JP2003046178A - Element arrangement in optical semiconductor module - Google Patents
Element arrangement in optical semiconductor moduleInfo
- Publication number
- JP2003046178A JP2003046178A JP2001231908A JP2001231908A JP2003046178A JP 2003046178 A JP2003046178 A JP 2003046178A JP 2001231908 A JP2001231908 A JP 2001231908A JP 2001231908 A JP2001231908 A JP 2001231908A JP 2003046178 A JP2003046178 A JP 2003046178A
- Authority
- JP
- Japan
- Prior art keywords
- emitting element
- light
- light emitting
- semiconductor module
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光通信ネットワー
クにおける光半導体モジュール関し、特に発光素子駆動
回路を内蔵した光半導体モジュール内部の素子配置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module in an optical communication network, and more particularly to an element arrangement inside an optical semiconductor module incorporating a light emitting element drive circuit.
【０００２】[0002]
【従来の技術】光半導体モジュールでは、通常は半導体
レーザなどの発光素子光から出射される光出力レベルを
一定に保つ等の目的から、発光素子から出力される信号
光の一部を受光素子により受光してモニタする。モニタ
用受光素子は、温度変化や経年劣化による発光素子の光
出力の変化を感知し、常に一定の出力がえられるように
駆動電流のフィードバック制御を行っている。発光素子
と発光素子駆動回路を備えた筐体との信号配線が短けれ
ば短いほど浮遊容量などの影響が少なくなる。2. Description of the Related Art In an optical semiconductor module, a part of the signal light output from a light emitting element is usually provided by a light receiving element for the purpose of maintaining a constant light output level emitted from light emitting element such as a semiconductor laser. Receive light and monitor. The monitor light-receiving element senses a change in light output of the light-emitting element due to a temperature change or deterioration over time, and performs feedback control of the drive current so that a constant output can be obtained at all times. The shorter the signal wiring between the light emitting element and the housing provided with the light emitting element driving circuit, the smaller the influence of stray capacitance and the like.
【０００３】図５、図６は従来の光半導体モジュールの
一例を示す構成図である。5 and 6 are block diagrams showing an example of a conventional optical semiconductor module.
【０００４】図５は発光素子と発光素子駆動回路を備え
た筐体は直近に配置されている。図６では、発光素子の
後方出力光をモニタするために発光素子の後方にモニタ
用受光素子が配置されている。In FIG. 5, a housing provided with a light emitting element and a light emitting element driving circuit is arranged in the immediate vicinity. In FIG. 6, a monitoring light receiving element is arranged behind the light emitting element in order to monitor the rear output light of the light emitting element.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、図５で
は発光素子と発光素子駆動回路を備えた筐体を直近に配
置すると、光出力の面の側面から電気信号入力になる。
また図６では発光素子がモニタ用受光素子の後ろに配置
された場合、ワイヤボンディングとマイクロストリップ
ラインを用いた配線となり、発光素子が浮遊容量の影響
を受けるという問題がある。However, in FIG. 5, when the housing provided with the light emitting element and the light emitting element drive circuit is arranged in the immediate vicinity, electric signals are input from the side of the side of light output.
Further, in FIG. 6, when the light emitting element is arranged behind the monitor light receiving element, there is a problem in that the wiring uses wire bonding and microstrip lines, and the light emitting element is affected by stray capacitance.
【０００６】本発明の目的は発光素子と発光素子駆動回
路を備えた筐体を直近に配置することで、浮遊容量など
の影響を低減することにある。An object of the present invention is to reduce the influence of stray capacitance etc. by arranging a housing provided with a light emitting element and a light emitting element driving circuit in the immediate vicinity.
【０００７】また他の目的として光出力の反対側から電
気信号入力が可能となり、小型化光半導体モジュールを
提供することにある。Another object of the present invention is to provide a miniaturized optical semiconductor module which enables electric signal input from the side opposite to the optical output.
