JP2003046143A - Optical device for optical element and apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure of preventing a crack in a resin thin wall in an optical device for an optical element wherein a light emitting element composed of a light emitting element module which is composed of a light reflecting member comprising a concave curved face and a resin used to seal at least a concave part on the light reflecting member, and in which a light emitting element chip is sealed in a molding resin near the center of the light reflecting member or a light receiving element composed of a light receiving element module in which the light receiving element chip is sealed in a molding resin can be sealed or arranged. SOLUTION: The concentration part of stress generated by the thermal contraction or the expansion of the light reflecting member 15 and the molding resin 16, or the recess of the light reflecting member or the whole surface of the light reflecting member is coated with a silicone or the like, a stress buffer material 23 is installed, the stress is made to escape, the generation of the crack is prevented, light is used efficiently, and the degradation of the element is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a light reflecting member having a concave curved surface and a resin that seals at least the concave portion of the light reflecting member, and a light emitting diode (LED) near the center of the light reflecting member. ) Or a semiconductor laser (LD) or other light emitting element chip, or a light emitting element comprising a light emitting element module in which the light emitting element chip is sealed in a molding resin, or a light receiving element chip such as a photodiode,
Alternatively, the present invention relates to a structure for preventing cracks in a thin portion of a resin in an optical device for an optical element in which a light receiving element composed of a light receiving element module in which the light receiving element chip is sealed in a mold resin can be sealed or arranged. It is a thing.

[0002]

2. Description of the Related Art In a light emitting device module in which a light emitting device chip such as a light emitting diode is sealed in a molding resin, light emitted from the light emitting device chip to the front is directly emitted from the light emitting device module. The light emitted in the oblique direction is totally reflected at the interface of the mold resin or scattered on the inner surface of the case, resulting in loss.
The light utilization efficiency becomes low.

For this reason, a light emitting element module as shown in FIG. 26 has been proposed as a light emitting element module capable of efficiently extracting light emitted in an oblique direction. In FIG. 26, 101 is a light emitting element chip and 102
Is a transparent glass substrate, 103 and 104 are lead frames, 105 is a bonding wire, 106 is a reflective member,
Reference numeral 108 denotes a mold resin made of a light transmissive resin. The lead frames 103 and 104 are the transparent glass substrate 102.
The light emitting element chip 101 is mounted on the back surface of the lead frame 103.
04 is connected by a bonding wire 105. The reflecting surface 107 of the reflecting member 106 is formed in a polyhedral shape by a plurality of flat plate regions.

In this light emitting element module, light is emitted from the light emitting element chip 101 toward the back side, and the light emitted to the back side is reflected by the reflecting surface 107 to pass through the mold resin 108 and the transparent glass substrate 102. I am trying to emit to. In particular, the light emitted from the light emitting element chip 101 in an oblique direction is also reflected by the reflection surface 107.
After being reflected by, the light is emitted forward through the mold resin 108 and the transparent glass substrate 102, so that the light utilization efficiency is improved. If a light receiving element chip such as a photodiode is arranged instead of the light emitting element chip 101 and the light incident from the front is received by the light receiving element chip, an efficient light receiving element module can be configured.

[0005]

However, in such a light emitting device module, when the light reflected by the reflecting member is emitted to the front, the light emitting device chip and the lead frame block the shadows of the light. It is not possible to efficiently use the light near the center of the optical axis where the maximum light amount should be obtained. Further, in the directional characteristics of the light emitted from the light emitting element module, the vicinity of the optical axis center becomes dark, so that it looks unsatisfactory as a light source for display and causes a visual defect. Also, when using in a place where temperature changes drastically,
Due to the difference in coefficient of thermal expansion between the light reflecting member and the mold resin, stress concentrates near the interface between the light reflecting member and the mold resin, causing a problem that the mold resin is cracked.

In view of the above-mentioned circumstances, the present invention provides a light emitting element chip or a light emitting element composed of a light emitting element module in which the light emitting element chip is sealed in a molding resin, or a light receiving element chip or the light receiving element is sealed in a molding resin. In order to use it as a light-receiving element that has been stopped, the desired directivity characteristics should be obtained in an optical device for an optical element in a form in which the light-emitting element or the light-receiving element can be sealed or arranged, or a device using the optical element for an optical element. An object of the present invention is to provide an optical device for an optical element, which has a function of preventing the generation of cracks, and an apparatus using the optical device for an optical element.

[0007]

An optical device for an optical element according to the present invention is an optical device for an optical element for controlling an optical path of outgoing light from the optical element to the outside or incident light from the outside to the optical element. And a resin member that covers at least the light reflecting surface of the light reflecting member, and the resin member has a resin interface that almost totally reflects light that has deviated from a predetermined region in front of the optical element. An optical path connecting light between the optical element and the outside of the optical device for an optical element of light that has left a predetermined region in front of the optical element is at least once at each of the resin interface and the light reflecting member. It is characterized in that the resin interface or the arrangement of the light reflecting member is determined so as to pass through a reflecting path, and a cushioning material is provided at a boundary between the light reflecting member and the resin. The resin member may include a lens portion that emits or condenses light reaching a predetermined area in front of the optical element.

The cushioning material may be provided at a portion where stress generated by thermal contraction or expansion of the light reflecting member and the resin is concentrated, or at least on the light reflecting side of the light reflecting member. Is also good.

With this structure, an optical device for an optical element having a high light utilization efficiency can be realized, and the stress generated by the difference in thermal expansion coefficient between the light reflecting member and the mold resin is released by the cushioning material to generate a crack. This prevents the light from being emitted or incident on the front side due to the occurrence of cracks, and the light reflecting member and the optical element may be rusted or deteriorated due to water vapor or gas, resulting in reliability. It is possible to prevent the problem that the power consumption decreases.

The cushioning material is a soft layer having a low hardness,
Alternatively, it is preferably a gas or fluid layer or a cavity layer formed by contraction. The hardness of the cushioning material is 50 at the hardness defined by JISK6249.
The following is preferable.

By using such a cushioning material, the stress caused by the difference in thermal expansion coefficient between the light reflecting member and the mold resin can be surely released.

It is preferable that the cushioning material has a uniform thickness or a thickness conforming to the uniformness, and the thickness of the cushioning material is 100 μm or less, preferably 30 μm or more.
It is preferably 00 μm or less.

By constructing the cushioning material in this way, it is possible to minimize the deviation of the light emitting direction due to the difference in the refractive index between the mold resin and the cushioning material, and further optimize the center efficiency and the directivity angle for assembly. It is possible to provide an optical device for an optical element that can withstand variations in time.

The optical device optical device array according to the present invention is characterized in that a plurality of the optical device optical devices are arranged. Such an optical device array for optical elements can be used for a thin and large-area light emitting device and a light receiving device that efficiently receives light incident from the front surface.

An optical device according to the present invention comprises the optical device array for optical elements and an optical element, wherein the optical element is
An optical path connecting light between the optical element and the outside of the optical device for an optical element of light that has left a predetermined area in front of the optical element is reflected at least once at each of the resin interface and the light reflecting member. It is characterized in that it is arranged at a position determined to pass through a route. According to this optical device, a thin and large-area light emitting device is formed by using a light emitting element composed of a light emitting element chip or a light emitting element module in which the light emitting element chip is encapsulated in a molding resin as an optical element. By using a light receiving element chip or a light receiving element in which the light receiving element chip is encapsulated in a molding resin, a light receiving device that efficiently receives light incident from the front surface can be formed.

