JP2003040447A - Substrate carrying device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate carrying device and method capable of surely carrying even thin materials to a prescribed direction, dispensing with a sliding part, between a substrate and a carrying mechanism, and having a short carrying cycle time. SOLUTION: This substrate carrying device is provided with substrate retaining chucks A1 and A2, substrate carrying chucks B1, B2, and B3, and chuck control means for controlling these operations. The both chucks can take two types of states of a retaining state retaining the both ends of the substrate 1 and a released state of not retaining them. The chuck control means alternately take a working state of retaining one of the both chucks and releasing the other and its reverse working state, and controls the substrate carrying chucks B1, B2, and B3 to move frontward in the carrying direction under their retained state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device and a substrate transfer method used in a manufacturing process of a flat panel display substrate, a printed wiring board and the like. In particular, the present invention relates to a substrate transfer device and a substrate transfer method used in a liquid processing apparatus or a heat processing apparatus for a flexible substrate made of resin or film.

[0002]

2. Description of the Related Art Conventionally, as a substrate transfer device for transferring a thin substrate, there has been one having a structure as shown in FIGS. 17 and 18, for example. In this substrate transfer device, the end support rollers 32 for supporting the substrate from below at both ends in the direction perpendicular to the transfer direction of the substrate 31 are fixed to the roller shaft 34, so that the end portions of the substrate 31 can be moved along the transfer direction. They are arranged at regular intervals. In addition, an intermediate support roller 33 for supporting the central portion of the substrate 31 is provided in the middle between the pair of end support rollers 32 arranged on the same roller shaft 34. Such a substrate transfer device has been used to transfer substrate materials such as glass, ceramics and plastics.

However, for example, when a glass substrate having a thickness of 0.5 mm or less, or a flexible substrate made of plastic, film, or the like is to be transported, there is a problem that the straightness in the transport direction of the substrate is lowered due to the deflection of the substrate due to its own weight. there were. As a countermeasure, it is general to dispose the above-mentioned intermediate support roller 33, but the flexibility of the substrate is excellent, and the intermediate support roller 33 may not be sufficiently improved.

Further, the roller shaft 34 arranged along the conveying direction.
Since the substrate tends to fall between the roller shafts 34 when the arrangement interval of the roller shafts is wide, the distance between the roller shafts 34 must be narrowed to increase the number as the thickness of the substrate to be conveyed becomes thinner. did not become. In this method, the direction of travel of the substrate is controlled by bringing the substrate end face into contact with the flange 35 provided on the end support roller 32, so that the substrate end face rubs against the flange 35, causing problems such as dust generation and substrate loss. It was happening.

[0005]

As a proposal for solving these problems, Japanese Patent Application Laid-Open No. 8-40598 has been proposed.
There is a transport device disclosed in the publication. In this, as shown in FIG. 19, the end portions 22 forming both sides parallel to the traveling direction of the substrate 21 are sandwiched by the sandwiching portion 23, and the sandwiching portion 23 itself is moved by the linear guide 25. However, in this transfer device, the pinching portion 23 that holds the end portion 22 of the substrate 21 at the transfer start point is moved by the linear guide 25, so after the pinch is completed at the transfer end point, the transfer start point is reached. There is a problem that the next substrate 21 cannot be transported unless it is returned. In this transfer device, the longer the distance between the transfer start point and the transfer end point is, the longer the transfer itself and the return after the transfer are. Therefore, the transfer cycle time is lengthened and the production efficiency is reduced.

Further, in the case of this system, it is structurally difficult to perform heating and cooling at the same time as transportation in combination with a hot plate or a cool plate.

Therefore, according to the present invention, even if it is thin, it can be surely conveyed in a desired direction, and there is no sliding portion between the substrate and the conveyance mechanism which causes dust or damage, and It is an object of the present invention to provide a substrate transfer apparatus and a substrate transfer method which have a short cycle time and can easily be used in combination with a hot plate or a cool plate.

