JP2003037292A - Light source device and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a bonding agent from flowing out of the bonded portion between a metallic sheet and an insulation member to a mounting surface. SOLUTION: On the margin of a through-hole 6, made through the bonding surface of the insulation member 4, a peripheral wall 20 protruded toward the metallic sheet 3 is formed. When the insulating member 4 is adhered to the surface of the metallic sheet 3 by inserting a projecting base section 11 into the through-hole 6, the peripheral wall 20 is arranged in the gap provided between the bonding material 13 and projecting base section 11 and the front end of the member 4 comes into contact with the sheet 3. When the sheet 3 and member 4 are pressed against each other, the bonding material 13 applied to the sheet 3 spreads in the space between the upper surface of the sheet 3 and lower surface of the member 4 and the bonded area between the sheet 3 and member 4 is expanded. However, since the peripheral wall 20 is arranged around the projecting base section 11, the spreading of the material 13 is intercepted by the wall 20. Consequently, flowing out of the material 13 from the bonded portion between the sheet 3 and member 4 to the mounting surface can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device using a light emitting diode and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in a light source device using a light emitting diode as a light source for illumination, an extremely large amount of light is required as compared with a display application, so that a large current tends to flow through each light emitting diode. There was That is, since the light quantity of the light emitting diode is proportional to the flowing current, a large current must be passed in order to increase the light quantity.

However, if a large current is applied, heat generation will cause a decrease in the luminous efficiency of the light emitting diode, and deterioration will be accelerated to shorten the service life.
In order to suppress the deterioration of the light emitting efficiency and the deterioration of the light emitting diode while flowing a large current to increase the light amount, it is necessary to radiate the heat of the light emitting diode satisfactorily. Therefore, conventionally, a structure has been provided in which a light emitting diode is directly mounted on a metal plate which is a good conductor of heat (a substance having high thermal conductivity), and the metal plate is used as a heat sink to radiate heat.

However, since wiring is required to supply power to the light emitting diode and the wiring cannot be formed only by the metal plate, an insulating member made of a resin molded product and having a wiring portion (conductor pattern) is formed. A structure in which a metal plate is bonded to one surface has been proposed.

FIG. 38 shows a light source device 1 already proposed by the applicant of the present invention, which includes a metal plate 3 formed of a material having high thermal conductivity such as aluminum, and a resin molded product such as a liquid crystal polymer. A substrate made of an insulating member 4 that is adhered and fixed to one surface of the metal plate 3 by an adhesive material, a projecting portion 11 protruding from the metal plate 3, and a mounting surface that is the top surface of the projecting portion 11. And a light emitting diode 2 to be mounted.

A mortar-shaped recess 5 is formed on the surface of the insulating member 4 opposite to the metal plate 3, and a through hole 6 penetrating the insulating member 4 in the thickness direction is formed on the bottom surface of the recess 5. ing. A protrusion 11 formed by punching the metal plate 3 from one surface and press working is inserted into the through hole 6, and the light emitting diode 2 is mounted on the top surface of the protrusion 11 by die bonding. It Then, the mounted light emitting diode 2 and the wiring portion (conductor pattern) 8 formed on the surface of the insulating member 4 including the recess 5 are connected by wire bonding. Further, the recess 5 is filled with a sealing member 10 made of a synthetic resin having a light-transmitting property, and the entire light emitting diode 2 and the bonding wire 9 are resin-sealed and protected. When the light emitting diode 2 is flip-chip mounted, the electrode of the light emitting diode 2 and the wiring portion 8 are directly bonded without using the bonding wire 9.

By mounting the light emitting diode 2 on the top surface of the protruding portion 11 projecting from the metal plate 3 as described above, light emitted from the side surface of the light emitting diode 2 is insulated from the metal plate 3 and an insulating member. Instead of being absorbed by the joint surface of No. 4, it is reflected by the inner surface of the recess 5 and is efficiently irradiated forward (upward in FIG. 38). Here, the sealing member 10 has a function of efficiently guiding the light emitted from the light emitting diode 2 to the outside, a function of protecting the light emitting diode 2, the bonding wire 9, and the like, or a lens function depending on its shape.

Further, if the blue light emitting diode 2 is used and the phosphor for converting blue light into yellow light is dispersed in the sealing member 10, the direct light (blue light) emitted from the light emitting diode 2 is obtained. It is also possible to add light to the light (yellow light) that has been color-converted by the fluorescent substance and to make the emission color white.
It should be noted that when the amount of the phosphor is large, the emission color is yellowish, and when the amount of the phosphor is small, the emission color is bluish.

[0009]

By the way, in the above-mentioned conventional structure, if the metal plate 3 and the insulating member 4 are not adhered to each other without a gap, the sealing member 10 filled in the recess 5 is passed through the gap to the outside of the recess 5. There is a risk that it will flow out or be washed away. In particular, when the phosphor is dispersed in the sealing member 10 to obtain white light as described above, it is necessary to control the amount of the phosphor in the recess 5, that is, the amount of the sealing member 10, Member 1
If 0 flows out, it becomes difficult to control the quantity.

On the other hand, when a large amount of adhesive material is used to improve the airtightness of the joint (bonding site) between the metal plate 3 and the insulating member 4, the gap between the joints (protruding from the inner peripheral surface of the through hole 6). Stand 1
The adhesive material squeezes out to the mounting surface (top surface of the protruding portion 11) through the gap (1) and the large amount of the adhesive material attached to the mounting surface hinders the die bonding of the light emitting diode 2. It will be. The light emitting diode 2 is an adhesive for die bonding (die bonding paste).
Although it is directly adhered to the mounting surface at 7, epoxy resin is often used as the die bonding paste 7. On the other hand, a silicone resin may be used as an adhesive material for bonding the metal plate 3 and the insulating member 4 in order to secure airtightness and absorb molding intersections of the insulating member 4 made of a resin molded product. However, when the component contained in the silicon resin adheres to the mounting surface, the die bonding paste 7 is repelled, and the die bonding failure of the light emitting diode 2 occurs. Such a problem may occur due to various components or dispersed substances contained in the adhesive material, for example, a filler such as aluminum mixed in for adjusting the viscosity or improving the thermal conductivity to protrude. Furthermore, if a large amount of the adhesive material sticks out and adheres to the mounting surface, even if the adhesive materials have a good affinity, the light emitting diode 2 cannot be mounted horizontally on the mounting surface even if no adhesive failure occurs. There is a possibility that inconvenience may occur in the wire bonding process or the optical characteristics may be adversely affected. As shown in FIG. 39, there is also provided one in which a reservoir portion 50 for storing an extra adhesive material 13 is formed on the joint surface of the insulating member 4 with the metal plate 3, but it is sufficient in view of the dimensions of the insulating member 4. In some cases, it could not perform such a function.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optical device in which the adhesive material is prevented from flowing out from a bonding portion between a metal plate and an insulating member to a mounting surface, and its manufacture. To provide a method.

