JP2003007913A - Method of manufacturing semiconductor device and semiconductor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent degradation in the reliability of a semiconductor device or a semiconductor module due to the warpage of a wiring board (carrier material), and to reduce an assembly failure due to the warpage of the wiring board (carrier material). SOLUTION: The wiring board (carrier material) is bonded onto a supporting plane by bonding whose adhesive power is strong and whose peeling is easy. A plurality of semiconductor elements or semiconductor modules (chips) are loaded in prescribed positions on the upper face of the wiring board. The outer terminal (pad) of the semiconductor element and a wiring terminal are electrically connected by an electric connection material. The semiconductor element, the electric connection material and a connection part where the outer terminal and the wiring terminal are electrically connected are mold-sealed by resin and the like. The wiring board is peeled from the supporting plane and a terminal for outer device connection is formed in the outer terminal of the semiconductor module at the back of the peeled wiring board. The device including the respective semiconductor elements or the semiconductor module elements is separated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device or a semiconductor module, and more particularly to a ball
The present invention relates to a technique effectively applied to a grid array (BGA) type package and a land grid array (LGA) type package.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device or a semiconductor module using a thin BGA type package or an LGA type package has a large number of semiconductor elements or semiconductor modules (chips) mounted at predetermined positions on the upper surface of a thin wiring board. The external terminals (pads) of the semiconductor element or the semiconductor module are electrically connected to the wiring terminals by wires, and in this state, the semiconductor element or the semiconductor module, the wires, and the external terminals (pads) and the wiring terminals are electrically connected. The portion connected to is molded and sealed with resin, and each semiconductor element or semiconductor module on the wiring board is diced to be separated, and each separated semiconductor element or semiconductor module is provided with an external device such as a metal ball. It is manufactured by forming connection terminals.

[0003]

The present inventor has found the following problems as a result of examining the above-mentioned prior art. When a thin substrate or film is used as the wiring board, the rigidity of the thin semiconductor device or semiconductor module as a whole is low, and due to the thermal history during assembly such as pelleting, wire bonding, resin molding, and the difference in the linear expansion coefficient of different materials. However, there is a problem that the wiring board (carrier material) is largely deformed. Further, when a large number of semiconductor elements or semiconductor modules are mounted on a thin wiring board, the area of the wiring board becomes large, and there is a problem that warpage is promoted. Also, due to the warp of the thin wiring board,
There is a problem in that the positional accuracy during assembly is reduced, adhesion defects (conduction defects) due to voids, defects due to troubles in the transfer process, and the like increase, and the reliability of the semiconductor device or semiconductor module decreases.

An object of the present invention is to provide a technique capable of preventing deterioration of reliability of a semiconductor device due to warpage of a thin wiring board (carrier material). Another object of the present invention is to provide a technique capable of reducing defective assembly due to warpage of a wiring board (carrier material). The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0005]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows. That is, according to the present invention, a wiring board having a large number of wirings for mounting a plurality of elements is attached in advance on a supporting flat plate with an adhesive having a strong adhesive force and easily peeled off, and a predetermined upper surface of the wiring board is attached. A plurality of semiconductor elements (chips) are mounted at positions, and the external terminals (pads) of the semiconductor elements and wiring terminals are electrically connected by an electrical connecting member, and the semiconductor element, the electrical connecting member, and the external terminal ( Pad) and the wiring terminal are electrically connected to each other by molding and sealing, and the wiring board is peeled from the supporting flat plate, and an external device is provided on the back surface of the peeled wiring board to the external terminal of each semiconductor element. It is a method of manufacturing a semiconductor device in which a connection terminal is formed and the device including each semiconductor element is individually separated.

On the supporting flat plate, a wiring board having a large number of wirings for mounting a plurality of elements is attached in advance with an adhesive having a strong adhesive force and easy to peel off, and a predetermined position on the upper surface of the wiring board is attached. A plurality of semiconductor modules (chips) are mounted on the semiconductor module, and the external terminals (pads) and wiring terminals of the semiconductor module are electrically connected by an electrical connecting member, and the semiconductor module, the electrical connecting member, and the external terminal (pad). ) And the wiring terminals are electrically connected to each other by mold-sealing, and the wiring board is separated from the supporting flat plate,
In the method of manufacturing a semiconductor module, an external device connection terminal is formed on an external terminal of each semiconductor module on the back surface of the peeled wiring board, and the device including each semiconductor module element is individually separated. The supporting flat plate is made of glass or a metal material, and the adhesive is made of a double-sided adhesive film.