[0008]

In order to achieve the above object, a substrate transfer device according to the present invention is a substrate transfer device for transferring a substrate along a transfer direction parallel to the surface of the substrate. A first chuck whose installation position is fixed in the carrying direction, a second chuck which can move along the carrying direction, and an operation for controlling the operations of the first and second chucks. And a chuck control means, wherein the first chuck and the second chuck respectively hold the substrate at both end portions in a direction substantially perpendicular to the transport direction and release state in which the substrate is not held. There are two states,
The chuck control means includes a first working state in which the first chuck is in the holding state and the second chuck is in the released state with respect to the first and second chucks; Alternately, the second chuck is in the holding state and the first chuck is in the released state, and the second chuck is in the second working state, and the second chuck is under the second working state. It is controlled to move forward in the transport direction. By adopting this configuration, the first
The second chuck and the second chuck alternately carry the front portions while securely holding both ends, so that the deflection and deformation due to the weight of the substrate do not pose a problem, and the thin and flexible substrate is used. There is no problem even if there is, it can be transported continuously. Further, even if the transport distance is long, the transport cycle time does not become long, so that the transport can be performed efficiently.

In the above invention, preferably, the first chuck is a first retracting means for moving in a direction away from the substrate and being substantially parallel to the surface of the substrate in the released state, and the first chuck in the released state. A second retracting means for moving in a direction substantially perpendicular to the surface of the substrate and away from the substrate, wherein the second chuck is substantially parallel to the surface of the substrate in the released state and moves away from the substrate. A third retracting means for moving to. By adopting this configuration, the first chuck and the second chuck can be retracted in a direction parallel to the substrate surface and away from the substrate when the substrate is not held, respectively. And the second working state can be smoothly switched. Further, since the first chuck includes the second retracting means that moves in a direction substantially perpendicular to the surface of the substrate and away from the substrate, when the second chuck moves in the transport direction, the first chuck is moved. Can be retracted to a position that does not interfere with the second chuck.

In the above invention, preferably, in the transfer control means, the second chuck holds the first portion of the substrate and the first portion of the substrate while the first chuck holds the first portion of the substrate. Hold a second portion different from the first chuck, and then hold the second portion of the substrate by the second delivery control means for bringing the first chuck into the released state. A second delivery control means for bringing the second chuck into the released state after the first chuck holds the first portion of the substrate in the state. By adopting this configuration, at the time of delivery between the first chuck and the second chuck, the delivery is performed after a time period in which both the first chuck and the second chuck simultaneously hold the substrate. ,
It is possible to carry the substrate without changing the posture of the substrate.

In the above invention, preferably, a heat exchanging means for exchanging heat with the substrate is provided at a position adjacent to a path along which the substrate is to be transported. By adopting this configuration, it is possible to heat or cool while transporting. Moreover, the whole can be stored compactly.

In order to achieve the above object, a substrate transfer method according to the present invention is a substrate transfer method for transferring a substrate along a transfer direction parallel to the surface of the substrate. With regard to the installation position is fixed,
A first chuck that can be in two states, a holding state in which the substrate is held at both ends in a direction substantially perpendicular to the carrying direction, and a released state in which the substrate is not held, and along the carrying direction. The holding state in which the substrate is held at both ends in the direction substantially perpendicular to the carrying direction and the released state in which the substrate is not held.
And a second chuck that can take the following states, a first working state in which the first chuck is in the holding state and the second chuck is in the released state,
Alternately, a second working state in which the second chuck is in the holding state and the first chuck is in the released state is used, and the second chuck holds the second working state under the second working state. Moves forward in the transport direction. By adopting this method, since the first chuck and the second chuck are alternately conveyed while reliably holding both end portions, the deflection and deformation due to the weight of the substrate do not pose a problem, Even a thin and flexible substrate can be continuously transported without any problem. Further, even if the transport distance is long, the transport cycle time does not become long, so that the transport can be performed efficiently.

In the above invention, it is preferable that the first chuck is moved in a released state in a direction substantially parallel to the surface of the substrate and away from the substrate, and the first chuck is moved. A second retracting step of moving in a direction substantially perpendicular to the surface of the substrate in the released state and away from the substrate; and moving the second chuck in the released state substantially parallel to the surface of the substrate and away from the substrate By including the third retracting step of moving in the direction, the first chuck and the second chuck hold the substrates alternately without interfering with each other. By adopting this method, it is possible to retract the first chuck and the second chuck that do not hold the substrate in the direction parallel to the substrate surface and away from the substrate. And the second working state can be smoothly switched. In addition, since the first chuck includes a second retracting step of moving in a direction substantially perpendicular to the surface of the substrate and away from the substrate, when moving the second chuck in the transport direction, the first chuck Can be retracted to a position that does not interfere with the second chuck.

