JP2003043516A - Substrate for liquid crystal display element and liquid crystal display element using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a means for strengthening a connecting electrode part in particular and for heightening flexibility and resistance to corrosion and oxidation in a transparent electrically conductive film of a substrate for a liquid crystal display element. SOLUTION: The substrate for the liquid crystal display element is characterized by that the transparent electrically conductive film of a desired electrode shape is formed on a surface of a transparent substrate and a part to be a connecting electrode of the transparent electrically conductive film is covered with a metallic film. Its manufacturing method is provided, too. Further the liquid crystal display element is characterized by containing a sealing member and two sheets of transparent substrates in which the transparent electrically conductive film of the desired electrode shape is formed at least on their surfaces and the connecting electrode part of the transparent electrically conductive film is covered with the metallic film, forming a liquid crystal cell body of the transparent substrates by disposing transparent electrically conductive film sides to face each other while keeping a fixed space by the sealing member and enclosing a liquid crystal material in the liquid crystal cell body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display element substrate having a connection electrode portion covered with a metal film and a liquid crystal display element using the same, and more specifically, to a transparent conductive film provided on a transparent substrate. Of these, the present invention relates to a liquid crystal display element substrate in which the connection electrode portion is covered with a metal film to improve the oxidation resistance and strength of the portion, and a liquid crystal display element using the same.

[0002]

2. Description of the Related Art Generally, in a liquid crystal display device, two transparent substrates, each having an electrode shape formed on the surface thereof, are made to face each other with their transparent conductive films facing each other, and the periphery thereof is surrounded by a sealing member to form a liquid crystal cell body. It is manufactured by injecting and sealing liquid crystal into, and further arranging a polarizing plate, a light reflection plate and the like according to the purpose of use.

In this liquid crystal element, the transparent conductive film used is divided into a liquid crystal display electrode portion and a connection electrode portion, and among these, the connection electrode portion transmits signals from peripheral electronic components to the liquid crystal display portion. The liquid crystal display portion has a function of displaying.

More specifically, an example of a sectional structure of a general liquid crystal display device is shown in FIG.

A liquid crystal display element 1 shown in FIG. 5 is such that a liquid crystal display section 2 and electronic circuit parts such as a driving IC for controlling the driving of the liquid crystal display section are mounted on one glass substrate.

The liquid crystal display element 1 is a COG (Chip On) device.
It is manufactured by the Glass method and has a liquid crystal display unit 2
And the electronic component mounting unit 3. In the liquid crystal display unit 2, the common electrode 5 and the segment electrode 6 which are liquid crystal display electrodes are formed on the inner surfaces of the lower glass substrate 4a and the upper glass substrate 4b that face each other, and the liquid crystal substance 7 is sealed by the sealing member 8. It has a sealed structure. This common electrode 5
The segment electrode 6 is a transparent conductive film formed by tin-doped tin oxide-indium oxide (ITO) vapor deposition.

Further, the electronic component mounting portion 3 is a portion where the lower glass substrate 4a protrudes largely in one direction as compared with the upper glass substrate 4b, and the common electrode is provided on the frame portion 11 of the lower glass substrate 4a. 5 and the connection electrode portion 16 extending from the electrode end extending from the segment electrode 6 is formed, and an electronic component such as a drive IC 13 for driving the liquid crystal display unit 2 and a signal from the outside are formed on the connection electrode portion 16. Is connected to a cable 14 for delivering and receiving. Although not shown, electrodes are extended from the segment electrodes 6 formed on the upper glass substrate 4b to the upper surface of the frame portion 11 to form a wiring pattern communicating with the connection electrode portions 16. This connection electrode portion 16 is also a transparent conductive film formed by depositing the same ITO powder as the common electrode 5 and the segment electrode 6.

Further, the connection electrode portion 16 and the driving IC 1
In order to further reduce the electric resistance value with respect to 3, the metal electrode coating film 15 having good conductivity may be formed on a part of the connection electrode portion 16.

