JP2003008393A - High frequency module component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high frequency module component which has a function for blocking a high frequency region in particular, improves productivity without conflicting with individual manufacturing processes, improves performance and reliability in use and performs the size reduction and height reduction of a product in a high frequency electronic circuit component including a ceramic multi-layer substrate and a flip chip mounting type surface acoustic wave element (SAW) to be mounted to it directly. SOLUTION: In the high frequency module component, the surface acoustic wave elements SAW and the other surface mounting elements 14 are mounted on a multi-layer substrate 1, the elements SAW are flip-chip-mounted directly on an electrode with a metallic film on the substrate 1, and a part of a conductor pattern 10 having a filter function is formed at least a part of the element (SAW) mounting region of the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency module component having a ceramic multi-layer substrate and a flip-chip mounting type surface acoustic wave element, which further improves performance, enhances reliability during use, and improves mountability during mounting. The present invention relates to a module structure capable of further improving the productivity and reducing the size and height of the product, and improving the productivity.

[0002]

2. Description of the Related Art There is always a market demand for miniaturization of electronic equipment, and miniaturization and weight reduction of parts used are also required. This tendency is remarkable in high-frequency devices typified by mobile phones, and this tendency is particularly remarkable in the parts used. In high-frequency equipment, the mounting density of components has been remarkably increased, and the demand for smaller and lighter devices has been met.

On the other hand, as a substrate on which elements are mounted, in order to cope with such miniaturization, a multilayer substrate having a plurality of conductor layers is used instead of a single-layer substrate.

In the ceramic multilayer substrate, the insulating layer of the multilayer substrate is made of electrically insulating ceramic, and the conductor layer is made of silver or the like. Such a ceramic multilayer substrate is
It has features such as low loss at high frequency, good heat conduction, good dimensional accuracy, and excellent reliability as compared with general resin multilayer substrates.

Further, in the ceramic multi-layer substrate, the internal conductors may be formed in a coil shape or face each other in parallel, whereby an inductance and a capacitance can be formed inside and a transmission line can be formed respectively, which results in low loss. Since the dimensional accuracy is good, an element having a high Q and a small tolerance can be formed inside.

[0006] These characteristics are utilized as a collective element, that is, a module, in which various parts are mounted on the surface, and in addition, in a high frequency circuit such as a mobile phone, which has high characteristics and miniaturization.

On the other hand, the high-frequency module, on the other hand, has a simpler device structure as compared with the conventional method of forming a circuit by mounting discrete components one by one in order to organize the circuit by function. As a result, it is possible to provide products with excellent reliability and characteristics.

Further, in the conventional discrete component, the design is complicated because the features of each component are combined and the function is fulfilled. However, by modularizing the component, the characteristic specification is determined for each module. When designing equipment, the design can be structured, and the manufacturing period can be shortened and labor can be saved.

FIG. 8 shows the GS with the highest production volume in the world.
A block diagram of an M dual-band mobile phone is shown. In the figure, transmission signals I / Q (I and Q signals of baseband signals) are input to an I / Q modulator 137. This I / Q modulator 137 has an IFVCO1
The IF signal is input from 20 through the frequency divider DIV 138, 90 ° shifter, and modulated. IQ module 1
The signal output from 37 is input to the mixer 132 via the phase detector 133. 900 VCO and 1800 VCO 136 are connected to the phase detector 133 via low-pass filters 134 and 135. In addition, the mixer 132 similarly has 900 VCO and 1800 V.
CO 117 is connected.

The signal output from mixer 132 is 90
The power amplifier 129 and the power amplifier 129 are modulated via the balun transformer 131, respectively.
It is input to the diplexer 102 through a path of the coupler 125, the low-pass filter 104, and the T / R switch 103, or is input to the diplexer 102 through a path of the power amplifier 130, the coupler 126, the low-pass filter 124, and the T / R switch 123. The signal input to the diplexer 102 is transmitted from the antenna 101.