Another optical device according to the present invention comprises an optical element and an optical device for an optical element which controls an optical path of outgoing light from the optical element to the outside or incident light from the outside to the optical element. In the optical device provided, the optical device for an optical element includes a light reflecting member and a resin member that covers at least a light reflecting surface of the light reflecting member, and the resin member is a predetermined region in front of the optical element. A resin interface that almost totally reflects light that has deviated from the optical element, and an optical path of light that has deviated from a predetermined region in front of the optical element, connecting the optical element and the outside of the optical element optical device, and the resin interface. In each of the light reflecting members, the resin interface or the disposition of the light reflecting member is determined so as to pass through a path that reflects at least once, and a cushioning material is provided at the boundary between the light reflecting member and the resin. Specially provided To.

The optical element may be a light emitting element which is a light emitting element chip or a light emitting element module in which the light emitting element chip is sealed in a molding resin. According to such an optical device, it is possible to form a light emitting device which has a high light utilization efficiency and prevents the occurrence of cracks due to the difference in thermal expansion coefficient between the light reflecting member and the mold resin.

The resin interface is closer to the light emitting element than the total reflection point on the resin interface where the first light emitted from the light emitting element is totally reflected and the total reflection point emitted from the light emitting element. Second total reflection at a point near the resin interface
It may be configured such that the light passing through the resin interface when the light is reflected by the light reflecting member and emitted to the outside has the same region. By defining the resin interface in this way, it is not necessary to provide another reflecting member at the resin interface, and the light emission is not blocked by such another reflecting member, and the light utilization efficiency can be improved with a simple structure. Can be increased.

The optical element may be a light receiving element chip or a light receiving element obtained by encapsulating the light receiving element chip in a molding resin. According to such an optical device, it is possible to form a light receiving device which has a high light utilization efficiency and prevents the occurrence of cracks due to the difference in thermal expansion coefficient between the light reflecting member and the mold resin.

In the optical device, the first light incident on the resin interface from the outside and reflected by the light reflecting member is totally reflected at the total reflection point of the resin interface and is incident on the light receiving element. A second path, which passes through the total reflection point from outside and is incident on the resin interface and is reflected by the light reflecting member;
The resin interface may be provided so as to have a light path in which the light is totally reflected at the resin interface at a point closer to the light receiving element than the total reflection position and is incident on the light receiving element. By providing the resin interface in this way, it is not necessary to provide another reflecting member on the resin interface, and the incidence of light is not blocked by such another reflecting member, and the light utilization efficiency is improved with a simple structure. Can be increased.

The optical element may be arranged near the position of the focal point of the light reflecting member, near the position of being a mirror image through the resin interface. Such an optical device can be used for a light emitting device that emits substantially parallel light and a light receiving device that receives substantially parallel light.

A method for manufacturing an optical device for an optical element according to the present invention is a method for manufacturing an optical device for an optical element, which controls an optical path of outgoing light from the optical element to the outside or incident light from the outside to the optical element. Then, the step of disposing a cushioning material in the light reflecting member, the light path outside the predetermined region in front of the optical element, the optical path connecting the optical element and the outside of the optical element optical device, And a step of covering the light reflecting member with the resin member so as to pass through an interface and a path where each of the light reflecting members reflects at least once or more. According to the method for manufacturing an optical device for an optical element, the positional relationship between the interface of the resin member and the light reflecting member is determined in a positional relationship that enhances the light utilization efficiency,
The cushioning material can be easily arranged at the boundary between the resin member and the light reflecting member.

A method of manufacturing an optical device according to the present invention is provided with an optical element inside and emits light from the optical element to the outside.
Or a method of manufacturing an optical device for controlling an optical path of incident light from the outside to the optical element, the step of disposing a cushioning material in a light reflecting member, and the light having deviated from a predetermined region in front of the optical element, The optical element and the light reflecting member are arranged such that the optical path connecting the optical element and the outside of the optical device passes through the interface of the resin member and the path reflecting at least once at each of the light reflecting member. Is covered with the resin member. According to the method for manufacturing an optical device for an optical element, the positional relationship between the optical element, the interface of the resin member, and the light reflecting member can be determined in a positional relationship that enhances the light utilization efficiency, and the cushioning material can be easily used as It can be arranged at the boundary of the light reflecting member.

A light control method for an optical device according to the present invention comprises:
A light control method of an optical device for controlling an optical path of emitted light from an optical element to the outside or incident light from the outside to the optical element, wherein a predetermined region in front of the optical element provided in the optical device is provided. An optical path of the deviated light, which connects the optical element and the outside of the optical device, passes through a path that reflects at least once at each of the resin interface and the light reflecting member provided in the optical device, and When the light is reflected by the light reflecting member, it is controlled so as to pass through a cushioning material that is in contact with at least a part of the light reflecting member. According to the light control method of this optical device, even when a cushioning material is arranged to prevent cracks in the mold resin,
A desired directional characteristic can be realized by the positional relationship between the optical element, the resin interface, the light reflecting member, and the position, material, and thickness of the cushioning material.

The optical device according to the present invention has a plurality of light emitting elements each including a light emitting element chip or a light emitting element module in which the light emitting element chip is sealed in a molding resin, and emits light emitted from the light emitting element to the outside. In an optical device having a plurality of optical devices for controlling an optical path, the optical device comprises a light reflecting member and a resin member that covers at least the light reflecting surface of the light reflecting member, and the resin member is provided in front of the light emitting device. The light path, which has a resin interface that almost totally reflects light that has deviated from a predetermined area, connects the light emitting element and the outside of the optical element optical device of light that has deviated from the predetermined area in front of the light emitting element. The resin interface or the arrangement of the light reflecting member is determined so as to pass through a path that reflects at least once or more at the interface and the light reflecting member. And the boundary between the resin, characterized in that a cushioning material.

Since the display device constituted by such an optical device can prevent the generation of cracks even outdoors, where the difference in temperature is severe, it is possible to obtain high luminous efficiency and high reliability. Further, the vehicle-mounted lamp light source configured by such an optical device can maintain high luminous efficiency and high reliability even in a severe temperature environment. Further, the outdoor display device such as a traffic light configured by the optical device of the present invention can maintain high luminous efficiency and high reliability even outdoors where the difference in temperature is severe, so that the visibility is good and the frequency of maintenance is high. The effect of being able to reduce is obtained.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be exemplarily described in detail below with reference to the drawings. However, the dimensions, materials, shapes, relative positions, and the like of the constituent parts described in this embodiment are not intended to limit the scope of the present invention thereto, unless otherwise specified, and are merely It is only an example.

FIG. 1 is a diagram for explaining an example of a light emitting device (optical device) in which a light emitting element chip is arranged in the optical device for an optical element of the present invention. In FIG. 1, a light emitting device is connected to a light emitting element chip 11 such as a light emitting diode (LED) or a semiconductor laser (LD) by a die-bonded lead frame 12 mounted on a tray and a bonding wire 14 to the light emitting element chip 11. The other lead frame 13 and the light reflecting member 15 provided around the other lead frame 13 are provided, and these members are sealed with the molding resin 16.

In this light emitting device, a direct emitting region 17 having a convex lens shape such as a spherical lens shape, an aspherical lens shape, or a parabolic shape is formed in the light emitting side central portion of the mold resin 16, and the light emitting element is formed. The chip 11 is located at or near the focal point of the direct emission area 17.
Therefore, the light is emitted from the light emitting element chip 11 and directly emitted from the emission region 1.
The light directed to 7 is converted into substantially parallel light and directly emitted from the front surface of the molding resin 16.