FIG. 6 shows the liquid crystal display device 1 shown in FIG.
2 shows an example of the wiring pattern. A plurality of common electrodes 5 and segment electrodes 6 formed on the liquid crystal display unit 2.
Are arranged in a matrix and a large number of display pixels 12 are formed at the intersections of the common electrodes 5 and the segment electrodes 6. In the electronic component mounting portion 3, the drive IC is attached to the frame portion 11.
13 and a connection electrode portion 16 extending from the common electrode 5 and the segment electrode 6 are patterned. Although not shown, the connection electrode portion 16 is connected to each terminal of the drive IC 13 and is also led out to the end of the cable 14 for external connection. When forming the wiring pattern of the connection electrode portion 16 as described above, the inter-electrode distance W1 of each connection electrode portion 16 is set to 100 μm or more so that a conduction failure due to a short circuit or the like does not occur.

[0010]

However, in the above-mentioned conventional liquid crystal display device, the connection electrode portion 16 formed in the electronic component mounting portion 3 is exposed on the upper surface of the lower glass substrate 4a. There is a problem that Since the connection electrode portion 16 is a transparent conductive film made of ITO vapor deposition, corrosion due to oxidation easily occurs when it is exposed to the outside air, and if left in that state, the electrical resistance value may increase, Depending on the case, there may be an effect such as disconnection. Further, there is a possibility that adjacent connection electrode portions 16 may be short-circuited due to corrosion or oxidation.

In order to solve such a problem, the electrode width of the connection electrode portion 16 is widened to keep the electric resistance value low, or the distance W1 between the electrode patterns is widened to short-circuit when corrosion or the like occurs. Although such measures have been taken, the wiring pattern area of the electronic component mounting portion 3 is widened by such a method, and the miniaturization of the liquid crystal display element 1 is restricted. Further, since the wiring pattern area is widened, there is a problem that the material cost and the man-hour required for manufacturing are increased.

When a flexible member such as a transparent polymer film substrate is used as the transparent substrate, the strength of the ITO film or the like forming the connection electrode portion of the transparent conductive film is weaker, so that it is easily scratched. As a result, there was a problem of disconnection.

Therefore, among the transparent conductive films currently used, it has been required to provide means for strengthening especially the connection electrode portion to enhance corrosion, oxidation or flexibility and strength.

[0014]

Means for Solving the Problems The inventors of the present invention have conducted extensive studies to solve the above problems, and as a result, coated a connection electrode portion of a transparent conductive film exposed on the surface of a liquid crystal display element with a metal film. As a result, the present invention has been completed by finding out that the above problems can be solved, and finding specific means therefor.

That is, the present invention is characterized in that a transparent conductive film is formed in a desired electrode shape on the surface of a transparent substrate, and a portion of the transparent conductive film to be a connection electrode is covered with a metal film. A substrate for use is provided.

Further, according to the present invention, there are provided two transparent substrates in which a transparent conductive film is formed in a desired electrode shape on at least the surface, and a connection electrode portion of the transparent conductive film is covered with a metal film.
A transparent substrate including a sealing member, the transparent substrate is opposed to the transparent conductive film side by the sealing member at a constant interval, and a liquid crystal substance is enclosed in the liquid crystal cell body. And a liquid crystal display element.

Further, according to the present invention, a transparent conductive film is formed on a transparent substrate, and then the transparent conductive film is etched into a desired electrode shape to form a transparent conductive film. The present invention provides a method for producing a substrate for a liquid crystal display device, which comprises coating the substrate with a metal film.

Furthermore, the present invention forms a transparent conductive film on a transparent substrate, coats the transparent conductive film with a metal film, and then etches the transparent conductive film layer and the metal film layer into a desired electrode shape. A method for manufacturing a substrate for a liquid crystal display element, which comprises forming a transparent conductive film coated with a metal, and finally peeling off a metal film layer of a portion of the transparent conductive film to be a liquid crystal display electrode.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION The substrate for a liquid crystal display device of the present invention comprises:
A transparent conductive film formed in a desired electrode shape on the surface of a transparent substrate is coated with a metal film on a portion to be a connection electrode. That is, when the liquid crystal display element is formed, the portions that will be the display electrodes remain transparent, and only the portions that will be the connection electrodes for passing current signals from the peripheral electronic components will be covered with metal. .

Such a substrate for a liquid crystal display device can be manufactured, for example, by either of the following method 1 or method 2.

(Method 1) A portion where a transparent conductive film is formed on a transparent substrate, and then the transparent conductive film is etched into a desired electrode shape to form a transparent conductive film, which is to be a connection electrode of the transparent conductive film. A method of coating the metal with a metal film.