【０００８】[0008]
【課題を解決するための手段】本発明の光半導体モジュ
ールは基板上に信号光を出射する発光素子と、前記信号
光の一部を受光するモニタ用受光素子と、発光素子を駆
動させるための発光素子駆動回路を備えた光半導体モジ
ュールであって、発光素子の光出力と発光素子駆動回路
への電気信号入力が直線的に配置され、また前記信号光
の後方光を発光素子駆動回路を備えた筐体の側面に反射
させて、モニタ用受光素子に入射するように配置されて
いることを特徴としている。この配置によって発光素子
の後方光はモニタ用受光素子では７〜２８％受光でき、
十分な受光電流を得ることができる。An optical semiconductor module of the present invention includes a light emitting element for emitting signal light onto a substrate, a light receiving element for monitoring for receiving a part of the signal light, and a light emitting element for driving the light emitting element. An optical semiconductor module including a light emitting element driving circuit, wherein a light output of the light emitting element and an electric signal input to the light emitting element driving circuit are linearly arranged, and a rear light of the signal light is provided in the light emitting element driving circuit. It is characterized in that it is arranged so that it is reflected on the side surface of the housing and is incident on the monitor light receiving element. With this arrangement, the back light of the light emitting element can be received by the monitor light receiving element by 7 to 28%,
A sufficient light receiving current can be obtained.
【０００９】[0009]
【発明の実施の形態】以下図面を参照して、本願発明の
各々の実施形態について詳細に説明する。DETAILED DESCRIPTION OF THE INVENTION Each embodiment of the present invention will be described in detail below with reference to the drawings.
【００１０】図１は本願発明の第１の実施の形態を示す
構成図である。図１において、本願発明の光半導体モジ
ュールは、基板１、発光素子２、発光素子駆動回路を備
えた筐体を備えた筐体３、モニタ用受光素子４から構成
されている。また、発光素子２から出射された後方光を
反射する反射部が筐体３に形成されている。FIG. 1 is a block diagram showing a first embodiment of the present invention. In FIG. 1, the optical semiconductor module of the present invention comprises a substrate 1, a light emitting element 2, a housing 3 having a housing having a light emitting element drive circuit, and a monitor light receiving element 4. Further, the housing 3 is formed with a reflecting portion that reflects the backward light emitted from the light emitting element 2.
【００１１】発光素子２から出射された後方光は、発光
素子駆動回路を備えた筐体を備えた筐体３の反射部５に
反射されモニタ用受光素子４で受光される。なお、反射
部５は独立して配置しても構わない。The backward light emitted from the light emitting element 2 is reflected by the reflecting portion 5 of the housing 3 having the housing having the light emitting element driving circuit and is received by the monitor light receiving element 4. The reflection part 5 may be arranged independently.
【００１２】発光素子駆動回路を備えた筐体３は発光素
子２の後方直近に配置され、発光素子２と発光素子駆動
回路を備えた筐体３はできるだけ距離を近づけることに
より、ワイヤボンディングの長さを短くすることができ
る。The housing 3 provided with the light emitting element drive circuit is disposed immediately behind the light emitting element 2 and the housing 3 provided with the light emitting element 2 and the light emitting element drive circuit are placed as close as possible to each other so that the length of wire bonding is increased. The length can be shortened.
【００１３】発光素子駆動回路を備えた筐体の反射部５
は鏡面加工され、金・銀・アルミなどがコーティングさ
れいる。反射部５には誘電体の膜を実装することもでき
る。誘電体膜を発光素子駆動回路を備えた筐体の鏡面部
分に利用することで、加工精度による反射効率の影響が
低減できる。また、発光素子駆動回路を備えた筐体にGa
As-ICを用いることもできる。反射部５を凹面鏡にする
ことで発光素子の後方光をモニタ用受光素子へ集光する
ことで受光量が増加することができる。The reflector 5 of the housing having the light emitting element drive circuit.