[0012]

In order to achieve the above object, the invention of claim 1 is a light source device in which a light emitting diode is mounted on a substrate, the metal plate being a good conductor of heat, and the metal plate. A substrate made of an insulating member that is adhered and fixed to one surface by an adhesive material, a projecting portion protruding from a metal plate through the insulating member, and mounted on the mounting surface that is the top surface of the projecting portion. A light emitting diode is provided, and a preventing means for preventing the adhesive material from flowing out from a bonding portion of the metal plate and the insulating member to the mounting surface is provided on at least one of the metal plate and the insulating member. By this, it is possible to prevent the adhesive material from flowing out from the bonding portion of the metal plate and the insulating member to the mounting surface, and the flowing-out adhesive material does not adhere to the mounting surface and hinder the mounting of the light emitting diode.

According to a second aspect of the present invention, in the first aspect of the invention, the prevention means is provided on the metal plate or the insulating member, and is composed of a portion where the wettability of the adhesive material is lower than other portions. Therefore, the part having low wettability can prevent the adhesive material from flowing out to the mounting surface.

According to a third aspect of the invention, in the second aspect of the invention, the adhesive material is solder, and a conductor pattern is formed on the adhesive surface side of the insulating member as a portion having high solder wettability. Since the solder does not spread to the portion excluding the conductor pattern, the adhesive material can be prevented from flowing out to the mounting surface.

The invention of claim 4 is characterized in that, in the invention of claim 2, the adhesive material is an epoxy resin or a silicon resin, and a substance repelling the adhesive material is disposed in the vicinity of the projection part. By being repelled by the substance, the adhesive material can be prevented from flowing out to the mounting surface.

The invention of claim 5 is characterized in that, in the invention of claim 1, a plurality of preventing means are provided, and the adhesive material can be more reliably prevented from flowing out to the mounting surface.

According to a sixth aspect of the present invention, in the first or fifth aspect of the invention, the preventing means comprises a sloped surface formed on a contact surface between the protrusion or the vicinity of the protrusion of the metal plate and the insulating member. Characteristically, the same operation as the invention of claim 1 or 5 is achieved.

According to a seventh aspect of the present invention, in the first or fifth aspect of the invention, the prevention means comprises a protrusion or a protrusion formed at a contact portion between the protrusion of the metal plate and the insulating member. The protrusion can prevent the adhesive member from flowing out.

According to an eighth aspect of the present invention, in the first or fifth aspect of the invention, the prevention means is formed by a metal plate so as to surround the circumference of the projecting portion, and the tip portion is a projection that bites into the insulating member. With the above feature, it is possible to prevent the adhesive member from flowing out by the protrusions that bite into the insulating member.

According to a ninth aspect of the present invention, in the first aspect of the invention, the prevention means prevents the outflow by utilizing a pressure difference when the adhesive material is cured. Play.

According to a tenth aspect of the invention, in the invention of the ninth aspect, the preventing means is a reservoir for accumulating excess adhesive material,
It is characterized by having an escape hole for allowing the air in the reservoir to escape, and by allowing the air in the reservoir to escape from the escape hole, it is possible to prevent the air in the reservoir from expanding when adhesive material cures and causing adhesion failure. .

The invention of claim 11 is characterized in that, in the invention of claim 10, the metal plate and the insulating member are bonded to each other in a depressurized environment, and the adhesive material and the air in the reservoir portion are discharged to the outside through an escape hole. Therefore, the protrusion of the adhesive material is suppressed and the air contained in the adhesive material is reduced, so that the expansion at the time of heating and curing can be suppressed.

According to a twelfth aspect of the present invention, in the first aspect of the present invention, the protrusion is formed separately from the metal plate, and the protrusion is provided with a prevention means. It is possible to separately perform the bonding process of the member and the mounting process of the light emitting diode on the top surface of the protrusion, and the influence of the temperature in the mounting process does not affect the insulating member. The range of adhesive selection is expanded.

According to a thirteenth aspect of the present invention, in the first aspect of the present invention, an adhesive material containing the same component as the adhesive agent for die-bonding the light emitting diode to the top surface of the protrusion is used. Even if the adhesive material adheres to the top surface of the protrusion, die bonding is performed using an adhesive containing the same components, and therefore peeling at the interface between the light emitting diode and the mounting surface is less likely to occur. Moreover, by using the adhesive material containing the same components, the step of adhering the metal plate and the insulating member and the step of mounting the light emitting diode on the top surface of the protrusion can be performed at the same time. The time spent in the temperature environment can be shortened and the occurrence of defects can be prevented.

According to a fourteenth aspect of the present invention, in order to achieve the above object, a light emitting diode is mounted on a substrate, and is bonded and fixed to a metal plate which is a good conductor of heat and one surface of the metal plate with an adhesive material. A method of manufacturing a light source device comprising: a substrate made of an insulating member, a projecting portion protruding from a metal plate through the insulating member, and a light emitting diode mounted on a mounting surface that is a top surface of the projecting portion. In the above, when the metal plate and the insulating member are bonded to each other to form a substrate, hydrostatic pressure is applied to the bonding site between the two, and the flow of the adhesive material from the bonding site between the metal plate and the insulating member to the mounting surface is prevented. It is possible to prevent the leaked adhesive material from adhering to the mounting surface and obstructing the mounting of the light emitting diode.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to embodiments. First, the basic configuration of the present invention will be summarized. It is considered that there are three different portions that play the following different roles in the bonding portion between the insulating member made of a synthetic resin molded product and the metal plate. 1) A portion that keeps airtightness 2) A portion that keeps the adhesive strength 3) A portion that stores extra adhesive material In the past, the above 1) and 2) are commonly used, and 3) does not exist or does not function sufficiently. Since it was not present, the airtightness was not sufficiently maintained, and the extra adhesive material was squeezed out.

On the other hand, in the present invention, as described above, the portions that play different roles are separated from each other without sharing as much as possible, and a portion that maintains airtightness is provided from the bonding portion of the metal plate and the insulating member to the mounting surface. This is a preventive measure to prevent the adhesive material from flowing out.

(Embodiment 1) As shown in FIG. 1, in this embodiment, the metal plate 3 (downward in FIG. 1) is formed on the periphery of the through hole 6 in the bonding surface (lower surface in FIG. 1) of the insulating member 4.
A peripheral wall 20 protruding inward is formed, and the other configuration is common to the conventional example. Therefore, the same components as those in the conventional example are designated by the same reference numerals and the description thereof will be omitted.

