JP2003041129A5 - - Google Patents

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Publication number
JP2003041129A5
JP2003041129A5 JP2001318759A JP2001318759A JP2003041129A5 JP 2003041129 A5 JP2003041129 A5 JP 2003041129A5 JP 2001318759 A JP2001318759 A JP 2001318759A JP 2001318759 A JP2001318759 A JP 2001318759A JP 2003041129 A5 JP2003041129 A5 JP 2003041129A5
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JP
Japan
Prior art keywords
filler
volume
thermoplastic resin
tablets agent
agent according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2001318759A
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Japanese (ja)
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JP3948240B2 (en
JP2003041129A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2001318759A external-priority patent/JP3948240B2/en
Priority to JP2001318759A priority Critical patent/JP3948240B2/en
Priority to CNB028024435A priority patent/CN100429059C/en
Priority to EP02726450.6A priority patent/EP1389514B2/en
Priority to KR1020037000969A priority patent/KR100901730B1/en
Priority to PCT/JP2002/004911 priority patent/WO2002094529A1/en
Priority to US10/432,390 priority patent/US7514144B2/en
Publication of JP2003041129A publication Critical patent/JP2003041129A/en
Publication of JP2003041129A5 publication Critical patent/JP2003041129A5/ja
Publication of JP3948240B2 publication Critical patent/JP3948240B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (13)

熱可塑性樹脂とフィラーの合計量100重量部に対し、25℃における粘度が1〜5000mPa・sの液状有機化合物を0.1〜30重量部配合してなる錠剤。 Heat to the thermoplastic resin and 100 parts by weight of the total amount of the filler, tablets agent a viscosity at 25 ° C. is then blended 0.1 to 30 parts by weight of a liquid organic compound of 1~5000mPa · s. 熱可塑性樹脂とフィラーの組成比が両者の合計100容量%に対して熱可塑性樹脂1〜50容量%、フィラー99〜50容量%である請求項1記載の錠剤。 Tablets agent according to claim 1 thermoplastic resin 1-50% by volume, a filler 99 to 50 volume% per 100 volume% of the composition ratio of the thermoplastic resin and filler both. 熱可塑性樹脂とフィラーの組成比が両者の合計100容量%に対して熱可塑性樹脂1〜40容量%、フィラー99〜60容量%である請求項1または2記載の錠剤。 Tablets agent according to claim 1 or 2, wherein the thermoplastic resin 1 to 40% by volume, a filler 99 to 60 volume% per 100 volume% of the composition ratio of the thermoplastic resin and filler both. 熱可塑性樹脂とフィラーの組成比が両者の合計100容量%に対して熱可塑性樹脂3容量%以上15容量%未満、フィラー97容量%以下85容量%超である請求項1〜3いずれか記載の錠剤。 The composition ratio of the thermoplastic resin and the filler is 3% by volume to less than 15% by volume and 97% by volume or less of the filler and more than 85% by volume with respect to 100% by volume in total. tablets agent. フィラーの比重が3.5以下である請求項1〜4いずれか記載の錠剤。 Tablets agent according to any one of claims 1 to 4 specific gravity of the filler is 3.5 or less. フィラーが繊維状、板状または鱗片状である請求項1〜5いずれか記載の錠剤。 Tablets agent according to any claims 1 to 5 filler fibrous, a plate-like or scaly. 熱可塑性樹脂、フィラーおよび液状有機化合物を圧縮成形してなるものである請求項1〜6のいずれか記載の錠剤。 Thermoplastic resins, tablets agent according to any of claims 1 to 6 is made by compression molding a filler and a liquid organic compound. 熱可塑性樹脂、フィラーおよび液状有機化合物を圧縮成形して錠剤化することを特徴とする請求項1〜7のいずれか記載の錠剤の製造方法。Method for producing a thermoplastic resin, tablets agent according to any one of claims 1 to 7, a filler and a liquid organic compound compression molded to characterized by tableting. 打錠機を用い、錠剤化することを特徴とする請求項8記載の製造方法。9. The production method according to claim 8, wherein tableting is performed using a tableting machine. 熱可塑性樹脂が圧縮成形前に粉末であり、その数平均粒子径が1000μm以下であることを特徴とする請求項8または9記載の製造方法。The method according to claim 8 or 9, wherein the thermoplastic resin is powder before compression molding, and the number average particle diameter is 1000 µm or less. 請求項1〜7のいずれか記載の錠剤を溶融成形してなる成形品。Melt-molding molded article formed of the tablet agent of any one of claims 1 to 7. 請求項1〜7のいずれか記載の錠剤を射出成形、射出圧縮成形あるいはプレス成形してなる自動車部品、電気・電子部品あるいは熱機器部品に用いられる成形品。Injection molding the tablet composition according to any one of claims 1 to 7, injection compression molding or press molding automotive parts comprising, a molded article for use in electric and electronic parts or heat equipment parts. 圧縮成形が固相状態で行われるものである請求項7記載の錠剤。The tablet according to claim 7, wherein the compression molding is performed in a solid phase.
JP2001318759A 2001-05-24 2001-10-16 Tablet for melt molding, method for producing the same, and molded product obtained therefrom Expired - Fee Related JP3948240B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001318759A JP3948240B2 (en) 2001-05-24 2001-10-16 Tablet for melt molding, method for producing the same, and molded product obtained therefrom
PCT/JP2002/004911 WO2002094529A1 (en) 2001-05-24 2002-05-21 Tablet, process for producing the same, and molded article obtained therefrom
EP02726450.6A EP1389514B2 (en) 2001-05-24 2002-05-21 Tablet, process for producing the same, and molded article obtained therefrom
KR1020037000969A KR100901730B1 (en) 2001-05-24 2002-05-21 Tablet, process for producing the same, and molded article obtained therefrom
CNB028024435A CN100429059C (en) 2001-05-24 2002-05-21 Tablet, process for producing the same, and molded article obtained therefrom
US10/432,390 US7514144B2 (en) 2001-05-24 2002-05-21 Tablet, process for producing the same, and molded article obtained therefrom

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-156063 2001-05-24
JP2001156063 2001-05-24
JP2001318759A JP3948240B2 (en) 2001-05-24 2001-10-16 Tablet for melt molding, method for producing the same, and molded product obtained therefrom

Publications (3)

Publication Number Publication Date
JP2003041129A JP2003041129A (en) 2003-02-13
JP2003041129A5 true JP2003041129A5 (en) 2005-06-23
JP3948240B2 JP3948240B2 (en) 2007-07-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001318759A Expired - Fee Related JP3948240B2 (en) 2001-05-24 2001-10-16 Tablet for melt molding, method for producing the same, and molded product obtained therefrom

Country Status (1)

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JP (1) JP3948240B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4631272B2 (en) * 2003-11-14 2011-02-16 東レ株式会社 Highly filled resin composition and molded product obtained therefrom
JP4973118B2 (en) * 2006-10-18 2012-07-11 東レ株式会社 Wire coating resin

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