JP2003007658A - Mirror-surface polishing method and mirror-surface polisher for wafer notch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable using a single polishing disc to polish the notch end faces and a notch bevel face, for eliminating the troublesome control of two polishing discs in a mirror-surface polisher or a mirror-surface polishing method for wafer notches and contribute a wide area of the disc to polishing, thereby dispersing the polishing load, to improve the service life of the polishing disc and the polishing efficiency. SOLUTION: The mirror-surface polishing method for mirror-surface finishing notch end faces and a notch bevel face of a wafer W uses the same polishing disc 8a, having a sectional contour shape complementary with the notch end face and the wafer W is tiltable about a tilt axis A parallel to the wafer plane to assume an attitude facing the notch end face and an attitude facing the notch bevel face, and further is turnable about a turn axis B. The wafer W is set to face the notch end face, thereby polishing the end face, and the wafer W is set to face and mutually push the notch bevel face and is turned about the axis B, thereby polishing the notch bevel face.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for mirror-finishing a notch portion formed on a peripheral portion of a semiconductor wafer or the like.

[0002]

2. Description of the Related Art A semiconductor wafer is provided with notches or notches for positioning, and a beveled surface is formed by dropping the corners of the edge over the entire circumference of the semiconductor wafer including the notch.

FIG. 1A is a plan view of a semiconductor wafer, and FIG. 1B is a partial sectional view of the semiconductor wafer. Moreover, FIG.
[Fig. 4] is a perspective view showing the periphery of an enlarged notch N. Since the pattern forming surface Sp, the bevel surface Sb and the outer peripheral surface (cylindrical surface forming the outer circumference) Sc of the semiconductor wafer, as they are, cause dust generation in the subsequent process, the polishing disk and the slurry are used including the notch N portion. It is mirror-finished by polishing. In this specification, the notch bevel surface Sbn of the notch N portion and the outer peripheral surface (the surface parallel to the wafer center axis Wc) of the notch portion N are referred to as the notch end surface Scn.

Conventionally, for example, as disclosed in Japanese Unexamined Patent Publication No. 9-168953, a polishing disk having a cross-sectional shape complementary to a notch end surface for mirror-polishing one notch N portion and a notch bevel surface are substantially provided. Two types were used: abrasive discs with different cross-sectional shapes. 2 like this
The reason for using different types of polishing discs is that the polishing direction suitable for the notch end face and the polishing direction suitable for the notch bevel surface are different, and even if the same notch is seen, the opening angle of the notch differs depending on these directions. This is because it is necessary to use the polishing disks 8a and 8b having angles corresponding to the respective opening angles such as the angles α and β.

As described above, when two types of polishing disks are used, the structure becomes so complicated that it is difficult to manage each polishing disk. On the other hand, for example, Japanese Patent No. 2798347 (Japanese Patent Laid-Open No. 7-024714) discloses a technique of polishing both the notch end face and the notch bevel surface with a single polishing disc without using two types of polishing discs. Being developed. This is for polishing the notch end face and the notch bevel surface with a single polishing disk by the copying operation, and since the polishing is performed by the self-copying operation without distinguishing the directionality of these surfaces, only the tip of the polishing disk Polishing load is applied. For this reason, the life of the polishing disk is short, and polishing is performed only in a portion having a substantially narrow tip, so that high polishing efficiency cannot be obtained.

[0006]

In view of the above problems, the present invention eliminates the trouble of managing two polishing disks by polishing the notch end surface and the notch bevel surface with one polishing disk. ,
A method for mirror-polishing a wafer notch, which can improve the life of the polishing disk (the time interval for dressing (reshaping)) and the polishing efficiency by dispersing a polishing load by contributing a large area of the polishing disk, An object of the present invention is to provide a mirror surface polishing device for that purpose.

[0007]

The above problems can be solved by the following means. That is, the wafer notch mirror-polishing method of the first invention of the present application is a wafer notch mirror-polishing method for mirror-polishing a notch end surface and a notch bevel surface of a wafer by using the same polishing disk. The polishing disk has a cross-sectional contour shape complementary to the notch end surface, and the wafer is tilted about a tilting axis parallel to the wafer plane so that the notch end surface directly faces the polishing disk. The wafer may have a facing attitude and a notch bevel surface facing attitude where the notch bevel surface faces the polishing disk, and the wafer has a central axis of the wafer when the wafer takes the notch end surface facing attitude. And a shaft that is parallel to the tilting shaft and that is orthogonal to the tilting shaft and that is rotatable around a rotation shaft that passes near the bottom of the notch. By taking the notch end face facing attitude to c, by pressing the polishing disk and the notch end surface against each other, the notch end surface is polished, the notch bevel surface facing attitude is taken on the wafer, the polishing disk and A mirror-polishing method for a wafer notch, which polishes the notch bevel surface by rotating the notch bevel surface while pressing the notch bevel surface together.

According to a second aspect of the invention, in the method for mirror-polishing a wafer notch according to the first aspect of the invention, slurry is supplied to the polishing disk.