As described in the prior art, the protrusion 11 having a height of 1 mm or less is formed by punching out the metal plate 3 having a thickness of several mm from one surface and press-working it. The insulating member 4 is made of a synthetic resin molded product such as liquid crystal polymer, and the peripheral wall 20 is formed together with the mortar-shaped recess 5 and the through hole 6 through which the protruding portion 11 is inserted.

Next, the bonding process of the metal plate 3 and the insulating member 4 in this embodiment will be described with reference to FIG. Figure 2
As shown in (b), a mask is used on the surface of the metal plate 3 (the upper surface in FIG. 2, the same applies hereinafter) to several tens to several hundreds μm.
The adhesive material 13 is applied to the thickness of. At this time, a gap is provided between the adhesive material 13 and the protrusion 11. Subsequently, as shown in FIG. 2C, the insulating member 4 is attached from above the metal plate 3 so that the projecting base 11 is inserted into the through hole 6. At this time, the peripheral wall 20 of the insulating member 4 is covered with the adhesive material 1
3 is arranged in a gap provided between the protrusion 3 and the protrusion 11, and the tip of the gap contacts the surface of the metal plate 3. Furthermore, the metal plate 3
When the insulating member 4 is pressed in the vertical direction, the adhesive material 13 applied to the metal plate 3 spreads in the space between the surface of the metal plate 3 and the lower surface of the insulating member 4 to expand the bonding area. However, since the peripheral wall 20 is arranged around the projecting portion 11, the peripheral wall 20 prevents the adhesive material 13 from spreading as shown in FIG. 2D. Then, when the adhesive material 13 is heated and cured in the above state, the metal plate 3 and the insulating member 4 are adhered by the cured adhesive material 13.

Thus, in this embodiment, the airtightness is maintained by the peripheral wall 20 formed on the insulating member 4, and at the same time the adhesive material 1 is used.
Since the spread of 3 is restricted, the metal plate 3 and the insulating member 4
It is possible to prevent the adhesive material 13 from flowing out from the adhesive portion of the above to the mounting surface (the top surface of the protruding portion 11), and the adhesive material 13 that has flowed out may adhere to the mounting surface and prevent the mounting of the light emitting diode 2. It will disappear.

As shown in FIG. 3, if the tip end portion of the peripheral wall 20 is formed narrower than the root portion to reduce the area of the tip end surface that abuts the metal plate 3, the pressure application range will be applied. The air-tightness can be further improved by narrowing the
Can be more reliably prevented from flowing out.

(Embodiment 2) As shown in FIG. 4, in this embodiment, a reservoir portion 21 for accumulating excess adhesive material 13 is formed on the adhesive surface of the insulating member 4. However, since the other configurations are common to those of the first embodiment, the common components are designated by the same reference numerals and the description thereof will be omitted.

The reservoir 21 is formed in a groove shape on the bonding surface of the insulating member 4 so as to surround the peripheral wall 20. That is, since it is difficult to precisely control the amount of the adhesive material 13, a little more adhesive material 13 is used to prevent defective adhesion.
However, the extra adhesive material 13 can be accumulated in the reservoir 21 by providing the reservoir 21.

Next, the step of adhering the metal plate 3 and the insulating member 4 in this embodiment will be described with reference to FIG. Figure 5
As shown in (b), the adhesive material 13 is applied to the surface of the metal plate 3 (the upper surface in FIG. 5, the same applies below) with a gap between the adhesive material 13 and the protrusion 11. Then, FIG.
As shown in (c), the insulating member 4 is attached from above the metal plate 3 so as to insert the protrusion 11 into the through hole 6.
At this time, the peripheral wall 20 of the insulating member 4 is arranged in the gap provided between the adhesive material 13 and the projecting portion 11, and the tip thereof abuts on the surface of the metal plate 3. Further, when the metal plate 3 and the insulating member 4 are pressed in the vertical direction, the adhesive material 13 applied to the metal plate 3 spreads in the space between the surface of the metal plate 3 and the lower surface of the insulating member 4 to increase the bonding area. To do. However, since the peripheral wall 20 is arranged around the protruding portion 11, the spread of the adhesive material 13 is increased as shown in FIG.
Blocked by. The excess adhesive material 13 collects in the reservoir 21 formed in the insulating member 4. If the adhesive material 13 is heated and cured in the above state, the metal plate 3
The insulating member 4 is adhered by the cured adhesive material 13.

Thus, in the present embodiment, as in the first embodiment, the peripheral wall 20 formed on the insulating member 4 maintains the airtightness and at the same time restricts the spread of the adhesive material 13 and collects the extra adhesive material 13. Since it is stored in the portion 21, it is possible to more reliably prevent the adhesive material 13 from flowing out from the bonding portion of the metal plate 3 and the insulating member 4 to the mounting surface (the top surface of the protrusion 11).

As shown in FIG. 6, the tip end portion of the peripheral wall 20 is formed narrower than the root portion to reduce the area of the tip end surface that abuts against the metal plate 3 so that the pressure applied at the time of pressurization is reduced. You may make it airtight by narrowing.

(Embodiment 3) As shown in FIG. 7, in this embodiment, silicon 22 is applied to the periphery of the through hole 6 in the adhesive surface of the insulating member 4, and the adhesive material 13 made of epoxy resin is used. Other configurations are common to the conventional example. Therefore, the same components as those in the conventional example are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 7, an adhesive material 13 is applied to the surface of the metal plate 3 with a gap between it and the protrusion 11. Then, on the bonding surface of the insulating member 4, silicon 22 is applied to the peripheral portion of the through hole 6 facing the gap by an appropriate method such as screen printing.

When the insulating member 4 is applied from above the metal plate 3 so as to insert the protruding portion 11 into the through hole 6, the silicon 22 applied to the adhesive surface of the insulating member 4 is the adhesive material 1.
3 and the protrusion portion 11 are arranged in a gap provided between them.
Then, when the metal plate 3 and the insulating member 4 are pressed in the vertical direction, the adhesive material 13 applied to the metal plate 3 spreads in the space between the surface of the metal plate 3 and the lower surface of the insulating member 4 to increase the bonding area. To do. However, since the silicon 22 applied to the insulating member 4 is arranged around the protruding portion 11, and the adhesive material 13 made of epoxy resin is repelled by the silicon 22, so that the adhesive material 13 is prevented from spreading.

Thus, in this embodiment, since the spread of the adhesive material 13 made of epoxy resin is restricted by the silicon 22 applied to the insulating member 4, the mounting surface (from the bonding portion of the metal plate 3 and the insulating member 4) It is possible to prevent the adhesive material 13 from flowing out to the top surface of the protrusion 11. The present embodiment is not limited to the combination of the silicon 22 and the epoxy resin, and the adhesive material 1 other than the epoxy resin 1 may be used.
Even when 3 is used, a material having a property of repelling the adhesive material 13 may be applied to the adhesive surface of the insulating member 4.