(Method 2) A transparent conductive film is formed on a transparent substrate, the transparent conductive film is then covered with a metal film, and then the transparent conductive film skin layer and the metal film layer are etched into a desired electrode shape to form a metal. A method of forming a coated transparent conductive film, and finally peeling off the metal film layer of the portion of the metal coated transparent conductive film to be the liquid crystal display electrode.

Of the above methods, the method 1 will be described first with reference to FIG. 3 showing the pattern forming step. Figure 3
The middle line AA is a boundary line between the connection electrode portion 16 and the sealing portion 39, and the left side is the sealing portion 39. Also, BB
The line is the boundary between the sealing part and the display part, and the left side shows the liquid crystal display electrode part.

To carry out the method 1, first, the transparent substrate 40
A transparent conductive film is formed on it (step a). As the transparent substrate 40 used here, various glass substrates and transparent polymer film substrates such as polyethylene terephthalate (PET) and polycarbonate (PC) can be used. The transparent conductive film 41 is formed by using a vapor deposition device to form a tin oxide film, an indium oxide film, or an ITO film obtained by doping indium oxide with tin.

Next, the transparent conductive film 41 formed in step a
The metal film layer 42 is formed on the upper portion which will be the connection electrode. The thickness of the metal film layer 42 is 0.1 to 0.3.
It is preferably about μm, and can be formed by various means for forming a metal film, for example, vapor deposition, sputtering, chemical plating, use of metal resinate paste, and the like. Of these, when a glass plate having heat resistance is used as the transparent substrate 40, it is preferable to use a metal resinate paste obtained by mixing an organic metal and an oxidizing resin in terms of efficiency and workability. . When this metal resinate paste is used, it is used as the transparent conductive film 41.
It is preferable to form the metal resinate paste layer 43 by screen printing on the portion (16 portion) which will be the connection electrode (step b).

The transparent substrate 40 on which the metal resinate paste layer 43 is formed is then heated to a suitable temperature, for example 500.
The metal coating layer 42 is formed by firing at about C (step c). It is preferable that the boiling point of the organic solvent used for the metal resinate paste for forming the metal resinate layer 43 is not so high, and an organic solvent that does not completely evaporate and leave the resin component 46 at about 500 ° C. should be selected. Is.

The metal film layer 42 for coating the transparent conductive film skin layer 41 can be selected according to the purpose of coating, and has high conductivity and oxidation resistance such as gold, nickel, chromium and platinum. It is preferable to use a metal, a metal having high conductivity and flexibility such as silver, copper, tin, or an alloy having these properties. Since metal resinate pastes for forming various metal coating layers are known, they can be appropriately selected and used.

Further, a positive type photoresist film 44 is formed by screen printing on the upper surface of the metal coating layer 42 formed in the above steps (b) and (c) (step d). The photoresist film 44 is a photosensitive material having a characteristic that it is decomposed by light irradiation and becomes soluble in a developing solution and is removed from the substrate surface during development.

Next, a positive type photomask 45 in which a desired electrode shape pattern (wiring pattern image) is opaquely formed.
Is disposed above the photoresist film 44 and is irradiated with ultraviolet rays (indicated by an arrow in FIG. 3), and then the portion of the photoresist film 44 irradiated with ultraviolet rays is dissolved and removed by a solvent (step e). . The electrode shape pattern is determined by the type of liquid crystal display element that is the final product, and as an example, a pattern in which the portion of the transparent conductive film that becomes the liquid crystal display electrode is the shape of the common electrode or the shape of the segment electrode is used. There is a certain pattern. The photomask 45
The portion corresponding to the desired electrode-shaped pattern formed in (3) remains because the ultraviolet rays are cut and remains, but the portions other than the pattern are in a state where the photoresist film is dissolved and removed by the action of the ultraviolet rays.

The transparent substrate 40 obtained as described above, in which the photoresist film 44 remains in the desired electrode pattern, is further immersed in an etching solution for metal to remove the photoresist film 44. The metal coating layer 42 on a portion (a portion other than the electrode shape pattern) is removed (step f). The metal etching solution used here may be appropriately selected depending on the type of the metal film used.

After that, the transparent substrate 40 is dipped in an etching solution for a transparent conductive film to remove the transparent conductive film 41 in the portion where the photoresist film 44 is removed to form a transparent conductive film having an electrode-shaped pattern ( Step g). The etching solution for the transparent conductive film used here may be appropriately selected and used according to the type of the transparent conductive film.

