JP2003055055A - Method for manufacturing low temperature fired ceramic substrate - Google Patents
Method for manufacturing low temperature fired ceramic substrateInfo
- Publication number
- JP2003055055A JP2003055055A JP2001250973A JP2001250973A JP2003055055A JP 2003055055 A JP2003055055 A JP 2003055055A JP 2001250973 A JP2001250973 A JP 2001250973A JP 2001250973 A JP2001250973 A JP 2001250973A JP 2003055055 A JP2003055055 A JP 2003055055A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- green sheet
- fired ceramic
- low temperature
- temperature fired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板表面に凸部又
は凹部を有する低温焼成セラミック基板を製造する低温
焼成セラミック基板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a low temperature fired ceramic substrate for producing a low temperature fired ceramic substrate having a projection or a depression on the surface of the substrate.
【０００２】[0002]
【従来の技術】例えば、低温焼成セラミック基板の表面
に水晶振動子を搭載する場合は、水晶振動子の振動を阻
害しないようにするために、水晶振動子を低温焼成セラ
ミック基板から浮かせた状態にする必要がある。そのた
めに、特許第２９１３６２９号公報や特開２０００−４
９５６２号公報に示すように、基板表面に、水晶振動子
を支持する金属製の台座部品を取り付け、この台座部品
上に水晶振動子を搭載するようにしたものがある。2. Description of the Related Art For example, when a crystal unit is mounted on the surface of a low-temperature fired ceramic substrate, the crystal unit is floated from the low-temperature fired ceramic substrate in order not to disturb the vibration of the crystal unit. There is a need to. Therefore, Japanese Patent No. 2913629 and Japanese Patent Laid-Open No. 2000-4
As disclosed in Japanese Laid-Open Patent Publication No. 9562, there is one in which a metal pedestal component that supports a crystal oscillator is attached to the surface of a substrate, and the crystal oscillator is mounted on the pedestal component.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記構
成では、水晶振動子を搭載する金属製の台座部品を加工
したり、基板に取り付ける作業に手間がかかり、製造コ
ストが高くなるという欠点がある。However, the above-described structure has a drawback that it takes time and effort to process a metal pedestal component for mounting a crystal unit or to attach it to a substrate, resulting in a high manufacturing cost.
【０００４】そこで、最近では、金属製の台座部品の代
わりに、基板表面に、導体ペースト又はガラスペースト
を印刷して台座部を形成し、この台座部上に水晶振動子
を搭載するようにしたものがある。Therefore, recently, instead of a metal pedestal component, a conductor paste or a glass paste is printed on the surface of the substrate to form a pedestal portion, and a crystal oscillator is mounted on the pedestal portion. There is something.
【０００５】しかし、この印刷法では、１回の印刷で得
られる台座部の厚みは、せいぜい、１５〜２０μｍ程度
であり、必要な厚みが得られないため、複数回重ね印刷
する必要があるが、それでも４０μｍ程度が限界であ
る。しかも、重ね印刷すると、印刷のにじみ、だれが発
生したり、或は、焼成時に台座部（導体層）にクラック
が発生することがあり、総じて、品質が安定しないとい
う欠点がある。However, in this printing method, the thickness of the pedestal portion obtained by one printing is about 15 to 20 μm at the most, and the necessary thickness cannot be obtained, so that it is necessary to perform multiple printing. Still, the limit is about 40 μm. In addition, when overprinting, printing bleeding or sagging may occur, or cracks may occur in the pedestal portion (conductor layer) during firing, which generally has the drawback of unstable quality.
【０００６】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、基板表面に３０μｍ
以上の凸部又は凹部を簡単に且つ寸法精度良く形成する
ことができ、製造コスト低減、品質向上の要求を満たす
ことができる低温焼成セラミック基板の製造方法を提供
することにある。The present invention has been made in consideration of the above circumstances, and therefore its object is to provide a substrate surface of 30 μm.