Is mirror-finished and coated with gold, silver, aluminum, etc. A dielectric film may be mounted on the reflection part 5. By using the dielectric film for the mirror surface portion of the housing having the light emitting element drive circuit, the influence of the processing efficiency on the reflection efficiency can be reduced. In addition, Ga
As-IC can also be used. When the reflecting portion 5 is a concave mirror, the amount of light received can be increased by collecting the rear light of the light emitting element on the light receiving element for monitoring.
【００１４】基板１からモジュールの端子まではマイク
ロストリップラインによって接続され、基板上の各部か
らマイクロストリップラインまではワイヤボンディング
にて接続される。このようにして発光素子２と発光素子
駆動回路を備えた筐体３との距離をできる限り近づける
ことでワイヤボンディングの長さを短くすることができ
る。The substrate 1 is connected to the terminals of the module by microstrip lines, and each part on the substrate is connected to the microstrip lines by wire bonding. In this way, the distance between the light emitting element 2 and the housing 3 provided with the light emitting element drive circuit is made as close as possible, whereby the length of wire bonding can be shortened.
【００１５】図２は第１の実施の形態の回路の構成図で
ある。FIG. 2 is a block diagram of the circuit of the first embodiment.
【００１６】発光素子２から出射された後方光はモニタ
用受光素子４において電流量として測定される。これが
電流電圧変換の後、APC(Automatic Power Control)制御
により発光素子駆動回路を備えた筐体３の駆動電流(バ
イアス電流Ib及びIp)のフィードバック制御を行う。発
光素子駆動回路を備えた筐体３は制御されたバイアス電
流と入力信号に合わせた振幅のパルス電流を発光素子へ
流すことで、発光素子駆動回路を備えた筐体３への電気
信号入力が発光素子２から光信号として出射される。The backward light emitted from the light emitting element 2 is measured as a current amount in the monitor light receiving element 4. After current-voltage conversion, this performs feedback control of the drive current (bias currents Ib and Ip) of the housing 3 including the light emitting element drive circuit by APC (Automatic Power Control) control. The casing 3 including the light emitting element drive circuit allows a controlled bias current and a pulse current having an amplitude matching the input signal to flow to the light emitting element, so that an electric signal can be input to the casing 3 including the light emitting element drive circuit. It is emitted as an optical signal from the light emitting element 2.
【００１７】図３は第２の実施の形態の構成図である。FIG. 3 is a block diagram of the second embodiment.
【００１８】発光素子駆動回路を備えた筐体の筐体の角
度をある程度にまで傾けると一定の受光量を保ったま
ま、発光素子と筐体の距離は短くすることができる。By tilting the angle of the case of the case provided with the light emitting element drive circuit to a certain extent, the distance between the light emitting element and the case can be shortened while maintaining a constant amount of received light.
【００１９】図４は第３の実施の形態の構成図である。
発光素子駆動回路を備えた筐体の一角を切り取り、その
断面を反射部５とする点に特徴を有する。これにより基
板をより小さくすることができ、モジュールを小型にす
ることができる。FIG. 4 is a block diagram of the third embodiment.
It is characterized in that one corner of a housing provided with a light emitting element drive circuit is cut out and its cross section is used as a reflecting portion 5. As a result, the substrate can be made smaller and the module can be made smaller.
【００２０】[0020]
【実施例】第１の実施の形態について具体的に説明す
る。EXAMPLES The first embodiment will be specifically described.
【００２１】反射部にGaAs-ICを用いた場合、発光素子
駆動回路を備えた筐体の反射部５は高さ200μm幅800μm
で発光素子の後方光をモニタ用受光素子４へ反射させる
ことができる。When a GaAs-IC is used for the reflection part, the reflection part 5 of the housing equipped with the light emitting element drive circuit has a height of 200 μm and a width of 800 μm.
Thus, the rear light of the light emitting element can be reflected to the monitor light receiving element 4.