On the other hand, around the direct emission area 17, a planar total reflection area 18 is formed so as to surround the direct emission area 17, and the direct emission area 17 and the total reflection area 18 are seen from the light emitting element chip 11. The angle formed by the boundary direction with the region 18 and the optical axis of the light emitting element chip 11 is set to be equal to or larger than the critical angle of total reflection between the mold resin 16 and the air. Therefore, of the light emitted from the light emitting element chip 11, the light heading for the total reflection area 18 is totally reflected at the interface of the mold resin 16 as shown in the path 19, and further reflected by the light reflecting member 15. Reflective area 1
8 is emitted forward. Here, the routes 19a and 19b
In order to emit almost parallel light as shown in FIG. 3, the light emitting element chip 11 may be arranged at a position which becomes a focal point of the light reflecting member 15. That is, in the light emitting device of FIG. 1, as is clear from the paths 19a and 19b, the light is totally reflected at the interface of the mold resin 16, so that the light emitting element chip 11
May be arranged at a position which becomes a mirror image with respect to the position of the focal point of the light reflecting member 15 via the interface of the mold resin 16.

In the total reflection area 18, the first light (path 19a) emitted from the light emitting element chip 11 is totally reflected, as is clear from the intersection of the paths 19a and 19b and the total reflection area 18. Of the total reflection point and the total reflection point emitted from the light emitting element chip 11 rather than the total reflection point.
The second light (path 19) is totally reflected at a point on the interface close to 1.
There is a region 10 having the same passing point that passes through the interface when b) is reflected by the light reflecting member 15 and emitted to the outside. That is, since the total reflection at the interface of the mold resin 16 is used, it is not necessary to provide another reflection member at the interface of the mold resin 16, and such another reflection member can prevent the emission of light. Nor.

Therefore, in this light emitting device, most of the light emitted from the light emitting element chip 11 is directly emitted from the emission region 17 and the total reflection region 18 as effective light, and a very efficient light emitting device can be obtained. . Moreover, by using a curved plate-shaped metal member as the light reflecting member,
Compared to the case of using aluminum vapor deposition film, etc., it is easy to assemble and can be constructed at very low cost, and if the mold resin and the vapor deposition film have different thermal expansion coefficients, cracks may occur in the vapor deposition film. That problem does not occur. In the example of FIG. 1, the case where the light emitting element chip 11 is placed at the center of the light reflecting member 15 is shown. However, instead of the light emitting element chip 11, a light receiving element chip such as a photodiode or a solar cell is placed and the light is incident from the front. By configuring the received light to be received by the light receiving element chip, an efficient light receiving device (optical device) can be configured. This light receiving device has a mold resin 16 which is a total reflection area 18 from the outside in FIG.
The optical path 19a in which the first light that is incident on the interface of the above and is reflected by the light reflecting member 15 is totally reflected at the total reflection point (the position indicated by reference numeral 10) on the interface of the mold resin 16 and enters the light receiving element chip 11. The second light reflected by the light reflection member 15 (the reverse arrow light path in FIG. 1) and the total reflection point (the position indicated by reference numeral 10) from the outside and incident on the interface of the mold resin 16 is reflected by the mold resin. A total reflection area 18 having an optical path 19b (reverse arrow optical path in FIG. 1) that is totally reflected at a point closer to the light receiving element than the total reflection point at the interface of 16 and enters the light receiving element chip 11 is provided. It is composed of As described above, the light receiving element chip can be applied instead of the light emitting element chip in the other embodiments described below.

The present invention is characterized in that the light emitting device constructed as described above is further provided with a crack prevention structure. The light emitting device of FIG. 1 is an optical device for an optical element including a light reflecting member 15 and a mold resin 16, and when each component is sealed with the mold resin 16,
A portion where stress is concentrated due to a difference in thermal expansion coefficient between the light reflecting member 15 and the mold resin 16, that is, the light reflecting member 15
The buffer material 23 is formed in the stress concentration portion of a material having a high transmittance with respect to the light emitted from the light emitting element chip 11 and a hardness lower than that of the molding resin 16. With this layer, the stress caused by the difference in thermal expansion coefficient between the light reflecting member 15 and the mold resin 16 can be released.

An optical device for an optical element without such a crack prevention structure will be described with reference to FIG. FIG. 2 is an explanatory view showing a cracked portion of the mold resin 15 in the light emitting device in which the light emitting element chip 11 is arranged in the optical device for an optical element used in the present invention. The light emitting device of FIG. 2 is connected to the light emitting element chip 11 by a lead frame 12 and a bonding wire 14 which are die-bonded by placing a light emitting element chip 11 such as a light emitting diode (LED) or a semiconductor laser (LD) on a tray. The other lead frame 13 and the light reflecting member 15 provided around the lead frame 13 are provided, and these members are sealed with a mold resin 16.

In this light emitting device, a direct emitting region 17 having a convex lens shape such as a spherical lens shape, an aspherical lens shape, or a parabolic shape is formed in the center of the light emitting side of the molding resin 16 to form a light emitting element. The chip 11 is located at or near the focal point of the direct emission area 17.
Therefore, the light is emitted from the light emitting element chip 11 and directly emitted from the emission region 1.
The light directed to 7 is converted into substantially parallel light and directly emitted from the front surface of the molding resin 16.

On the other hand, around the direct emission area 17, a planar total reflection area 18 is formed so as to surround the direct emission area 17, and the direct emission area 17 and the total reflection area are seen from the light emitting element chip 11. The angle formed by the boundary direction with the region 18 and the optical axis of the light emitting element chip 11 is set to be equal to or larger than the critical angle of total reflection between the mold resin 16 and air. Therefore, of the light emitted from the light emitting element chip 11, the light traveling toward the total reflection area 18 as shown by paths 19a and 19b is totally reflected at the interface of the mold resin 16 and further reflected by the light reflecting member 15. And is emitted forward from the total reflection area 18.

In the total reflection area 18, the first light (path 19a) emitted from the light emitting element chip 11 is totally reflected, as is clear from the intersection of the paths 19a and 19b and the total reflection area 18. Of the total reflection point and the total reflection point emitted from the light emitting element chip 11 rather than the total reflection point.
The second light (path 19) is totally reflected at a point on the interface close to 1.
There is a region 10 having the same passing point that passes through the interface when b) is reflected by the light reflecting member 15 and emitted to the outside. That is, since the total reflection at the interface of the mold resin 16 is used, it is not necessary to provide another reflection member at the interface of the mold resin 16, and such another reflection member can prevent the emission of light. Nor.

Therefore, in this light emitting device, most of the light emitted from the light emitting element chip 11 is directly emitted from the emission region 17 and the total reflection region 18 as effective light, and a very efficient light emitting device can be obtained. . Although the example of FIG. 2 shows the case where the light emitting element chip 11 is placed at the center of the light reflecting member 15, the light emitting element chip 11 is shown.
If a light-receiving element chip such as a photodiode is placed instead of and the light received from the front is configured to be received by the light-receiving element chip, an efficient light-receiving device can be configured.

However, in the optical device for an optical element constituted by the light reflecting member 15 and the molding resin 16 in the light emitting device thus configured, the layer of the molding resin becomes thinner toward the edge of the light reflecting member 15. . Therefore, in the outermost peripheral portion of the light reflecting member 15 shown by 20 in FIG.
A thin portion is formed in the mold resin 16 by the acute angle portion of the light reflecting member 15, and a thin portion is also formed in the vicinity of the light reflecting member 15 and the lead frame 12 or 13 shown by 21. Further, the coefficient of thermal expansion when the temperature changes is significantly different from 11 to 15 ppm for metal and 70 to 100 ppm for resin, and the direction in which stress is applied during expansion and contraction differs greatly between metal and resin.