Finally, the photoresist film 44 remaining on the surface of the surface layer is dipped in a resist stripping solution and removed to obtain the liquid crystal display device substrate of the present invention (step h). The resist stripping solution used in this step may be a known one corresponding to the photoresist film.

Next, the preparation of the liquid crystal display element substrate by the method 2 will be described with reference to FIG. In addition, in the figure, AA line and BB mean the same thing as FIG.

In preparing the liquid crystal display element substrate of the present invention by the method 2, first, the transparent conductive film layer 41 is formed on the transparent substrate 40 (step a). The transparent substrate 40 and the transparent conductive film layer 41 used here can be the same as those described in the method 1, and the transparent conductive film layer 41 can be formed by the same method.

Next, the metal film layer 42 is formed on the transparent conductive film layer 41 (step b). The formation of the metal coating layer 42 can also be performed by the same method as described in the method 1, but when the transparent substrate 40 is a transparent polymer film such as PET or PC, it is preferable to use the metal resinate paste. Since it is impossible from the viewpoint of the above, it is preferable to use other means such as vapor deposition, sputtering and chemical plating.

On the transparent substrate 40 sequentially coated with the transparent conductive film layer 41 and the metal film layer 42 as described above,
Further, a photoresist film 44 is formed (step c).

On the transparent substrate 40 having the photoresist film 44 formed thereon, a positive type photomask 45 on which a desired electrode shape pattern (wiring pattern image) is formed is arranged above, and then ultraviolet rays (indicated by an arrow in the figure). (Shown), and then the portion of the photoresist film 44 exposed to ultraviolet rays is dissolved and removed by a solvent (step d).

Thereafter, the metal film 42 and the transparent conductive film 41 on the remaining photoresist film 44 other than the electrode pattern are removed by etching (step e). The etching agent used here can be appropriately selected according to the types of the metal film and the transparent conductive film used, and the etching may be performed simultaneously or sequentially. When a copper film is used as the metal film and ITO is used as the transparent conductive film, ADEKA CHEMICA ITO is an example of an etching agent that can be used to simultaneously etch both of them.
-400 (made by Asahi Denka Co., Ltd.) etc. can be mentioned.

Further, the photoresist film 44 remaining on the uppermost part is removed from the transparent substrate 40 on which the desired electrode shape is formed by a resist stripping solution (step f). As this resist stripping solution, one corresponding to the photoresist film 44 may be used.

Again, the connecting electrode portion and the sealing portion (16
And a portion 39), a photoresist film 40 is formed,
The metal film layer of the liquid crystal display electrode portion (2 portion) is peeled off (step g). The etching agent used here does not peel off the transparent conductive film, and may be selected appropriately as one that peels off the metal film. However, similar to the above, when the metal film is a copper film and the transparent conductive film is ITO, only copper is used. Adeka Chemika AN-8, Adeka Chemika CE-1505 (both manufactured by Asahi Denka Co., Ltd.) and the like may be used for peeling.

Finally, the photoresist film 40 is peeled off,
The metal film on the portion to be the connection electrode is exposed to obtain the liquid crystal display element substrate of the present invention (step h).

In the above description using FIGS. 3 and 4,
An example of forming the metal electrode coating 42 up to the connection electrode portion and the sealing portion is shown, but the metal electrode coating 42 is formed only on the connection electrode portion 16 exposed on the surface on the right side of the line AA. However, there is no practical problem. Further, in the above manufacturing method, the case where the pattern formation is performed by using the positive type photoresist film and the positive type photomask has been described, but the combination of the negative type photoresist film and the negative type photomask may also be used. Of course, it is possible to form a pattern.

By doing so, the liquid crystal display element substrate of the present invention is manufactured, and the liquid crystal display element substrate is
It is used in the manufacture of liquid crystal display devices.

The liquid crystal display device is manufactured by forming at least two substrates for liquid crystal display device of the present invention by using a sealing member, with the transparent conductive film sides facing each other while keeping a constant gap, to form a liquid crystal cell body. This is performed by enclosing a liquid crystal substance in this liquid crystal cell body.