Similarly, a received signal of 900 MHz or 1800 MHz input from the antenna 101 to the diplexer 102 is passed through the T / R switch 103 or the T / R switch 123, the bandpass filter 105 and the amplifier 1
06, balun transformer 107 and mixer 111
Input to the bandpass filter 108 or amplifier 1
09, balun transformer 110 and mixer 111
Entered in. 900 VCO and 1800 VCO 117 are connected to the mixer 111.

The IF-modulated signal output from mixer 111 is input to mixer 114 via bandpass filter 112 and amplifier 113. I for the mixer 114
The FVCO 120 is connected. The signal output from the mixer 114 is passed through the automatic gain controller 115 to the I / Q
It is input to the demodulator 116 and demodulated. Note that I
An IF signal is input to the / Q demodulator 116 from the IFVCO 120 via the frequency divider DIV 138 and a 90 ° shifter, and is modulated. In addition, IFVCO 120, 9
The 00VCO and the 1800VCO 117 are connected to the IFPLL 119 and the RFPLL 118, respectively.

The modularization as described above is performed by several functions. For example, the antenna switch parts (102, 103, 104, 123, 1 of such a circuit are used.
In 24), it is proceeding by actually mounting the element on the ceramic multilayer substrate.

FIG. 9 shows an example of the configuration of such a module. In the figure, chip components 14 such as a diode element, an inductor element, and a resistance element are arranged on a substrate 1. Then, the shield case 15 is formed so as to cover them.
Are arranged. The outer conductor 9 is provided on the side surface of the substrate 1.
However, the conductor 10 is formed and arranged inside and on the surface to form the capacitor 12, the inductor 13, and the like. Further, these conductors 10 are vertically connected by via holes 11.

At present, modularization is realized by a single function such as a power amplifier and an antenna switch module, but if a wider range of functions are modularized, the advantage of modularization will be brought out further.

Of course, modularization with the addition of SAW elements is also important. Conventional SAW devices use so-called package parts. In this case, it is possible to mount a packaged product and modularize it, but it is also possible to mount the element chip directly on the substrate. By doing so, a small size and a low profile can be realized, and further, a low cost can be realized.

The ceramic multilayer substrate has an inductance,
Capacitors can be built in, which makes it possible to reduce the size, but on the other hand, it is difficult to reduce the height. Therefore, in a general module in which a package is further mounted on the substrate, it is not possible to sufficiently meet the demand for a reduction in height in the future.

In addition, the packaged product requires a larger occupied area than the original chip. Of the parts used, the SAW element is one of the tallest, and it occupies a large area. Under these circumstances, SAW
The chip somehow, directly without the package
Mounting on a ceramic multilayer substrate is desired.

Furthermore, the structure must be created through steps that satisfy the SAW mounting method, the soldering component mounting method, and the sealing method.

Particularly when used in a ceramic multilayer substrate,
The surface conductor is usually a sintered body of metal powder that is co-fired with the ceramic. In this case, the smoothness of the surface cannot eliminate the shape of the metal powder, resulting in a considerably rough surface. In such a case, when the SAW chip is mounted by gold-gold bonding, the bonding becomes unstable, causing disconnection failure and reliability failure against thermal shock and the like.

Further, in order to realize the above-mentioned structure, it is necessary to make the flip mounting process of the SAW element and the soldering process compatible with each other on the ceramic multilayer substrate.

In the soldering step, generally, a solder paste is applied to the land portion on the surface of the substrate, then the element is placed and heat treatment such as reflow is performed to fix the element. In this case, the flux in the solder paste is vaporized to activate the interface with the surface electrode and secure the wettability of the solder.

For example, since the SAW element is mounted in an exposed form, if it is mounted on the substrate first, the adhesion of flux will occur, which will greatly affect the characteristics of the SAW.

The SAW joining is generally performed by gold-gold bump joining. In the case of solder joining, the metal surface on the substrate is tin or a solder film, and each is formed by plating. It is usually done.

In the case of the current small-sized SAW element, it is fixed to a ceramic substrate or a resin substrate by a method called flip chip mounting, as shown in, for example, Japanese Patent Laid-Open No. 10-79638.

