductor 3b is displaced. As a result, when the warp of the base body 1 is corrected when the semiconductor package is mounted on the external circuit board, the tip portion of the center conductor 3b may come off from the conductive adhesive 6b, and the center conductor 3b and the line conductor 6a may be separated. Connection will be less reliable.

Further, in the present invention, as shown in FIG. 3, it is preferable that a step 12 is formed by cutting out a ridge portion between the end surface on the inner side of the frame 2 of the holding member 11 and the lower surface. . In this case, when the base 1 and the holding member 11 are joined by brazing or the like, the brazing material flows out from the lower surface of the holding member 11 to the inner surface of the frame 2 on the upper main surface of the base 1 to form an unnecessary brazing material pool. Formation can be prevented by the step 12.

As shown in FIG. 3, the step 12 has a stepped notch formed at the ridge between the end surface of the narrow portion 11d of the holding member 11 (the lower portion of the holding member 11) inside the frame 2 and the lower surface. Alternatively, as shown in FIG. 4, the ridge between the end surface of the narrow portion 11d of the holding member 11 on the inner side of the frame 2 and the lower surface can be chamfered to form an inclined surface. This step 12 is
The brazing material for joining the base 1 and the holding member 11 is prevented from flowing out from the lower surface of the holding member 11 to the inner surface of the frame 2 of the upper main surface of the base 1 to form an unnecessary brazing material pool,
It is formed to secure the effective area of the mounting portion 1a. Therefore, the step 12 may be provided at least at the lower end of the end surface inside the frame 2 of the holding member 11.

The depth of the step 12 in the vertical direction may be 0.1 mm or more, the length of the upper main surface of the substrate 1 in the surface direction may be 0.2 mm or more, and the width may be the width Y of the shelf 11a. Depth 0.1
If it is less than mm, the depth of the step 12 is shallow, and therefore the step 12
Thus, the brazing material easily flows out from the lower surface of the holding member 11 to the surface of the upper main surface of the base body 1 inside the frame body 2. 0.2m long
When it is less than m, the brazing filler metal easily flows over the step 12 from the lower surface of the holding member 11 to the inner surface of the frame body 2 of the upper main surface of the base body 1. When the width of the step 12 is less than the width Y of the shelf 11a, the brazing material easily flows out from the lower surface of the holding member 11 to the surface of the upper main surface of the base 1 inside the frame 2.

In this manner, the brazing material is prevented from flowing from the lower surface of the holding member 11 to the inner surface of the frame body 2 on the upper main surface of the base body 1, and as a result, the semiconductor element on the upper main surface of the base body 1 is mounted. Therefore, the effective area of the mounting portion 1a can be secured. Further, it is possible to prevent the brazing material from flowing out and coming into contact with the semiconductor element 5 to cause a short circuit or the like.

In the present invention, the frequency of the high frequency signal is preferably about 5 to 50 GHz, and in this case, the transmission characteristic of the high frequency signal can be improved.

The present invention is not limited to the above embodiment, and various modifications may be made without departing from the gist of the present invention.

[0047]

According to the present invention, the holding member of the coaxial connector is
A through hole is formed so as to penetrate through the inside and outside of the frame, and a through hole is formed so that the coaxial connector is inserted from the outside of the frame to the inside of the frame. A shelf having a circuit board installed on the upper surface is provided at a lower portion, and a line conductor is formed on the surface of the circuit board for electrically connecting the end of the central conductor protruding from the inner surface of the frame and the semiconductor element. Further, a narrow portion is formed on the lower side in which the width of the line conductor in the line direction becomes smaller toward the inside of the frame body, the lower surface of the narrow portion is joined to the upper main surface of the base, and the width Since the side surface of the narrow portion facing the outer side of the frame body is joined to the inner surface of the frame body, since the coaxial connector and the circuit board are fitted to the frame body via the holding member,
The strain applied to the frame when the semiconductor package is mounted on the external circuit board, etc. by screws etc. is dispersed and absorbed by the holding member, and it is almost impossible for the coaxial connector inserted and fixed to the circuit board installed and fixed on the holding member. No distortion will occur. Therefore, it is possible to effectively prevent the crack of the circuit board and the crack of the insulator of the coaxial connector.

