JP2003009368A - Terminal portion of ultra-thin coaxial line and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal portion of an ultra-thin coaxial line and a manufacturing method therefor, where the end of shielding is prevented from sticking into an internal insulator, short-circuiting between the shielding and the central conductor of the ultra-thin coaxial line, and capability for withstanding a high-voltage withstand voltage test is provided. SOLUTION: A terminal portion 1 of the ultra-thin coaxial line is obtained, by placing the exposed shielding 43 at an end of the ultra-thin coaxial line 40 on a shielding pad 47 placed on a board 46, placing a ground bar 45 for grounding on the shielding 43, and soldering the shield 43 to the ground bar 45 and the shielding pad 47. The tip X of the shielding is protruded from the ground bar 45 and exposed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention devises the connection between the shield of the ultrafine coaxial line and the substrate to connect the ultrafine coaxial line and the substrate, prevents short-circuiting of the shield and the center conductor, and withstands voltage test at high voltage. The present invention relates to a terminal portion of an ultrafine coaxial wire intended to endure the above and a manufacturing method thereof.

[0002]

2. Description of the Related Art As an example of a micro coaxial line, for example, FIG.
As shown in FIG. 3, there is a micro coaxial wire 40 configured by covering the center conductor 41 with an inner insulator 42, providing a shield 43 on the outer periphery of the inner insulator 42, and covering the shield 43 with a jacket 44.

In the conventional method of manufacturing the terminal portion 50 of the ultrafine coaxial wire, the shield 43 of the ultrafine coaxial wire 40 is cut in advance to a length such that the tip Y thereof does not protrude from the ground bar 45 for grounding, and the shield 46 is placed on the substrate 46. Shield pad 4
7, the tip Y of the shield 43 has a shield pad 47.
The shield 43 with the end of the ultrafine coaxial line 40 exposed is placed so that it does not stick out, and the ground bar 45 is placed on the shield 43 so as to face the shield pad 47 via the shield 43. 43 is soldered to the ground bar 45 and the shield pad 47.

In the conventional end portion 50 of the ultra-fine coaxial line, the tip Y of the shield 43 is not exposed from the ground bar 45 or the shield pad 47. That is, the tip Y of the shield 43 is below the ground bar 45 and above the shield pad 47.

[0005]

However, in the conventional end portion 50 of the ultrafine coaxial wire, the tip Y of the shield does not protrude from the ground bar 45, and the ground bar 4
Since it is the lower part of 5, the ground bar 45 when soldering is connected.
When a force is applied from above, there is a problem that the tip Y of the shield may pierce the thin inner insulator 42 and short-circuit the shield 43 and the center conductor 41.

Further, even if the shield 43 and the central conductor 41 are not short-circuited, the tip Y of the shield has a thin inner insulator 42.
However, there is a problem in that the insulation distance may be shortened and the high voltage withstanding voltage test may not be able to be withstood.

In particular, these problems occur when the shield 43 is a horizontally wound shield composed of a plurality of conductor wires or a braided shield composed of a braid.

Therefore, an object of the present invention is to prevent the tip of the shield from sticking into the internal insulator, prevent short-circuiting between the shield and the center conductor of the ultra-fine coaxial line, and yet withstand the high voltage withstanding voltage test. An object is to provide a terminal portion of a coaxial line and a manufacturing method thereof.

[0009]

The present invention was devised to achieve the above object, and the invention of claim 1 is
On the shield pad provided on the substrate, the shield with the exposed end of the ultra-fine coaxial line was provided, and the ground bar for grounding was provided on the shield, and the shield was soldered to the ground bar and the shield pad. In the terminal portion of the ultrafine coaxial wire, the tip of the shield is the terminal portion of the ultrafine coaxial wire exposed from the ground bar.

According to a second aspect of the present invention, a shield having an exposed end of a micro coaxial wire is placed on a shield pad provided on a substrate so that a tip of the shield protrudes, and the shield is placed on the shield. Place the grounding ground bar so as to face the shield pad via the shield, and pull out the protruding end of the shield in a direction away from the internal insulator so that it does not touch the internal insulator. Is soldered to the ground bar and the shield pad, and then the tip of the drawn shield is cut to produce a terminal portion of an ultrafine coaxial wire.

According to a third aspect of the present invention, a shield having an exposed end of the ultrafine coaxial line is placed on a shield pad provided on the substrate so that the tip of the shield protrudes, and the shield is placed on the shield. Place the grounding bar for grounding so as to face the shield pad through, and pull out the protruding end of the shield in a direction away from the internal insulator so that it does not touch the internal insulator. This is a method for manufacturing an end portion of a micro coaxial wire in which a shield which is not pulled out is soldered to a ground bar and a shield pad after the portion is cut.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 2 is a schematic diagram showing a preferred embodiment of the present invention.

As shown in FIG. 2, the terminal portion 1 of the ultrafine coaxial wire according to the present invention is for connecting the ultrafine coaxial wire 40 and the substrate 46. The present invention has an outer diameter of 0.0799 mm
In other words, 40 AWG (American Wire Gaug
e: American wire gauge) It is especially useful when applied to the following ultra-fine coaxial wires.