In the above invention, preferably, a second portion different from the first portion of the substrate is attached to the second chuck while the first chuck holds the first portion of the substrate. And then holding the second chuck to hold the second portion of the substrate in the released state, and the second chuck holds the second portion of the substrate to the first chuck. A second delivery step of bringing the second chuck into the released state after holding the first portion of the substrate. By adopting this method, at the time of delivery between the first chuck and the second chuck, the delivery is performed after a time period in which both the first chuck and the second chuck simultaneously hold the substrate. The transfer can be performed without changing the posture of the substrate.

In the above invention, preferably, the substrate is in a state in which a transport member is attached to both ends of the substrate body in a direction substantially perpendicular to the transport direction. By adopting this method, it is possible to avoid directly sandwiching the surface of the substrate, so that it is possible to prevent the substrate from being scratched or chipped. As a result, the entire surface of the substrate can be used. Further, by appropriately selecting the material of the carrying member, the carrying member can have a certain degree of rigidity even if the substrate is flexible, and the substrate can be easily handled.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) (Structure) Referring to FIG. 1, a first embodiment according to the present invention.
The substrate transfer device in FIG. This substrate transfer apparatus is provided with a substrate holding chuck A as a first chuck.
1, A2, and substrate transfer chucks B1, B2, B3 as second chucks.

2 and 3 show the substrate holding chucks A1 and A2 taken out and viewed from the front in the carrying direction. FIG. 2 shows a state in which the end portion 2 of the substrate 1 is held (hereinafter referred to as “holding state”). Substrate holding chuck A1, A2
Includes a substrate holding unit 3, and the substrate holding unit 3 includes substrate holding members 3a and 3b. When holding the substrate 1, the cylinder 11 performs an ascending operation, so that the substrate holding member 3 is held.
b approaches the substrate holding member 3a and the end portion 2 of the substrate 1
To pinch. FIG. 3 shows a state in which the substrate is not held (hereinafter,
It is called "released state". ) Is shown. When the substrate 1 is released, the cylinder 11 performs a descending operation to separate the substrate holding member 3b from the substrate holding member 3a. further,
The substrate holding chucks A1 and A2 include a cylinder 12 as a first retracting unit. The substrate holding chucks A1 and A2 are
The substrate holding part 3 and the cylinder 11 are moved by the cylinder 12.
It can be moved in a direction (parallel to the left and right in FIGS. 2 and 3) that is substantially parallel to the substrate surface and away from the substrate.
Further, the substrate holding chucks A1 and A2 include a cylinder 13 as a second retracting means. Substrate holding chuck A1,
A2 can vertically move the entire substrate including the substrate holder 3 and the cylinders 11 and 12 by the cylinder 13. The second retracting means causes the substrate holding chucks A1 and A2 to move when the substrate 1 is transferred by the substrate transfer chucks B1, B2 and B3 described later.
1, B2, B3 are for retreating downward from the transport path so as not to interfere with them.

FIGS. 4 and 5 show the substrate transfer chucks B1, B2, B3 taken out and viewed from the front in the transfer direction. FIG. 4 shows a state in which the end 2 of the substrate 1 is held (hereinafter,
It is called "holding state". ) Is shown. FIG. 5 shows a state in which the substrate is not held (hereinafter referred to as “released state”). The substrate transfer chucks B1, B2, B3 include a substrate holding unit 4, and the substrate holding unit 4 includes substrate holding members 4a, 4b.
The substrate holding member 4a is attached to the interlocking rod 7, and when the interlocking rod 7 is rotated by the motor 6 (see FIG. 1), the substrate holding members 4a of the substrate transport chucks B1, B2, B3 are simultaneously rotated. It is supposed to do.
The substrate transfer chucks B1, B2, B3 can clamp or release the substrate 1 between the substrate holding member 4a and the substrate holding member 4b by rotating the interlocking rod 7. Instead of the motor 6, other rotating means such as a rotary actuator may be used to rotate the interlocking rod 7. In addition, the substrate holding unit 4 may also be of a system in which the substrate holding member is moved in parallel by a cylinder to pinch or release the substrate holding member, like the substrate holding unit 3. Substrate transfer chuck B
1, B2 and B3 are mounted on the linear guide 5 and can be moved in parallel as a unit along a rail 8 arranged in the transport direction of the substrate 1. Furthermore, the rail 8
It is placed on the linear guide 14 as the third retracting means, and is moved in parallel along the rail 15 arranged perpendicularly to the transfer direction of the substrate 1, thereby moving away from the transfer route of the substrate 1 to both sides. be able to. The third retracting means is configured so that the substrate transport chucks B1, B2, B3 transfer the substrate 1 to the substrate holding chucks A1, A2 and then retract to both sides from the transport path to return to the original position in the transport direction. This is for avoiding interference with the substrate holding chucks A1 and A2 when retracting along. The substrate transfer chucks B1, B2, B3 have a continuous structure in order to move in parallel as a unit. FIG. 6 shows a side view of a series of substrate transfer chucks B1, B2, B3. As the linear motion guides 5 and 14, commercially available products such as an LM guide (R) can be used.