This liquid crystal display device is manufactured according to a conventional method, and generally, the liquid crystal display device substrate is subjected to alignment treatment to obtain a liquid crystal cell body. The liquid crystal substance may be enclosed by a known method. Further, it goes without saying that a polarizing plate, a light reflecting plate and the like can be arranged depending on the purpose of use of the liquid crystal display element.

Next, an example of the liquid crystal display element according to the present invention will be described in more detail with reference to the drawings. FIG. 1 is a sectional view of a liquid crystal display element according to the present invention, and FIG. 2 is a plan view showing an example of a wiring pattern of the liquid crystal display element.

The liquid crystal display element 21 of the embodiment shown in FIG.
COG type liquid crystal display device, one lower transparent substrate 24
The liquid crystal display section 22 is formed on substantially the entire surface of a, and the electronic component mounting section 23 is formed on a peripheral portion of the liquid crystal display section 22 (hereinafter, referred to as a frame section 31).

The liquid crystal display section 22 includes a lower transparent substrate 24.
The common electrode 25 and the segment electrode 26 are provided on the inner surfaces of the a (for example, glass substrate) and the upper transparent substrate 24b (for example, glass substrate) facing each other. The common electrode 25 and the segment electrode 26 are covered with alignment films 29a and 29b, and the liquid crystal substance 27 is provided between the facing alignment films 29a and 29b.
Are filled, and the periphery thereof is sealed by the sealing member 28. The electronic component mounting part 23 is a lower glass substrate 24a.
The ITO similar to the common electrode 25 and the segment electrode 26 is formed on the frame portion 31 of the lower glass substrate 24a, which is larger than the upper glass substrate 24b in one direction.
A wiring pattern is formed by the connection electrode portion 36 formed in 1. and the metal film 35 covering the connection electrode portion 36. In addition, a drive IC 33 for driving and controlling the liquid crystal display unit 22 and a cable 34 for exchanging signals from the outside are connected to the wiring pattern.

The common electrodes 25 and the segment electrodes 26 formed on the lower glass substrate 24a and the upper glass substrate 24b are formed in a matrix, as will be described later, and constitute a large number of display pixels. The common electrode 25 and the segment electrode 26 are connected to the drive IC 33 mounted on the frame portion 31 through the connection electrode portion 36.

The connection electrode portion 36 has the metal electrode coating 35 formed on the entire surface thereof, and the connection electrode portion 36 is formed.
Is not exposed directly, the connection electrode 36
It can prevent corrosion and oxidation and improve stability.

The common electrode 25 of one liquid crystal display portion 22
And the segment electrode 26 includes alignment films 29a and 29b.
Since it is covered with and is sealed by the sealing member 28, corrosion or the like is unlikely to occur. Since corrosion may occur from the gap of the portion where the sealing member 28 is applied, it is preferable to form the metal electrode coating film 35 including the sealing portion.

Further, the liquid crystal display element 2 of the embodiment shown in FIG.
1 has a wiring pattern as shown in FIG. The liquid crystal display element 21 shown here is one in which a large number of display pixels 32 are formed by arranging the common electrodes 25 and the segment electrodes 26 shown in FIG. 1 in a matrix.
A connection electrode 36 covered with a metal electrode coating 35 is formed between each of the common electrodes 25 and a driving IC 33 that controls driving of the segment electrodes 26. The common electrode 25
The segment electrodes 26 are both made of ITO,
Since all of the connection electrodes 36 exposed on the frame portion 31 and the connection electrodes 36a hanging on the portion sealed by the sealing member 28 are covered with the metal electrode coating 35, even if they are exposed to the outside air, they are corroded or oxidized. Can be suppressed. Therefore, as compared with the connection electrode portion 16 in which the conventional ITO film is exposed as shown in FIGS. 5 and 6, the inter-electrode distance W2 is 20 μm.
It becomes possible to form it by narrowing it to a certain degree.

Further, when a polymer film is used as the transparent substrate, the transparent conductive film alone may be scratched when the surface is rubbed or may be broken in some cases. If the part that will be the connection electrode is covered with a metal film according to, the strength of this part increases,
Problems such as wire breakage no longer occur. As a result, stable liquid crystal display can be expected, and the yield in the manufacturing process is also improved.