(Embodiment 4) As shown in FIG. 8, in this embodiment, a wiring pattern 23 is formed on the adhesive surface of the insulating member 4, and the wiring pattern 23 is reflow-soldered on the surface of the metal plate 3. It is characterized in that the metal plate 3 and the insulating member 4 are bonded together.

A wiring pattern 23 made of a metal thin film is formed around the through hole 6 on the bonding surface of the insulating member 4.
The wiring pattern 23 is used, for example, for wiring between the light emitting diode 2 mounted on the top surface of the protrusion 11 and other circuit components.

On the other hand, the metal plate 3 in the present embodiment is made of a copper plate, and the adhesive material 13 made of solder is applied to the periphery of the protrusion 11 on the surface before being bonded to the insulating member 4.

If reflow soldering is performed in a state where the insulating member 4 is adhered on the metal plate 3 so that the protrusion 11 is inserted into the through hole 6, the adhesive member made of solder is used. 1
3 extends along the wiring pattern 23, and the wiring pattern 2
It does not spread to the area where 3 is not formed.

In this embodiment, the wiring pattern 23 formed on the insulating member 4 restricts the spread of the adhesive material 13 made of solder. It is possible to prevent the adhesive material 13 from flowing out to the (top surface of the protrusion 11). In addition, as shown in FIG.
If 4 is applied, it is possible to more reliably prevent the adhesive material 13 from spreading to the protruding portion 11.

By the way, the wiring pattern 23 is connected to the insulating member 4.
In the structure in which the metal plate 3 and the insulating member 4 are bonded to each other by reflow soldering, a recess 14 is provided on the bonding surface side of the insulating member 4, and the circuit component 15 is mounted on the bottom surface of the recess 14 as shown in FIG. If the wiring pattern 25 for forming the wiring pattern is formed, the circuit component 15 can be reflow soldered to the wiring pattern 25 at the same time as the metal plate 3 and the insulating member 4 are bonded by reflow soldering, and the manufacturing process can be simplified.

(Embodiment 5) As shown in FIG. 10, in this embodiment, the bonding surface of the insulating member 4 (the lower surface in FIG. 10).
The peripheral wall of the through hole 6 is characterized in that a plurality of peripheral walls 20 are formed in a concentric shape with the through hole 6 as the center.
Since the basic configuration is the same as that of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted.

The heights of the plurality of peripheral walls 20 are larger as they are closer to the through holes 6. Around the protrusion 11 on the surface of the metal plate 3 is formed an inclined surface that descends downward as it approaches the protrusion 11, and the tips of the plurality of peripheral walls 20 formed on the adhesive surface of the insulating member 4 are provided. It contacts the inclined surface.

Thus, in this embodiment, a plurality of peripheral walls 20 are multiply provided on the adhesive surface of the insulating member 4, so that the outflow of the adhesive material 13 can be prevented more reliably than in the first embodiment. You can Further, since the peripheral wall 20 closer to the through hole 6 has a larger height dimension, the peripheral wall 20 closer to the protruding portion 11 has a larger contact pressure with the metal plate 3, and the outflow of the adhesive material 13 can be more reliably prevented. . Further, even if the contact angle between the peripheral wall 20 and the metal plate 3 is made close to a right angle, the outflow of the adhesive material 13 can be prevented more reliably as well. Similar effects can be obtained even if the peripheral wall 20 is provided on the surface of the metal plate 3 instead of the insulating member 4 as shown in FIG.

(Embodiment 6) As shown in FIG. 12, in the present embodiment, the peripheral surface of the protruding portion 11 of the metal plate 3 is an inclined surface 11a that tapers toward the tip. Since the basic configuration is the same as that of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted.

When the protrusion 11 is inserted into the through hole 6 of the insulating member 4, the protrusion 11 fits into the through hole 6 of the insulating member 4 like a wedge, and the protrusion 11 is inclined. Since the surface (peripheral surface) and the corner portion 6a of the peripheral edge of the through hole 6 of the insulating member 4 are in contact with each other, the contact portion prevents the adhesive material 13 from flowing out to the protruding portion 11. Further, in the present embodiment, the step portion 26 is formed around the through hole 6 on the adhesive surface of the insulating member 4, and the corner portion 26 a of the step portion 26 is brought into contact with the inclined surface of the projecting portion 11 to thereby bond the adhesive material. It has a structure that double blocks the outflow of 13.

Since the protrusion 11 is formed by pressing the metal plate 3, the metal plate 3 is formed as in the first to fifth embodiments.
The machining is easier than the case where the surface of the and the peripheral surface of the protruding portion 11 are vertical.

(Embodiment 7) As shown in FIG. 13, in the present embodiment, the peripheral surface of the protruding portion 11 of the metal plate 3 is an inclined surface 11a tapering toward the tip, and the inside of the through hole 6 is formed. The peripheral surface is an inclined surface parallel to the inclined surface 11a. Since the basic configuration is the same as that of the sixth embodiment, the common components are designated by the same reference numerals and the description thereof will be omitted.

When the protrusion 11 is inserted into the through hole 6 of the insulating member 4, the inclined surfaces come into contact with each other, so that the contact portion prevents the adhesive material 13 from flowing out to the protrusion 11. It Here, the corner portion 6a and the inclined surface 1 as in the sixth embodiment.
The airtightness of the present embodiment in which the surface contact is made is lower than that of the contact portion with 1a, but the advantage that the airtightness is less influenced by the processing accuracy as compared with the structure of the sixth embodiment. There is. That is, the corner portion 6 as in the sixth embodiment
In the structure in which a is brought into contact with the inclined surface 11a, the corner portion 6
If there is a chip or irregularity somewhere in a, the airtightness will be reduced at that portion, so the airtightness is greatly affected by the processing accuracy of the corner portion 6a (through hole 6). On the other hand, in the surface contact structure of the present embodiment, since the insulating member 4 made of a resin molded product has some elasticity, if the average contact is made somewhere on the inclined surface, it is airtight to some extent. Stable surface 1
The influence of the processing accuracy of 1a is small.

It should be noted that, as shown in FIG. 14, a reservoir portion 27 may be provided around the protruding portion 11 on the surface of the metal plate 3 for storing the excess adhesive material 13. Alternatively, as shown in FIG. 15, the inclined surface 11a of the projecting base 11 is stepped to form the reservoir 2
7 may be provided.