When the substrate holding chucks A1, A2 and the substrate transfer chucks B1, B2, B3 hold the substrate 1, the substrate 1
The surface contacting the substrate 1 may be any surface that can hold the substrate 1 in a stable manner, but is particularly preferably one that is highly elastic and that has irregularities so as not to slip.

(Operation) The operation of the substrate transfer apparatus will be described with reference to FIGS. 7 to 14, only the part of the structure of the substrate transfer device necessary for explaining the operation is shown, and the other parts are omitted. In this example, a plurality of rectangular substrates 1a, 1b, ... Among them, the substrate 1a is already the substrate holding chuck A1.
Held in. In this state, as shown in FIG. 7, the substrate holding portions 4 of the substrate transport chucks B1, B2, B3 are
It moves so as to approach from both sides of the substrate transfer path. The next substrate 1b is transported by the transport fork 10 to the transport start position of this substrate transport device. As a result, the substrate holding member 4b of the substrate transfer chuck B1 enters the lower side of the substrate 1b, and the substrate holding member 4b of the substrate transfer chuck B2 enters the lower side of the substrate 1a.

As shown in FIG. 8, the rotation of the interlocking rod 7 by the motor 6 rotates the substrate holding member 4a, the substrate holding portion 4 of the substrate transfer chuck B2 holds the substrate 1a, and the substrate transfer chuck B1 moves. The substrate holding unit 4 holds the substrate 1b. After that, the transfer fork 10 retracts and retreats outside the substrate transfer device. The width of the transport fork 10 is
The distance between the substrate holding portion 4 of the substrate transport chuck B1 and the substrate 1b holding the substrate 1b is narrower. Transport fork 10
The evacuation operation of is performed after descending to a position lower than the substrate 1b.

As shown in FIG. 9, the substrate holding chuck A
1 and A2, the respective substrate holders 3 are opened to move them away from the substrate transfer path to the left and right, and the next substrate transfer chuck B1, B2
It is lowered so as not to interfere with the movement of B3. Figure 10
As shown in, the substrate transfer chucks B1, B2 and B3 are advanced by one pitch along the substrate transfer direction. "1 pitch"
The term "one pitch" in the arrangement of the substrate transport chucks or the substrate holding chucks. The substrate holding chucks A1 and A2 that have been lowered previously are raised.
As shown in FIG. 11, the substrate holding chucks A1 and A2 are brought close to the substrate transfer path to hold the substrates respectively. As a result, the substrate holding chuck A1 holds the substrate 1b, and the substrate holding chuck A2 holds the substrate 1a. As shown in FIG. 12, the substrate holders 4 of the substrate transfer chucks B1, B2, B3 are opened and moved away from the substrate transfer path. As shown in FIG. 13, the substrate transfer chucks B1, B2, B3 are retracted by one pitch along the substrate transfer direction. As shown in FIG. 14, the substrate holding portions 4 of the substrate transport chucks B1, B2, B3 move so as to approach from both sides of the substrate transport path. The next substrate 1c is transported by the transport fork 10 to the transport start position of this substrate transport device. As a result,
The substrate holding member 4b of the substrate transfer chuck B1 enters below the substrate 1c, and the substrate holding member 4b of the substrate transfer chuck B2 enters below the substrate 1b.
Substrate holding member 4b of No. 3 enters the lower side of substrate 1a. In this way, each substrate is conveyed forward by one pitch by repeating the operation from FIG. 7 again.

