JP2003037256A - Package type solid-state image pickup element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image pickup element, capable of preventing sticking of foreign materials to a light receiving part in a package type solid- state image pickup element, for which a solid-state image pickup element chip, having a light-receiving part is sealed inside a package, and the opening part of a package facing the light-receiving part is covered with a light-transmitting member. SOLUTION: The package type solid-state image pickup element is provided with at least the package having an internal space, the solid-state image pickup element chip, having the light-receiving part sealed inside the internal space and the light-transmitting member arranged at the opening part of the package facing the light-receiving part to turn the internal space into a tightly sealed space, and an adhesive material layer is formed on the inner wall surface of the package forming the internal space.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image sensor, and more particularly to a package type solid-state image sensor in which a solid-state image sensor chip is enclosed in a package.

[0002]

2. Description of the Related Art In recent years, using a video camera or a digital camera, an object such as a desired landscape or a person is photographed, converted into an electric signal, and the obtained electric signal is imaged and displayed on a monitor screen such as a CRT or a liquid crystal display device. It is easy to display on the monitor. Also, a personal computer,
It can be said that there are many opportunities to attach digital image data to the exchange of e-mail using a mobile phone, and it can be said that interest in electronic imaging devices represented by video cameras and digital cameras is increasing.

FIG. 7 is a schematic diagram showing a solid-state image pickup device 702 incorporated in an electronic image pickup device. As shown in FIG. 7, the solid-state imaging device 702 mainly includes a storage container 703 having a solid-state imaging device 71, an optical system mechanism 706 including a lens 704 that collects incident light, a lens barrel 705 that holds the lens, and the like. As a component. Other components of the solid-state imaging device include various electronic components for converting electric signals, mechanical driving mechanisms such as shutters, etc., but they are not shown for convenience of description.

As shown in FIG. 7, a solid-state image pickup element 71 is one of the main components of the solid-state image pickup device. The solid-state image pickup device has a solid-state image pickup device chip represented by CCD and CMOS, and has a function of converting light entering the inside of the solid-state image pickup device through an optical system mechanism into an electric signal.

A package type solid-state image pickup device is known as a solid-state image pickup device. As shown in FIGS. 5 and 6, the package type solid-state image pickup device 51 has a solid-state image pickup device chip 53 such as CCD or CMOS mounted in a package 52 made of plastic, ceramic, glass or the like. That is, the package 52 has an internal space 54 for storing the solid-state image sensor chip 53 therein, and the solid-state image sensor chip 53 is arranged in the internal space 54. 6 is a perspective explanatory view of the package type solid-state imaging device 51, and FIG.
-Shows a sectional view taken along the line Y. Light that has entered the solid-state imaging device is converted into an electric signal by the solid-state imaging device 51.
Therefore, the opening 5 is provided in the internal space 54 so that light may enter.
5 is formed. Light enters the solid-state image sensor 51 through the opening 55, and the light is converted into an electric signal after being incident on the light-receiving section 56 formed in the solid-state image sensor chip 53.

Usually, a translucent member such as glass or plastic is fixed to the opening 55 formed in the package 52 with an adhesive or the like as a lid (hereinafter, a member for covering the opening 55 of the package 52). Is referred to as a transparent member 57). That is, by covering with the translucent member 57,
Foreign matter such as dust is prevented from entering the internal space 54 of the solid-state imaging device 51, and moisture from the surrounding atmosphere enters the device by making the internal space 54 of the solid-state imaging device 51 a closed space. To improve the durability of the device. In the general package type solid-state imaging device 51, an external connection terminal 58 is provided on the outer periphery as shown in the figure, mainly for the purpose of electrically connecting to an external device. One end of the external connection terminal 58 extends into the internal space 54 to become an inner lead 59, and each electrode pad (not shown) formed on the solid-state imaging device chip 53 and each inner lead 59 are bonded with a metal wire 60. And electrical connection is made. Although not shown, gold bumps may be used to connect the electrode pads to the inner leads. The electric signal converted from light by the solid-state image sensor chip 53 is sent to various devices and elements arranged outside the solid-state image sensor 51 via the external connection terminal 58.