It is an object of the present invention to provide a method for manufacturing a low-temperature fired ceramic substrate, which can easily form the above-mentioned protrusions or recesses with high dimensional accuracy and can satisfy the demands for manufacturing cost reduction and quality improvement.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の請求項１の低温焼成セラミック基板の製造
方法は、低温焼成セラミックの生基板の両面に、該低温
焼成セラミックの焼結温度では焼結しない拘束用グリー
ンシートを圧着して加圧しながら焼成し、焼成後に該拘
束用グリーンシートの残存物を除去して低温焼成セラミ
ック基板を製造する加圧焼成法（拘束焼成法とも呼ばれ
る）を用い、拘束用グリーンシートのうちの前記生基板
に圧着する面に凸状又は凹状の成形部を形成し、該拘束
用グリーンシートを該生基板に圧着して加圧しながら焼
成することで、基板表面に該拘束用グリーンシートの成
形部の形状を転写するようにしたものである。この場
合、加圧焼成法は、基板の面方向の焼成収縮を小さくし
て基板寸法精度を向上させる焼成法であるから、この加
圧焼成法を用いて基板表面に拘束用グリーンシートの成
形部の形状を転写すれば、基板表面に３０μｍ以上の凸
部又は凹部を簡単に且つ寸法精度良く形成することがで
きる。In order to achieve the above object, a method for producing a low temperature co-fired ceramic substrate according to claim 1 of the present invention is to sinter the low temperature co-fired ceramic on both surfaces of a green low-fired ceramic substrate. A pressure firing method (also called a restraint firing method) for manufacturing a low-temperature fired ceramic substrate by press-bonding and firing a restraint green sheet that does not sinter at a temperature while applying pressure and removing the residue of the restraint green sheet after firing. ) Is used to form a convex or concave shaped portion on the surface of the constraining green sheet to be pressure-bonded to the raw substrate, and the constraining green sheet is pressure-bonded to the green substrate and baked while being pressurized. The shape of the molding portion of the restraining green sheet is transferred to the surface of the substrate. In this case, the pressure firing method is a firing method that reduces the firing shrinkage in the plane direction of the substrate to improve the dimensional accuracy of the substrate. Therefore, the pressure firing method is used to form the constraining green sheet forming part on the substrate surface. By transferring the above shape, it is possible to easily form a convex portion or a concave portion having a size of 30 μm or more on the substrate surface with high dimensional accuracy.
【０００８】この場合、請求項２のように、前記成形部
を有する拘束用グリーンシートを、複数枚のグリーンシ
ートを積層して形成しても良く、或は、請求項３のよう
に、前記成形部を有する拘束用グリーンシートをプレス
成形により形成するようにしても良い。いずれの方法で
も、成形部を有する拘束用グリーンシートを、簡単に且
つ寸法精度良く形成することができる。In this case, as in claim 2, the constraining green sheet having the molding portion may be formed by laminating a plurality of green sheets, or as in claim 3, You may make it form the constraining green sheet which has a shaping | molding part by press molding. In any of the methods, the restraining green sheet having the molding portion can be easily formed with high dimensional accuracy.
【０００９】本発明の低温焼成セラミック基板の製造方
法を用いれば、基板表面に様々な形状の凸部又は凹部を
形成することができ、例えば、請求項４のように、基板
表面に、水晶振動子等の振動素子を搭載する台座部を拘
束用グリーンシートの成形部により形成するようにした
り、或は、請求項５のように、基板表面に、封止樹脂の
流出を防止する凸条部を拘束用グリーンシートの成形部
により形成するようにしても良い。これにより、基板表
面に、適度な高さ寸法の台座部や凸条部を簡単に且つ寸
法精度良く形成することができる。By using the method for manufacturing a low temperature fired ceramic substrate of the present invention, it is possible to form projections or depressions of various shapes on the surface of the substrate. For example, as in claim 4, crystal vibration is formed on the surface of the substrate. A pedestal portion on which a vibration element such as a child is mounted is formed by a molded portion of a restraining green sheet, or as in claim 5, a ridge portion for preventing the sealing resin from flowing out on the surface of the substrate. May be formed by the forming portion of the restraining green sheet. As a result, it is possible to easily form the pedestal portion and the ridge portion having appropriate height dimensions on the substrate surface with high dimensional accuracy.
【００１０】[0010]
【発明の実施の形態】［実施形態（１）］以下、本発明
を水晶振動子搭載用の低温焼成セラミック基板の製造方
法に適用した実施形態（１）を図１及び図２に基づいて
説明する。BEST MODE FOR CARRYING OUT THE INVENTION [Embodiment (1)] An embodiment (1) in which the present invention is applied to a method for manufacturing a low temperature fired ceramic substrate for mounting a crystal resonator will be described below with reference to FIGS. 1 and 2. To do.
【００１１】まず、図２に基づいて低温焼成セラミック
基板１０の構造を説明する。低温焼成セラミック基板１
０は、複数枚の低温焼成セラミックのグリーンシート１
１ａ，１１ｂ，１１ｃを積層して８００〜１０００℃で
加圧焼成したものである。低温焼成セラミックとして
は、例えばＣａＯ−ＳｉＯ2 −Ａｌ2 Ｏ3 −Ｂ2 Ｏ3 系
ガラス：５０〜６５重量％（好ましくは６０重量％）と
アルミナ：５０〜３５重量％（好ましくは４０重量％）
との混合物を用いれば良い。この他、ＭｇＯ−ＳｉＯ2
−Ａｌ2 Ｏ3 −Ｂ2 Ｏ3 系ガラスとアルミナとの混合
物、或は、ＳｉＯ2−Ｂ2 Ｏ3 系ガラスとアルミナとの
混合物、ＰｂＯ−ＳｉＯ2 −Ｂ2 Ｏ3 系ガラスとアルミ
ナとの混合物、コージェライト系結晶化ガラス等の８０
０〜１０００℃で焼成できる低温焼成セラミック材料を
用いても良い。First, the structure of the low temperature fired ceramic substrate 10 will be described with reference to FIG. Low temperature firing ceramic substrate 1
0 is a plurality of low temperature fired ceramic green sheets 1
1a, 11b and 11c are laminated and pressure-fired at 800 to 1000 ° C. The low temperature co-fired ceramic, for example, CaO-SiO 2 -Al 2 O 3 -B 2 O 3 based glass: 50-65% by weight (preferably 60 wt%) alumina: 50 to 35 wt% (preferably 40 wt% )
A mixture of and may be used. Besides this, MgO-SiO 2
-Al 2 O 3 -B 2 mixture of O 3 based glass and alumina, or a mixture of SiO 2 -B 2 O 3 based glass and alumina, and PbO-SiO 2 -B 2 O 3 based glass and alumina 80, such as a mixture of
A low temperature fired ceramic material that can be fired at 0 to 1000 ° C. may be used.