[0054]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

Example 1 As a substrate, 0.4 which is often used for liquid crystal panels
An ITO film was deposited on the tBLC glass (Nippon Electric Glass Co., Ltd.) by a sputtering method. The sheet resistance of the substrate on which the ITO film is deposited is 100Ω and the transmittance is 88%.
Met. Gold paste (A1086-12Y; Seishin Trading Co., Ltd.) was screen-printed on a portion of this product that did not cover the display. Printing plate by screen printing is SUS300
Mesh cloth tension, tension tension etc. is 1
The weight was 0 kg, and the gold paste used was in the range of 20,000 cps to 50,000 cps. Next, the screen-printed product was heated and dried on a hot plate at 140 ° C.
The drying time was controlled with 30 seconds as a guide. By printing and drying under these conditions, a gold paste film having a film thickness of 10 to 13 μm was obtained. After confirming the printing amount, baking furnace (3 manufactured by Sanken Scientific Co., Ltd.
K-70P-HP) to a peak temperature of 500 ° C. After holding at the peak temperature for 1 hour, the temperature was lowered to the greenhouse over 2 hours. The baked gold thin film is 0.2
It was confirmed that there was no defect such as pinholes, and that there was no peeling in a Cellotape (registered trademark) peeling test after cross-cutting at 1 mm pitch in four divisions.

After the gold film was formed, washing and drying were performed in the steps of alkali washing, hot water washing, water washing (twice), warm pure water washing, and drying in order to remove dust attached during firing. After that, a photoresist (Nagase positive resist 3200) is formed on the gold thin film.
Was coated with a roll coater, and after drying, a film thickness of 1.5 μm was confirmed.

Using a photomask having a desired shape and an ultraviolet exposure device, write a pattern on the photoresist film,
The exposed portion was removed by developing with an alkaline solution. Next, after the photoresist film was post-baked at 180 ° C. for 30 minutes, it was immersed in a gold etchant of a mixed solution of iodine and potassium iodide (2: 1) for 60 seconds to remove only the gold film on the portion where the photoresist film was removed. Etched. Then 50%
The ITO film was removed by immersing in a hydrochloric acid aqueous solution for 3 minutes to remove the photoresist film.

Further, 1% in 10% sodium hydroxide aqueous solution
By immersing for 0 minutes, the photoresist film in the unexposed portion was removed, and a substrate in which the surface of the exposed portion of ITO was covered with gold was obtained. The obtained substrate was then subjected to an alignment film attaching step of a normal liquid crystal panel step to obtain a final liquid crystal element.

[0059]

As described above, in the liquid crystal display device manufactured by using the substrate for liquid crystal display device according to the present invention, the connection electrodes exposed on the substrate are covered with the metal film. Even in an electronic component mounting portion that is easily exposed to the outside air, corrosion or oxidation that causes defective conduction does not occur and the electronic component mounting portion can be used in a stable state for a long period of time.

Further, since there is no short circuit due to corrosion, the width between the connection electrodes can be narrowed and more wiring patterns can be formed. Therefore, the space around the liquid crystal display section can be saved, and the entire liquid crystal display element can be made smaller and thinner.

Furthermore, the connection electrode exposed on the glass substrate, the common electrode and the segment electrode hanging on the sealing member of the liquid crystal display section are covered with the metal film, so that the sealing portion is included. Since a perfect corrosion prevention effect is obtained and gold, which is the most conductive metal among the metals, is used as a film for covering the connection electrode, the corrosion prevention effect is further enhanced and good conductivity with a low electric resistance value is obtained. can get.

On the other hand, in the liquid crystal display element manufactured by using the substrate for liquid crystal display element such as transparent polymer film, the strength of the connecting electrode portion is improved, so that even if the surface is rubbed, a disconnection or the like occurs. It is possible to obtain a stable liquid crystal display without the above problem.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a liquid crystal display element according to the present invention.

FIG. 2 is a plan view showing an example of a wiring pattern of the liquid crystal display element of FIG.

FIG. 3 is a process chart showing an example of a method for forming a wiring pattern of the liquid crystal display element.

FIG. 4 is a process drawing showing another example of the method for forming a wiring pattern of the liquid crystal display element.

FIG. 5 is a cross-sectional view of a conventional liquid crystal display element.

6 is a plan view showing an example of a wiring pattern of the liquid crystal display element of FIG.