By preventing cracks in the circuit board, disconnection of the line conductor formed on the upper surface of the circuit board is prevented, and high frequency signals can be efficiently transmitted. In addition, by preventing cracks in the insulator of the coaxial connector, it is possible to keep the inside of the semiconductor package airtight and to maintain the mode of the coaxial line of the high frequency signal transmitted through the center conductor, thus efficiently transmitting the high frequency signal. be able to. Further, since the coaxial connector and the circuit board are provided on the holding member, it is possible to reduce the positional deviation between the center conductor and the line conductor when manufacturing the semiconductor package, compared with the conventional case.
Therefore, it is possible to suppress the variation in impedance at the connecting portion between the center conductor and the line conductor, and improve the transmission characteristics of the high frequency signal.

Further, even if the frame body is distorted when the semiconductor package is mounted on the external circuit board, the distortion transmitted to the insertion portion of the coaxial connector is effectively prevented. It is possible to effectively prevent the center conductor from being disengaged from the line conductor by eliminating the displacement.

Further, in the narrow portion of the holding member, the side surface facing the outside of the frame body is joined to the inner surface of the frame body by a brazing material such as silver solder, and the frame body is fleshed at the joint portion with the narrow portion. The holding member reinforces the frame body because it is substantially the same as the increased thickness. As a result, when the warp of the base body is corrected, it is possible to make the frame body difficult to deform and suppress the distortion transmitted to the frame body.

In this way, it is possible to prevent cracks in the circuit board, cracks in the insulator of the coaxial connector, misalignment of the center conductor with respect to the line conductor, and prevention of disengagement of the center conductor from the line conductor. Further, due to these effects, it is possible to provide a highly reliable semiconductor package having excellent transmission efficiency of high frequency signals and excellent airtightness. A semiconductor device of the present invention includes a semiconductor element storage package of the present invention, a semiconductor element mounted and fixed on a mounting portion and electrically connected to a coaxial connector, and a lid body joined to an upper surface of a frame body. By including the above, it is possible to provide a highly reliable semiconductor device using the semiconductor package having the effects of the present invention.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a semiconductor package of the present invention.

FIG. 2 is a partial plan view of a holding member and a circuit board in the semiconductor package of FIG. 1, viewed from above.

FIG. 3 is an enlarged cross-sectional view of a main part of a holding member showing another example of the embodiment of the semiconductor package of the present invention.

FIG. 4 is an enlarged cross-sectional view of a main part of a holding member showing another example of the embodiment of the semiconductor package of the present invention.

FIG. 5 is a cross-sectional view of a conventional semiconductor package.

[Explanation of symbols]

1: Base 1a: Placement part 2: Frame body 2a: Mounting part 3: Coaxial connector 3a: peripheral conductor 3b: central conductor 3c: insulator 5: Semiconductor element 6: Circuit board 6a: Line conductor 11: Holding member 11a: shelf 11b: through hole 11d: narrow part

Claims (2)

[Claims] 1. A base body having a mounting portion for mounting a semiconductor element on the upper main surface, and a peripheral portion of the upper main surface, which is joined so as to surround the mounting portion, and which penetrates the side portion. A frame body in which a mounting portion of a holding member of a coaxial connector including a hole or a cutout portion is formed, the holding member fitted in the mounting portion, a cylindrical outer peripheral conductor, and a center installed on the central axis thereof. A semiconductor element housing package comprising a conductor and an insulator interposed therebetween and the coaxial connector held by the holding member, wherein the holding member is fitted so as to penetrate the inside and outside of the frame. And a through hole penetrating from the outer side of the frame body to the inner side of the frame body so that the coaxial connector is inserted from the outer side of the frame body, and at a site below the through hole of the inner surface of the frame body. Circuit board up A shelf portion provided on a surface is provided, and a line conductor is formed on the surface of the circuit board, the line conductor electrically connecting the end portion of the center conductor protruding from the inner surface of the frame and the semiconductor element, Further, a narrow portion is formed on the lower side in which the width of the line conductor in the line direction becomes smaller toward the inner side of the frame body, and the lower surface of the narrow portion is joined to the upper main surface of the base body, and A semiconductor element housing package, wherein a side surface of the narrow portion facing the outer side of the frame body is joined to an inner surface of the frame body. 2. The semiconductor element storage package according to claim 1, the semiconductor element mounted and fixed on the mounting portion and electrically connected to the coaxial connector, and the upper surface of the frame body. A semiconductor device having a lid.