(Embodiment 8) As shown in FIG. 16, in this embodiment, the protrusion 11 has a two-step structure of a first protrusion 11A having a large diameter and a second protrusion 11B having a small diameter. The corner portion of the first projecting base portion 11A is in contact with the inner peripheral surface of the through hole 6 formed as a surface. Since the basic configuration is the same as that of the sixth embodiment, the common components are designated by the same reference numerals and the description thereof will be omitted.

When the protrusion 11 is inserted into the through hole 6 of the insulating member 4, the inner peripheral surface of the through hole 6 and the first protrusion 11A.
Since the corner portions of the contact point abut, the pressure concentrates on this contact portion to increase the airtightness, and the adhesive material 13 is prevented from flowing out to the second projecting part 11B. In addition, in this embodiment, the protrusion 11
Although it has a two-stage structure, it may have a three-stage structure or more stages as shown in FIG. Alternatively,
As shown in FIG. 18, the same effect can be obtained even if the inner peripheral surface of the through hole 6 of the insulating member 4 has a stepped structure and a marked corner portion abuts on the peripheral surface of the projecting base 11 which is an inclined surface. can get.

(Embodiment 9) As shown in FIG. 19, in the present embodiment, the projecting base 11 has a two-step structure of a first projecting base 11A having a large diameter and a second projecting base 11B having a small diameter, and is insulated. A fitting recess 6 that fits with the first protrusion 11A on the inner peripheral surface of the through hole 6 of the member 4.
b is formed. The basic configuration is the sixth embodiment.
Also, since it is common to the eighth embodiment, common constituent elements are given the same reference numerals, and description thereof will be omitted.

The fitting recess 6b is formed on the peripheral surface of the through hole 6 on the bonding surface of the insulating member 4. Then, when the protrusion 11 is inserted into the through hole 6, the fitting recess 6 b and the first protrusion 11 are inserted.
A and A are fitted to each other, and the pressure is concentrated on this fitting portion to increase the airtightness, and the adhesive material 13 is prevented from flowing out to the second protruding portion 11B.

(Embodiment 10) As shown in FIG. 20, in the present embodiment, a fitting groove 28 into which the tip of the peripheral wall 20 of the insulating member 4 is fitted is formed in the periphery of the protruding portion 11 on the surface of the metal plate 3. Since the other configurations are common to those of the first embodiment, the common components are designated by the same reference numerals and the description thereof will be omitted.

When the protrusion 11 is inserted into the through hole 6, the tip of the peripheral wall 20 fits into the fitting groove 28. The tip of the peripheral wall 20 is formed narrower than the root portion. Therefore, as shown in FIG. 20, the corner of the opening peripheral edge of the fitting groove 28 abuts on the inclined outer peripheral surface of the peripheral wall 20, and the pressure is concentrated on this abutting portion to increase the airtightness, and the adhesiveness is improved. Material 13
This will be prevented from flowing out to the protrusion part 11.

As shown in FIG. 21, a gap is provided between the fitting groove 28 and the protruding portion 11, and the peripheral wall 20 is brought into contact with the corner of the opening of the fitting groove 28 on the protruding portion 11 side. It is also possible to adopt a structure or a structure in which the peripheral wall 20 is brought into contact with the protruding portion 11 side and the corners on the opposite side of the opening peripheral edge of the fitting groove 28 as shown in FIG. Further, in any of the above-mentioned structures, by forming a reservoir for storing the excess adhesive material 13, the adhesive material 13 can be more reliably prevented from flowing out to the protrusion 11. Further, as shown in FIG. 23, a large gap may be provided between the fitting groove 28 and the protruding portion 11, and the surface of the metal plate 3 and the adhesive surface of the insulating member 4 may be in surface contact with each other in this gap. good.

(Embodiment 11) As shown in FIG. 24, in this embodiment, a fitting groove 28 is formed in the inclined surface 11a of the projecting base portion 11, and other structures are common to the tenth embodiment. Therefore, common constituent elements are given the same reference numerals, and description thereof will be omitted.

In the configuration of the tenth embodiment, the fitting groove 2
When the metal plate 3 is pressed to form 8, a protrusion corresponding to the fitting groove 28 is formed on the back surface side of the metal plate 3, and this protrusion causes the light source device according to the present invention to operate. It will be a hindrance when installing it on a heat dissipation part.

Therefore, as in the present embodiment, the peripheral surface of the protruding portion 11 is formed into the inclined surface 11a, and the inclined surface 11a is pressed to form the fitting groove 28. It is possible to prevent the protrusion from protruding.

(Embodiment 12) As shown in FIG. 25, in this embodiment, the peripheral wall 20 'is formed by using a material different from that of the insulating member 4, and other configurations are common to those of the first embodiment. The common components are given the same reference numerals and the description thereof is omitted.

In the first embodiment, the peripheral wall 20 is integrally molded with the same material as the insulating member 4, but in the present embodiment, a resin material softer than the material forming the insulating member 4 is used, for example, by two-color molding. A peripheral wall 20 ′ is provided on the bonding surface of the member 4 in a protruding manner.

When the metal plate 3 and the insulating member 4 are adhered to each other, the peripheral wall 20 'is deformed by the pressure applied between them,
The deformed peripheral wall 20 ′ enhances the airtightness and prevents the adhesive material 13 from flowing out to the protrusion 11.

As shown in FIG. 26, a fitting groove 28 is provided on the surface of the metal plate 3, and the fitting groove 28 is formed as in the tenth embodiment.
With the structure in which the peripheral wall 20 'is fitted in, the outflow of the adhesive material 13 can be prevented more reliably.

(Embodiment 13) As shown in FIG. 27, in this embodiment, a peripheral wall 20 ″ is projected on the surface of the metal plate 3,
A fitting groove 28 ′ that fits with the peripheral wall 20 ″ is provided on the adhesive surface of the insulating member 4, and other configurations are the same as those of the first embodiment.
Therefore, the same reference numerals are given to the common components and the description thereof will be omitted.

The peripheral wall 20 ″ is formed by press working so as to surround the periphery of the protruding portion 11 on the surface of the metal plate 3. Then, the adhesive surface of the insulating member 4 is fitted so as to fit with the peripheral wall 20 ″. A groove 28 ′ is provided around the through hole 6.

Then, when the insulating member 4 is attached from above the metal plate 3 so that the protrusion 11 is inserted into the through hole 6, the metal plate is fitted in the fitting groove 28 'of the insulating member 4. 3 ”20”
Are fitted to each other, and the airtightness is enhanced by the peripheral wall 20 ″, so that the adhesive material 13 is prevented from flowing out to the protrusion 11.