It is considered that this method is also effective for mounting the SAW element in the module, but it should be a problem-free one even if it is mixed with other solder joint parts. To meet such requirements, the surface conductor of the ceramic substrate may be treated with a gold plating layer to enable both solder bonding and gold-gold bonding.

On the other hand, when the SAW filter is mounted on the ceramic substrate in a bare state, a so-called bandpass function can be exhibited, but the characteristic in the vicinity of the band is SAW.
It depends on the characteristics of the device itself. However, bare SAW cannot cope with the higher frequency region corresponding to the spurious in the used frequency region. For this reason, in the case of package products, when a conductor pattern is drawn on the package, or when mounting by the gold wire bond method, the gold wire is used as it is and it functions as a filter that blocks high frequency areas, and The component is removed.

Therefore, when the SAW is mounted on the ceramic substrate in a bare state by flip chip, it is necessary to specially form the filter pattern.

However, the conductor of the ceramic multilayer substrate is usually made of silver, and although the specific resistance of the substance itself is sufficiently low, since it is a sintered body, the weaving is non-uniform, the conductor loss is large, and the surface loss is large. The unevenness is also large.

Therefore, in addition to the loss due to the conductor loss, the loss in the high frequency region is affected by the skin effect, which further increases the loss and adversely affects the filter characteristics.

[0031]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a high frequency electronic circuit component including a ceramic multilayer substrate and a flip chip mounting type surface acoustic wave device (SAW) directly mounted on the ceramic multilayer substrate, and particularly a function of blocking a higher harmonic region. The high-frequency module component that has the following characteristics, enables productivity to be improved without contradicting each manufacturing process, enhances performance and reliability during use, and enables compact product dimensions and low profile. Is to provide.

[0032]

That is, the above object is achieved by the following constitution of the present invention. (1) A surface acoustic wave element and other surface mount elements are mounted on a multi-layer substrate, the surface acoustic wave element is directly flip-chip mounted on a metal film-coated electrode of the multi-layer substrate, and the multi-layer substrate is also provided. 2. A high-frequency module component in which a part of a conductor pattern having a filter function is formed in at least a part of the surface acoustic wave device mounting area. (2) The high frequency module component according to (1), wherein the surface acoustic wave device is mounted on a bare chip by gold-gold bonding and has a gold layer on the surface of the conductor pattern having the filter function. (3) The high-frequency module component according to (1) or (2), wherein the metal film on the electrode and the gold layer of the conductor pattern are formed by gold plating at the same time. (4) The high frequency module component according to (2) or (3), wherein the thickness of the gold layer is 0.1 to 1 μm. (5) The high-frequency module component according to any one of (1) to (4) above, wherein the entire height of the module is less than 2 mm.

[0033]

In order to achieve the above object, the present inventors tried to improve the following points. (1) A high frequency suppression circuit pattern is formed at the SAW element mounting position on the substrate. (2) In particular, a gold layer is formed on the high frequency suppression circuit pattern. (3) A plurality of SAW elements are hermetically sealed together in order to realize miniaturization. (4) Make the soldering process compatible with the SAW element mounting process.

As a result, the surface acoustic wave device was mounted on the filter circuit pattern formed on the ceramic multilayer substrate for suppressing the high frequency region by the gold ball bonding method, and the other surface mount components were mounted by soldering. Then, a plurality of the SAW elements mounted in this way are collectively made to have a structure in which airtightness is secured by a lid.

As described above, by directly mounting the SAW element and forming a pattern having a filter function immediately below the mounting position, the occupied area of the filter circuit and the base plate of the SAW package, which have been conventionally required, can be obtained. It became unnecessary, and it became possible to reduce the size and height. As a result, the extra canopy structure that was required in the past can be omitted, and the size and height can be further reduced.

Incidentally, Japanese Patent Application Laid-Open No. 6-97315 discloses that
An example in which the SAW element is mounted with another circuit component and sealed is disclosed. In this publication, a SAW element is fixed to a resin substrate face up, and electrical connection is made by wire bonding, and a ceramic multilayer substrate is formed as in the present invention.
This is clearly different from the one in which SAW is flip-chip mounted and the filter pattern is formed directly underneath.