(Operation / Effect) With such a substrate transfer apparatus, the substrate holding chuck and the substrate transfer chuck alternately transfer the substrates forward while securely holding both ends. Deflection or deformation due to its own weight does not pose a problem, and even a thin flexible substrate can be continuously conveyed without any problem. In particular, when delivering between the substrate holding chuck and the substrate transport chuck, the substrate holding chuck and the substrate transport chuck both deliver the substrate at the same time, so that the substrate is transported without changing the posture. Can be done. With this substrate transfer device, since there is no sliding portion between the substrate and the transfer mechanism, the problems of dust generation and chipping can be solved.

Further, the substrate transport chuck can start transporting new substrates one after another by reciprocating the distance by one pitch, so that the transport cycle time does not become long depending on the transport distance.

Since the substrate holding chucks A1 and A2 simultaneously perform the operations, the driving devices may be shared. The same applies to the substrate transfer chucks B1, B2, B3.

(Second Embodiment) (Substrate Transfer Method) The substrate transfer method according to the second embodiment of the present invention uses the substrate transfer device described in the first embodiment. In this substrate transfer method, the edge 22 of the substrate is
There may be a problem in pinching and holding. For example, if the substrate is extremely thin and if it is directly sandwiched, it may cause chipping, cracking, or cracking of the substrate, or if almost all the surface including the end 2 is processed, the sandwiching If so, a case where a scratch or the like is generated in the processed portion is applicable. As shown in FIG. 15, for example, as shown in FIG. 15, a transport tape 18 as a transport member is attached to both ends of these substrates 1 by thermocompression bonding or an adhesive, and the transport tape 18 is sandwiched and transported. You can do that. The transport tape 18 is made of a material having excellent chemical resistance and heat resistance such as silicon resin, Teflon (R) resin and aramid resin depending on the environment in which the substrate is processed. Alternatively, it is not limited to resin and may be a thin metal plate.

(Operation / Effect) By using the transport tape 18 as described above, it is possible to avoid directly pinching the surface of the substrate 1, and therefore it is possible to prevent the substrate 1 from being scratched or chipped. As a result, the entire surface of the substrate 1 can be used. Further, by appropriately selecting the material of the carrying tape 18, the carrying tape 18 can give a certain degree of rigidity even if the substrate is flexible, and the handling of the substrate becomes easy.

In the above-mentioned example, the transport tape 18 is attached from the back side, but it may be attached from the front side or fixed to the side of the substrate by another method, if necessary. Further, the carrying member is not limited to the tape-shaped member, but may have another shape.

(Embodiment 3) (Structure) A substrate transfer apparatus according to a third embodiment of the present invention is basically the same as the substrate transfer apparatus shown in the first embodiment. As shown from the above, a hot plate 17 is provided below the substrate transfer path. The hot plate 17 is a substrate holding chuck A.
It is installed according to the arrangement of A1 and A2. When the substrate holding chucks A1 and A2 hold the substrate 1, the entire substrate holding chucks A1 and A2 descend to a position where the back surface of the substrate 1 contacts the upper surface of the hot plate 17. In this way, the substrate 1 is heated. In order to arrange the hot plate 17, a frame is passed along the substrate transfer direction, and if it is mounted on the frame, the hot plate 17 and the mechanism of the substrate holding chucks A1, A2 and the substrate transfer chucks B1, B2, B3 are arranged. Interference can be avoided, and the structure of the first embodiment can be used as it is.

Although an example of the hot plate 17 is shown here, a cool plate may be arranged instead of the hot plate 17 and cooling may be performed instead of heating.

(Operation / Effect) In this substrate transfer apparatus or substrate transfer method, since the space in which the hot plate or cool plate can be placed is below the substrate transfer path, the hot plate or cool plate can be easily installed. Can be placed. Also, the substrate holding chuck A
Since 1 and A2 can move up and down while holding the substrate, it is possible to bring the substrate into contact with a hot plate or a cool plate during heating to heat or cool the substrate as needed.