Here, the peripheral wall 20 "is tapered so that the fitting groove 2
By increasing the width dimension of the peripheral wall 20 ″ on the base end side with respect to the width of 8 ′, when the peripheral wall 20 ″ is fitted with the fitting groove 28 ′ as shown in FIGS. 28 (a) and (b). If the structure is such that the peripheral portion of the through hole 6 of the insulating member 4 is pushed toward the through hole 6 and the inner diameter of the through hole 6 is narrowed, the inner peripheral surface of the through hole 6 and the peripheral surface of the protrusion 11 are separated. It is possible to more reliably prevent the adhesive material 13 from flowing out to the protruding portion 11 in close contact.

Further, as shown in FIG. 29, the peripheral portion of the through hole 6 of the insulating member 4 is brought into contact with the surface of the metal plate 3 in the gap between the peripheral wall 20 ″ and the projecting portion 11, so that the airtightness is further enhanced. A structure may be provided in which a reservoir 21 'for accumulating the excess adhesive material 13 is provided at a portion of the insulating member 4 corresponding to the above-mentioned gap. The reservoir 21' has a circumference of the protrusion 11 as shown in FIG. The structure may be provided on the inner peripheral surface of the through hole 6 facing the surface.

(Embodiment 14) As shown in FIG. 31, in the present embodiment, a peripheral wall 29 having a sharpened tip in the shape of a knife edge is provided on the surface of the metal plate 3 so as to project. Since it is common to the first embodiment, common components are given the same reference numerals, and description thereof will be omitted.

The peripheral wall 29 is protruded by press working or the like so as to surround the protruding portion 11 on the surface of the metal plate 3, and its tip is sharpened in a knife edge shape.

Then, when the insulating member 4 is adhered from above the metal plate 3 so that the protruding portion 11 is inserted into the through hole 6, the peripheral surface of the metal plate 3 is adhered to the insulating member 4. 29 bites in to improve airtightness, and prevents the adhesive material 13 from flowing out to the protrusion 11.

(Embodiment 15) As shown in FIG. 32, in this embodiment, a reservoir portion 30 is formed in the peripheral portion of the through hole 6 of the insulating member 4 so as to open on the adhesive surface side and store the excess adhesive material 13 therein. In addition to being provided in the shape of a groove around the through hole 6, there are formed one to a plurality of escape holes 31 for communicating the reservoir 30 with the recess 5 and allowing the air in the reservoir 30 to escape. Is common with the conventional example. Therefore, the same components as those in the conventional example are designated by the same reference numerals and the description thereof will be omitted.

The reservoir 30 is formed in a groove shape on the adhesive surface of the insulating member 4 with a gap between it and the through hole 6. And
One or a plurality of escape holes 31 communicating with the recesses 5 of the insulating member 4 are provided at the important points on the bottom surface of the reservoir 30, and the air in the reservoir 30 can be released to the outside through the escape holes 31. ing.

Thus, when the metal plate 3 and the insulating member 4 are bonded together, the excess adhesive material 13 collects in the reservoir 30 of the insulating member 4 so that it can be prevented from flowing out to the protrusion 11. Here, conventionally, it was difficult for the adhesive material 13 to collect in the reservoir portion 30 due to the air in the reservoir portion 30 interfering, but in the present embodiment, the escape hole 31 is provided so that the air in the reservoir portion 30 is exposed to the outside. The adhesive material 13 is easily accumulated in the reservoir 30 because it can be released. Further, in the related art, there is a risk that the air in the reservoir 30 expands during heating for curing the adhesive material 13 and the adhesive material 13 peels off. However, in the present embodiment, the air in the reservoir 30 passes through the escape hole 31. Since it escapes to the outside, there is no risk of the adhesive material 13 peeling off due to heating.

Here, if the bonding work of the metal plate 3 and the insulating member 4 is performed under a reduced pressure environment, the air inside the bonding material 13 and the reservoir 30 can be released to the outside through the escape hole 31,
There is an advantage that the protrusion of the adhesive material 13 can be suppressed and the air contained in the adhesive material 13 can be reduced to suppress expansion during heating and curing.

The escape hole 31 for releasing the air in the reservoir 30 need not necessarily be communicated with the recess 5, and the escape hole 31 may be provided in the metal plate 3. For example, the insulating member 4 or the metal plate 3 has a reservoir 30
32 may be provided with a groove-shaped escape hole for communicating with the outside to allow air to escape along the lateral direction in FIG.

(Embodiment 16) In the present embodiment, a protrusion 11 'for mounting the light emitting diode 2 on the top surface is formed separately from the metal plate 3, and a protrusion of the adhesive material 13 is applied to the protrusion 11'. It is characterized in that a preventive means for preventing outflow to the base 11 'is provided. However, since the basic configuration is the same as that of the conventional example, the same reference numerals are given to the common components and the description thereof will be omitted.

The metal plate 3 is formed of a relatively soft metal such as a copper plate. Then, as shown in FIG.
The protrusion part 11 ′ is formed in a wedge shape by a metal material harder than the metal plate 3, and its tip end is press-fitted into a key part of the metal plate 3 so as to be projected on the surface of the metal plate 3. Here, since the protrusion 11 'is formed in a wedge shape, the peripheral surface 11a' of the protrusion 11 'inclined toward the tip and the peripheral edge of the through hole 6 of the insulating member 4 are in pressure contact with each other to ensure airtightness. Therefore, it is possible to prevent the adhesive material 13 from flowing out to the mounting surface (top surface) of the protruding portion 11 ′ at this pressure contact portion.

Here, as shown in FIG. 34, the protrusion 1 in which the light emitting diode 2 is mounted by die bonding in advance.
1'may be press-fitted onto the surface of the metal plate 3, or FIG.
As shown in FIG. 5, the protrusion 11 'is press-fitted on the surface of the metal plate 3.
Alternatively, the light emitting diode 2 may be mounted.

The protrusion 11 'may be press-fitted before the bonding work of the metal plate 3 and the insulating member 4, or the protrusion 11' may be pressed-in after the bonding work. However, in the case of press-fitting after the bonding work, the heat at the time of die bonding of the light emitting diode 2 is not applied to the insulating member 4, so the influence of the temperature in the mounting process does not reach the insulating member 4, and the material of the insulating member 4 or There is an advantage that the range of selection of the adhesive for mounting (die bonding) is expanded.

(Embodiment 17) This embodiment is characterized in that an adhesive material 13 containing the same component as the adhesive agent for die-bonding the light emitting diode 2 to the top surface of the protrusion 11 is used. Since this configuration is the same as that of the conventional example, common components are designated by the same reference numerals, and illustration and description thereof will be omitted.