The high frequency module component of the present invention can be further miniaturized by flip chip mounting. The flip-chip mounting method itself is known as disclosed in, for example, Japanese Patent Laid-Open No. 10-270975. However, the difference is that the flip chip form can reduce the influence of the difference in the coefficient of thermal expansion from the substrate. Further, at first glance, although it seems to disclose mixed mounting with other passive components, like the present invention,
Mixed mounting with solder-mounted parts is not disclosed. In particular, solder is used for sealing, but in this case, an instantaneous heating method is used to avoid contamination by flux. In other words, it indicates that it is extremely difficult to mix-mount with solder-mounted parts. According to the present invention, even in such a case, it is possible to mix-mount other solder components by passing through the cleaning step, and it is possible to mix-mount more easily and versatile components.

[0038]

BEST MODE FOR CARRYING OUT THE INVENTION In a high frequency module component of the present invention, a surface acoustic wave element (or Rayleigh wave, which may be hereinafter referred to as SAW: Surface Acoustic Wave) and other surface mount elements are mounted on a multilayer substrate. The surface acoustic wave device is directly flip-chip mounted on the metal-coated electrode of the multi-layer substrate, and at least a part of the surface acoustic wave device mounting area of the multi-layer substrate has a conductive pattern having a filter function. Part is formed.

As described above, by forming a part, preferably the whole, of the conductor pattern having a filter function in at least a part of the area immediately below the SAW element mounting position of the multilayer substrate, the area occupied by the filter pattern can be covered by the module. Can be made smaller.

In the high frequency module component of the present invention, a pattern having a high frequency blocking ability is formed on the substrate in order to suppress spurious. The harmonic suppression filter having the low-pass filtering function is preferably 3 to 6G.
It is necessary to function up to Hz, especially around 3.5 to 5.0 GHz.

This filter can be obtained by forming a conductor having a predetermined pattern on a substrate. The filter pattern can be formed at the same time when the silver powder paste is screen-printed as the uppermost layer pattern. At this time, it may be formed at the SAW mounting position. Here, the SAW mounting position means an area occupied by the SAW element on the substrate, and an area immediately below the SAW element.
That is, the surface acoustic wave element mounting area means an area occupied by the projection surface of the SAW element on the substrate.

The projection surface of the SAW element and the filter pattern forming area are not necessarily the same as the filter pattern forming area.
0% does not need to be accommodated in the projection surface of the SAW element, and 50% or more, especially 80% or more of the area of the two regions may overlap.

In some cases, a filter is formed by forming a capacitor with either the surface conductor layer or the inner conductor layer.

Since the printed pattern is before firing, both silver and ceramic are a mixture of powder and organic resin, and the press treatment is performed before firing, so that the surface is smoothed, and as it is usually It exhibits a relatively good filter function as compared with the sintered body.

However, from a microscopic point of view, the conductor layer is not uniform yet, and if it becomes smoother, better characteristics can be obtained. In this case, by further forming a gold layer on the surface, the surface becomes smoother and the high frequency characteristics can be improved.

Furthermore, in the case of high frequencies such as microwaves used in portable equipment and the like, it is desirable to form and process a filter near the input / output of the SAW element.

Further, in the high frequency circuit, the treatment at the outermost layer is very effective in that it is not affected by extra stray capacitors, parasitic inductors and the like.

Further, if ripples are present in the pass band, it is possible to adjust and correct the C and L components by adjusting the pattern of this filter.

In the surface conductor, a gold layer is formed to achieve the gold-gold bond. In this surface conductor, the thickness of the gold layer is preferably 0.1 μm or more and 1 μm or less, more preferably 0.3 to 0.7 μm.

If the gold plating layer is too thin, it causes a reliability problem in gold-gold bonding, and if it is too thick, the conductor layer is likely to be stressed and becomes brittle when soldering.

Such a gold layer is preferably a gold plating layer formed by plating. The gold plating layer is
Usually, it can be formed by an electroless plating method.