【００２２】また、発光素子駆動回路を備えた筐体３の
素子の厚さが400μmの場合、反射部５の高さを400μmに
広げることができる。よって、発光素子駆動回路を備え
た筐体３の反射時の損失を減らすことができ、モニタ用
受光素子４での受光量も増加することができる。When the thickness of the element of the housing 3 having the light emitting element drive circuit is 400 μm, the height of the reflection part 5 can be increased to 400 μm. Therefore, the loss at the time of reflection of the housing 3 including the light emitting element drive circuit can be reduced, and the amount of light received by the monitor light receiving element 4 can also be increased.
【００２３】第２の実施の形態について具体的に説明す
る。The second embodiment will be specifically described.
【００２４】発光素子駆動回路を備えた筐体３の角度を
発光素子２に対して３０度とすると、発光素子２と発光
素子駆動回路を備えた筐体３の距離は０．７３ｍｍ、発
光素子駆動回路を備えた筐体３とモニタ用受光素子４の
距離は０．７３ｍｍ、反射部５の幅を１ｍｍとすると、
モニタ用受光素子４では発光素子２の後方出力光の１２
〜４９％を受光することになり、受光量が増加する。When the angle of the housing 3 having the light emitting element drive circuit is 30 degrees with respect to the light emitting element 2, the distance between the light emitting element 2 and the housing 3 having the light emitting element drive circuit is 0.73 mm. Assuming that the distance between the housing 3 having the drive circuit and the light receiving element 4 for monitoring is 0.73 mm and the width of the reflecting portion 5 is 1 mm,
In the monitor light-receiving element 4, the rear output light of the light-emitting element 2 is 12
As a result, ˜49% of light is received, and the amount of received light increases.
【００２５】[0025]
【発明の効果】以上説明したように、発光素子からの後
方光を発光素子駆動回路を備えた筐体の側面で反射させ
てモニタ用受光素子で受光させることによって、発光素
子と発光素子駆動回路を備えた筐体の距離を短くするこ
とで、浮遊容量・寄生インダクタンスを低減することが
できる。これにより、基板をより小さくすることがで
き、モジュールの小型化が可能となる。As described above, the rear light from the light emitting element is reflected by the side surface of the housing having the light emitting element driving circuit and is received by the monitor light receiving element. Stray capacitance and parasitic inductance can be reduced by shortening the distance of the housing provided with. As a result, the substrate can be made smaller and the module can be miniaturized.
【図１】本願発明の光半導体モジュールの第１の実施の
形態の構成を示す図である。FIG. 1 is a diagram showing a configuration of a first embodiment of an optical semiconductor module of the present invention.
【図２】本願発明の光半導体モジュールの第１の実施の
形態の回路構成を示す図である。FIG. 2 is a diagram showing a circuit configuration of a first embodiment of an optical semiconductor module of the present invention.
【図３】本願発明の光半導体モジュールの第２の実施の
形態の構成を示す図である。FIG. 3 is a diagram showing a configuration of a second embodiment of an optical semiconductor module of the present invention.
【図４】本願発明の光半導体モジュールの第３の実施の
形態の構成を示す図である。FIG. 4 is a diagram showing a configuration of a third embodiment of an optical semiconductor module of the present invention.
【図５】従来の光半導体モジュールの一例を示す構成図
である。FIG. 5 is a configuration diagram showing an example of a conventional optical semiconductor module.
【図６】従来の光半導体モジュールの一例を示す構成図
である。FIG. 6 is a configuration diagram showing an example of a conventional optical semiconductor module.
１ 基板 ２ 発光素子 ３ 発光素子駆動回路を備えた筐体 ４ モニタ用受光素子 ５ 反射部 1 substrate 2 light emitting element 3 Housing with light-emitting element drive circuit 4 Photodetector for monitor 5 Reflector
Claims (10)
る発光素子と、 前記後方の信号光を反射する反射部と、 前記反射部において反射された前記信号光を受信するモ
ニタ用受光素子とを備えた光半導体モジュール。1. A light-emitting element that emits signal light to the front and rear respectively, a reflector that reflects the signal light at the rear, and a monitor light-receiving element that receives the signal light reflected by the reflector. An optical semiconductor module equipped with.