Here, in the solid-state image pickup device 51, when foreign matter such as dust adheres to the light receiving portion 56 of the solid-state image pickup device chip 53, the foreign matter-attached portion becomes a shadow because the incident light is blocked, and the electric power of the incident light is reduced. Signaling is hindered. As a result, what is called a flaw display is displayed on the monitor screen as if there were flaws on the foreign matter-attached portion. Hereinafter, the fact that the foreign matter-attached portion is displayed as if it were a flaw during the nitter display due to the foreign matter attached to the light receiving unit is referred to as a flaw indication.

In the manufacture of the solid-state image pickup element, sufficient care is taken to prevent foreign matter such as dust from adhering to the light receiving section 56, for example, in a clean room.
However, in reality, it is difficult to prevent foreign matter from entering the internal space 54 in the solid-state imaging device 51, and it can be said that it is impossible to prevent the foreign matter from adhering to the light receiving unit 56.

That is, no matter how the solid-state image pickup device is manufactured in a clean room, metal scraps, mist-like oil, etc. are generated as foreign matters from the apparatus constituting the manufacturing process, and the worker also wears clothes. However, it is inevitable that skin pieces will be generated as foreign matter. It can be said that the foreign matter generated from such an apparatus or an operator is floating in the atmosphere around the solid-state image sensor in the manufacturing process.

Therefore, the solid-state image pickup device 51 shown in FIGS.
In the package 52
When it is stored inside, foreign matter floating in the surrounding atmosphere is taken into the internal space 54. Even when the opening 55 of the package 52 is covered with the translucent member 57, foreign matter enters the internal space 54 through the opening 55 before covering.

As shown in FIG. 4, foreign matter that has entered the internal space 54 of the package type solid-state image pickup device 51 and is floating in the space falls on the light receiving portion 56 of the solid-state image pickup device chip 53 with the passage of time. Therefore, it was a cause of scratches on the monitor display.

In recent years, as represented by digital cameras, the number of pixels has increased to several millions, and the pixels formed on the solid-state image pickup element chip 53 have become finer. For this reason, even if an extremely fine foreign substance adheres to the light receiving unit 56, the image display is affected.

[0013]

The present invention has been made in view of the above problems. That is, the present invention is a package type solid-state imaging device in which a solid-state imaging device chip having a light-receiving part is mounted in a package, and an opening of the package facing the light-receiving part is covered with a translucent member. It is intended to provide a solid-state image sensor capable of preventing adhesion, and to provide a monitor display without a scratch display due to adhesion of foreign matter.

[0014]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and in claim 1, a solid-state image pickup having a package having an internal space and a light receiving section mounted in the internal space of the package. In a package type solid-state imaging device having at least an element chip and a light-transmissive member which is arranged in an opening of a package facing the light-receiving section and has the internal space as a closed space, an adhesive is applied to an inner wall surface of a package forming the internal space. This is a package type solid-state image pickup device characterized in that an agent layer is formed.

Next, in claim 2, an adhesive layer is also formed on the surface of the solid-state image pickup device chip exposed to the internal space except the light receiving portion, and the package type solid-state image pickup according to claim 1. It is an element.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An example of an embodiment of a solid-state image pickup device according to the present invention will be described below with reference to the drawings.

FIG. 1 shows a solid-state image pickup device 11 according to the present invention.
It is sectional drawing which shows the principal part of an example typically. The solid-state image pickup device 11 according to the present embodiment shown in FIG. 1 has the same configuration as the conventional solid-state image pickup device 51 described with reference to FIGS.

That is, the internal space 1 of the package 12 made of plastic, ceramic, glass or the like.
Solid-state image sensor chip 13 such as CCD or CMOS in 4
It is equipped with. The internal space 14 has a light entrance opening 1
5 is formed, and the light incident through the opening 15 is incident on the light receiving portion 16 formed in the solid-state image sensor chip 13 and converted into an electric signal.