Further, in some cases, it is advisable to deposit a nickel plating layer of about 2 μm to 5 μm as a base.
As a result, the unevenness of the surface conductor of the base is absorbed, and when gold-gold bonding is performed by ultrasonic waves, a hard base is formed and the adhesiveness is improved.

Also in the soldered component, the gold plating layer is effective, and the nickel layer can suppress the phenomenon of disappearance of the coating film due to the soldering process, which is so-called "buckling".

The sealing member covering the surface acoustic wave element is fixed to the multilayer substrate, but it is preferable to bond it with an adhesive in consideration of the sealing effect. As such an adhesive agent, an adhesive agent for fixing or sealing which is used in a usual electronic component can be used, but an adhesive agent which has little influence on the SAW element by the gas emitted during curing is preferable. Specifically, an epoxy adhesive or the like can be used.

Further, since the acoustic wave element is separated from other mounted parts by the sealing member, the airtightness is maintained and the acoustic wave element can be effectively protected from moisture and gas.

Further, preferably, the conductor pattern inside the sealing member is guided to the lower portion by a through hole so as not to touch the adhesive portion of the sealing member, that is, the adhesive flange portion, and the external conductor is formed by the pattern of the intermediate layer of the multilayer wiring board. Should be derived from the. In this way, by preventing the conductor pattern inside the sealing member from touching the adhesive portion of the sealing member, that is, the adhesive flange portion, the adverse effect of the adhesive and the conductor,
For example, it is possible to prevent dielectric loss and wraparound of volatile components.

Furthermore, since at least one of the surface mount elements other than the surface acoustic wave element is mounted on the multilayer board by soldering, the components mounted by the soldering process in the past are mounted in the same process. Therefore, it is possible to effectively use parts and equipment, and it is possible to suppress an increase in cost.

The height of the sealing member should be such that it does not come into contact with the surface acoustic wave element, and may be determined by the surface acoustic wave element and its mounting structure. Specifically, the gap between the surface acoustic wave element and the surface acoustic wave element is 50 to 20.
The thickness may be 0 μm, particularly about 70 to 120 μm.

The material used for the sealing member is not particularly limited as long as it has a predetermined airtightness and a strength that can withstand handling. However, it is preferable to use a material having the same coefficient of thermal expansion as that of the substrate, and it is preferable to use the same material. Specific examples include ceramics, epoxy plastics, BT resin plastics and the like, and among these, ceramics are particularly preferable.

By thus mounting the SAW elements on the flip chip and encapsulating them all at once, the height of the entire module can be set to less than 2 mm, particularly 1.5 mm or less.

The multilayer substrate may be a resin substrate or a ceramic substrate as long as it can satisfy a predetermined size and electrical characteristics, but a ceramic substrate is preferable. Examples of the ceramic substrate include a low-temperature fired substrate containing glass-alumina as a main component.

The number of laminated layers of the multi-layer substrate may be adjusted to the required number of laminated layers depending on the circuit configuration of the high frequency module component, the mounting component and the like. Usually, it is about 5 to 30 layers.

Inside the multilayer substrate, there are a transmission line formed of an internal conductor, an inductor, a capacitor and the like. These are formed to exert the functions required as a module. In particular, inductors and capacitors are formed inside the board rather than being mounted as parts on the board, so that the size and height can be further reduced. it can.

The built-in SAW element may be of any form, and an appropriate SAW element may be used depending on the function required for the module component.

The SAW element is directly flip-chip mounted on the electrodes on the substrate, preferably by metal-metal bonding. In this case, as a preferable metal for the metal-to-metal bonding of the flip chip, Au, Al or the like can be mentioned, and Au is particularly preferable.

The high frequency module component of the present invention may be manufactured according to the following steps. That is, at least the component bonding portion of the conductor surface of the component mounting ceramic multilayer substrate is plated with metal, at least one element other than the surface acoustic wave element is mounted by solder, and after cleaning, the surface acoustic wave element is bonded to the metal. The flip-chip mounting is performed on the multilayer substrate by the bonding, and the sealing member of the surface acoustic wave device is bonded.