【００１２】各層のセラミック層（グリーンシート１１
ａ，１１ｂ，１１ｃ）には、層間接続用のビアホール１
２が形成され、各層のビアホール１２にビア導体１３が
充填されている。各層のビア導体１３は、例えば、Ａ
ｇ、Ａｇ／Ｐｄ、Ａｇ／Ｐｔ、Ａｇ／Ａｕ等を主に含む
Ａｇ系導体ペースト、或は、Ａｕ系、Ｃｕ系等の低融点
金属のペーストを用いて形成されている。Ceramic layers of each layer (green sheet 11
a, 11b, 11c), via holes 1 for interlayer connection
2 are formed, and the via conductors 13 are filled in the via holes 12 of each layer. The via conductor 13 of each layer is, for example, A
It is formed using an Ag-based conductor paste mainly containing g, Ag / Pd, Ag / Pt, Ag / Au, or the like, or a low-melting-point metal paste such as Au-based or Cu-based.
【００１３】また、２層目のセラミック層（グリーンシ
ート１１ｂ）には、１層目と２層目のビア導体１３を接
続するための内層導体パターン１４がＡｇ系、Ａｕ系、
Ｃｕ系等の低融点金属のペーストの印刷により形成され
ている。また、最下層のセラミック層（グリーンシート
１１ｃ）の下面には、ビア導体１３と導通する位置に裏
面端子１５がＡｇ系、Ａｕ系、Ｃｕ系等の低融点金属の
ペーストの印刷により形成されている。In the second ceramic layer (green sheet 11b), inner layer conductor patterns 14 for connecting the first and second via conductors 13 are made of Ag, Au,
It is formed by printing a paste of a low melting point metal such as Cu. Further, on the lower surface of the lowermost ceramic layer (green sheet 11c), the back surface terminal 15 is formed at a position electrically connected to the via conductor 13 by printing a paste of a low melting point metal such as Ag series, Au series, Cu series. There is.
【００１４】一方、最上層のセラミック層（グリーンシ
ート１１ａ）の表面には、水晶振動子１６を搭載する台
座部１７が後述する方法で一体に形成されている。この
台座部１７の高さ寸法は、例えば３０〜６０μｍであ
る。この台座部１７の上面にはランド１８がＡｇ系、Ａ
ｕ系、Ｃｕ系等の低融点金属のペーストの印刷により形
成され、このランド１８が台座部１７を貫通するビア導
体１３と接続されている。これにより、ランド１８がビ
ア導体１３と内層導体パターン１４を介して裏面端子１
５と接続されている。このランド１８上には、水晶振動
子１６が導電性接着剤１９により接合されている。On the other hand, on the surface of the uppermost ceramic layer (green sheet 11a), a pedestal portion 17 for mounting the crystal unit 16 is integrally formed by a method described later. The height dimension of the pedestal portion 17 is, for example, 30 to 60 μm. On the upper surface of this pedestal portion 17, land 18 is made of Ag,
The land 18 is formed by printing a paste of a low melting point metal such as u-based or Cu-based, and the land 18 is connected to the via conductor 13 penetrating the pedestal portion 17. As a result, the land 18 passes through the via conductor 13 and the inner layer conductor pattern 14 and the back surface terminal 1
It is connected to 5. The crystal oscillator 16 is bonded onto the land 18 with a conductive adhesive 19.
【００１５】次に、上記構成の低温焼成セラミック基板
１０の製造方法を説明する。低温焼成セラミックのグリ
ーンシート１１ａ，１１ｂ，１１ｃは、上記の低温焼成
セラミック粉末に、バインダー、溶剤及び可塑剤を配合
して、十分に撹拌混合してスラリーを作製し、このスラ
リーを用いてドクターブレード法等でテープ成形したも
のである。Next, a method of manufacturing the low temperature fired ceramic substrate 10 having the above-mentioned structure will be described. The low temperature fired ceramic green sheets 11a, 11b and 11c are prepared by mixing the low temperature fired ceramic powder with a binder, a solvent and a plasticizer and thoroughly mixing them with stirring to prepare a slurry. The tape is formed by the method.
