CN1318508C - Injection moulded heat-conductive insulated plastics - Google Patents
Injection moulded heat-conductive insulated plastics Download PDFInfo
- Publication number
- CN1318508C CN1318508C CNB2005101017000A CN200510101700A CN1318508C CN 1318508 C CN1318508 C CN 1318508C CN B2005101017000 A CNB2005101017000 A CN B2005101017000A CN 200510101700 A CN200510101700 A CN 200510101700A CN 1318508 C CN1318508 C CN 1318508C
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- CN
- China
- Prior art keywords
- heat
- conductive
- coupling agent
- injection molding
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 42
- 229920003023 plastic Polymers 0.000 title claims abstract description 42
- 239000007924 injection Substances 0.000 title description 9
- 238000002347 injection Methods 0.000 title description 9
- 239000007822 coupling agent Substances 0.000 claims abstract description 18
- 238000001746 injection moulding Methods 0.000 claims abstract description 15
- 239000000314 lubricant Substances 0.000 claims abstract description 12
- 239000000395 magnesium oxide Substances 0.000 claims description 12
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 12
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 239000011231 conductive filler Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 150000004645 aluminates Chemical class 0.000 claims description 4
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 4
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical group CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- 239000005264 High molar mass liquid crystal Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- -1 ester salt Chemical class 0.000 claims description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000005453 pelletization Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The present invention relates to insulating heat-conductive plastics in injection moulding, which are prepared from 100 parts by weight of plastic basal bodies, 100 to 400 parts by weight of large-grain size heat-conductive dielectric filling of 20 to 500 microns, 0 to 300 parts by weight of small-grain size heat-conductive dielectric filling of 0.5 to 5 microns, 0 to 5 parts by weight of coupling agents, and 0 to 5 parts by weight of lubricating agents. The plastics prepared with the prescription have the advantages of high heat-conductive performance and favorable processing performance.
Description
Technical field
The present invention relates to a kind of injection molding moulded heat-conductive insulated plastics of conducting heat and dispelling the heat of being used to.
Background technology
Traditional metallic substance in heat radiation industry, because of it is very heavy usually, the machining cost height, the geometrical shape of goods is very limited, and easily is corroded and conducts electricity and substituted by the heat-conducting plastic of forming process easily more and more.
In prior art, the polymeric matrix that uses granulated material such as boron nitride particle to fill is arranged, and the polymeric matrix of laminar filler filling.Wherein with laminar, (5: 1-10: 1) plastics of Tian Chonging have heat conductivility (ZL 99815810.0) preferably to high length-diameter ratio.Yet satisfactory filler is with high costs, and is difficult to obtain.The present invention adopts the market insulating heat-conductive filler of the cheapness of acquisition easily, reaches high thermal conductivity by high fill-ratio, guarantees that by adding lubricant this moulded heat-conductive insulated plastics has the injectable processing characteristics simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of is the injection molding moulded heat-conductive insulated plastics of main stuffing with the macrobead heat conductive filler.
Injection molding moulded heat-conductive insulated plastics of the present invention is made by plastic substrate, filler, coupling agent, lubricant, and the parts by weight consumption of each component is as follows:
100 parts of plastic substrates
The big particle diameter heat conductive insulating of 20-500 micron filler 100-400 part
0.5-5 micron small particle size heat conductive insulating filler 0-300 part
Coupling agent 0-5 part
Lubricant 0-5 part.
Described injection molding is the general manufacture method of plastics.For example comprise the steps:
(1) filler is added in the high-speed mixer;
(2) add coupling agent;
(3) said components is mixed;
(4) add lubricant and plastic substrate, and mix;
By the forcing machine extruding pelletization, make injection molding moulded heat-conductive insulated plastics.
Preferred version of the present invention is as follows:
Described big particle diameter insulating heat-conductive filler 200-300 part, small particle size insulating heat-conductive filler 50-200 part, coupling agent 0.1-2 part, lubricant 0.1-2 part.