When the temperature to be changed by heating or cooling is high, it is general to provide hot plates or cool plates at several places to perform heating or cooling stepwise. In the apparatus or the substrate transfer method, the expansion or contraction of the substrate due to heating or cooling can be gradually absorbed when the substrate holding chucks A1, A2 and the substrate transfer chucks B1, B2, B3 alternately switch the substrates. In addition, the flatness can be maintained and the transfer can be performed without accumulating the stress at the time of expansion or contraction in the substrate.

It should be noted that what is installed below the substrate transfer path is not limited to the hot plate or the cool plate, and a structure for performing some processing on the substrate may be installed. Further, it may be provided above the substrate transporting path instead of below. In this substrate transfer apparatus, various processing, heating, and cooling can be performed consistently in the transfer line in this way, so a production system that continuously processes substrates such as flexible substrates is provided. Easy to build.

In each of the above-described embodiments, an example in which a rectangular substrate is handled has been described, but the substrate is not limited to a rectangular substrate, and the present invention is not limited as long as both ends can be held by chucks. Is applicable.

Further, in each of the above embodiments, the substrate holding chucks A1, A2 and the substrate transfer chucks B1, B2, B3.
Although the substrate transfer apparatus configured by the above has been described as an example, the number of each chuck is not limited to this, and may be increased or decreased.
If you operate a larger number of chucks side by side in the same way,
It can also be used for longer distances.

The above-described embodiment disclosed this time is illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the scope of the claims, and includes meaning equivalent to the scope of the claims and all modifications within the scope.

[0037]

According to the present invention, a substrate holding chuck serving as a first chuck and a substrate carrying chuck serving as a second chuck alternately carry forward while securely holding both ends. Therefore, the bending and deformation of the substrate due to its own weight do not pose a problem, and even a thin and flexible substrate can be continuously transported without any problem. Also,
Since the transport cycle time does not become long even if the transport distance is long, the transport can be performed efficiently.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate transfer device according to a first embodiment of the present invention.

FIG. 2 is a front view of a substrate holding chuck of the substrate transfer apparatus according to the first embodiment of the present invention in a state of holding a substrate.

FIG. 3 is a front view of a substrate holding chuck of the substrate transfer apparatus according to the first embodiment of the present invention in a state in which a substrate is not held.

FIG. 4 is a front view of a substrate transfer chuck of the substrate transfer device according to the first embodiment of the present invention in a state of holding a substrate.

FIG. 5 is a front view of the substrate transfer chuck of the substrate transfer device according to the first embodiment of the present invention in a state in which the substrate is not held.

FIG. 6 is a side view of a substrate transfer chuck of the substrate transfer device according to the first embodiment of the present invention.

FIG. 7 is a first explanatory diagram of the operation of the substrate transfer device according to the first embodiment of the present invention.

FIG. 8 is a second explanatory diagram of the operation of the substrate transfer device according to the first embodiment of the present invention.

FIG. 9 is a third explanatory diagram of the operation of the substrate transfer device according to the first embodiment of the present invention.

FIG. 10 is a fourth explanatory view of the operation of the substrate transfer device according to Embodiment 1 of the present invention.

FIG. 11 is a fifth explanatory view of the operation of the substrate transfer device according to Embodiment 1 of the present invention.

FIG. 12 is a sixth explanatory diagram of the operation of the substrate transfer device according to the first embodiment of the present invention.

FIG. 13 is a seventh explanatory diagram of the operation of the substrate transfer device according to Embodiment 1 of the present invention.

FIG. 14 is an eighth explanatory diagram of the operation of the substrate transfer device according to the first embodiment of the present invention.

FIG. 15 is an explanatory diagram of a carrying tape used in the substrate carrying method according to the second embodiment of the present invention.

FIG. 16 is a front view of a substrate holding chuck of a substrate transfer apparatus according to a third embodiment of the present invention in a state of holding a substrate.

FIG. 17 is a perspective view of a first substrate transfer device based on a conventional technique.

FIG. 18 is a front view of a first substrate transfer device based on a conventional technique.

FIG. 19 is a perspective view of a second substrate transfer device according to the related art.

