JP2003025706A - Method and device for printing pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform a printing without bringing a printing plate into contact with a substrate for preventing the substrate from being stained through the contact with the printing plate at the printing of the pattern of an electronic part or the like with an ink on the substrate. SOLUTION: Printing with non-contact of the substrate with the printing plate can be realized by blasting the ink from an ink blasting mask against the substrate by a method wherein a high pressure gas is used after the charging of the ink in the ink blasting mask, on which a through pattern is formed or the pressure on the substrate side of the ink blasting mask is temporarily made lower as compared with the pressure on the opposite side of the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing method used for forming a wiring pattern on an electronic component or a display or a pattern of an etching resist, and more particularly to a working substrate and an ink spray used as a printing plate. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern printing method and apparatus by spraying ink from a mask using a high-pressure gas without bringing the mask into contact with a work substrate.

[0002]

2. Description of the Related Art Conventionally, a screen printing method has been generally used as a printing method of ink used for forming a wiring pattern on an electronic part or the like or a display and a pattern forming of an etching resist, and thus a pattern is formed. A rubber squeegee was used for the screen plate, and the ink was printed directly on the substrate.

[0003]

In the conventional screen printing method, the ink is printed while the ink is brought into contact with the substrate by the squeegee through the screen printing plate, so that foreign matter or the like adheres to the substrate side of the screen printing plate. In this case, there is a problem that it adheres to the substrate and contaminates the substrate, and in particular, contaminating the substrate in the wiring pattern of a display or an electronic component causes a problem that the yield of product manufacturing is deteriorated.

[0004]

As a method for solving the above-mentioned problems, as a method of etching and / or photo-processing and / or sandblasting and / or laser processing, a through pattern is formed of glass, ceramic, metal, resin or a composite material thereof. For printing a mask for spraying ink with a resin pattern formed on the screen mesh by photo process after forming a film of the photosensitive resin by forming it on the plate material or by applying a photosensitive resin liquid on the screen mesh After filling the ink through the pattern part of the mask for spraying this ink, use a high pressure gas whose gas pressure is higher than atmospheric pressure with the mask for spraying ink and the work piece separated Or temporarily apply the pressure on the substrate side of the ink spray mask to the side opposite the substrate. A pattern was printed on a workpiece by spraying the ink in the ink spray mask onto a plate or cylindrical workpiece to the workpiece by lowering compared to the force.

Hereinafter, a mask for spraying ink used as a printing plate will be referred to as an ink spray mask hereinafter.

As a method for forming a penetrating pattern of an ink spraying mask, a chemical etching is performed after a pattern is formed on the material of the ink spraying mask with a photoresist or the like, a photoresist for sandblasting or the like is used, and an abrasive is used by sandblasting. A method of forming by cutting, a method of using a laser such as an excimer laser, a carbon dioxide gas laser, or a yag laser, a method of forming by a photo process using a resin or glass having a photosensitivity as an ink spraying material. There is.

When a penetrating pattern is formed on a plate using an ink spraying mask, for example, a pattern with islands such as double circles cannot be held because the part of the island drops and a mesh is formed on one side of the plate on which the penetrating pattern is formed. Use a pasted ink spray mask and use a mesh made of metal wire such as stainless steel or nickel or resin wire such as tetron or nylon woven in a grid pattern or a plate material such as metal so that the pattern remains in a grid pattern. The one formed by etching or the like is used.

Other methods for forming an ink spray mask include metals such as stainless steel and nickel, or tetron,
Apply a photosensitive resin liquid to the screen mesh formed by weaving wire rods made of resin such as nylon or the like in a grid pattern or by etching a plate material such as metal so that the pattern remains in a grid pattern The ink spraying mask may be formed by forming a resin film on the screen mesh by a photo process after forming a film of a photosensitive resin by pasting a transparent film.

When a brittle material such as ceramic or glass that is hard and is not easily deformed is used as the material of the ink spraying mask, the ink spraying mask is filled with ink, and then the ink spraying mask is brought close to the work piece. The ink filled in the through pattern part of is sprayed on the work piece using a high-pressure gas whose gas pressure is higher than atmospheric pressure, or the pressure on the substrate side of the ink spray mask is temporarily lower than that on the opposite side of the substrate. By doing so, the ink in the ink spraying mask is sprayed onto the workpiece to form a print pattern on the workpiece.

When a flexible material such as metal or resin is used as the material of the ink spraying mask, the distance between the ink spraying mask and the workpiece cannot be kept constant only by holding the ink spraying mask as it is. Since it becomes difficult to keep the distance between the ink spray mask and the workpiece constant, after applying the material of the ink spray mask to the frame,
A method of forming a penetrating pattern and pressing the ink spraying mask in the direction of the work piece by the mask pressing portion to keep the distance between the ink spraying mask and the work piece constant by the tension of the ink spraying mask and spray the ink on the work piece. Also, use a magnetic material such as ferrite, stainless steel, nickel, or cobalt that attracts magnets to part or all of the material of the ink spray mask, or attach magnetic material powder to the ink spray mask using a resin binder or the like. Or by mixing powder of magnetic material into resin such as photosensitive resin to give magnetism to the ink spray mask, and using a magnet to draw ink while attracting the ink spray mask to the magnet to create an ink spray mask. Printing while keeping a constant distance from the work piece

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a pattern printing method and apparatus by spraying the ink of the present invention on a workpiece will be described below with reference to the drawings.