【００１６】各層のグリーンシート１１ａ，１１ｂ，１
１ｃを積層する前に、各層のグリーンシート１１ａ，１
１ｂにパンチング加工されたビアホール１２に、Ａｇ
系、Ａｕ系、Ｃｕ系等の低融点金属の導体ペーストをス
クリーン印刷により充填してビア導体１３を形成し、更
に、２層目のグリーンシート１１ｂには、同種の低融点
金属の導体ペーストを使用して内層導体パターン１４を
スクリーン印刷する。Green sheets 11a, 11b, 1 of each layer
Before stacking 1c, the green sheets 11a, 1 of each layer are stacked.
Ag in the via hole 12 punched in 1b
Of a low-melting-point metal such as a Cu-based, Au-based, or Cu-based is filled by screen printing to form a via conductor 13. Further, a conductive paste of the same low-melting point metal is formed on the second green sheet 11b. The inner layer conductor pattern 14 is screen-printed by using.
【００１７】また、最下層のグリーンシート１１ｃの下
面には、裏面端子１５をＡｇ系、Ａｕ系、Ｃｕ系等の低
融点金属のペーストを用いてスクリーン印刷し、更に、
最上層のグリーンシート１１ａには、ランド１８をＡｇ
系、Ａｕ系、Ｃｕ系等の低融点金属のペーストを用いて
スクリーン印刷する。尚、裏面端子１５とランド１８に
ついては、加圧焼成後に後付けで印刷・焼成するように
しても良い。印刷工程後に、各層のグリーンシート１１
ａ，１１ｂ，１１ｃを積層して加熱圧着して一体化して
低温焼成セラミック生基板１０’を作製する。On the lower surface of the lowermost green sheet 11c, the back surface terminals 15 are screen-printed using a paste of a low melting point metal such as Ag series, Au series, Cu series, and the like.
The land 18 is made of Ag on the uppermost green sheet 11a.
Screen printing is performed using a paste of a low melting point metal such as a Cu-based, Au-based, or Cu-based. Incidentally, the back surface terminal 15 and the land 18 may be printed and fired after pressure firing and afterward. After the printing process, each layer of green sheet 11
A, 11b, and 11c are stacked, thermocompression-bonded, and integrated to produce a low temperature fired ceramic raw substrate 10 '.
【００１８】一方、拘束用グリーンシート２０は、低温
焼成セラミック生基板１０’の焼成温度（８００〜１０
００℃）では焼結しない高温焼結性セラミック粉末（例
えばアルミナ粉末）を用いて形成されている。On the other hand, the restraining green sheet 20 has a firing temperature (800 to 10) of the low temperature fired ceramic raw substrate 10 '.
It is formed by using high-temperature sinterable ceramic powder (for example, alumina powder) that does not sinter at 00 ° C.
【００１９】低温焼成セラミック生基板１０’の上面に
圧着する拘束用グリーンシート２０の下面には、基板表
面に台座部１７を形成するための凹部２１（成形部）を
プレス成形法又はグリーンシート積層法で形成する。プ
レス成形法では、予め、ドクターブレード法等でテープ
成形した拘束用グリーンシート２０をプレス成形して凹
部２１を形成する。On the lower surface of the constraining green sheet 20 which is pressure-bonded to the upper surface of the low-temperature fired ceramic green substrate 10 ', a recess 21 (forming portion) for forming the pedestal portion 17 on the substrate surface is formed by press forming or green sheet lamination. Form by method. In the press molding method, the recessed portion 21 is formed by press-molding the constraining green sheet 20 previously tape-molded by a doctor blade method or the like.
【００２０】一方、グリーンシート積層法では、複数枚
の高温焼結性セラミックのグリーンシートを積層して拘
束用グリーンシート２０を作製する際に、予め、下面側
に積層する少なくとも１枚のグリーンシートに凹部２１
を形成するための角孔をパンチング加工等により形成し
ておき、これを他のグリーンシートに積層して加熱圧着
して拘束用グリーンシート２０を作製する。On the other hand, in the green sheet laminating method, when the constraining green sheet 20 is manufactured by laminating a plurality of high temperature sinterable green sheets, at least one green sheet is laminated on the lower surface side in advance. Recessed in 21
A square hole for forming the above is formed by punching or the like, and this is laminated on another green sheet and thermocompression bonded to produce the restraining green sheet 20.
【００２１】この場合、拘束用グリーンシート２０の硬
さは、配合するバインダー、溶剤、可塑剤のいずれかを
適宜調整することで、低温焼成セラミックのグリーンシ
ート１１ａ，１１ｂ，１１ｃ（生基板１０’）よりも適
度に硬くするように調整すると良い。In this case, the hardness of the restraining green sheet 20 can be adjusted by appropriately adjusting any one of a binder, a solvent and a plasticizer to be blended, so that the green sheets 11a, 11b and 11c (raw substrate 10 ') of the low temperature firing ceramics can be obtained. It is better to adjust so that it is harder than).