The micro coaxial wire 40 is, for example, a center conductor 41.
Is covered with an inner insulator 42, a shield 43 is provided on the outer periphery of the inner insulator 42, and the shield 43 is covered with a jacket 44 which is an outer insulator. Shield 43
For example, a horizontally wound shield composed of a plurality of conductor wires or a braided shield composed of a braid may be used.

A shield pad 47 on which the shield 43 of the ultrafine coaxial line 40 is placed is provided on the substrate 46. The center conductor 4 of the micro coaxial wire 40 is provided on the substrate 46 at a position separated from the shield pad 47 by a predetermined distance.
A wiring pattern 21 to which 1 is connected is formed. The board 46 is, for example, a printed circuit board or an FPC.
(Flexible Printed Circuit Board) is used.

Now, the terminal portion 1 of the ultrafine coaxial line is composed of the substrate 46.
A shield 43 having an exposed end portion of the ultrafine coaxial line 40 is provided on a shield pad 47 formed in the form of a thin plate, and a thin plate-shaped ground bar 45 for grounding is provided on the shield 43.
And the shield 43 is soldered to the ground bar 45 and the shield pad 47, and the tip X of the shield is exposed from the ground bar 45. Also,
It is preferable that the tip X of the shield does not touch the exposed inner insulator 42 at the end of the micro coaxial wire 40.

The microscopic coaxial wire 40 has its axial direction perpendicular to the longitudinal direction of the shield pad 47.
It is placed on the shield pad 47. The ground bar 45 is provided on the shield 43 so that its longitudinal direction is perpendicular to the axial direction of the ultrafine coaxial wire 40. As the ground bar 45, for example, a rectangular hard copper wire is used. The ground bar 45 and the shield pad 47 face each other via the shield 43.

FIG. 3 shows the end portion 1 of the ultrafine coaxial line and the substrate 46.
It is a perspective view showing an example of a connection with.

As shown in FIG. 3, the terminal portion 1 of the ultrafine coaxial line is shown.
Is usually used in a state in which a plurality of micro coaxial wires 40a, 40b ... Are arranged in parallel. Each micro coaxial wire 40
The tips Xa, Xb ... Of the shields a, 40b ... Are exposed from the ground bar 45, and the inner insulator 42
It is designed not to touch a, 42b .... The ground bar 45 has a plurality of fine coaxial wires 40 in the longitudinal direction.
Shield 4 is aligned with the arrangement direction of a, 40b ...
3a, 43b ... Are provided above. FIG. 3 illustrates an example in which seven ultrafine coaxial lines 40a, 40b ... Are arranged in parallel.

The central conductor 41 of the terminal portion 1 of this ultrafine coaxial line
a, 41b, ..., The respective tip ends of the wiring patterns 21a, 21b ,.
Soldered by. As a result, the micro coaxial wires 40a, 40b ... And the substrate 46 are electrically connected.

Next, a method of manufacturing the terminal portion 1 of the ultrafine coaxial wire will be described.

FIG. 1 is a schematic view showing an example of a manufacturing process of the terminal portion 1 of the ultrafine coaxial wire according to the present invention.

First, as shown in FIG.
The terminal coating, jacket 44 and inner insulator 42 are removed to expose shield 43 and center conductor 41. At this time, the exposed length of the shield 43 is set to be longer than the exposed length of the shield 43 in the terminal portion 50 of the conventional ultra-fine coaxial wire described in FIG.

The exposed shield 43 is placed on the shield pad 47 so that the tip 43t of the shield protrudes. A ground bar 45 is placed on the shield 43 so as to face the shield pad 47 via the shield 43 (procedure 1).

Next, the tip 43t of the shield protruding from the shield pad 47 and the ground bar 45 is pulled out in a direction away from the internal insulator 42 so as not to touch the internal insulator 42. Shield 43 not pulled out
b is soldered to the ground bar 45 and the shield pad 47. At this time, soldering is performed while applying force from above the ground bar 45. Thereby, the ground bar 45, the shield 43, and the shield pad 47
Are connected together with solder.

After that, when the drawn shield 43t is cut, the terminal portion 1 of the ultrafine coaxial line as shown in FIG. 2 is completed. The tip X of the shield is exposed from the ground bar 45 without touching the inner insulator 42. Further, the tip end of the center conductor 41 and the wiring pattern 21 on the substrate 46 are soldered to electrically connect the micro coaxial wire 40 and the substrate 46.

As described above, the feature of the present invention resides in that when the ground bar 45 is connected, the tip end portion 43t of the shield is pulled out in the direction away from the internal insulator 42, and the tip end portion 43t of the shield is cut after the connection.

As a result, when soldering the shield 43b that has not been pulled out to the ground bar 45 and the shield pad 47, even if soldering is performed while applying force from above the ground bar 45, external force is applied to the tip X of the shield. Is not applied and the tip X of the shield does not become the lower part of the ground bar 45, so that the tip X of the shield can be prevented from being pierced into the internal insulator 42.