By manufacturing in this way, the components mounted by soldering can follow the conventional mounting method. In addition, the surface of metal plating such as gold plating is rich in solder wettability and can be firmly fixed. However, the surface of the board after mounting the soldered parts is dirty due to the scattering of flux, solder residue, etc., and the surface of the metal such as gold in the SAW mounting part is still in doubt.

Therefore, after mounting the components other than the SAW element, cleaning is performed to activate the metal surface so that the mounting is not hindered.

Cleaning can be activated to the extent that it does not hinder mounting even with conventional chemical cleaning, but cleaning by plasma etching is more preferable. In that case, it is necessary to make the condition that other mounted components are not damaged. Further, in the resin bonding, by bonding in vacuum, it is possible to further remove stains and adhered matters around the SAW.

[0070]

EXAMPLES The present invention will be described more concretely with reference to the following examples. In this example, an antenna switch module for GSM-DCS switching was manufactured.

The structure of the module was as shown in FIG. That is, the SAW element SAW was flip-chip mounted on the ceramic substrate 1, and the chip parts 14 such as the diode element, the inductor element, and the resistance element were solder-mounted. Further, the outer conductor layer 9 was formed on the side surface of the substrate 1, and the conductor layer 10 was formed on the inside and on the surface to form conductor lines, terminals, capacitors, inductors, and the like. Then, this substrate was collectively sealed by the sealing member 15.

As the ceramic multilayer substrate, one having alumina glass composite ceramic as an insulating layer and 15 inner conductor layers was used. The outer shape was about 6 mm x 4 mm and the thickness was 0.8 mm. The overall height of this module was 1.5 mm.

The circuit diagram of this module is shown in FIG. 2, and the conductor pattern including the pattern under the surface SAW mounting portion is shown in FIG.
Shown in. In these figures, the same components as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

For comparison, the conventional package 17 is used.
A structural diagram and a pattern diagram of a module using is shown in FIGS. 4 and 5, respectively. In these figures, the same components as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. The external dimensions of the conventional module are 8 × 5 mm and the height is 2 mm, and it can be seen that the module of the present invention is sufficiently small and has a low profile.

In forming the ceramic multilayer substrate,
An organic binder and an organic solution were mixed with alumina- and glass-based powder, and this was applied onto a carrier tape by a doctor blade method. After that, it was dried, and the sheet was cut into pieces each having a size of 10 cm.

A punching process was applied to this sheet, and the portion to be the cavity portion was cut out together with the carrier film. Then, a portion to be a through hole was punched with a laser.

A silver powder pattern was applied to these sheets by screen printing. The silver powder used for printing at this time was a powder having a particle size of 0.1 to 1 .mu.m, which was in the form of a paste capable of screen printing with an organic binder and a solvent.

This sheet was peeled off from the carrier tape and laminated and pressure-bonded by a press. Pressure is 0.686
It was Pa (700 kg / cm ² ).

After this, cut into predetermined pieces and 900
Firing was performed at 15 ° C. for 15 minutes. During firing, the ceramic, the inner conductor, the surface layer conductor, and the cavity inner conductor are collectively sintered. As a result, a multilayer substrate having circuit function element elements such as L and C inside and a conductor layer on the surface was formed.

After that, nickel electroless plating was applied to a thickness of 2 μm, and gold electroless plating was applied to a thickness of 0.5 μm. The surface roughness at this time was about 1 μm or less.

The SAW was mounted on this by gold-gold bonding. That is, the SAW element is laid face down on the multi-layer substrate 1 and the solder ball 25 is used to interpose S on the terminal composed of the Al—Cu alloy layer 22, the Ni layer 23, and the Au plating layer 24.
It was arranged so that the Au bumps 26 of the AW element were positioned. Then, from the SAW side, ultrasonic waves are simultaneously applied and 600
It was applied while applying a load of g to bond the gold bump to the gold surface of the substrate. This state is shown in FIG.

For comparison, the gold layer has a thickness of 0.05 μm,
I tried changing it to 3 μm. When the gold layer was less than 0.1 μm, the bonding state of the SAW became unstable, the gold was peeled off at the neck of the bonding, and the nickel layer was sometimes exposed. On the contrary, when the thickness exceeds 1 μm, a phenomenon of peeling from the nickel interface was observed when the solder component was mounted.