【００２２】この拘束用グリーンシート２０を用いて低
温焼成セラミック生基板１０’を加圧焼成する場合は、
まず、図１（ｂ）に示すように、低温焼成セラミック生
基板１０’の表裏両面に拘束用グリーンシート２０を積
層して、この積層体を例えば８０〜１５０℃で加熱圧着
する。When the low temperature fired ceramic raw substrate 10 'is pressure-fired using the restraining green sheet 20,
First, as shown in FIG. 1B, the constraining green sheets 20 are laminated on both front and back surfaces of the low temperature fired ceramic raw substrate 10 ′, and the laminated body is thermocompression bonded at 80 to 150 ° C., for example.
【００２３】この後、低温焼成セラミック生基板１０’
と拘束用グリーンシート２０との圧着体を、アルミナ等
で形成した多孔質セッター板（図示せず）間に挟み込ん
で、１０〜３００Ｎ／ｃｍ2 の圧力で加圧しながら低温
焼成セラミック生基板１０’の焼結温度である８００〜
１０００℃で焼成する。After this, the low temperature fired ceramic green substrate 10 '
A low pressure fired ceramic raw substrate 10 'is sandwiched between a pressure-bonded body of the restraint green sheet 20 and a constraining green sheet 20 between porous setter plates (not shown) made of alumina or the like, and pressurized at a pressure of 10 to 300 N / cm 2. Which is the sintering temperature of 800 ~
Bake at 1000 ° C.
【００２４】この焼成中に、低温焼成セラミック生基板
１０’の表面部のうち、拘束用グリーンシート２０の凹
部２１に対応する部分には圧力が加わらないため、当該
部分のセラミックが凹部２１内に盛り上がって、凹部２
１内に基板表面のセラミックが充填された状態となる。
これにより、基板表面に水晶振動子１６を搭載する台座
部１７が形成される。この際、凹部２１の深さ寸法が例
えば３０〜６０μｍであれば、台座部１７の高さ寸法が
３０〜６０μｍとなる。During this firing, no pressure is applied to the portion of the surface portion of the low temperature fired ceramic raw substrate 10 'corresponding to the recess 21 of the restraining green sheet 20, so that the ceramic of that portion is placed in the recess 21. Rise up, recess 2
1 is filled with the ceramic on the surface of the substrate.
As a result, the pedestal 17 on which the crystal unit 16 is mounted is formed on the surface of the substrate. At this time, if the depth dimension of the concave portion 21 is, for example, 30 to 60 μm, the height dimension of the pedestal portion 17 is 30 to 60 μm.
【００２５】この場合、低温焼成セラミック生基板１
０’両面に積層された拘束用グリーンシート２０（アル
ミナ等の高温焼結性セラミック）は、１３００℃以上に
加熱しないと焼結しないので、８００〜１０００℃で焼
成すれば、拘束用グリーンシート２０は未焼結のまま残
される。但し、焼成の過程で、拘束用グリーンシート２
０中のバインダー等の有機物が熱分解して飛散してセラ
ミック粉体として残る。In this case, the low temperature fired ceramic green substrate 1
The constraining green sheets 20 (high-temperature sinterable ceramics such as alumina) laminated on both sides of 0 ′ do not sinter unless heated to 1300 ° C. or higher. Are left unsintered. However, in the process of firing, the restraining green sheet 2
Organic substances such as binder in 0 are thermally decomposed and scattered to remain as ceramic powder.
【００２６】焼成後、焼成基板の両面に付着した拘束用
グリーンシート２０の残存物（セラミック粉体）をブラ
スト処理、バフ研磨等により除去する。これにより、低
温焼成セラミック基板１０の製造が完了する。After firing, the residue (ceramic powder) of the restraining green sheet 20 attached to both sides of the fired substrate is removed by blasting, buffing or the like. This completes the manufacture of the low temperature fired ceramic substrate 10.
【００２７】以上説明した実施形態（１）は、加圧焼成
法を利用して基板表面に水晶振動子１６を搭載する台座
部１７を形成するところに特徴があり、加圧焼成法は、
基板の面方向の焼成収縮を小さくして基板寸法精度を向
上させる焼成法であるから、この加圧焼成法を利用して
基板表面に拘束用グリーンシート２０の凹部２１の形状
を転写すれば、基板表面に３０〜６０μｍの台座部１７
を簡単に且つ寸法精度良く形成することができ、製造コ
スト低減、品質向上の要求を満たすことができる。本発
明者の実験結果によれば、拘束用グリーンシート２０の
凹部２１の深さ寸法の調整によって±１０％の精度で台
座部１７の高さ寸法を調整することができることが確認
されている。The embodiment (1) described above is characterized in that the pedestal portion 17 for mounting the crystal unit 16 is formed on the surface of the substrate by utilizing the pressure firing method.