Therefore, when a metal is used for the light reflecting member 15, the degree of temperature change in the environment of use is great, such as the temperature change at the time of molding the mold resin 16 or the use in a place where the temperature change is drastic such as in a car. In the place, stress is concentrated on such thin portions 20 and 21 due to the difference in thermal expansion coefficient between metal and resin, and there is an acute angle portion of the light reflecting member 15 at the portion 21, and 1
The mold resin 16 near 5 may be cracked.

FIGS. 3 to 6 are views for explaining the cause of this crack, and FIG. 3 is a view showing a direction in which a force is applied due to a temperature change of the light reflecting member 15 in FIG. 2, and FIG. Shows a stress applied to the molding resin 16 inside the light reflecting member 15, and FIG.
5 is a diagram for explaining the stress and cracking in the thin portion of the mold resin 16 at the edge portion of FIG. 5, and FIG.
It is a simulation diagram of stress in the mold resin 16 in the vicinity.

First, since the light reflecting member 15 is made of metal, when the temperature decreases, a force is applied in the direction in which the curvature decreases as shown by the arrow in FIG. 3 (A), and contracts as shown in FIG. 3 (B). try to. On the other hand, the molding resin 16 inside the light reflecting member 15 contracts toward the direction of the center of gravity of the solid body formed by the molding resin 16, as shown by the arrow in FIG. Try to shrink like. Therefore, in the thinned portion of the mold resin 16 at the edge of the light reflecting member 15, the directions of the contracting force of the light reflecting member 15 and the contracting force of the molding resin 16 are different as shown in FIG. As shown in FIG. 5 (B), the crack 22 enters.

The same applies to the thin portion in the vicinity of the light reflecting member 15 and the lead frame 12 or 13 described above, which appears in the simulation FIG.
That is, in FIG. 6, 12 is a lead frame and 15
Is a light reflecting member, these are metals, and 16 is a molding resin. 1 to 9 represent the strength of stress at each place, and the larger the number, the stronger the stress.

As is apparent from FIG. 6, as shown in FIG.
20 corresponds to the thin-walled portion of the molding resin 16 due to the acute-angled portion of the outermost peripheral portion of the light-reflecting member 15 and the thin-walled portion at 21 near the light reflecting member 15 and the lead frame 12 or 13. The stress is 7, 8, 9
Indicates that a crack is likely to occur in this portion. It should be noted that the portion with the highest stress of 8 and 9 is on the concave surface side of the light reflecting member 15, that is, the light reflecting side, and it is shown that cracks are particularly likely to occur in this portion.

However, when a crack is formed in this way, the light in that portion is naturally bent in the traveling direction or cannot be emitted, and the light emitted in the front is reduced. Even though the light emitting element chip 11 is sealed, the light reflection member 15 and the light emitting element chip 11 are rusted or deteriorated due to water vapor or gas contained in the air that has entered from the crack portion, and the reliability is reduced. The problem of doing so will occur.

Therefore, the crack prevention structure provided in the light emitting device of FIG. 1, that is, the light reflection member 15 and the molding resin, which are the portions where stress is concentrated due to the difference in thermal expansion coefficient between the light reflection member 15 and the molding resin 16. The buffer material 23a, 23b, 23c, 23d, 2d, 2d, 2c, 2d
The structure in which 3e and 23f are formed is effective. In particular, the buffer materials 23a, 23 are always provided on the concave surface side of the light reflecting member 15 where the stress is most concentrated, that is, on the portion including the stress concentrated portion on the light reflecting side.
It is better to provide b, 23d, and 23e.

By providing such a structure, when a high-temperature molding resin of about 130 ° C. used for sealing during resin molding is injected and the temperature falls to room temperature, or when the temperature is high such as in a summer car. Even when used in places with large temperature changes, such as when used in exposed areas,
The stress generated by the difference in the amount and direction of the heat shrinkage of the light reflecting member 15 and the heat shrinkage of the mold resin 16 can be released by the buffer layer, and the mold resin 16 is not cracked. The cushioning material 23 also has an effect of eliminating the edge of the acute angle portion near the lead frames 12 and 13 of the light reflecting member 15, and can prevent the mold resin 16 from cracking due to the edge. Further, since the buffer material 23 may be coated only on the portion where the stress is concentrated, the process can be simplified.

The buffer material 23 has a good transmittance for the light emitted from the light emitting element chip 11 as described above, and
Any substance such as resin, silicon, a fluorine-based coating agent, gas, or liquid may be used as long as the substance has a hardness lower than that of the molding resin 16, and the layer may be not only a single layer but also a plurality of layers. . When using a fluorine-based coating material,
Since an air layer is formed when the temperature of the coating material is lowered, it can be used as it is. Also, a cavity layer formed by shrinkage of the mold resin 16 can be used. Regarding the hardness, in the hardness defined by JISK6249, cracks occurred when 80 vulcanized rubber was used, and good results were obtained when 39 silicon rubber was used. Therefore, the hardness is 50 or less, preferably 40 or less.

However, as described above, the molding resin 1
When the buffer material 23 is provided in the stress concentration portion, which is a portion where cracks are likely to occur, the buffer material 23 has a refractive index different from the refractive index of the mold resin 16. Therefore, the light emitting direction differs only in that portion. Will end up. This is explained based on experimental values in FIG. 7, FIG. 7 (A) shows the case where the cushioning material is provided, and FIG. 7 (B) shows the case where the cushioning material is not provided. In the figure, 15 is a light reflecting member, 16 is a molding resin, 18
Is a total reflection area, 23 is a cushioning material, 28 is a virtual light emitting element chip, and 29 and 35 are light paths.
The light emitting element chip indicated by 11 in FIG. 1 is shown as a virtual light emitting element chip 28 at a position virtually symmetric to the total reflection region 18 for the sake of simplification of description.

In this example, in the case of FIG. 7B in which the buffer material is not provided, the light emitted from the virtual light emitting element chip 28 toward the path 29 is reflected by the light reflection member 15 and emitted from the total reflection area 18. At this time, for example, it is designed so that the light exits at an inclination of 8 degrees with respect to the optical axis and the light toward the path 35 also exits at 10.5 degrees with respect to the optical axis. At that time, in FIG. 7A in which there is a cushioning material using silicon or the like, the light traveling toward the light reflecting member 15 in the same light path 29 is absorbed by this cushioning material 23.
Is reflected by the light reflecting member 15, and is refracted again when it comes out of the buffer material 23. Therefore, the total reflection area 18
When the light is emitted from the optical axis, the light has an inclination of about 14 degrees with respect to the optical axis, and the light is concentrated in the optical axis direction. For this reason, the light passing through the buffer material 23 and the light from other portions have different emission directions, and the light reflected from the edge of the light reflecting member 15 cannot be used efficiently.

In order to cope with such a situation, the embodiment shown in FIG. 8 is provided with a cushioning material over the entire surface of the light reflecting member 15. In FIG. 8, the same components as those in FIG. 1 are denoted by the same reference numerals, and 30 is a cushioning member provided on the entire surface of the light reflecting member 15 so as to have a uniform thickness or a thickness that is uniform. By providing the cushioning material 30 on the entire surface of the light reflecting member 15 in this manner, light is refracted by the cushioning material 30 at substantially the same refraction angle on the total reflection surface, and a specific amount as shown in FIG. There is no longer a large difference in the reflection angle only for the part.

