JP2003031727A5 - - Google Patents
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- JP2003031727A5 JP2003031727A5 JP2001215297A JP2001215297A JP2003031727A5 JP 2003031727 A5 JP2003031727 A5 JP 2003031727A5 JP 2001215297 A JP2001215297 A JP 2001215297A JP 2001215297 A JP2001215297 A JP 2001215297A JP 2003031727 A5 JP2003031727 A5 JP 2003031727A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001215297A JP4259774B2 (ja) | 2001-07-16 | 2001-07-16 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001215297A JP4259774B2 (ja) | 2001-07-16 | 2001-07-16 | 半導体装置およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003031727A JP2003031727A (ja) | 2003-01-31 |
| JP2003031727A5 true JP2003031727A5 (ja) | 2008-08-28 |
| JP4259774B2 JP4259774B2 (ja) | 2009-04-30 |
Family
ID=19049967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001215297A Expired - Fee Related JP4259774B2 (ja) | 2001-07-16 | 2001-07-16 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4259774B2 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI331370B (en) | 2004-06-18 | 2010-10-01 | Megica Corp | Connection between two circuitry components |
| US8022544B2 (en) | 2004-07-09 | 2011-09-20 | Megica Corporation | Chip structure |
| US7465654B2 (en) | 2004-07-09 | 2008-12-16 | Megica Corporation | Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures |
| US7452803B2 (en) | 2004-08-12 | 2008-11-18 | Megica Corporation | Method for fabricating chip structure |
| CN1901161B (zh) | 2005-07-22 | 2010-10-27 | 米辑电子股份有限公司 | 连续电镀制作线路组件的方法及线路组件结构 |
| KR100886714B1 (ko) | 2007-10-10 | 2009-03-04 | 주식회사 하이닉스반도체 | 반도체 칩 |
| KR101138592B1 (ko) | 2010-08-18 | 2012-05-10 | 삼성전기주식회사 | 미세 피치 범프를 구비한 기판과 이의 제조 방법 |
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2001
- 2001-07-16 JP JP2001215297A patent/JP4259774B2/ja not_active Expired - Fee Related