The filter characteristics were evaluated especially by the notch characteristics formed in the vicinity of 4 GHz in this pattern. The deeper the notch, the better the characteristic. The case where no filter is formed, the case where gold plating is not applied, the case of 0.05 μm, and the case of 0.5 μm are shown.

For those not plated with gold, SA
Since it was necessary to perform gold-gold bonding of the W device, it was performed without plating only the filter portion.

FIG. 7 shows the filter characteristics when the thickness of the gold plating layer was changed. The characteristics were generally good when the thickness was 0.05 μm, more preferably 0.1 μm or more, and if the thickness was more than 0.1 μm, the characteristics were satisfactory.

As shown above, in the high frequency electronic circuit component including the ceramic multilayer substrate and the flip chip mounting type surface acoustic wave device (SAW) directly mounted on the ceramic multilayer substrate,
By forming a filter pattern directly under the SAW element on the outermost surface of the ceramic multilayer substrate, it is possible to obtain a small size and good filter characteristics. Further, there is no contradiction with the mounting process of gold-gold bonding.

[0087]

As described above, according to the present invention, in a high frequency electronic circuit component including a ceramic multilayer substrate and a flip chip mounting type surface acoustic wave element (SAW) directly mounted on the ceramic multilayer substrate, a function of blocking a higher harmonic region is provided. The high-frequency module component that has the following characteristics, enables productivity to be improved without contradicting each manufacturing process, enhances performance and reliability during use, and enables compact product dimensions and low profile. To provide

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a configuration example of a high frequency module component of the present invention.

FIG. 2 is a circuit diagram showing a configuration example of a high frequency module component of the present invention.

FIG. 3 is a schematic plan view showing a pattern configuration example of the high-frequency module component of the present invention.

FIG. 4 is a schematic cross-sectional view showing a configuration example of a conventional high frequency module component.

FIG. 5 is a schematic plan view showing a pattern configuration example of a conventional high frequency module component.

FIG. 6 is a schematic cross-sectional view showing a mounted state of the surface acoustic wave element.

FIG. 7 is a graph showing frequency characteristics depending on the plating thickness of the filter pattern.

FIG. 8 is a block diagram configuration diagram of a GSM dual-band mobile phone.

FIG. 9 is a cross-sectional view showing a configuration example of a modularized antenna switch unit.

[Simple explanation of symbols]

1 substrate 10 conductors 11 beer hall 12 capacitors 13 inductor 14 Surface mount device 15 Sealing member SAW surface acoustic wave device

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01P 1/203 H05K 1/02 J H03H 7/46 3/46 Q Z H05K 1/02 H01L 23/12 B 3/46 25/04 ZF Term (reference) 5E338 AA03 AA18 CC01 CC10 EE13 EE24 EE32 5E346 AA02 BB16 BB20 CC16 CC37 CC38 DD13 DD22 5F044 KK07 KK09 KK18 QQ03 5J006 HB01 A01 LA31 A30 A01 A13 LA30 A30 A01 A23 LA30 A01 A23 LA30 A30 A01 JJ09 KK10 LL08

Claims (5)

[Claims] 1. A surface acoustic wave device and other surface mount devices are mounted on a multi-layer substrate, the surface acoustic wave device is directly flip-chip mounted on a metal-coated electrode of the multi-layer substrate, and A high frequency module component in which a part of a conductor pattern having a filter function is formed in at least a part of a surface acoustic wave device mounting region of a multilayer substrate. 2. The high frequency module component according to claim 1, wherein the surface acoustic wave device is mounted on a bare chip by gold-gold bonding, and has a gold layer on a surface of the conductor pattern having the filter function. 3. The high frequency module component according to claim 1, wherein the metal film on the electrode and the gold layer of the conductor pattern are simultaneously formed by gold plating. 4. The high frequency module component according to claim 2, wherein the gold layer has a thickness of 0.1 to 1 μm. 5. The high frequency module component according to claim 1, wherein the entire height of the module is less than 2 mm.