[Explanation of symbols]

1,1a, 1b, 21,31 substrate, 2,22 end,
3 Substrate holding parts (of substrate holding chuck) 3a, 3b
Substrate holding member, 4 Substrate holding unit (of substrate transfer chuck), 4a, 4b Substrate holding member, 5, 14 Linear motion guide, 6 Motor, 7 interlocking rod, 8, 15 Rail, 10
Transport fork, 11, 12 cylinder, 17 hot plate, 23 sandwiching portion, 25 linear guide, 32 end supporting roller, 33 intermediate supporting roller, 34 roller shaft,
35 flange.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3C030 DA22                 5F031 CA05 CA09 DA15 FA02 FA14                       GA13 GA14 GA16 GA32 GA37                       GA46 GA48 GA49 GA60 LA06                       LA15 PA13 PA20 PA26

Claims (8)

[Claims] 1. A substrate transfer device for transferring a substrate along a transfer direction parallel to a surface of the substrate, the first chuck having a fixed installation position in the transfer direction, and the transfer device. A second chuck movable along a direction, and a chuck control means for controlling the operation of the first and second chucks, wherein the first chuck and the second chuck are Each of them can be in two holding states, that is, a holding state in which the substrate is held at both ends in a direction substantially perpendicular to the carrying direction, and a release state in which the substrate is not held. For the first and second chucks, the first chuck is in the holding state and the second chuck is in the released state, and the second chuck is in the holding state. In the state, the first chuck alternates with the second work state in which the first chuck is in the release state, and the second chuck moves forward in the transport direction under the second work state. The substrate transfer device is controlled as follows. 2. The first chuck is a first retracting means for moving in a direction away from the substrate, being substantially parallel to the surface of the substrate in the released state, and a first chuck on the surface of the substrate in the released state. Second retraction means for moving in a direction substantially vertical and moving away from the substrate, wherein the second chuck moves in a direction substantially parallel to the surface of the substrate and moving away from the substrate in the released state. The substrate transfer apparatus according to claim 1, further comprising: 3. The transfer control means causes the second chuck to hold a second portion different from the first portion of the substrate while the first chuck holds the first portion of the substrate. After holding the part of the
First transfer control means for putting the second chuck of the substrate into the released state, and the second chuck holding the second portion of the substrate, the first chuck is connected to the first chuck of the substrate. The substrate transfer apparatus according to claim 1 or 2, further comprising: second delivery control means for bringing the second chuck into the released state after holding the first portion. 4. The substrate transfer according to claim 1, further comprising a heat exchanging means for exchanging heat with the substrate, at a position adjacent to a path along which the substrate is to be transferred. apparatus. 5. A substrate transfer method for transferring a substrate along a transfer direction parallel to a surface of the substrate, wherein an installation position is fixed with respect to the transfer direction, and the substrate is moved in the transfer direction. A first chuck that can be in two states, a holding state in which it is held at both ends in a substantially vertical direction and a release state in which the substrate is not held; and a first chuck that can move along the carrying direction, Using a second chuck that can be in two states, a holding state in which the substrate is held at both ends in a direction substantially perpendicular to the transport direction and a release state in which the substrate is not held, A first working state in which the first chuck is in the holding state and the second chuck is in the releasing state, and a second working state is in the holding state and the first chuck is in the releasing state. is there A substrate transfer method, wherein the second work state is alternately taken, and the second chuck is moved forward in the transfer direction under the second work state. 6. A first retracting step of moving the first chuck in a direction in which the first chuck is substantially parallel to the surface of the substrate in the released state and away from the substrate, and the first chuck in the released state. A second retracting step of moving in a direction substantially perpendicular to the surface of the substrate and away from the substrate; and moving the second chuck in a direction substantially parallel to the surface of the substrate and away from the substrate in the released state. The substrate transfer method according to claim 5, wherein the first chuck and the second chuck hold the substrates alternately without interfering with each other by including the third retracting step. 7. The second chuck holds a second portion of the substrate different from the first portion while the first chuck holds the first portion of the substrate. After that, a first transfer step of bringing the first chuck into the released state, and a state in which the second chuck holds the second portion of the substrate 7. The substrate transfer method according to claim 5, further comprising a second transfer step of bringing the second chuck into the released state after holding the first portion. 8. The substrate transfer method according to claim 5, wherein the substrate has a transfer member attached to both ends of the substrate main body in a direction substantially perpendicular to the transfer direction.