However, since the cushioning material 30 has a different refractive index from the molding resin 16 as described above, even if the cushioning material 30 is evenly provided over the entire reflecting surface, the light to the cushioning material 30 will be affected by the position of the reflecting surface. The incident angle is different, and the thickness of the cushioning material 30 causes a difference in the light emitting angle. Therefore, FIG. 9 shows the result of examining the emission angle with the thickness of the cushioning material 30 being 100 μm and 300 μm. In the figure, 15 is a light reflecting member, and its curvature is assumed to be the same as that of the light reflecting member 15 in FIG. 7 (B) (that is, when the cushioning material 30 is not provided, light travels in the same path as in FIG. 7 (B). Exit from the total reflection area 18). 16 is a mold resin, 18 is a total reflection region, 28 is a virtual light emitting element chip as described in FIG. 7, 30 is a buffer material, and 31 to 34 are light paths.

First, as shown in FIG. 9A, the light reflecting member 15 is formed.
When silicon is uniformly coated with a thickness of 100 μm on the surface of the virtual light emitting element chip 28, the light emitted from the virtual light emitting element chip 28 is absorbed by the buffer material 30.
The light is refracted when entering, is reflected by the light reflecting member 15, and is refracted again when exiting from the buffer material 30 and is emitted from the total reflection region 18. Then, the light reflecting member 1 is routed through the route 31 in FIG. 9A similar to the route 35 near the optical axis side in FIG. 7B.
The light traveling toward 5 is the same as in FIG. 7B from the optical axis 10.5.
The light is emitted from the total reflection area 18 at an inclination of a degree. And Figure 7
The light traveling toward the light reflecting member 15 in the path 32 in FIG. 9A, which is the same as the path 29 in FIG. 9B, has an inclination of 8 degrees from the optical axis in the case of FIG. In the case of (A), the light was emitted from the total reflection area 18 with an inclination of 8.2 degrees, and a difference of 0.2 degrees occurred between the two.

Then, as shown in FIG. 9B, the light reflecting member 1
When the surface of No. 5 is uniformly coated with silicon to a thickness of 300 μm, light traveling toward the light reflecting member 15 through the route 33 of FIG. 9B similar to the route 35 near the optical axis side of FIG. The light was emitted from the total reflection area 18 at an inclination of 10.8 degrees from the optical axis, and a difference of 0.3 degrees occurred between the two. And Figure 7
Light traveling toward the light reflecting member 15 in the route 34 in FIG. 9B similar to the route 29 in FIG. 9B is emitted from the total reflection region 18 at an inclination of 8.4 degrees, and both of them are 0.4. There was a difference in degree.

In this way, the buffer material 30 is used as the light reflecting member 15.
If it is coated with a uniform thickness, the thickness is 100
There is no great difference in the direction of the light emitted from the total reflection region 18 at μm or 300 μm. However, as a practical matter, it is difficult to coat silicon or the like on the entire surface such as the light reflecting member 15 with a completely uniform thickness. That is, as shown in FIGS. 10A and 10B, the normal cushioning material 3
6, 37 are the outer edges of the light reflecting member 15 due to the effect of surface tension,
It is thin at the inner edge and thick at the center. In addition, in FIG. 10, the thickness of the cushioning material in FIG.
m, and the thickness of the cushioning material in FIG. 10B is 100 μm.

Therefore, when 28 is a virtual light emitting element chip of the light emitting element chip 11 placed at a position symmetrical to the total reflection area 18, the thickness of the cushioning material is 3 as shown in FIG. 10 (A).
If it is set to 00 μm, in the light path 38 that advances to the thinned portion near the outer edge of the light reflecting member 15, a deviation of about 2.1 degrees occurs in comparison with the emission direction when the thickness of the cushioning material is 300 μm. Also, in the path 39 of the light traveling in the inner edge direction, a deviation of about 1.5 degrees occurs similarly. On the other hand, FIG.
In the case of 100 μm in (B), the path 38 of light advancing near the outer edge is about 0.6 degrees, and the path 39 of light advancing in the inner edge direction.
In, the difference is about 0.5 degrees and less than 1 degree. Therefore, the thickness of the buffer material is preferably 100 μm or less in order to reduce the deviation caused by the buffer material in the light emission direction to 1 degree or less.

FIG. 11 and FIG. 12 are graphs in which the thickness (coating thickness) and center efficiency of this cushioning material, and the divergence angle (directional angle) of the light emitted from the light emitting device were examined. In FIG. 11, the horizontal axis represents the thickness of the cushioning material (coating thickness), and the vertical axis represents the central efficiency. The central efficiency is the ratio of the amount of light entering a circle centered on the optical axis at a certain distance from the light emitting device, when the total amount of light emitted from the light emitting device is 100%. In Example 11, 120 m from the light emitting device as an example
It shows the ratio of the amount of light falling within the range of Φ 8.4 mm on the irradiation surface at a distance of m. Further, in FIG. 12, the horizontal axis represents the thickness of the cushioning material (coating thickness), and the vertical axis represents the directivity angle.
The directivity angle means a divergence angle of a light beam emitted from the light emitting device, and indicates an angle of an irradiation region having a constant ratio with respect to the brightest point on a certain irradiation surface. In the example of FIG. 12, for example, The figure shows the angle of the irradiation area at 50% (half value).

In FIGS. 11 and 12, the maximum value and the minimum value are the component tolerances with respect to the ideal assembled state (design value) with a certain cushioning material thickness (coating thickness). And the maximum and minimum values of the center efficiency and the directivity angle in consideration of the assembly tolerance (variation). Therefore, in FIG. 11, for example, when the thickness of the cushioning material (coating thickness) is 50 μm, the maximum value is 2.
7%, the minimum value is 1.3%, which means that the central efficiency varies within this range.

First, as is clear from FIG. 11, the minimum value of the center efficiency is 0 when the thickness of the cushioning material (coating thickness) is 0.
The maximum value is flat between 30 and 100 μm, while the maximum value is flat between 30 and 100 μm, but at other thicknesses, the central efficiency is high and the light is concentrated in the center, so the buffer is It is preferable to control the thickness of the material (coating thickness) to 30 to 100 μm. Then, referring to FIG. 12, when the thickness of the cushioning material (coating thickness) is in the range of 30 to 100 μm, the fluctuation widths of both the maximum value and the minimum value are within 2 degrees.
If it exceeds, the minimum value becomes small and light tends to be concentrated in the center as well. Therefore, it is preferable to control the thickness of the cushioning material (coating thickness) to 30 to 100 μm.

The thickness (coating thickness) of the cushioning material is expected to fluctuate by about 20 μm due to variations in manufacturing, environmental conditions during manufacturing, etc., and it is difficult to strictly control it. Therefore, even if the thickness of the cushioning material (coating thickness) slightly fluctuates, it is desirable that the fluctuation of the center efficiency and the directivity angle be suppressed to ± 10% or less. In FIGS. 11 and 12, the “maximum value”, The "minimum value" satisfies this condition from 30 to 100 .mu.m described above. If the thickness (coating thickness) of the cushioning material is 30 .mu.m or more and 100 .mu.m or less, it is possible to realize a cushioning material with little influence on optical characteristics.

The above is the structure for preventing cracks in the molding resin of the optical device for optical elements according to the present invention, but only the optical device for optical elements composed of the light reflecting member and the molding resin for sealing as described above. Can be combined with a light emitting device that does not have such an optical device for an optical element, that is, a light emitting element module in which a light emitting element chip is sealed in a mold resin.

An example of this is shown in FIG.
Reference numeral 1 is a light emitting element chip as a single device, 15 is a light reflecting member, and 16 is a molding resin. In the light reflecting member 15 in the following description of the embodiment, as described above, stress is concentrated on the molding resin. Alternatively, it is assumed that the concave side of the light reflecting member or the entire surface thereof is coated with a cushioning material.