Since this is a firing method that reduces the firing shrinkage in the surface direction of the substrate to improve the dimensional accuracy of the substrate, if the shape of the recess 21 of the restraining green sheet 20 is transferred to the substrate surface using this pressure firing method, Pedestal portion 17 of 30 to 60 μm on the substrate surface
Can be easily formed with high dimensional accuracy, and requirements for manufacturing cost reduction and quality improvement can be satisfied. According to the experimental results of the present inventor, it has been confirmed that the height dimension of the pedestal portion 17 can be adjusted with an accuracy of ± 10% by adjusting the depth dimension of the recess 21 of the restraining green sheet 20.
【００２８】尚、台座部１７に搭載する素子は、水晶振
動子１６に限定されず、例えばセラミック共振子等の他
の発振素子であっても良いことは言うまでもない。It is needless to say that the element mounted on the pedestal portion 17 is not limited to the crystal oscillator 16 and may be another oscillation element such as a ceramic resonator.
【００２９】［実施形態（２）］次に、本発明の実施形
態（２）を図３に基づいて説明する。本実施形態（２）
では、低温焼成セラミック基板２２の表面周縁部に封止
樹脂の流出を防止する凸条部２３を次のようにして形成
する。[Embodiment (2)] Next, an embodiment (2) of the present invention will be described with reference to FIG. This embodiment (2)
Then, the ridge portion 23 for preventing the sealing resin from flowing out is formed on the peripheral portion of the surface of the low temperature fired ceramic substrate 22 as follows.
【００３０】まず、低温焼成セラミック生基板の上面に
圧着する拘束用グリーンシート２４の下面に、基板表面
の周縁部に凸条部２３を形成するための段差部２５（成
形部）をプレス成形法又はグリーンシート積層法で形成
する。First, on the lower surface of the constraining green sheet 24 which is pressure-bonded to the upper surface of the low-temperature fired ceramic green substrate, a step portion 25 (forming portion) for forming the convex streak portion 23 on the peripheral portion of the substrate surface is formed by press molding. Alternatively, it is formed by a green sheet laminating method.
【００３１】そして、各層の低温焼成セラミックのグリ
ーンシート１１ａ，１１ｂ，１１ｃを積層して加熱圧着
して一体化して低温焼成セラミック生基板を作製し、こ
の生基板の表裏両面に拘束用グリーンシート２４を積層
して、この積層体を例えば８０〜１５０℃で加熱圧着す
る。Then, the low temperature fired ceramic green sheets 11a, 11b and 11c of the respective layers are laminated and thermocompressed to be integrated to prepare a low temperature fired ceramic raw substrate, and the restraining green sheets 24 are provided on both front and back surfaces of the green substrate. Are laminated, and the laminate is thermocompression bonded at 80 to 150 ° C., for example.
【００３２】この後、低温焼成セラミック生基板と拘束
用グリーンシート２４との圧着体を、アルミナ等で形成
した多孔質セッター板（図示せず）間に挟み込んで、１
０〜３００Ｎ／ｃｍ2 の圧力で加圧しながら低温焼成セ
ラミック生基板の焼結温度である８００〜１０００℃で
焼成する。これにより、基板表面の周縁部には、拘束用
グリーンシート２４の段差部２５によって凸条部２３が
形成される。Thereafter, the pressure bonded body of the low temperature fired ceramic green substrate and the restraining green sheet 24 is sandwiched between porous setter plates (not shown) made of alumina or the like, and
The low temperature fired ceramic green substrate is fired at 800 to 1000 ° C. which is the sintering temperature while applying a pressure of 0 to 300 N / cm 2 . As a result, the ridge 23 is formed by the step 25 of the restraining green sheet 24 on the peripheral edge of the substrate surface.
【００３３】焼成後、焼成基板の両面に付着した拘束用
グリーンシート２０の残存物（セラミック粉体）をブラ
スト処理、バフ研磨等により除去する。これにより、低
温焼成セラミック基板２２の製造が完了する。After firing, the residue (ceramic powder) of the restraining green sheet 20 attached to both sides of the fired substrate is removed by blasting, buffing or the like. This completes the manufacture of the low temperature fired ceramic substrate 22.
【００３４】以上説明した本実施形態（２）によれば、
加圧焼成法を利用して、基板表面に封止樹脂の流出を防
止する凸条部２３を拘束用グリーンシート２４の段差部
２５により形成するようにしたので、基板表面に、適度
な高さ寸法の凸条部２３を簡単に且つ寸法精度良く形成
することができ、製造コスト低減、品質向上の要求を満
たすことができる。According to the embodiment (2) described above,
Since the convex streak portion 23 for preventing the sealing resin from flowing out is formed by the step portion 25 of the constraining green sheet 24 by using the pressure firing method, it is possible to form an appropriate height on the substrate surface. It is possible to easily form the ridge portion 23 having a size with high dimensional accuracy, and it is possible to satisfy the demands for manufacturing cost reduction and quality improvement.