Described plastic substrate is one or more mixtures among polyphenylene sulfide (PPS), PA, PBT, PP or the ABS.
Described heat conductive insulating filler is magnesium oxide (MgO), aluminum oxide (Al
2O
3), one or more mixtures in the silicon carbide (SiC).
Described coupling agent is silane coupling agent, titanate coupling agent or aluminate coupling agent.
Described lubricant is stearic acid amide, hard acid ester salt, low-molecular(weight)polymer liquid crystal, boron nitride (BN) or molybdenumdisulphide (MoS
2).
The present invention compared with prior art has following advantage:
(1) adopt oarse-grained heat conduction powder to increase loading level, composite fine particle heat conduction powder increases the UNICOM of heat conduction network and adds the certain injectable flowability of lubricant assurance.
(2) have high heat-conducting property and good processing properties, cheap.
Embodiment
Embodiment 1
Composition of raw materials (kilogram)
Polyphenylene sulfide 100
20 microns magnesium oxide 400
5 micrometer aluminas 300
Silane coupling agent 5
Stearic acid amide 5.
Add magnesium oxide and aluminum oxide in high-speed mixer, add silane coupling agent and stearic acid amide then, then high-speed mixing is even.Add polyphenylene sulfide again, after mixing, be added in the twin screw extruder, at 280 ℃ of left and right sides extruding pelletizations, get the injection moldable moulded heat-conductive insulated plastics, injection pressure is 10MPa, and be 30 seconds inject time.
These plastics are made the heat-conducting plastic product by injection molding, and thermal diffusivity is during 50 ℃ of this heat-conducting plastic products: 0.757mm
2/ s is converted into thermal conductivity and is: 1.967W/mK.Room temperature lower volume resistivity is the 1.52E+13 ohmcm.Tensile strength is: 41.4MPa, and flexural strength: 70.61MPa, modulus in flexure: 6.62GPa, notched Izod impact strength is: 3.3KJ/m
2, non-notched Izod impact strength: 5.9KJ/m
2
Embodiment 2
Composition of raw materials (kilogram)
PP 50
ABS 50
500 microns magnesium oxide 100
0.5 micron magnesium oxide 200
Titanate coupling agent 2
Molybdenumdisulphide 2.
Add magnesium oxide in high-speed mixer, add titanate coupling agent then, then high-speed mixing is even.Add molybdenumdisulphide 50 grams, PP and ABS again, after mixing, be added in the twin screw extruder, at 280 ℃ of left and right sides extruding pelletizations, get the injection moldable moulded heat-conductive insulated plastics, injection pressure is 100MPa, and be 1 second inject time.
This injection-moulding plastic is got the heat-conducting plastic product.Thermal diffusivity is during 50 ℃ of this heat-conducting plastic products: 1.092mm
2/ s is converted into thermal conductivity and is: 2.838W/mK.
Embodiment 3
Composition of raw materials (kilogram)
PA 100
200 microns magnesium oxide 200
1.5 micron silicon carbide 50
Aluminate coupling agent 0.1
Magnesium stearate 0.1
Add magnesium oxide and silicon carbide in high-speed mixer, add aluminate coupling agent then, then high-speed mixing is even.Add PA again, after remix is even, be added in the twin screw extruder,, get the injection moldable moulded heat-conductive insulated plastics at 280～300 ℃ of extruding pelletizations.Injection pressure is 50MPa, and be 15 seconds inject time.
These plastics are injected in after 300 ℃ of plasticizings in 150 ℃ the mould the heat-conducting plastic product.Thermal diffusivity is during 50 ℃ of this heat-conducting plastic products: 0.994mm
2/ s is converted into thermal conductivity and is: 2.480W/mK.Room temperature lower volume resistivity is the 9.08E+12 ohmcm.