[Explanation of symbols]

1 ... Liquid crystal display element 24 ... Transparent glass substrate 2 ... Liquid crystal display portion 24a ... Lower glass substrate 3 ... Electronic component mounting portion 24b ... Upper glass substrate 4 ... Glass substrate 25 ... Common electrode 4a. Lower glass substrate 26 Segment electrode 4b Upper glass substrate 27 Liquid crystal substance 5 Common electrode 28 Sealing member 6 Segment electrode 29 Alignment film 7 Liquid crystal substance 31 Frame part 8 ... Sealing member 33 ... Drive IC 11 ... Frame part 34 ... Cable 12 ... Display pixel 35 ... Metal electrode coating 13 ... Drive IC 36 ... Connection electrode part 14 ... Cable 40 ... Transparent substrate 15 Metal electrode coating 41 Transparent conductive film layer 16 Connection electrode portion 42 Metal coating layer 21 Liquid crystal示素Ko 43 ... metal resinate paste layer 22 ... ... liquid crystal display unit 44 ... ... photoresist layer 23 ... ... electronic component mounting portion 45 ... ... photomask 46 ... evaporation resin content than on

Claims (16)

[Claims] 1. A substrate for a liquid crystal display element, wherein a transparent conductive film having a desired electrode shape is formed on the surface of the transparent substrate, and a portion of the transparent conductive film to be a connection electrode is covered with a metal film. 2. The substrate for a liquid crystal display device according to claim 1, wherein the transparent substrate is a glass substrate or a transparent polymer film substrate. 3. The substrate for a liquid crystal display element according to claim 1, wherein the transparent conductive film is a tin oxide film, an indium oxide film or a tin oxide-indium oxide film. 4. The substrate for a liquid crystal display element according to claim 1, wherein a portion of the transparent conductive film to be a liquid crystal display electrode has a shape of a common electrode or a segment electrode. 5. A transparent conductive film is formed on a transparent substrate, and then the transparent conductive film is etched into a desired electrode shape to form a transparent conductive film, and a portion of the transparent conductive film to be a connection electrode is a metal film. A method for manufacturing a substrate for a liquid crystal display element, which is characterized by coating with. 6. A transparent conductive film is formed on a transparent substrate, the transparent conductive film is then covered with a metal film, and then the transparent conductive film layer and the metal film layer are etched into a desired electrode shape to be coated with a metal. A method for manufacturing a substrate for a liquid crystal display element, which comprises forming a transparent conductive film, and finally peeling off a metal film layer in a portion of the transparent conductive film to be a liquid crystal display electrode. 7. A transparent conductive film having a desired electrode shape is formed on at least a surface of the transparent conductive film. The transparent conductive film includes two transparent substrates each having a connection electrode portion covered with a metal film, and a sealing member. The liquid crystal display element is characterized in that a transparent substrate is formed with a liquid crystal cell body facing each other with the transparent conductive film side facing each other while keeping a constant space by the sealing member, and a liquid crystal substance is sealed in the liquid crystal cell body. 8. The liquid crystal display element according to claim 7, wherein the connection electrode portion of the transparent conductive film is a portion exposed on the transparent substrate or a portion sealed with the portion by a sealing member. 9. The liquid crystal display device according to claim 7, wherein the transparent substrate is a glass substrate or a transparent polymer film substrate. 10. The liquid crystal display device according to claim 7, wherein the transparent conductive film is a tin oxide film, an indium oxide film, or a tin oxide-indium oxide film. 11. The liquid crystal display electrode portion of one of the two transparent conductive films is a common electrode, and the liquid crystal display electrode portion of the other is a segment electrode. Liquid crystal display device. 12. The glass substrate according to claim 7, further comprising an electronic component mounting portion formed at a connecting electrode portion at one end portion, and an electronic component for driving a liquid crystal mounted on the electronic component mounting portion. Item 11. The liquid crystal display device according to any one of items 11. 13. The liquid crystal display device according to claim 7, wherein the metal film is a metal film having high conductivity and oxidation resistance. 14. The metal coating having high conductivity and oxidation resistance is a coating of a metal selected from gold, nickel, chromium or platinum or a coating of an alloy of the metals.
Item 3. A liquid crystal display element. 15. The liquid crystal display device according to claim 7, wherein the metal film is a metal film having high conductivity and flexibility. 16. The liquid crystal display element according to claim 15, wherein the metal film having high conductivity and flexibility is a film of a metal selected from silver, copper and tin or a film of an alloy of the metals.