In addition, a transparent member 17 such as glass or plastic that can transmit light is fixed to the opening 15 as a lid with an adhesive or the like. Further, the external connection terminals 18 are provided on the outer periphery for the main purpose of electrically connecting with an external device. One end of the external connection terminal 18 has an internal space 1
4 to form inner leads 19, each electrode pad (not shown) formed on the solid-state image pickup device chip 13 and each inner lead 19 are bonded by a metal wire 20 for electrical connection.

Here, as shown in FIG. 1, the solid-state image pickup device 11 of the present invention is characterized in that the adhesive layer 1 is formed on the inner wall surface of the package 12 forming the internal space 14 for housing the solid-state image pickup device chip 13. To do.

That is, the feature of the solid-state image pickup device 11 of the present invention is that the pressure-sensitive adhesive layer 1 is formed on the portion exposed to the internal space 14 as shown in FIG. As a result, as shown in FIG. 3, foreign substances that enter the internal space 34 and float in the space before being covered with the translucent member 37 to form a closed space are caught by the adhesive layer 1. The foreign matter once trapped in the pressure-sensitive adhesive layer 1 will be attached to the pressure-sensitive adhesive layer 1 as it is, and will not fall onto the light receiving portion 36. Further, even if the foreign matter falls on the light receiving section 36, the foreign matter is easily detached from the light receiving section 36 by giving vibrations such as shaking to the solid-state imaging element 31 or reversing the solid-state imaging element 31. The detached foreign matter is caught by the adhesive layer 1 and does not fall onto the light receiving unit 36 again.

Next, FIG. 2 is a sectional view schematically showing an example of another solid-state image pickup device 21 according to the present invention. The solid-state image pickup device 21 of FIG. 2 also has the same structure as the solid-state image pickup device 51 described in FIG. 5 and FIG.

Here, as a feature of the solid-state image pickup device 21 of the present invention, the adhesive layer 1 is also formed on the surface of the solid-state image pickup element chip 23 excluding the light receiving portion 26.

As a result, it is possible to increase the number of areas of the pressure-sensitive adhesive layer to which foreign matter is attached, and it is possible to improve the efficiency of foreign matter attachment. It should be noted that if the adhesive layer is formed on the light receiving portion 26, the foreign matter that has fallen onto the light receiving portion 26 will adhere to the light receiving portion 26 as it is, which is not preferable.

Here, the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 1 is not particularly limited, but it is desirable that it does not vaporize and affects the solid-state image pickup device chip. Further, it is preferable that the solid-state image sensor does not fluidize or deteriorate at the temperature in the usage environment, and further, it is preferable that the material and the refractive index do not diffusely reflect the incident light entering the internal space. The pressure-sensitive adhesive may be appropriately selected in consideration of the usage environment of the solid-state image pickup device. For example, acrylic pressure-sensitive adhesive, SEB
The S-based pressure-sensitive adhesive is preferably used. From the viewpoint of the refractive index, if the inner space is air, it is desirable to use a material having a low refractive index close to the refractive index (n = 1) of air (for example, a pressure-sensitive adhesive made of a fluorine-based resin), Also,
If filling the interior space with a gas such as nitrogen,
It is desirable to select a material having a refractive index close to that of the filling gas.

Next, as the means for forming the pressure-sensitive adhesive layer, coating, spray coating and the like can be mentioned. Considering the constitution of the solid-state image pickup element, etc., the pressure-sensitive adhesive is formed on the light-receiving surface or the light transmitting member when forming the pressure-sensitive adhesive layer. The forming means may be appropriately selected so as not to adhere.

Although the example of the embodiment of the solid-state image pickup device of the present invention has been described above, the embodiment of the present invention is not limited to the above description and drawings, and various modifications can be made based on the gist of the present invention. It goes without saying that you can go.

For example, the pressure-sensitive adhesive layer may be formed on the transparent member portion except the portion facing the light receiving portion. Further, in the above description, the electrical connection between the electrode pad and the inner lead is made by wire bonding, but the electrical connection may be made by a gold bump.

[0029]

In the solid-state image sensor of the present invention, the adhesive layer is formed on the inner wall surface of the package on which the solid-state image sensor chip is mounted. The foreign matter floating in the internal space is caught by the adhesive layer and adheres to the adhesive layer as it is.
Further, even when a foreign substance falls on the light receiving unit, it is possible to remove the foreign substance from the light receiving unit by vibrating and reversing the solid-state image sensor, and the removed foreign substance is captured by the adhesive layer, It does not re-deposit on the light receiving part.