First, FIG. 13A shows a light emitting element module 40 of a surface mounting type or the like which is housed in an optical element optical device made of a reflecting member 15 and a molding resin 16. In this case, as shown in FIG. 1 and FIG.
Then, the light is totally reflected by the total reflection area 18, and then is reflected again by the light reflecting member 15 to be emitted to the outside of the optical device for an optical element. With such a configuration, it is possible to form a light emitting device having high light utilization efficiency and preventing generation of cracks, as in the case where the light emitting element chip is provided inside.

FIG. 13B shows a structure in which the optical device for an optical element made of the reflecting member 15 and the molding resin 16 is formed in a donut shape, and the shell-shaped light emitting element module 41 is inserted in the center hole. . In this case, the light emitting element chip 1
The light traveling from 1 to the total reflection area 18 is totally reflected here, toward the light reflecting member 15 and emitted forward.

FIG. 13C shows a light-emitting element module 42 having a convex lens portion in front of the light-emitting element chip 11 in which the optical element optical device made of the reflecting member 15 and the molding resin 16 is formed in a donut shape. It has a convex part.

In FIG. 13D, a direct emission area 17 is formed in the optical device for an optical element made of the reflection member 15 and the molding resin 16, and a shell type light emitting element module 43 is provided on the back of the direct emission area 17. It is shaped so that it can be inserted and accommodates the shell-shaped light emitting element module 43.

FIG. 13E shows a combination of the optical device for optical elements used in FIG. 13A and a light emitting element module 44 having a similar shape to the light emitting element module used in FIG. 13C. The same effect as 13 (a) is obtained.
FIG. 13F shows an optical device for an optical element whose rear surface is formed in a flat shape and a light emitting element module 45 whose front surface is a flat surface.
13A is also combined, and the same effect as in FIG. 13A can be obtained.

In the above description of the embodiment, the case where the light emitting element chip 11 is placed on the reflecting member 15 side has been described. However, as shown in FIG. 14, the light emitting element chip 11 is provided inside the light emitting surface side of the molding resin 16. The same applies when placed. Also in this case, since the light emitting element chip 11 is sealed in the concave portion of the reflecting member 15 with the mold resin 16, the crack of the mold resin 16 occurs at the edge of the reflecting member 15 as described above.

Therefore, as shown in FIG. 14B, a cushioning material 46 is provided at the end of the reflecting member 15 to inject the molding resin 16, or as shown in FIG. 14C, the concave reflection of the reflecting member 15 is performed. If the cushioning material 47 is provided on the entire surface of the portion, these cracks can be prevented.

In the above description, the case where the light emitting element composed of the light emitting element chip or the light emitting element module in which the light emitting element chip is sealed in the molding resin and the optical device for the optical element are combined has been described. As described above, instead of the light emitting element, a light receiving element chip such as a photodiode or a solar cell, or a light receiving element chip made of a light receiving element module in which the light receiving element chip is encapsulated in a molding resin is placed, so that the light enters from the front. A light receiving device (optical device) that efficiently receives light can be configured. Also in this case, as described above, by coating the stress concentrating portion of the mold resin 16 and the concave portion or the entire surface of the light reflecting member with a buffering agent, cracks of the mold resin 16 can be prevented and the light reflecting member can be prevented. All the incident light can be collected in the light receiving element, and by the water vapor and gas,
It is possible to prevent the problem that the reliability is lowered due to the light reflecting member or the light receiving element being rusted or deteriorated.

In the above description, an optical element such as a light emitting element or a light receiving element is sealed at a predetermined position of the optical device for an optical element.
Alternatively, the configuration of an optical device such as a light emitting device or a light receiving device to be arranged has been described, but in the following method of manufacturing such an optical device, a light emitting device in which a light emitting element chip is sealed at a predetermined position of an optical device for an optical element. Will be described as an example.

FIGS. 15A, 15B, and 15C show an example of a method for manufacturing a light emitting device in which a light emitting element chip is sealed at a predetermined position of an optical device for an optical element. Figure 15
24 for manufacturing a light emitting device is shown, a cavity 25 for molding the molding resin 16 is formed in the mold 24, and the total reflection region 18 is molded on the bottom surface of the cavity 25. And a pattern surface 27 for directly molding the emitting region 17 are formed.

In the manufacture of the light emitting device, the light reflecting member 15 in which the cushioning material 23 is previously arranged at a predetermined position.
To make. That is, the light reflecting member 15 shown in FIG.
As described above, the surface of the light reflecting member 15 has a good transmittance for the light emitted from the light emitting element chip 11 at the position of the stress concentration portion at the boundary between the light reflecting member 15 and the molding resin 16, and the molding resin The cushioning material 23 is arranged with a substance having a hardness smaller than 16. Next, as shown in FIG. 15, the light reflecting member 15 in which the cushioning material 23 is arranged is housed in the cavity 25. Since the outer diameter of the light reflecting member 15 and the inner diameter of the cavity 25 are substantially equal to each other, the light reflecting member 15 is put in the cavity 25 and the light reflecting member 15 is placed on the bottom surface of the cavity 25.
The light reflecting member 15 can be positioned in the cavity 25 by placing the.

FIG. 15B shows a structure in which the light emitting element chip 11 is die-bonded to the pan portion of the lead frame 12 and the lead frame 13 and the light emitting element chip 11 are connected by the bonding wire 14. It is manufactured in a separate process in advance. As shown in FIG. 15 (b), this is placed in the cavity 2 with the light emitting element chip 11 down.
5, the light emitting element chip 11 is positioned at a predetermined position in the cavity 25 by supporting the upper ends of the lead frames 12 and 13.

In this state, as shown in FIG.
The mold resin 16 is injected into the cavity 25 to insert the light emitting element chip 11 and the light reflection member 15, and the emission region 17 and the total reflection region 18 are directly formed. When the mold resin 16 is cooled and cured, it is taken out from the cavity 25. , Get light emitting device.

According to such a manufacturing method, as shown by the path 19 in FIG. 1, of the light emitted from the light emitting element chip 11, the light traveling toward the total reflection region 18 is the interface of the mold resin 16. The light-emitting element chip 11, the resin interface 18, and the light-reflecting member 1 are so reflected as to be totally reflected by the light-reflecting member 15, further reflected by the light-reflecting member 15, and emitted forward from the total-reflection region 18.
5 and the like can be easily positioned, and the cushioning material 23 can be easily arranged at the boundary between the resin member and the light reflecting member, so that the light utilization efficiency is high and cracks are less likely to occur with simple equipment. Can be mass-produced.

Although an example of a method of manufacturing a light emitting device is shown here, in FIG. 15B, instead of housing the lead frames 12 and 13 on which the light emitting element chip 11 is mounted in the cavity 25, FIG. The optical device single unit for an optical element can be easily manufactured by accommodating the mold for forming the recess or the flat portion for disposing the light emitting element modules 40 to 45 as shown. Further, the light emitting element chip 11 or the light emitting element module 40 to
By using a mold for a light-receiving element chip or a light-receiving element module instead of the mold for 45, the light-receiving device can be manufactured in the same manner.

The optical device for an optical element and the optical device using the optical device for an optical element according to the present invention described above have bad installation conditions such as an outdoor where the difference in temperature is large and a vehicle where the temperature is considerably high in summer. It is suitable for use in an environment display device, a light source for an on-vehicle lamp, or an optical device such as an outdoor display device. Hereinafter, such an example will be described with reference to FIGS. 16 to 25.