板に対して垂直に配置されていることを特徴とする請求
項１記載の光半導体モジュール。2. The optical semiconductor module according to claim 1, wherein the reflector is arranged perpendicular to a substrate that receives the light emitting element.
ることを特徴とする請求項１記載の光半導体モジュー
ル。3. The optical semiconductor module according to claim 1, wherein the optical semiconductor module is reflected by a housing provided with a light emitting element drive circuit.
を特徴とする請求項１または請求項２または請求項３記
載の光半導体モジュール。4. The optical semiconductor module according to claim 1, wherein the reflecting portion is mirror-finished.
を特徴とする請求項１または請求項２または請求項３記
載の光半導体モジュール。5. The optical semiconductor module according to claim 1, wherein the reflection part is provided with a dielectric film.
特徴とする請求項１または請求項２または請求項３記載
の光半導体モジュール。6. The optical semiconductor module according to claim 1, wherein the reflecting portion is provided with a concave mirror.
る発光素子と、 前記発光素子駆動回路を備えた筐体と、 前記後方の信号光を反射する反射部と、 前記反射部において反射された前記信号光を受信するモ
ニタ用受光素子であって、 前記反射部は前記筐体の角を切断した断面に形成されて
いることを特徴とする光半導体モジュール。7. A light-emitting element that emits signal light to the front and the rear respectively, a housing including the light-emitting element drive circuit, a reflector that reflects the signal light in the rear, and a light reflected by the reflector. An optical semiconductor module for receiving the signal light for monitoring, wherein the reflection portion is formed in a cross section of the casing with a corner cut off.
を特徴とする請求項７記載の光半導体モジュール。8. The optical semiconductor module according to claim 7, wherein the reflecting portion is mirror-finished.
を特徴とする請求項７記載の光半導体モジュール。9. The optical semiconductor module according to claim 7, wherein the reflecting portion is provided with a dielectric film.
を特徴とする請求項７記載の光半導体モジュール。10. The optical semiconductor module according to claim 7, wherein the reflecting portion is provided with a concave mirror.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001231908A JP3624863B2 (en) | 2001-07-31 | 2001-07-31 | Device layout in optical semiconductor modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001231908A JP3624863B2 (en) | 2001-07-31 | 2001-07-31 | Device layout in optical semiconductor modules |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003046178A true JP2003046178A (en) | 2003-02-14 |
| JP3624863B2 JP3624863B2 (en) | 2005-03-02 |
Family
ID=19063901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001231908A Expired - Fee Related JP3624863B2 (en) | 2001-07-31 | 2001-07-31 | Device layout in optical semiconductor modules |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3624863B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273782A (en) * | 2003-03-10 | 2004-09-30 | Mitsubishi Electric Corp | Light emitting element module |
| JP2015177115A (en) * | 2014-03-17 | 2015-10-05 | 三菱電機株式会社 | Optical module and manufacturing method for the same |
| JP2016100372A (en) * | 2014-11-18 | 2016-05-30 | 富士通オプティカルコンポーネンツ株式会社 | Optical transmitter module |
| CN107546569A (en) * | 2016-06-28 | 2018-01-05 | 三菱电机株式会社 | Semiconductor device |
-
2001
- 2001-07-31 JP JP2001231908A patent/JP3624863B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273782A (en) * | 2003-03-10 | 2004-09-30 | Mitsubishi Electric Corp | Light emitting element module |
| JP4496708B2 (en) * | 2003-03-10 | 2010-07-07 | 三菱電機株式会社 | Light emitting element module |
| JP2015177115A (en) * | 2014-03-17 | 2015-10-05 | 三菱電機株式会社 | Optical module and manufacturing method for the same |
| JP2016100372A (en) * | 2014-11-18 | 2016-05-30 | 富士通オプティカルコンポーネンツ株式会社 | Optical transmitter module |
| CN107546569A (en) * | 2016-06-28 | 2018-01-05 | 三菱电机株式会社 | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3624863B2 (en) | 2005-03-02 |
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