In the penetrating pattern portion of the ink spraying mask 1 of FIG. 1, the ink 7 is filled with the ink 7 at (1-1).
To fill the ink 7.

As the ink-filling spatula 5, resin, rubber,
Any material such as metal may be used as long as the ink on the surface of the ink spraying mask 1 can be cut off and the penetrating pattern portion can be filled with the ink 7. For example, a squeegee used for screen printing may be used.

As a method of forming the penetrating pattern of the ink spray mask 1, when the material is ceramic, a method of forming a pattern on the surface with a resist and then sandblasting it, or using a laser such as a yag laser or a carbon dioxide gas laser is used. There are a method of forming, a method of forming a hole by drilling, and a method of forming a penetrating pattern using an abrasive by ultrasonic processing.

When the material is glass, in addition to the same method as for ceramics, there is a method for forming by a photo process using photosensitive glass.

When the material is metal, there are a method of forming by wet etching and a method of forming by laser, and in the case of resin, there is a method of forming a pattern by a photo process using a photosensitive resin.

The direction of filling ink is (1) in FIG.
As shown in -1), a spatula for ink emphasis is used to fill from the top, or from the bottom as shown in (2-1) of FIG.

When the pattern to be printed is an island pattern in the pattern as shown in FIG. 9, it is necessary to hold the island portion, and the screen mesh 11 is provided on one side of the ink spray mask 1 as shown in FIG. Do not fall.

When the screen mesh 11 is used, it is desirable to provide the screen mesh 11 on the high pressure gas spray nozzle 8 side of the ink spray mask 1.

As shown in (1-2) of FIG. 1, (2-2) of FIG. 2 and (2-3) of FIG. Printing is performed by spraying the ink 7 onto the work piece 3 using a high pressure gas 23 such as high pressure air.

The blowing pressure from the high pressure gas injection nozzle 8 is preferably 0.01 MPa or more, and 0.2 MPa.
Set to the following pressure.

As another method of spraying the ink 7 from the ink spraying mask 1 onto the workpiece 3, as shown in FIG. 7, after filling the ink spraying mask 1 with the ink, the space between the ink spraying mask 1 and the workpiece 3 is filled. Is temporarily lower than the atmospheric pressure and the atmosphere is introduced from the atmospheric pressure to spray the ink in the ink spray mask 1 onto the workpiece, and as shown in FIG. 8, the ink spray mask is opposite to the workpiece side. There is a method in which the ink in the ink spraying mask is sprayed on the workpiece by temporarily increasing the surface pressure of the surface to the atmospheric pressure.

If the distance between the ink spraying mask 1 and the work piece 3 is too short, the sprayed ink adheres to the ink spraying mask 1 and clean printing cannot be performed. Since high printing cannot be performed, the distance between the ink spray mask 1 and the workpiece 3 is set to 0.01 mm or more and 3 mm or less.

As the ink spraying mask 1, a screen plate used in screen printing as shown in FIGS. 4, 5 and 6 may be used.

As a method of keeping the distance between the ink spraying mask 1 and the work piece 3 constant, the mask holding part 6 or the high pressure gas spraying nozzle 8 is used as shown in FIG. And keep the distance between the ink spray mask and the work piece constant by the tension of the ink spray mask, or use a magnetic material for a part or the entire surface of the ink spray mask as shown in FIG. Then, the magnet 28 is used to hold the ink spraying mask at a constant height to keep the distance between the ink spraying mask and the workpiece constant.

When a screen printing plate for screen printing is used, the screen printing plate can be made into a magnetic material by mixing a magnetic resin powder such as nickel or ferrite with a photosensitive resin (photosensitive emulsion) used for screen printing. it can.

When the workpiece is not a plate but a cylinder as shown in FIG. 6, the high pressure gas spray nozzle 8 is fixed, and the workpiece 3 is rotated to rotate the ink spray mask 1
By moving the, it becomes possible to perform printing without bringing the workpiece and the ink spray mask into contact with the circumference of the cylinder.

Example 1 A YAG laser was used on a 0.5 mm alumina substrate as an ink spray mask.
A 0.5 mm through hole was formed.

After forming a 0.5 mm through hole in the glass substrate by sandblasting, the distance between the ink spray mask and the glass substrate is separated by 0.1 mm, and a screen printing squeegee is used in the through hole of the ink spray mask. After filling with silver paste, the silver paste in the ink spray mask is sprayed with high pressure gas at a pressure of 0.03 MPa, the silver paste is applied to the through holes formed in the glass substrate, and the top and bottom surfaces of the glass substrate are electrically connected. I went.

Example 2 A screen mesh of stainless 200 mesh was used, a plate for screen printing was used as an ink spraying mask, a squeegee for screen printing was used, and the screen mesh was filled with silver paste. , The ink pressing mask is pressed against the ceramic base material side by the mask pressing part, and the distance between the ink spraying mask and the ceramic substrate is set to 100 μm,
High-pressure air of 0.05 MPa was blown from a high-pressure gas blowing nozzle to form a wiring pattern of silver paste on the ceramic substrate.

