JP2003017202A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket effective as a measure against sitting defect generated in storing an IC package at the time of mounting, such as a burn-in test and a handler test, in a final inspection process through improvement of storage efficiency of the IC package, which can improve productivity by reducing process defect due to bending or contact error caused by the sitting defect of the IC package, and can reduce the running cost. SOLUTION: The IC socket is provided with a fixed socket body, a movable pedestal fitted in free adjustment to the socket body, and a movable cam mechanism mounted on the movable pedestal in free adjustment on the socket body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC having a positioning pedestal for improving and improving the seatability of an IC package.
The present invention relates to a socket, which is particularly effective in improving the efficiency of storing an IC package, and is effective as a measure against a seating defect that occurs when the IC package is stored during mounting, such as a burn-in test or a handler test in the final inspection process. The present invention relates to an IC socket having a positioning pedestal capable of reducing running costs.

[0002]

2. Description of the Related Art Conventionally, as an IC package or the like as an electric component, there is known an IC socket in which a positioning pedestal is fixed or mounted so as to be movable back and forth on a socket body to which an IC socket is fixed.

[0003]

A conventional IC as described above.
In the case of a package or the like, the IC package is inserted into the IC socket by an automatic machine or manually, and in particular, when the IC package or the like is inserted into the IC socket, seating failure may occur on the positioning base of the IC socket. However, there have been problems such as a troublesome and troublesome process due to a process defect due to bending of the IC lead or a contact error.

Therefore, an object of the present invention is to improve the efficiency by solving the problems in the prior art by reducing process defects such as bending of IC leads and contact errors due to poor seating of the IC package. An object of the present invention is to provide an IC socket having a positioning base for an IC package that can be improved.

[0005]

In order to achieve the above-mentioned object, an IC socket of the present invention has a fixed socket body, a movable pedestal adjustably attached to the socket body, and the movable pedestal is adjustable. And a movable cam mechanism attached to the socket body.

Further, the IC socket of the present invention is characterized in that the movable pedestal is adjustably attached to the socket body via the movable cam mechanism.

Further, in the IC socket of the present invention, the movable cam mechanism includes a cam member provided on the socket body and a driven member provided on the movable pedestal.

Further, in the IC socket of the present invention, the cam member comprises a protrusion formed on the movable base, and the driven member has a shape corresponding to the protrusion formed on the socket body. It is characterized by comprising a plurality of continuous depressions.

The IC socket of the present invention is characterized in that the protrusion of the cam member has a corrugated shape with a semicircular cross section, and the recessed portion of the driven member has a continuous corrugated shape with a semicircular cross section.

The IC socket of the present invention is characterized in that an IC package is mounted on the movable pedestal.

Other objects, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the IC socket of the present invention shown in the accompanying drawings.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment) FIGS. 1 and 2 are a central vertical sectional view and a plan view showing an embodiment of an IC socket of the present invention.

As shown in FIGS. 1 and 2, an IC socket 1 of the present invention has a fixed socket body 2 and a movable pedestal 3 which is adjustably attached to the socket body 2.
The movable pedestal 3 is adjustably mounted on the socket body 2, and the movable cam mechanism 4 is provided.
Is formed of a cam member 5 provided on the movable base 3 and a driven member 6 provided on the socket body 2.

In such an IC socket 1 of the present invention, the movable pedestal 3 is formed of the pedestal 7 and the pedestal member 8 and acts as a positioning pedestal. The pedestal member 8 is formed in a frame shape so as to surround it, and the pedestal member 8 is adjustably and integrally attached to the pedestal plate 7 by a connecting member 9 such as a spring member or a screw member.

In the movable cam mechanism 4 that adjustably mounts the movable pedestal 3 on the socket body 2, the cam member 5 is composed of one protrusion 10 formed on the movable pedestal 3, and the driven member 6 is mounted on the socket body 2. It is formed of a plurality of concavo-convex portions 11 having a corrugated cross-section and having a shape corresponding to the protrusion 10.

As shown in the figure, in the movable cam mechanism 4 of the IC socket 1 of the present invention, the protrusion 10 is a semicircular protrusion having a corrugated cross section, and the uneven portion 11 has a continuous corrugated cross section. The semi-circular projections 11a and the depressions 11b are formed alternately and continuously, and the projections 10 having a semi-circular cross-section have a semi-circular depression 11b having a semi-circular cross-section. Are fitted so as to mesh with each other, and the protrusions 1 of the uneven portion 11 are
For 1a, the top of the protrusion 10 and the protrusion 11 of the uneven portion 11
a is formed so that the top portion and the protrusion portions contact each other with their heads in contact with each other. The movable pedestal 3 is configured by connecting four pedestal members 8 to the pedestal plate 7 by elastically displacable or elastically deformable coupling members 9, respectively, and these pedestal members 8 are attached.
The four positioning portions 12 in the diagonal direction are formed as corner members.

The operation of mounting the IC package in the IC socket of the present invention thus constructed will be described below.

In the operation procedure of the IC socket of the present invention shown in FIGS. 1 to 6, first, when the IC package 15 is mounted on the IC socket 1 as shown in FIGS. Is not inserted in the correct position, but is placed in a displaced position as shown in the drawing, and the movable base 3
If the movable pedestal 3 is caught in the middle of the position and placed in the poor seating position, the movable pedestal 3 is pushed downward by one step. Then, due to this pressing, the protrusion 10 of the pedestal member 8 of the movable pedestal 3 rides over the protrusion 11a of the uneven portion 11 of the socket body 2 through the movable cam mechanism 4 and is fitted into the adjacent recessed portion 11b, and the pedestal Since the member 8 slightly moves outward and the frontage of the pedestal member 8 is temporarily widened, the IC package mounting place on the base plate 7 is widened, as shown in FIG.
As shown in FIG. 4 and FIG. 4, the IC package 15 is placed on the base plate 7 in a flat state.