【００３５】尚、本発明は、基板表面に水晶振動子搭載
用の台座部１７や封止樹脂流出防止用の凸条部２３を形
成する場合に限定されず、基板表面に様々な形状の凸部
又は凹部を形成する場合に適用できる。The present invention is not limited to the case in which the pedestal portion 17 for mounting the crystal unit and the convex streak portion 23 for preventing the sealing resin outflow are formed on the surface of the substrate, and various shapes of convex portions are formed on the surface of the substrate. It can be applied when forming a part or a recess.
【００３６】また、拘束用グリーンシートは、アルミナ
グリーンシートに限定されず、窒化アルミニウム（Ａｌ
Ｎ）等の他の高温焼結性セラミックのグリーンシートを
用いるようにしても良い。Further, the restraining green sheet is not limited to the alumina green sheet, but aluminum nitride (Al
It is also possible to use a green sheet of other high temperature sinterable ceramic such as N).
【００３７】[0037]
【発明の効果】以上の説明から明らかなように、本発明
の請求項１の低温焼成セラミック基板の製造方法によれ
ば、加圧焼成法を用い、拘束用グリーンシートのうちの
生基板に圧着する面に凸状又は凹状の成形部を形成し、
該拘束用グリーンシートを該生基板に圧着して加圧しな
がら焼成することで、基板表面に該拘束用グリーンシー
トの成形部の形状を転写するようにしたので、基板表面
に３０μｍ以上の凸部又は凹部を簡単に且つ寸法精度良
く形成することができ、製造コスト低減、品質向上の要
求を満たすことができる。As is apparent from the above description, according to the method of manufacturing a low temperature fired ceramic substrate according to claim 1 of the present invention, the pressure firing method is used to press-bond to the green substrate of the restraining green sheets. Form a convex or concave shaped part on the surface to be
Since the shape of the molded portion of the constraining green sheet is transferred to the substrate surface by pressing the constraining green sheet against the green substrate and baking it while applying pressure, a convex portion of 30 μm or more on the substrate surface. Alternatively, it is possible to easily form the concave portion with high dimensional accuracy, and it is possible to satisfy the requirements for manufacturing cost reduction and quality improvement.
【００３８】また、請求項２，３では、成形部を有する
拘束用グリーンシートを、グリーンシート積層法又はプ
レス成形法で形成するようにしたので、成形部を有する
拘束用グリーンシートを、簡単に且つ寸法精度良く形成
することができる。Further, in the second and third aspects, the constraining green sheet having the molding portion is formed by the green sheet laminating method or the press molding method. Therefore, the constraining green sheet having the molding portion can be easily formed. In addition, it can be formed with high dimensional accuracy.
【００３９】また、請求項４では、基板表面に、水晶振
動子等の振動素子を搭載する台座部を拘束用グリーンシ
ートの成形部により形成するようにしたので、基板表面
に、適度な高さ寸法の台座部を簡単に且つ寸法精度良く
形成することができる。Further, according to the present invention, the pedestal portion for mounting the vibration element such as the crystal unit is formed on the surface of the substrate by the molded portion of the constraining green sheet. It is possible to easily form the pedestal portion having a size with high dimensional accuracy.
【００４０】また、請求項５では、基板表面に、封止樹
脂の流出を防止する凸条部を拘束用グリーンシートの成
形部により形成するようにしたので、適度な高さ寸法の
凸条部を簡単に且つ寸法精度良く形成することができ
る。Further, according to the present invention, since the protrusions for preventing the sealing resin from flowing out are formed by the molding portion of the restraining green sheet on the substrate surface, the protrusions having an appropriate height dimension are formed. Can be easily formed with high dimensional accuracy.
【図１】（ａ）〜（ｃ）は本発明の実施形態（１）の製
造工程を説明する図1A to 1C are views for explaining a manufacturing process of an embodiment (1) of the present invention.
【図２】水晶振動子を搭載した低温焼成セラミック基板
の構造を示す縦断面図FIG. 2 is a vertical sectional view showing the structure of a low temperature fired ceramic substrate on which a crystal unit is mounted.
【図３】（ａ）、（ｂ）は本発明の実施形態（２）の製
造工程を説明する図3 (a) and 3 (b) are views for explaining the manufacturing process of the embodiment (2) of the present invention.
１０…低温焼成セラミック基板、１０’…低温焼成セラ
ミック生基板、１１ａ，１１ｂ，１１ｃ…低温焼成セラ
ミックのグリーンシート、１２…ビアホール、１３…ビ
ア導体、１４…内層導体パターン、１５…裏面端子、１
６…水晶振動子、１７…台座部、１８…ランド、１９…
導電性接着剤、２０…拘束用グリーンシート、２１…凹
部（成形部）、２２…低温焼成セラミック基板、２３…
凸条部、２４…拘束用グリーンシート、２５…段差部
（成形部）。10 ... Low temperature fired ceramic substrate, 10 '... Low temperature fired ceramic raw substrate, 11a, 11b, 11c ... Low temperature fired ceramic green sheet, 12 ... Via hole, 13 ... Via conductor, 14 ... Inner layer conductor pattern, 15 ... Back surface terminal, 1
6 ... Crystal oscillator, 17 ... Pedestal part, 18 ... Land, 19 ...