Embodiment 4
Composition of raw materials (kilogram)
PBT 50
PP 50
200 microns magnesium oxide 300
Add magnesium oxide in high-speed mixer, then high-speed mixing is even.Add PP and PBT again, after remix is even, be added in the twin screw extruder,, get the injection moldable moulded heat-conductive insulated plastics at 280～300 ℃ of extruding pelletizations.Injection pressure is 70MPa, and be 5 seconds inject time.
These plastics are injected in after 300 ℃ of plasticizings in 150 ℃ the mould the heat-conducting plastic product.Thermal diffusivity is during 50 ℃ of this heat-conducting plastic products: 1.322mm
2/ s is converted into thermal conductivity and is: 3.469W/mK.Room temperature lower volume resistivity is the 8.13E+12 ohmcm.
Claims (6)
1, a kind of injection molding moulded heat-conductive insulated plastics is characterized in that being made by plastic substrate, filler, coupling agent, lubricant, and the parts by weight consumption of each component is as follows:
100 parts of plastic substrates
The big particle diameter insulating heat-conductive of 20-500 micron filler 100-400 part
0.5-5 micron small particle size insulating heat-conductive filler 0-300 part
Coupling agent 0-5 part
Lubricant 0-5 part.
2,, it is characterized in that described big particle diameter insulating heat-conductive filler 200-300 part, small particle size insulating heat-conductive filler 50-200 part, coupling agent 0.1-2 part, lubricant 0.1-2 part according to the described injection molding moulded heat-conductive insulated plastics of claim 1.
3,, it is characterized in that described plastic substrate is one or more mixtures among polyphenylene sulfide, PA, PBT, PP or the ABS according to claim 1 or 2 described injection molding moulded heat-conductive insulated plastics.
4,, it is characterized in that described filler is one or more mixtures in magnesium oxide, aluminum oxide, the silicon carbide according to the described injection molding moulded heat-conductive insulated plastics of claim 3.
5,, it is characterized in that described coupling agent is silane coupling agent, titanate coupling agent or aluminate coupling agent according to the described injection molding moulded heat-conductive insulated plastics of claim 4.
6,, it is characterized in that described lubricant is stearic acid amide, hard acid ester salt, low-molecular(weight)polymer liquid crystal, boron nitride or molybdenumdisulphide according to the described injection molding moulded heat-conductive insulated plastics of claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101017000A CN1318508C (en) | 2005-11-25 | 2005-11-25 | Injection moulded heat-conductive insulated plastics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101017000A CN1318508C (en) | 2005-11-25 | 2005-11-25 | Injection moulded heat-conductive insulated plastics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1775860A CN1775860A (en) | 2006-05-24 |
| CN1318508C true CN1318508C (en) | 2007-05-30 |
Family
ID=36765588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101017000A Expired - Fee Related CN1318508C (en) | 2005-11-25 | 2005-11-25 | Injection moulded heat-conductive insulated plastics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1318508C (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5297639B2 (en) * | 2007-11-28 | 2013-09-25 | ポリプラスチックス株式会社 | Thermally conductive resin composition |
| MX340497B (en) * | 2010-10-08 | 2016-07-11 | Mitsui Chemicals Inc | Solar cell sealing material, and solar cell module. |
| CN102070899B (en) * | 2010-12-30 | 2012-11-07 | 广东银禧科技股份有限公司 | Insulating and heat-conducting polyamide composite material and preparation method thereof |
| CN102250481A (en) * | 2011-05-25 | 2011-11-23 | 上海树普新材料科技有限公司 | Plastic with high thermal conductivity and preparation method thereof |
| KR101437880B1 (en) * | 2011-12-30 | 2014-09-12 | 제일모직주식회사 | Thermal conductive polyphenylene sulfide resin composition having a good surface gloss and article using the same |