[0031]

EFFECTS OF THE INVENTION In pattern printing for printing a wiring pattern or the like on electronic parts or the like, by printing the ink spray mask used as a printing plate and the work piece in a non-contact manner, the work piece can be kept clean. It is possible to print patterns.

[Brief description of drawings]

FIG. 1 is a process diagram of a method of filling ink from above an ink spray mask and spraying the ink.

FIG. 2 is a process diagram of a method of filling ink from below the ink spray mask and spraying the ink.

FIG. 3 is a process diagram using an ink spray mask having a screen mesh on one side.

FIG. 4 is a process diagram of a method of spraying ink while using an ink spraying mask that uses a screen mesh and holding the mask by a mask pressing portion.

FIG. 5 is a process diagram of a method of spraying ink while holding an ink spray mask using a magnet.

FIG. 6 is a process diagram of processing a cylindrical workpiece.

FIG. 7 is a process diagram of a method of spraying ink by setting a negative pressure below atmospheric pressure between the ink spray mask and the workpiece.

FIG. 8 is a process diagram of a method of ejecting ink by setting the surface of the ink ejection mask opposite to the workpiece to a pressure of atmospheric pressure or higher.

[Figure 9] Processing pattern diagram

[Explanation of symbols]

1 ink spray mask 3 Workpiece 5 Spatula for ink filling 6 Mask holding part 7 ink 8 High-pressure gas spray nozzle 11 screen mesh 15 frames 17 Negative pressure holding unit 20 pressure tube 21 Pressure-resistant hose 22 Negative pressure below atmospheric pressure 23 High pressure gas 25 High pressure holding unit 28 magnets 30 printing table

Claims (12)

[Claims] 1. A process is performed by filling ink into a penetrating pattern portion of an ink spraying mask having a penetrating pattern and then spraying the ink in the ink spraying mask onto a workpiece located at a position away from the ink spraying mask. A method for printing a pattern on a workpiece, which comprises performing pattern printing on the workpiece. 2. A workpiece which is located away from the ink spray mask after ink has been filled into the penetrated pattern portion and / or mesh portion of an ink spray mask having a mesh attached to one side of a plate having a through pattern formed thereon. A pattern printing method on a pattern substrate, characterized in that pattern printing is performed on a work by spraying ink in an ink spray mask onto the pattern. 3. A resin portion and / or mesh portion of an ink spray mask in which a photosensitive resin film is formed by applying a photosensitive resin liquid on the screen mesh and then a resin pattern is formed on the screen mesh by a photo process. Pattern filling method of performing pattern printing on a workpiece by filling the ink in the mask and then spraying the ink in the ink spraying mask on the workpiece. 4. A method for spraying the ink in the ink spray mask according to claim 1 onto a workpiece, wherein high pressure gas higher than atmospheric pressure is used to spray the high pressure gas onto the ink spray mask, A method of pattern printing on a workpiece, which comprises performing pattern printing on the workpiece by spraying ink onto the workpiece. 5. A method for spraying the ink in the ink spray mask according to claim 1 onto a workpiece, by lowering the pressure on the substrate side of the ink spray mask as compared with the pressure on the side opposite to the substrate. A method for printing a pattern on a workpiece, which comprises performing pattern printing on the workpiece by spraying ink in a spray mask. 6. The method of forming a through pattern according to claim 1, wherein the etching and / or photo process and / or
Alternatively, a pattern printing method characterized by forming by sandblasting and / or laser processing. 7. The mask material according to claim 1, wherein:
A pattern printing method comprising glass, ceramic, metal, resin, or a composite material thereof. 8. The pattern printing method according to claim 1, wherein the distance between the ink spraying mask and the workpiece is 0.0.
A pattern printing device having a size of 1 mm or more and 2 mm or less. 9. The pattern printing method according to any one of claims 1 to 7, wherein the ink spraying mask is pressed toward the work piece by a mask pressing portion or / and a high-pressure gas nozzle, and the work piece and the ink spraying mask are tensioned by the ink spraying mask. A pattern printing device characterized by holding a constant distance 10. The pattern printing method according to any one of claims 1 to 7, wherein a magnetic material is used for a part or the whole surface of the ink spray mask, and the magnet is used to draw the ink spray mask to the side opposite to the workpiece. The pattern printing device is characterized in that the distance between the workpiece and the ink spraying mask is kept constant. 11. The pattern printing method according to claim 5,
A pattern characterized by temporarily lowering the pressure between the ink spray mask and the workpiece compared to atmospheric pressure in order to lower the pressure on the substrate side of the ink spray mask compared to the pressure on the side opposite to the substrate. Printing device. 12. The pattern printing method according to claim 5,
In order to lower the pressure on the substrate side of the ink spray mask compared to the pressure on the opposite side of the substrate, the surface of the ink spray mask on the side opposite to the workpiece is temporarily increased to atmospheric pressure. Pattern printing device.