Conductive adhesive, 20 ... Restraint green sheet, 21 ... Recessed portion (molded portion), 22 ... Low temperature fired ceramic substrate, 23 ...
Convex portion, 24 ... Green sheet for restraint, 25 ... Stepped portion (molded portion).
Claims (5)
該低温焼成セラミックの焼結温度では焼結しない拘束用
グリーンシートを圧着して加圧しながら焼成し、焼成後
に該拘束用グリーンシートの残存物を除去して低温焼成
セラミック基板を製造する方法であって、 前記拘束用グリーンシートのうちの前記生基板に圧着す
る面に凸状又は凹状の成形部を形成し、該拘束用グリー
ンシートを該生基板に圧着して加圧しながら焼成するこ
とで、基板表面に該拘束用グリーンシートの成形部の形
状を転写することを特徴とする低温焼成セラミック基板
の製造方法。1. Both sides of a low temperature fired ceramic green substrate,
A method for producing a low-temperature fired ceramic substrate by pressing a constraining green sheet that does not sinter at the sintering temperature of the low-temperature fired ceramic and firing it while applying pressure, and removing the residue of the restraint green sheet after firing. By forming a convex or concave shaped portion on the surface of the constraining green sheet to be crimped to the raw substrate, by pressing the constraining green sheet to the raw substrate and firing while pressing, A method for producing a low-temperature fired ceramic substrate, which comprises transferring the shape of the molded portion of the restraining green sheet to the surface of the substrate.
トを、複数枚のグリーンシートを積層して形成すること
を特徴とする請求項１に記載の低温焼成セラミック基板
の製造方法。2. The method for manufacturing a low temperature fired ceramic substrate according to claim 1, wherein the constraining green sheet having the molding portion is formed by laminating a plurality of green sheets.
トをプレス成形により形成することを特徴とする請求項
１に記載の低温焼成セラミック基板の製造方法。3. The method of manufacturing a low temperature fired ceramic substrate according to claim 1, wherein the constraining green sheet having the molding portion is formed by press molding.
搭載する台座部を前記拘束用グリーンシートの成形部に
より形成することを特徴とする請求項１乃至３のいずれ
かに記載の低温焼成セラミック基板の製造方法。4. The low temperature according to claim 1, wherein a pedestal portion on which a vibrating element such as a crystal oscillator is mounted is formed on the surface of the substrate by the molded portion of the restraining green sheet. Manufacturing method of fired ceramic substrate.
凸条部を前記拘束用グリーンシートの成形部により形成
することを特徴とする請求項１乃至４のいずれかに記載
の低温焼成セラミック基板の製造方法。5. The low temperature firing according to claim 1, wherein a convex portion for preventing the sealing resin from flowing out is formed on the surface of the substrate by the molding portion of the constraining green sheet. Ceramic substrate manufacturing method.
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| WO2007060788A1 (en) * | 2005-11-25 | 2007-05-31 | Murata Manufacturing Co., Ltd. | Process for producing multilayer ceramic substrate |
| US8003893B2 (en) | 2007-09-05 | 2011-08-23 | Alps Electric Co., Ltd. | Multilayer ceramic circuit board having protruding portion and method for manufacturing the same |
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| JPH10218675A (en) * | 1997-02-06 | 1998-08-18 | Sumitomo Kinzoku Electro Device:Kk | Production of ceramic substrate |
| JP2001085839A (en) * | 1999-09-16 | 2001-03-30 | Murata Mfg Co Ltd | Method for manufacturing multi-ceramic substrate |
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2001
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|---|---|---|---|---|
| JPH07106188A (en) * | 1993-10-07 | 1995-04-21 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component. |
| JPH07122959A (en) * | 1993-10-27 | 1995-05-12 | Daishinku Co | Surface-mounted type crystal oscillator |
| JPH10218675A (en) * | 1997-02-06 | 1998-08-18 | Sumitomo Kinzoku Electro Device:Kk | Production of ceramic substrate |
| JP2001085839A (en) * | 1999-09-16 | 2001-03-30 | Murata Mfg Co Ltd | Method for manufacturing multi-ceramic substrate |
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| WO2007060788A1 (en) * | 2005-11-25 | 2007-05-31 | Murata Manufacturing Co., Ltd. | Process for producing multilayer ceramic substrate |
| KR100890231B1 (en) * | 2005-11-25 | 2009-03-25 | 가부시키가이샤 무라타 세이사쿠쇼 | Process for producing multilayer ceramic substrate |
| US7601235B2 (en) | 2005-11-25 | 2009-10-13 | Murata Manufacturing Co., Ltd. | Manufacturing method of multilayer ceramic board |
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