| CN102617927A (en) * | 2012-02-17 | 2012-08-01 | 许永信 | New material for reducing LED junction temperature and preparation method thereof |
| CN102649328B (en) * | 2012-05-14 | 2015-07-15 | 陈建伟 | Metal wire mesh reinforced heat-conducting plastic with high strength, high corrosion resistance and high heat conductivity |
| CN102719099B (en) * | 2012-06-08 | 2014-08-20 | 金发科技股份有限公司 | Thermal conductive molding compound and preparation method thereof |
| CN102977457B (en) * | 2012-12-10 | 2015-01-07 | 云南昆钢新型复合材料开发有限公司 | Anti-sticking isolating membrane of polypropylene laminated metal composite material |
| CN103087415B (en) * | 2013-01-31 | 2015-06-10 | 合肥工业大学 | Thermally conductive and insulating composite material and preparation method thereof |
| CN103602060B (en) * | 2013-11-06 | 2016-08-17 | 上海大学 | Heat conduction abrasion-proof insulating nylon 6 composite material and preparation method thereof |
| CN104387762A (en) * | 2014-11-18 | 2015-03-04 | 上海大学 | Polyamide/polypropylene alloy heat-conducting composite material and preparation method thereof |
| CN107434879A (en) * | 2017-08-30 | 2017-12-05 | 武汉光盛电气有限公司 | A kind of damp-proof PP/ABS heat conductive insulating nano composite materials and preparation method thereof |
| CN107892773A (en) * | 2017-11-24 | 2018-04-10 | 广东威林工程塑料股份有限公司 | A kind of weather-proof heat conduction PP PE PET composite materials and preparation method thereof |
| CN109161175A (en) * | 2018-09-28 | 2019-01-08 | 珠海格力电器股份有限公司 | A kind of alloy composite materials of high thermal conductivity high fire-retardance and preparation method thereof and battery case |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002188005A (en) * | 2000-12-20 | 2002-07-05 | Sumitomo Bakelite Co Ltd | Polyphenylene sulfide resin composition |
| JP2003096298A (en) * | 2001-09-25 | 2003-04-03 | Toray Ind Inc | Polyphenylene sulfide resin composition and condenser part |
| CN1464008A (en) * | 2002-06-07 | 2003-12-31 | 四川大学 | Nano particle polyarylthio-ether composite and method for making same |
| CN1694941A (en) * | 2002-09-03 | 2005-11-09 | 索尔维先进聚合物有限责任公司 | Thermally conductive liquid crystalline polymer compositions and articles formed therefrom |
-
2005
- 2005-11-25 CN CNB2005101017000A patent/CN1318508C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002188005A (en) * | 2000-12-20 | 2002-07-05 | Sumitomo Bakelite Co Ltd | Polyphenylene sulfide resin composition |
| JP2003096298A (en) * | 2001-09-25 | 2003-04-03 | Toray Ind Inc | Polyphenylene sulfide resin composition and condenser part |
| CN1464008A (en) * | 2002-06-07 | 2003-12-31 | 四川大学 | Nano particle polyarylthio-ether composite and method for making same |
| CN1694941A (en) * | 2002-09-03 | 2005-11-09 | 索尔维先进聚合物有限责任公司 | Thermally conductive liquid crystalline polymer compositions and articles formed therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1775860A (en) | 2006-05-24 |
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Address after: No. five, No. 381, Tianhe District mountain road, Guangdong, Guangzhou Province, China: 510640 Co-patentee after: Guangzhou Keyuan new materials Co.,Ltd. Patentee after: SOUTH CHINA University OF TECHNOLOGY Address before: No. five, No. 381, Tianhe District mountain road, Guangdong, Guangzhou Province, China: 510640 Co-patentee before: Guangzhou Huadu Keyuan Enterprise Co.,Ltd. Patentee before: South China University of Technology |
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Address after: Guangdong Province, Guangzhou City, Huadu District Shiling Town Qi Ling Street No. 3 first industrial park Patentee after: GUANGZHOU KEYUAN INNOVATIVE MATERIALS Co.,Ltd. Address before: Guangdong Province, Guangzhou City, Huadu District Shiling Town Qi Ling Street No. 3 first industrial park Patentee before: Guangzhou Keyuan new materials Co.,Ltd. |
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Granted publication date: 20070530 Termination date: 20161125 |