First, FIGS. 16 and 17 show a light emitting device array 50 which is an optical device in which the optical devices for optical elements according to the present invention described in FIG. 13 are arranged in an array.
16 is a perspective view (FIG. 16) and a cross-sectional view (FIG. 17) of one configuration example. This is the circuit board 52 placed on the pedestal 51.
A plurality of light emitting element chips or a plurality of light emitting element modules each including a plurality of light emitting element chips in which the light emitting element chips are encapsulated in a molding resin are arranged at regular intervals, and the optical device for an optical element of the present invention is arranged thereon. The optical device array 54 for optical elements is formed by stacking the arrays 54, and the direct emitting area portion 55 and the light reflecting member 56 are provided at the same pitch as the light emitting elements 53. The individual light emitting devices 57 arranged in the light emitting device array 50 at a constant pitch are individually lit, and are configured to be used in various displays. The optical device for an optical element in FIGS. 16 and 17 is exemplified by the case described in FIG. 13, but may be a light emitting device as shown in FIG. 1, FIG. 8 or FIG. Of course.

FIG. 18 is a perspective view of a display device 60 which is an optical device including an optical device for an optical element according to the present invention and a plurality of light emitting devices 61 each composed of a light emitting element composed of a light emitting element chip or a light emitting element module. In this display device 60, a plurality of light emitting devices 61 are arranged in a matrix form or a honeycomb form, and various displays can be performed by individually blinking each light emitting device 61. ing. Although FIG. 18 shows a stand-type one, it may be a wall-mounted type or one that is attached to the outer wall of a house or the like.

FIG. 19 shows a light emitting display 71 having a plurality of light emitting devices 73 each composed of a light emitting element composed of a light emitting element chip or a light emitting element module, and an optical device for an optical element according to the present invention installed on a column 70. 20 and 21 are a front view and a side view of a light emitting display unit 72 that constitutes the light emitting display 71. The light emitting display 71 displays characters and illustrations on the light emitting device 73 in order to inform the driver of, for example, road conditions and weather conditions.
As shown in FIG. 21, the light emitting device 73 is mounted on the substrate 74, and the substrate 74 is mounted on the base 75.
It is sandwiched between the cover 76 and the cover 76 so that each light emitting device 73 is exposed from the hole of the cover 76.
The light emitting device 73 is a substrate 74 having an appropriate light emission color and an appropriate pattern according to the mark or character to be displayed.
Is located in.

22 and 23 show a light emitting device 5 comprising an optical device for an optical device according to the present invention and a light emitting device composed of a light emitting device chip or a light emitting device module.
Front view of a traffic light 80, which is an optical device equipped with a plurality of 7.
FIG. This traffic signal 80 is an array of red, yellow, and green traffic lights 81R, 81Y, 81G,
The upper part is covered with a hood 82. As shown in FIG. 17, the red, yellow, and green signal lights 81R, 81Y, and 81G have a plurality of light emitting devices 57 of corresponding emission colors mounted on the substrate 52 in the same direction, and the substrate 52 is a casing. It is housed inside and its front surface is covered with a milky white or translucent cover.

FIG. 24 is a perspective view showing a high mount stop lamp 91 using an optical device for an optical element according to the present invention and a light emitting device 90 composed of a light emitting element composed of a light emitting element chip or a light emitting element module. This high mount stop lamp 91 is a board 9 that is long sideways.
25, a plurality of light emitting devices 90 each having a substantially elliptical shape as shown in FIG.

The light emitting device 90 for the high mount stop lamp has the same structure as the light emitting device shown in FIG. 1, FIG. 8, FIG. 13 or FIG. Shape, oval, rectangular, etc.
Since it has a laterally long front shape, both sides of the disc-shaped light reflecting member 15 are bent and inserted into the mold resin 16. The light emitting device 90 is mounted on the substrate 92 such that its long axis direction is parallel to the length direction of the substrate.

The high mount stop lamp 91 is
Mounted inside the rear window 94 of the vehicle 93,
When the driver of the vehicle 93 presses the brake, all the light emitting devices 90 are turned on all at once to notify the following vehicles. In such a high mount stop lamp 91, if a horizontally long light emitting device 90 is used, it becomes possible to efficiently emit horizontally long light. Further, by making the light emitting device 90 horizontally long, the necessary light emitting device 9
Since the number of 0s can be reduced, the cost of the high mount stop lamp 91 can be reduced.

[0086]

As described above, according to the present invention, the stress generated by the difference in thermal expansion coefficient between the light reflecting member and the mold resin is released by the buffer material to prevent the occurrence of cracks. It is possible to prevent the generation of a region in which light is not emitted forward, and it is possible to prevent the problem that the light reflection member and the light emitting element are rusted or deteriorated due to the water vapor or the gas and the reliability is lowered. Therefore, it is possible to provide an optical device for an optical element, which is suitable for use in a display device or the like in an environment where installation conditions are bad, such as outdoors where there is a great difference in temperature or temperature, or in a car where the temperature is considerably high in summer and the like.

The buffer material has a uniform thickness or a thickness that conforms to the uniform thickness and is 100 μm or less to minimize the deviation of the light emitting direction due to the difference in the refractive index between the mold resin and the buffer material. In addition, it is possible to provide an efficient optical device for an optical element that can withstand variations during assembly by optimizing the central efficiency and the directivity angle.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a configuration of a main part according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a cracked portion of a mold resin in the light emitting device used in the present invention.

FIG. 3 is an explanatory diagram of an effect due to heat contraction of a reflecting member.

FIG. 4 is an explanatory diagram of an effect of heat shrinkage of a mold resin.

FIG. 5 is a diagram illustrating a stress applied to the molding resin when the reflecting member is sealed with the molding resin.

FIG. 6 is a simulation diagram of stress applied to the molding resin when the reflecting member is sealed with the molding resin.

FIG. 7: A cushioning material for preventing cracks in the mold resin,
It is explanatory drawing of the optical path at the time of providing in the edge part of a reflecting member, and when not providing a buffer material.

FIG. 8 is a schematic cross-sectional view showing the configuration of the main parts according to another embodiment of the present invention.

FIG. 9: A cushioning material for preventing cracks in the mold resin,
It is explanatory drawing of the optical path by the difference in the thickness of the buffer material when providing in the reflective surface whole surface of a reflective member.

FIG. 10 is an explanatory diagram of an optical path due to a difference in thickness of a cushioning material between an edge portion and a center of a reflecting member.

FIG. 11 is a graph showing the relationship between the thickness of the buffer material for preventing cracks and the center efficiency in the optical device for an optical element according to the present invention.

FIG. 12 is a graph showing the relationship between the thickness of the buffer material for preventing cracks and the spread angle of light emitted from the light emitting device in the optical device for an optical element according to the present invention.

FIG. 13 is an explanatory diagram of an example in which the light emitting device is a separate member.

FIG. 14 is an explanatory diagram of an example in which a light emitting element is provided on the light emitting surface side of a mold resin.

FIG. 15 is an explanatory diagram of a method for manufacturing an optical device of the present invention, using a light emitting device as an example.

FIG. 16 is a perspective view of a configuration example of a light emitting device array in which optical devices for optical elements according to the present invention are arranged in an array.

FIG. 17 is a cross-sectional view of a configuration of a light emitting device array 50 in which optical devices for optical elements according to the present invention are arranged in an array.

FIG. 18 is a perspective view of a display device using the optical device for an optical element according to the present invention.

FIG. 19 is a front view showing an example of a light emitting display that is configured by the optical device for an optical element according to the present invention, which is installed on a column.

20 is a front view of the light emitting display unit shown in FIG.

FIG. 21 is a side view of the light emitting display unit shown in FIG.