If the adhesive material 13 containing the same components as the die-bonding adhesive is used, even if the adhesive material 13 that has flowed out adheres to the top surface of the protrusion 11, the same components will remain. Since die bonding is performed using the included adhesive, peeling at the interface between the light emitting diode 2 and the mounting surface is less likely to occur. Moreover, the adhesive material 1 containing the same components
3 is used to bond the metal plate 3 and the insulating member 4,
The step of mounting the light emitting diode 2 on the top surface of the protrusion 11 can be performed at the same time. As a result, it is possible to shorten the time for which the insulating member 4 is exposed to a high temperature environment, and it is possible to prevent the insulating member 4 from being deformed due to temperature.

(Embodiment 18) In this embodiment, the metal plate 3 is used.
When the substrate is formed by adhering the insulating member 4 and the insulating member 4 to each other, a hydrostatic pressure is applied to the adhering portions of the both, and since the basic configuration is the same as the conventional example, the common constituent elements are the same. The reference numerals are given and the description is omitted.

As shown in FIG. 37, a jig 40 for applying hydrostatic pressure is formed in an airtight box shape with one surface open, and is covered on the surface (the upper surface in FIG. 37) of the insulating member 4 from the opening surface side. Here, the jig 4 that contacts the surface of the insulating member 4
A seal structure is provided on the opening end face of 0.

Then, the insulating member 4 is applied to the surface of the metal plate 3 coated with the adhesive material 13, and the jig 40 is applied to the surface of the insulating member 4. Hydrostatic pressure is applied to the insulating member 4 via the gas (for example, air) in the jig 40.

According to such a method, it is possible to prevent the adhesive material 13 from flowing out from the bonding portion of the metal plate 3 and the insulating member 4 to the mounting surface (the top surface of the protruding portion 11), and the bonded adhesive that has flowed out. The material 13 does not adhere to the mounting surface and hinder the mounting of the light emitting diode 2.

[0094]

According to the first aspect of the present invention, there is provided a light source device in which a light emitting diode is mounted on a substrate, which is adhered and fixed to a metal plate which is a good conductor of heat and one surface of the metal plate by an adhesive material. A substrate made of an insulating member; a protruding portion protruding from the metal plate through the insulating member; and a light-emitting diode mounted on a mounting surface that is the top surface of the protruding portion. Since the preventive means for preventing the adhesive material from flowing out from the adhesive portion to the mounting surface is provided on at least one of the metal plate and the insulating member, the preventive means adheres the adhesive portion of the metal plate and the insulating member to the mounting surface. It is possible to prevent the material from flowing out, and it is possible to prevent the adhesive material that has flowed out from adhering to the mounting surface and hindering the mounting of the light emitting diode.

According to a second aspect of the present invention, in the first aspect of the invention, the preventing means is provided on the metal plate or the insulating member and is composed of a portion where the wettability of the adhesive material is lower than other portions. There is an effect that the adhesive material can be prevented from flowing out to the mounting surface by the portion having low property.

According to the invention of claim 3, in the invention of claim 2, since the adhesive material is solder and the conductor pattern is formed on the adhesive surface side of the insulating member as a portion having high solder wettability,
Since the solder, which is the adhesive material, does not spread to the portion excluding the conductor pattern, the adhesive material can be prevented from flowing out to the mounting surface.

According to a fourth aspect of the invention, in the second aspect of the invention, the adhesive material is epoxy resin or silicon resin, and the substance that repels the adhesive material is disposed near the protrusion.
The fact that the adhesive material is repelled by the above substances has an effect of preventing the adhesive material from flowing out to the mounting surface.

According to the invention of claim 5, in the invention of claim 1, since a plurality of preventing means are provided, it is possible to more reliably prevent the adhesive material from flowing out to the mounting surface.

According to a sixth aspect of the present invention, in the first or fifth aspect of the invention, the preventing means comprises a sloped portion formed on the contact surface between the protrusion or the vicinity of the protrusion of the metal plate and the insulating member.
The same effect as that of the invention of claim 1 or 5 is achieved.

According to a seventh aspect of the present invention, in the first or fifth aspect of the invention, the prevention means is a protrusion formed at the contact portion between the protrusion or the protrusion of the metal plate and the insulating member. This has the effect of preventing the adhesive member from flowing out.

According to an eighth aspect of the present invention, in the first or fifth aspect of the invention, the prevention means is a projection formed by a metal plate so as to surround the periphery of the projecting portion, and the tip portion is a projection that bites into the insulating member. There is an effect that it is possible to prevent the adhesive member from flowing out by the protrusions that bite into the insulating member.

According to a ninth aspect of the present invention, in the first aspect of the invention, the preventing means has the same effect as the first aspect of the invention because the pressure difference is used to prevent the outflow when the adhesive material is cured.

According to a tenth aspect of the present invention, in the ninth aspect of the invention, the preventing means is a reservoir portion for storing excess adhesive material,
Since it has an escape hole that allows the air in the reservoir to escape, the effect of being able to prevent the air in the reservoir from expanding from the escape hole and expanding the air in the reservoir during the curing of the adhesive material can be achieved. is there.

According to the invention of claim 11, in the invention of claim 10, since the metal plate and the insulating member are adhered in a reduced pressure environment, the adhesive material and the air in the reservoir can be extracted to the outside through the escape hole, There is an effect that the protrusion of the adhesive material can be suppressed and the air contained in the adhesive material can be reduced to suppress expansion during heating and curing.

According to a twelfth aspect of the present invention, in the invention of the first aspect, the protrusion is formed separately from the metal plate, and the protrusion is provided with the prevention means, so that the metal plate and the insulating member are bonded to each other. It is possible to separately perform the process and the mounting process of the light emitting diode on the top surface of the protrusion part, and the influence of temperature in the mounting process does not affect the insulating member, and the material of the insulating member or the mounting adhesive This has the effect of expanding the range of choices.

According to the thirteenth aspect of the present invention, since the adhesive material containing the same components as the adhesive agent for die-bonding the light emitting diode to the top surface of the protrusion is used in the first aspect of the invention, the adhesive material that has leaked out is Even if it adheres to the top surface of the protrusion, die bonding is performed using an adhesive containing the same components, so peeling at the interface between the light emitting diode and the mounting surface does not occur easily, and the same components are included. It is possible to perform the bonding process of the metal plate and the insulating member and the mounting process of the light emitting diode on the top surface of the protrusion at the same time by using the adhesive material that has been prepared. There is an effect that it is possible to shorten and prevent the occurrence of defects.

According to a fourteenth aspect of the present invention, a light emitting diode is mounted on a substrate, the substrate is composed of a metal plate which is a good conductor of heat, and an insulating member which is adhesively fixed to one surface of the metal plate with an adhesive material. In a method of manufacturing a light source device, comprising: a protruding portion protruding from a metal plate and penetrating an insulating member; and a light emitting diode mounted on a mounting surface that is a top surface of the protruding portion, the metal plate and the insulating member. Since hydrostatic pressure is applied to the bonding parts of both when bonding the two to form the substrate, it is possible to prevent the bonding material from flowing out from the bonding part of the metal plate and the insulating member to the mounting surface. The effect is that it does not adhere to the mounting surface and hinder the mounting of the light emitting diode.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a first embodiment.