In other words, the solid-state image pickup device of the present invention can prevent the scratch display at the time of the monitor display caused by the foreign matter that has entered the internal space and is attached to the light receiving portion, and can realize the excellent monitor display.

Conventionally, a solid-state image pickup device in which foreign matter that has entered the internal space during the manufacturing process falls on the light receiving portion and causes a scratch display during monitor display is a defective product in an inspection before shipping the product to the market. It was often hit and unable to ship to the market. That is, even if a foreign substance that has fallen onto the light receiving unit is removed from the light receiving unit by vibration or reversal of the solid-state image sensor and the inspection is passed, the removed foreign substance exists in the sealed internal space. Therefore, it may not be shipped to the market because it may adhere to the light receiving unit again. Therefore, the solid-state imaging device must be re-produced according to the number of defective products, which causes problems such as a decrease in manufacturing efficiency and an increase in manufacturing cost.

In the solid-state image pickup device of the present invention, however, foreign matter that has entered the space during the manufacturing process adheres to the adhesive layer, and can prevent the display of scratches by adhering to the light receiving portion. Moreover, even if foreign matter is found to have adhered to the light receiving part during inspection and once it becomes a defective product, it should be removed from the light receiving part by vibration or reversal of the solid-state image sensor. The removed foreign matter is captured by the pressure-sensitive adhesive layer and prevented from re-adhering on the light receiving portion. In other words, even a defective product can be shipped as a good product. As described above, by adopting the structure of the solid-state image pickup device of the present invention, it is possible to significantly reduce the number of defective products, prevent a decrease in manufacturing efficiency due to remanufacturing, and save material. It also has the effect of becoming.

[0033]

[Brief description of drawings]

FIG. 1 is a sectional explanatory view schematically showing a main part of an embodiment of a solid-state image pickup device of the present invention.

FIG. 2 is a sectional explanatory view schematically showing a main part of another embodiment of the solid-state imaging device of the present invention.

FIG. 3 is an explanatory view showing an example of adhesion of foreign matter to an adhesive layer.

FIG. 4 is an explanatory view showing an example of foreign matter falling on a light receiving surface.

FIG. 5 is a cross-sectional explanatory view schematically showing a main part of an example of a conventional solid-state imaging device.

FIG. 6 is a perspective explanatory view schematically showing a main part of an example of a conventional solid-state imaging device.

FIG. 7 is an explanatory diagram schematically showing a main part of a solid-state imaging device.

[Simple explanation of symbols]

1 ...
・ Adhesive layers 11, 21, 31, 51, 71 ・ ・
..Solid-state image pickup devices 12, 22, 32, 52 ...
Package 13, 23, 33, 53 ...
.... Solid-state image pickup device chips 14, 24, 34, 54
・ Internal spaces 15, 25, 35, 55 ・ ・ ・ ・
Openings 16, 26, 36, 56 ..... Light receiving parts 17, 27, 37, 57 ..... Translucent members 18, 28, 58 ..
..Connecting terminals 19, 29, 59 ...
・ Inner leads 20, 30, 60 ・
... Wire 702
... Solid-state imaging device 703
... Storage container 704
... Lens 705
... Lens 706
... Optical system mechanism 707
... Transparent substrate

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4M118 AA10 BA10 BA14 HA02 HA30                       HA31 HA40

Claims (2)

[Claims] 1. A package having an internal space, a solid-state image sensor chip having a light receiving section mounted in the internal space of the package, and an internal space disposed in an opening of the package facing the light receiving section. What is claimed is: 1. A packaged solid-state imaging device comprising at least a light-transmitting member as a closed space, wherein an adhesive layer is formed on an inner wall surface of a package forming an internal space. 2. The package type solid-state image pickup device according to claim 1, wherein an adhesive layer is also formed on the surface of the solid-state image pickup device chip exposed in the internal space except for the light receiving portion.