FIG. 22 is a front view of a traffic signal using the optical device for an optical element according to the present invention.

FIG. 23 is a side view of a traffic signal using the optical device for an optical element according to the present invention.

FIG. 24 is a perspective view showing an example of a vehicle-mounted high mount stop lamp using the optical device for an optical element according to the present invention.

FIG. 25 is an example of a light emitting device that constitutes the vehicle-mounted high mount stop lamp shown in FIG. 24.

FIG. 26 is a sectional view of a conventional light emitting device module.

[Explanation of symbols]

11 light emitting element chips 12, 13 Lead frame 14 Bonding wire 15 Light reflection member 16 Mold resin 17 Direct emission area 18 Total reflection area 23 cushioning material

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hironobu Kiyomoto             Shimogyo-ku, Kyoto-shi Shioji-dori Horikawa Higashiiri Minamifudo-cho             801 OMRON Corporation F term (reference) 5F041 AA06 DA16 DA19 DA57 EE23                       FF01 FF11                 5F073 FA06 FA29 FA30                 5F088 JA02 JA03 JA06 JA11

Claims (21)

[Claims] 1. An optical device for an optical element, which controls an optical path of outgoing light from an optical element to the outside or incident light from the outside to the optical element, comprising at least a light reflecting member and at least light of the light reflecting member. A resin member that covers a reflecting surface, wherein the resin member includes a resin interface that substantially totally reflects light that has deviated from a predetermined area in front of the optical element, and light that has deviated from a predetermined area in front of the optical element, An optical path connecting an optical element and the outside of the optical device for an optical element is at least 1 at each of the resin interface and the light reflecting member.
The optical interface for an optical element is characterized in that the resin interface or the arrangement of the light reflecting member is determined so as to pass through a path that reflects more than once, and a cushioning material is provided at the boundary between the light reflecting member and the resin. device. 2. The optical device for an optical element according to claim 1, wherein the resin member includes a lens portion that emits or condenses light reaching a predetermined area in front of the optical element. 3. The optical device for an optical element according to claim 1, wherein the buffer material is provided at a portion where stress generated by thermal contraction or expansion of the light reflecting member and the resin is concentrated. . 4. The optical device for an optical element according to claim 1, wherein the cushioning material is provided at least on the light reflecting side of the light reflecting member. 5. The optical device for an optical element according to claim 1, wherein the cushioning material is a soft layer having a low hardness, a gas or a fluid layer, or a cavity layer formed by contraction. 6. The optical device for an optical element according to claim 1, wherein the cushioning material has a hardness defined by JISK6249 of 50 or less. 7. The optical device for an optical element according to claim 1, wherein the cushioning material has a uniform thickness or a uniform thickness. 8. The optical device for an optical element according to claim 1, wherein the buffer material has a thickness of 100 μm or less. 9. The buffer material has a thickness of 30 μm or more and 10 or more.
The optical device for an optical element according to claim 1, wherein the optical device has a thickness of 0 μm or less. 10. An optical device array for optical elements, wherein a plurality of optical devices for optical elements according to claim 1 are arranged. 11. An optical device array for an optical element according to claim 10, and an optical element, wherein the optical element is an optical element and an optical element for an optical element, which is a light beam outside a predetermined region in front of the optical element. An optical path connecting the outside of the device is at the resin interface and each of the light reflecting members,
An optical device arranged at a position determined so as to pass through a path that reflects at least once. 12. An optical device comprising: an optical element; and an optical device for an optical element that controls an optical path of outgoing light from the optical element to the outside or incident light from the outside to the optical element, The optical device for optical elements includes a light reflecting member and a resin member that covers at least the light reflecting surface of the light reflecting member, and the resin member substantially totally reflects light that has deviated from a predetermined region in front of the optical element. A resin interface to allow, the light path out of a predetermined region in front of the optical element, an optical path connecting the optical element and the outside of the optical device for an optical element, at the resin interface and the light reflection member respectively. , At least 1
An optical device, wherein the resin interface or the arrangement of the light reflecting member is determined so as to pass through a path that reflects more than once, and a cushioning material is provided at a boundary between the light reflecting member and the resin. 13. The optical device according to claim 12, wherein the optical element is a light emitting element chip or a light emitting element module including a light emitting element module in which the light emitting element chip is encapsulated in a molding resin. 14. The resin interface has a total reflection point on the resin interface where the first light emitted from the light emitting element is totally reflected, and the light emission from the light emission element rather than the total reflection point. A region where the second light, which is totally reflected at a point on the resin interface close to the element, passes through the resin interface when the second light is reflected by the light reflecting member and emitted to the outside, is the same. 14. The optical device according to claim 13, which has. 15. The optical device according to claim 12, wherein the optical element is a light receiving element chip or a light receiving element in which the light receiving element chip is sealed in a mold resin. 16. An optical path in which the first light incident on the resin interface from the outside and reflected by the light reflecting member is totally reflected at a total reflection point on the resin interface and enters the light receiving element,
The second light that has passed through the total reflection point from the outside and is incident on the resin interface and reflected by the light reflecting member is totally reflected at a point closer to the light receiving element than the total reflection point at the resin interface, and The optical device according to claim 15, further comprising: a light path incident on the light receiving element. 17. The optical element according to claim 12, wherein the optical element is arranged in the vicinity of a position that is a mirror image through the resin interface with respect to a position that is a focal point of the light reflecting member. Optical device. 18. A method of manufacturing an optical device for an optical element, which controls an optical path of light emitted from an optical element to the outside or an incident light reaching the optical element from the outside, wherein a buffer material is arranged on a light reflecting member. Steps, of the light that has deviated from a predetermined area in front of the optical element, an optical path connecting the optical element and the outside of the optical element optical device, at least at the interface of the resin member and each of the light reflecting members. And a step of covering the light reflecting member with the resin member so as to pass through a path that is reflected once or more. 19. A method of manufacturing an optical device, comprising an optical element inside, and controlling an optical path of outgoing light from the optical element to the outside or incident light from the outside to the optical element, the method comprising: A step of disposing a cushioning material, and an optical path connecting light outside the predetermined area in front of the optical element, the optical element and the outside of the optical device, at an interface of a resin member and at each of the light reflecting members. And a step of covering the optical element and the light reflecting member with the resin member so as to pass through a path that reflects at least once. 20. A light control method of an optical device for controlling an optical path of outgoing light from an optical element to the outside, or incident light from the outside to the optical element, the optical device comprising: A light path that connects the optical element and the outside of the optical device of light that has deviated from a predetermined front area is a path that is reflected at least once at each of a resin interface and a light reflection member provided in the optical device. A light control method for an optical device, wherein the light control member is controlled so as to pass through a cushioning material that is in contact with at least a part of the light reflection member when reflected by the light reflection member. 21. An optical element having a plurality of light emitting elements each comprising a light emitting element chip or a light emitting element module in which the light emitting element chip is sealed in a molding resin, and controlling an optical path of outgoing light from the light emitting element to the outside. In an optical apparatus having a plurality of optical devices for use, a light reflecting member and a resin member that covers at least the light reflecting surface of the light reflecting member, wherein the resin member is a light beam that is outside a predetermined region in front of the light emitting element. Is provided with a resin interface for almost total reflection of light, and an optical path connecting the light emitting element and the outside of the optical device for an optical element of light outside a predetermined region in front of the light emitting element is the resin interface and the light reflection. In each of the members, the resin interface or the arrangement of the light reflecting member is defined so as to pass through a path that reflects at least once, and at the boundary between the light reflecting member and the resin, An optical apparatus characterized in that a 衝材.