As described above, the wiring board (carrier material) is adhered and fixed to the supporting flat plate such as metal or glass, thereby improving the flatness of the wiring board (carrier material) and performing the assembly. Therefore, defects due to assembly are reduced. This improves the reliability of the semiconductor device or the semiconductor module.

Hereinafter, the present invention will be described in detail with reference to the drawings together with embodiments (embodiments). In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and repeated description thereof will be omitted.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a flow chart showing an outline procedure of all steps (processes) of a method for manufacturing a BGA type semiconductor device according to a first embodiment of the present invention.
FIG. 10 is a diagram for explaining each step of the manufacturing method of the BGA type semiconductor device shown in FIG. A method of manufacturing the BGA type semiconductor device according to the first embodiment will be described with reference to FIG.

First, as shown in FIGS. 2 and 3, a double-sided adhesive film (adhesive tape material having high adhesive strength and easy peeling) 3 is placed on a supporting flat plate 1 made of glass or metal, After the wiring board (carrier material) 2 is placed thereon, they are thermocompression bonded (step S1). Double-sided adhesive film (adhesive with strong adhesive strength and easy peeling) 3
For example, a thermosetting resin film, a dicing tape (thin tape coated with an organic adhesive on both sides), or the like is used.

The wiring board 2 is, for example, as shown in FIGS.
A single thin wiring board is used as shown in FIG. As shown in FIG. 2, the wiring board 2 is provided with semiconductor chip mounting areas 2A in an array, and each area 2A is provided with wiring corresponding to one semiconductor device in advance. Further, as shown in FIGS. 4 and 5, a large number of wiring boards 2 may be bonded in an array on the supporting flat plate 1. Also in this case, the wiring board 2 is provided with wirings corresponding to one semiconductor device in advance.

Next, as shown in FIG. 6, the wiring board 2
The semiconductor chip 4 is adhered and fixed onto each semiconductor chip mounting area 2A by paste (not shown) (step S2). External terminals (pads) of the semiconductor chip 4
And the wiring terminal are electrically connected with the gold bonding wire 5 (step S3). When a large number of wiring boards 2 are bonded as shown in FIGS. 4 and 5, each wiring board 2
The semiconductor chip 4 is adhered to the top by a paste.

Next, as shown in FIG. 7, the semiconductor chip 4, the gold bonding wire 5, and the connecting portion are molded and sealed with a resin 6 such as a resin (step S4).
Next, as shown in FIG. 8, a double-sided adhesive film (adhesive having strong adhesive strength and easy peeling) 3 from the supporting flat plate 1 is used.
Then, the wiring board 2 is peeled off (step S5). As shown in FIG. 10B, an external device connecting terminal 7 including a land (not shown) and a metal ball is formed on the back surface of the peeled wiring substrate 2 at a position corresponding to each semiconductor device. (Step S6). In this state, the device including each semiconductor element on the wiring board 2 is diced along the broken line shown in FIG. 9 to separate each into individual semiconductor devices (step S7), and thus FIG. , B are side views), each semiconductor device is obtained.

As described above, according to the first embodiment, since the flatness of the wiring board (carrier material) 2 is improved to perform the assembly, defects due to the assembly can be reduced. Thereby, the reliability of the semiconductor device can be improved.

(Second Embodiment) FIG. 11 shows a second embodiment of the present invention.
12 is a plan view for explaining a step of the method for manufacturing the BGA type semiconductor module of FIG. 12, and FIG. 12 is a side view of FIG. 11. As shown in FIGS. 11 and 12, in the method of manufacturing the BGA type semiconductor device of the second embodiment, a semiconductor module chip is used instead of the semiconductor chip of the first embodiment, and shown in FIGS. As described above, a large number of wiring boards (carrier materials) 2'of semiconductor modules are adhered in an array on the supporting flat plate 1. The wiring board 2'is a small piece of the wiring board 2.

The manufacturing process of the second embodiment is the same as that of the first embodiment and has the same effects as the first embodiment.
That is, since the flatness of the wiring board (carrier material) 2'is improved to perform the assembly, defects due to the assembly can be reduced and the reliability of the semiconductor module can be improved.

Further, by adhering only the non-defective pieces of the wiring board (carrier material) 2'which have been cut into small pieces to the supporting flat plate 1, the subsequent semiconductor chip bonding, wire bonding,
Without lowering the assembly process capability such as resin encapsulation,
Prevents cost increase.