Next, if the movable base 3 is pushed down one step further, as shown in FIGS. 5 and 6, the base member 8 is moved.
The protrusion 10 is the recess 11 of the uneven portion 11 of the socket body 2.
The protrusion 10 of the pedestal member 8 is positioned on the protrusion 11a on the socket body 2 side by being pushed out from b, and the top of the protrusion 10 and the top of the protrusion 11a abut against each other. The members 8 are respectively moved inward in the diagonal direction so that the members 8 correctly contact the corners of the four corners of the IC package 15, so that the positioning portion 12 of the pedestal member 8 is moved.
It is placed in a state of being in contact with the corners of the four corners. Therefore, as shown in FIG. 6, the pedestal member 8 is positioned again at the final position with respect to the IC package 15, and the IC package 15 is accurately positioned and placed in the correct mounting position.

As described above, since the IC socket of the present invention has the movable cam mechanism that adjustably mounts the movable pedestal as the positioning pedestal on the socket main body, the IC package is unsuitable when tilted with respect to the IC socket. Even if the IC package is placed in a state, the IC package can always be positioned at a normal position, and the work of inserting the IC package into the IC socket can be handled by an automatic machine, which can reduce the mounting time. , It is possible to improve and improve the efficiency of the mounting work of the IC package to the IC socket, reduce the running cost such as burn-in test, and the process defect due to the bending of the IC lead due to poor seating of the IC package and the contact mistake. Can be reduced.

[0021]

As described above, according to the first aspect of the present invention.
The described IC socket has a fixed socket body, a movable pedestal that is adjustably attached to the socket body, and a movable cam mechanism that adjustably attaches the movable pedestal to the socket body. The positioning pedestal is provided to improve the storage efficiency of the IC package, and it is effective against the seating failure that occurs when the IC package is stored during mounting such as burn-in test and handler test in the final inspection process. It is possible to reduce the process defects due to the bending of the IC lead due to the poor seating and the contact mistake, improve the efficiency and improve the running cost.

The IC socket according to claim 2 of the present invention is
Since the movable pedestal is adjustably attached to the socket body via the movable cam mechanism, the movable pedestal can be favorably attached to the socket body.

The IC socket according to claim 3 of the present invention is
Since the movable cam mechanism has the cam member provided on the movable pedestal and the driven member provided on the socket main body, the positioning pedestal can be reliably operated by the movable cam mechanism.

The IC socket according to claim 4 of the present invention is
Since the cam member is formed of a protrusion formed on the movable pedestal and the driven member is formed of a plurality of continuous depressions having a shape corresponding to the protrusion formed on the socket body, it is simple. With the configuration, it is possible to easily and easily manufacture a cam mechanism that can reliably operate.

The IC socket according to claim 5 of the present invention is
Since the protrusion of the cam member has a semi-circular cross-sectional waveform and the recess of the driven member has a continuous semi-circular cross-sectional waveform, the cam member and the driven member can be easily and easily manufactured. it can.

In the IC socket according to claim 6 of the present invention, since the IC package is mounted on the movable pedestal,
The IC package can be easily mounted by hand or by an automatic machine, and the mounting time can be shortened.

[Brief description of drawings]

FIG. 1 is a central vertical sectional view showing an embodiment of an IC socket of the present invention.

FIG. 2 is a plan view of the IC socket of the present invention in FIG.

FIG. 3 is a central longitudinal cross-sectional view showing a state in which the movable base is pushed against the socket body to widen the frontage of the movable base to widen the mounting location of the IC package in the IC socket of the present invention.

FIG. 4 is a plan view in the state of FIG.

FIG. 5 is a central vertical cross-sectional view showing a state in which the movable pedestal is further pressed against the socket body and the movable pedestal is positioned again at the final position, and the IC package is positioned subsequent to FIG. 3;

FIG. 6 is a plan view in the state of FIG.

[Explanation of symbols]

1 IC socket 2 socket body 3 movable pedestal 4 Movable cam mechanism 5 Cam member 6 Follower member 7 base plate 8 base member 9 Connection member 10 Projection 11 uneven part 11a protrusion 11b depression 12 Positioning unit 15 IC package

Claims (6)

[Claims] 1. An IC socket comprising: a fixed socket body; a movable pedestal that is adjustably attached to the socket body; and a movable cam mechanism that adjustably mounts the movable pedestal on the socket body. . 2. The IC socket according to claim 1, wherein the movable pedestal is adjustably attached to the socket body via the movable cam mechanism. 3. The I according to claim 1, wherein the movable cam mechanism includes a cam member provided on the movable base and a driven member provided on the socket body.
C socket. 4. The cam member comprises a protrusion formed on the movable base, and the driven member comprises a plurality of continuous depressions having a shape corresponding to the protrusion formed on the socket body. I according to claim 3, characterized in that
C socket. 5. The I according to claim 4, wherein the protrusion of the cam member has a semi-circular waveform in a cross section, and the recess of the driven member has a continuous semi-circular waveform in a cross section.
C socket. 6. The IC socket according to claim 1, wherein an IC package is mounted on the movable base.