FIG. 2 is an explanatory view illustrating a bonding step of the metal plate and the insulating member in the above.

FIG. 3 is a sectional view showing a main part of another configuration of the above.

FIG. 4 is a cross-sectional view showing the main parts of the second embodiment.

FIG. 5 is an explanatory view illustrating a bonding step of the metal plate and the insulating member in the above.

FIG. 6 is a cross-sectional view showing a main part of another configuration of the above.

FIG. 7 is a cross-sectional view showing the main parts of the third embodiment.

FIG. 8 is a sectional view showing a main part of the fourth embodiment.

FIG. 9 is a sectional view showing a main part of another configuration of the above.

FIG. 10 is a cross-sectional view showing the main parts of the fifth embodiment.

FIG. 11 is a cross-sectional view showing a main part of another configuration of the above.

FIG. 12 is a sectional view showing a main part of the sixth embodiment.

FIG. 13 is a cross-sectional view showing the main parts of the seventh embodiment.

FIG. 14 is a cross-sectional view showing a main part of another configuration of the above.

FIG. 15 is a sectional view showing a main part of still another configuration of the above.

FIG. 16 is a cross-sectional view showing the main parts of the eighth embodiment.

FIG. 17 is a cross-sectional view showing the main parts of another configuration of the above.

FIG. 18 is a sectional view showing a main part of still another configuration of the above.

FIG. 19 is a cross-sectional view showing the main parts of the ninth embodiment.

FIG. 20 is a cross-sectional view showing the main parts of the tenth embodiment.

FIG. 21 is a cross-sectional view showing the main parts of another configuration of the above.

FIG. 22 is a sectional view showing a main part of still another configuration of the above.

FIG. 23 is a sectional view showing a main part of still another configuration of the above.

FIG. 24 is a cross-sectional view showing the main parts of the eleventh embodiment.

FIG. 25 is a cross-sectional view showing the main parts of the twelfth embodiment.

FIG. 26 is a cross-sectional view showing the main parts of another configuration of the above.

FIG. 27 is a cross-sectional view showing the main parts of the thirteenth embodiment.

FIG. 28 is a cross-sectional view showing the main parts of another configuration of the above.

FIG. 29 is a sectional view showing a main part of still another configuration of the above.

FIG. 30 is a cross-sectional view showing the main parts of yet another configuration of the above.

FIG. 31 is a cross-sectional view showing the main parts of the fourteenth embodiment.

FIG. 32 is a cross-sectional view showing the main parts of the fifteenth embodiment.

FIG. 33 is an exploded cross-sectional view showing the main parts of the sixteenth embodiment.

FIG. 34 (a) is a cross-sectional view of the protrusion part in the above.
(B) is an explanatory view for explaining a press-fitting operation of the protrusion to the metal plate.

FIG. 35 is a cross-sectional view showing the main parts of the above.

FIG. 36 is a cross-sectional view showing the main part of the above.

FIG. 37 is an explanatory diagram of the eighteenth embodiment.

FIG. 38 is a cross-sectional view showing a conventional example.

FIG. 39 is a main-portion cross-sectional view showing another conventional example.

[Explanation of symbols]

3 metal plates 4 Insulation member 6 through holes 11 Projection part 13 Adhesive material 20 surrounding wall

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideyoshi Kimura             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Takuma Hashimoto             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Ryoji Imai             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Nobuhiro Yoshioka             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Eitaro Matsui             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company F-term (reference) 5F041 AA03 AA31 AA41 DA03 DA12                       DA20 DA35 DA43 EE25

Claims (14)

[Claims] 1. A light source device in which a light emitting diode is mounted on a substrate, the substrate comprising a metal plate which is a good conductor of heat, and an insulating member which is adhesively fixed to one surface of the metal plate by an adhesive material. A projecting portion protruding from the metal plate through the insulating member and a light emitting diode mounted on the mounting surface that is the top surface of the projecting portion are provided. A light source device, characterized in that a prevention means for preventing the adhesive material from flowing out is provided on at least one of the metal plate and the insulating member. 2. The light source device according to claim 1, wherein the preventing means is provided on the metal plate or the insulating member, and is composed of a portion where the wettability of the adhesive material is lower than that of other portions. 3. The light source device according to claim 2, wherein the adhesive material is solder, and a conductor pattern is formed on the adhesive surface side of the insulating member as a portion having high solder wettability. 4. The light source device according to claim 2, wherein the adhesive material is an epoxy resin or a silicon resin, and a substance that repels the adhesive material is disposed in the vicinity of the protrusion. 5. The light source device according to claim 1, wherein a plurality of prevention means are provided. 6. The light source device according to claim 1 or 5, wherein the preventing means comprises an inclined surface formed on a contact surface between the protruding portion or the protruding portion of the metal plate and the insulating member. 7. The light source device according to claim 1 or 5, wherein the preventing means comprises a protrusion or a protrusion formed at a contact portion between the protrusion of the metal plate and the insulating member. 8. The light source device according to claim 1 or 5, wherein the prevention means is a projection provided from a metal plate so as to surround the circumference of the projecting portion, and the tip portion is a projection that bites into the insulating member. 9. The light source device according to claim 1, wherein the preventing means prevents the outflow by utilizing a pressure difference when the adhesive material is cured. 10. The light source device according to claim 9, wherein the prevention means has a reservoir for accumulating excess adhesive material, and an escape hole for allowing air in the reservoir to escape. 11. The light source device according to claim 10, wherein the metal plate and the insulating member are bonded to each other under a reduced pressure environment. 12. The light source device according to claim 1, wherein the protrusion is formed separately from the metal plate, and the protrusion is provided with a prevention means. 13. The light source device according to claim 1, wherein an adhesive material containing the same component as an adhesive agent for die-bonding the light emitting diode to the top surface of the protrusion is used. 14. A substrate, which comprises a light emitting diode mounted on a substrate and which is a good conductor of heat, and an insulating member which is adhered and fixed to one surface of the metal plate by an adhesive material, and an insulating member from the metal plate. In a method of manufacturing a light source device, comprising: a protruding portion penetrating through a protrusion and a light emitting diode mounted on a mounting surface which is a top surface of the protruding portion, a substrate is obtained by bonding a metal plate and an insulating member. A method of manufacturing a light source device, characterized in that hydrostatic pressure is applied to the bonding site between the two when forming.