In the above embodiments, the BGA type semiconductor device and the BGA type semiconductor module have been described as examples, but the present invention can be applied to the LGA type semiconductor device and the LGA type semiconductor module. The LGA type is different from the BGA type in that the terminals for external device connection of the thin wiring boards 2 and 2'include lands and do not have metal balls.
That is, the manufacturing steps of the semiconductor device and the semiconductor module are almost the same except for the difference between the BGA type package terminal and the LGA type package terminal.

Although the present invention has been specifically described based on the above embodiment, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. Of course.

[0020]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows. That is, according to the present invention, the wiring board (carrier material) is adhered and fixed onto a substrate such as metal or glass, so that the flatness of the wiring board (carrier material) is improved and the assembly is performed. It is possible to reduce defects due to assembly. Thereby, the reliability of the semiconductor device or the semiconductor module can be improved.

[Brief description of drawings]

FIG. 1 is a flowchart showing a schematic procedure of steps of a method for manufacturing a BGA type semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a plan view for explaining the process of step S1 of the method for manufacturing the BGA type semiconductor device of the first embodiment.

FIG. 3 is a side view of FIG.

FIG. 4 is a plan view for explaining a process of a modified example of step S1 of the method for manufacturing the BGA type semiconductor device of the first embodiment.

FIG. 5 is a side view of FIG.

FIG. 6 is a plan view for explaining steps S2 and S3 of the method for manufacturing the BGA type semiconductor device according to the first embodiment.

FIG. 7 is a plan view for explaining the process of step S4 of the method for manufacturing the BGA type semiconductor device of the first embodiment.

FIG. 8 is a plan view for explaining the process of step S5 of the method for manufacturing the BGA type semiconductor device of the first embodiment.

FIG. 9 is a plan view for explaining the process of step S7 of the method for manufacturing the BGA type semiconductor device of the first embodiment.

FIG. 10 is a diagram showing a completed device of the BGA type semiconductor device of the first embodiment.

FIG. 11 is a plan view for explaining the steps of the method for manufacturing the BGA type semiconductor module of the second embodiment.

FIG. 12 is a side view of FIG. 11.

[Explanation of symbols]

1 ... Supporting flat plate 2, 2 '... Wiring board (carrier material) 2A ... Semiconductor chip mounting area 3 ... Double-sided adhesive film 4 ... Semiconductor chip 5 ... Gold bonding wire 6 ... Resin 7 ... External device connection terminal

Continued front page    (72) Inventor Issei Suzuki             5-22-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company Hitachi Cho-LS System             Within (72) Inventor Yoshinori Miyaki             5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company within Hitachi Semiconductor Group

Claims (3)

[Claims] 1. A step of adhering a wiring board on which a plurality of element mounting wirings are provided in advance on a supporting flat plate with an adhesive material having a strong adhesive force and easy to peel off, and a top surface of the wiring board. Multiple semiconductor devices (chips) at predetermined positions
And a step of electrically connecting an external terminal (pad) and a wiring terminal of the semiconductor element with an electrical connection member, the semiconductor element, the electrical connection member, and an external terminal (pad) and a wiring terminal A step of mold-sealing a connection portion electrically connected to each other, a step of peeling the wiring board from the supporting flat plate, and an external device connection to an external terminal of each semiconductor element on the back surface of the peeled wiring board. A method of manufacturing a semiconductor device, comprising: a step of forming a terminal; and a step of individually separating a device including each of the semiconductor elements. 2. A step of adhering a wiring board, on which a multi-element mounting wiring is preliminarily provided, on a supporting flat plate with an adhesive material having a strong adhesive force and easy to peel off, and a step of attaching an upper surface of the wiring board. A step of mounting a plurality of semiconductor modules (chips) at predetermined positions; a step of electrically connecting an external terminal (pad) and a wiring terminal of the semiconductor module with an electrical connecting member; the semiconductor module, an electrical connecting member , And a step of mold-sealing the connection portion where the external terminal (pad) and the wiring terminal are electrically connected, a step of peeling the wiring board from the supporting flat plate, and a step of removing the wiring board on the back surface of the peeled wiring board. The method further comprises a step of forming an external device connection terminal on an external terminal of each semiconductor module, and a step of individually separating the device including each semiconductor module element. And a method for manufacturing a semiconductor module. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the supporting flat plate is made of glass or a metal material, and the adhesive is made of a double-sided adhesive film.