Therefore, in the ultrafine coaxial wire 40 having an outer diameter of 0.0799 mm or less, the inner insulator 42 is thin, but even in such an ultrafine coaxial wire 40, the shield 4
3 and the center conductor 41 can be prevented from being short-circuited.

Further, the terminal portion 1 of the ultrafine coaxial wire is subjected to a high voltage withstanding voltage test prior to commercialization. This withstand voltage test is a test in which a voltage is gradually applied between the center conductor 41 and the shield 43 to check whether the voltage when the center conductor 41 and the shield 43 are short-circuited is equal to or higher than a predetermined withstand voltage.

In the conventional ultrafine coaxial wire end portion 50 described with reference to FIG. 4, since the tip Y of the shield is the lower part of the ground bar 45, the tip Y of the shield is a thin internal insulator 42.
However, in the present invention, since the tip X of the shield does not pierce the internal insulator 42, the insulation distance may be shortened and it may not be possible to endure a withstand voltage test of a predetermined high voltage. It can withstand a predetermined high voltage withstand voltage test. Therefore, it is very effective in preventing the breakdown voltage failure.

In the above embodiment, the shield 43 is cut after the shield 43 is soldered to the ground bar 45 and the shield pad 47, but the shield 43 may be cut before soldering. Good.

More specifically, following the procedure 1 described above, the tip 43t of the shield protruding from the shield pad 47 and the ground bar 45 is moved away from the inner insulator 42 so as not to touch the inner insulator 42. After pulling out in the direction and cutting off the tip portion 43t of the pulled-out shield, the shield 43b not pulled out may be soldered to the ground bar 45 and the shield pad 47.

The manufacturing method according to the above procedure can also manufacture the end portion 1 of the ultrafine coaxial wire described with reference to FIGS. 2 and 3.

In the above embodiment, the substrate 4
Although the printed circuit board or the FPC has been described as an example of 6, the board 46 may be a connector or other connection parts.

[0037]

As is apparent from the above description,
According to the present invention, the following excellent effects are exhibited.

(1) It is possible to prevent the tip of the shield from sticking into the internal insulator when the shield is connected to the micro coaxial wire.

(2) It is possible to prevent a short circuit between the shield of the ultra-fine coaxial line and the center conductor, and to endure a high voltage withstanding voltage test.

[Brief description of drawings]

FIG. 1 is a schematic view showing an example of a manufacturing process of a terminal portion of an ultrafine coaxial wire according to the present invention.

FIG. 2 is a schematic view showing a preferred embodiment of the present invention.

FIG. 3 is a perspective view showing an example of a connection between a terminal portion of a micro coaxial wire and a substrate according to the present invention.

FIG. 4 is a schematic view of a terminal portion of a conventional ultrafine coaxial wire.

[Explanation of symbols]

1 Terminal of micro coaxial wire 21 Wiring pattern 40 micro coaxial line 42 Internal insulator 43 shield 43b Shield not pulled out X shield tip 45 Grand Bar 46 board 47 Shield pad

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 7/00 H05K 7/00 G (72) Inventor Hideki Saito 4-10-1 Kawajiri-cho, Hitachi-shi, Ibaraki Issue Hitachi Electric Wire Finetech Co., Ltd. F-term (reference) 4E352 AA06 AA17 BB04 CC22 CC53 DD04 DR01 EE01 FF02 FF04 GG08 5E051 GA06 GA07 GB04 5E085 BB04 BB08 BB09 CC01 DD01 FF19 JJ03 JJ04 JJ38 5G355 AA10 CA09 DB09 CA10 A04 BA12 CA10 BA04 BA12

Claims (3)

[Claims] 1. A shield pad provided on a substrate,
An exposed shield of the end of the ultra-fine coaxial line is provided, a ground bar for grounding is provided on the shield, and the shield is
In the terminal portion of the ultrafine coaxial wire soldered to the ground bar and the shield pad, the tip end of the shield is exposed from the ground bar. 2. A shield pad provided on a substrate,
Place the exposed shield of the end of the ultra-fine coaxial cable so that the tip of the shield sticks out, put a grounding ground bar on the shield so that it faces the shield pad through the shield, and then stick it out. Pull out the tip of the shield that is still away from the inner insulator so that it does not touch the inner insulator, solder the shield that has not been pulled out to the ground bar and the shield pad, and then remove the tip of the pulled shield. A method for manufacturing an end portion of an ultrafine coaxial wire, characterized by cutting. 3. A shield pad provided on a substrate,
Place the exposed shield of the end of the ultra-fine coaxial cable so that the tip of the shield sticks out, put a grounding ground bar on the shield so that it faces the shield pad through the shield, and then stick it out. Pull the tip of the shield that is away from the inner insulator so that it does not touch the inner insulator, cut the tip of the shield that you pulled out, and then solder the unstretched shield to the ground bar and shield pad. A method for manufacturing an end portion of an ultrafine coaxial line, characterized by connecting.