According to a third aspect of the present invention, there is provided a wafer notch mirror polishing apparatus, wherein a base, a linear slide guide provided on the base, a headstock guided by the linear slide guide, and the headstock. Headstock urging drive means for urging and moving the linear slide guide along the guide direction, and a headstock urging drive means, which is provided on the headstock, around an axis in a direction perpendicular to the guide direction of the linear slide guide. A spindle that is rotatable and to which a polishing disk for polishing a wafer can be attached, a slurry supply means for supplying slurry to the polishing disk, a spindle drive means for rotationally driving the spindle, and the base. It is mounted on the table and rotates in the direction perpendicular to the guide direction of the linear slide guide and perpendicular to the axis of the spindle. A rotary table that is rotatable as a line, a rotary table drive means for rotating the rotary table to a plurality of angular positions, and a rotary axis of the rotary table on the rotary table. A wafer table provided so as to be tiltable with a direction perpendicular to the direction as a tilt axis;
A wafer table driving means for tilting the wafer table to a plurality of angular positions, and a wafer holding means provided on the wafer table for holding the wafer are provided.

A wafer notch mirror-polishing device according to a fourth aspect of the present invention is the wafer notch mirror-polishing device according to the third aspect of the invention, wherein the headstock biasing drive means is a weight, and one end of which is coupled to the weight, and the other. An end is composed of a wire coupled to the headstock and a pulley for hanging the wire.

A wafer notch mirror-polishing apparatus according to a fifth aspect of the present invention is the wafer notch mirror-polishing apparatus according to the third aspect, wherein the headstock urging and driving means is a fluid using pressurized air or pressure oil as a working medium. It is used as an actuator.

A wafer notch mirror-polishing device according to a sixth aspect of the present invention is the wafer notch mirror-polishing device according to any one of the third through fifth inventions, wherein the rotating table driving means and the wafer table driving means are respectively stepped. It consists of a motor.

A wafer notch mirror-polishing device according to a seventh aspect of the present invention is the wafer notch mirror-polishing device according to any one of the third through sixth aspects of the invention, wherein the wafer notch mirror-polishing device is mounted on the spindle at one tilt position of the wafer table. The notch end surface of the wafer is polished by the disk, and the notch bevel surface of the wafer is polished by the same polishing disk at the other tilt position of the wafer table as the rotary table rotates.

An eighth aspect of the wafer notch mirror-polishing apparatus is the wafer notch mirror-polishing apparatus of the third to seventh aspects, wherein the polishing disk mounted on the spindle is complementary to the notch end surface of the wafer. It has a typical cross-sectional profile.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 4 is a perspective view for explaining the outline of a notch mirror surface processing method for a wafer and a mirror surface polishing apparatus therefor according to the present invention. The outline of the present invention is as follows. The present invention uses only the abrasive disc 8a, shown in FIG. 3, having an angle α, which is conventionally used to polish the notch end face. The polishing disk 8b dedicated to the notch bevel surface with the angle β as in the prior art is not used.

First, as in the conventional case, as shown in (1) of FIG. 4, the wafer W is in a horizontal state (the wafer table is shown by a dotted line), that is, the notch end surface Scn is directly opposed to the polishing disk 8a. The notch end surface Scn
To polish. At this time, the polishing disk 8a has a notch end surface S
Since it has a shape complementary to cn, the notch end surface Scn hits the entire surface (solid), and the entire notch end surface Scn is polished.

After polishing the notch end surface Scn, the wafer table 12 is tilted around the tilt axis A while the polishing disk 8a is retracted or the polishing pressure is maintained, and the notch bevel surface Sbn faces the polishing disk 8a ( Notch bevel surface facing posture). When the polishing disk 8a is pushed to the forward position in this state, the polishing disk 8a comes into contact with the innermost part of the notch bevel surface Sbn, that is, a part of the conical surface, and the polishing disk 8a is partially deformed by the applied pressing force. Is notch bevel surface Sb
The vicinity of the innermost part of n is mirror polished. FIG. 5 shows an example of the innermost region thus polished by cross-hatching.

When the polishing of this innermost region is completed, the regions (side regions) on both sides of this region are then polished. In the mirror polishing of the side region, the rotary table 31 is rotated around the rotary axis B, for example, clockwise while applying polishing pressure, and one flat surface forming the notch bevel surface Sbn is polished. When polishing of one flat surface is completed, the rotary table 31
Is rotated in the opposite direction, eg, counterclockwise, to polish the remaining flat surface. In this case, when the flat surface is being polished, the polishing disk 8a is deformed under the polishing pressure, so that the remaining conical surface area is overlapped with the already polished innermost area. To be polished. In this way, all the surfaces of the notch bevel surface Sbn are polished.

As is clear from the above description, in the present invention, only the polishing disk 8a having the angle α is used, and the conventional polishing disk having the angle β (α <β) is not used. Since the side region cannot be ground, the rotary table 31 is rotated instead.

Therefore, unlike the conventional copying operation, the polishing load is not concentrated only on the tip of the polishing disk, and the polishing load is the angle α of the polishing disk 8a.
In this invention, the problem that the life of the polishing disk is unnecessarily shortened does not occur, because it is dispersed on the two surfaces forming

In the above description, the side region is polished after the innermost region is completely polished, but this order is not important, and the order should be reversed.
Alternatively, polishing the innermost region and the side region,
It is possible to polish the notch bevel surface over the entire surface by performing each step little by little and repeating this alternately.

Further, the notch end surface and the notch bevel surface may be polished in different orders.

[Example 1] The following is an example of a notch mirror surface processing apparatus for carrying out the above polishing method. FIG. 7 is a front view showing the front surface of the notch mirror surface processing apparatus (Example 1) of the present invention, and FIG. 8 is a top view thereof. FIG. 9 is a left side view of FIG. 7.

A linear slide guide 14 is mounted on the base 15.
And a rotary slide guide 30 is provided. A linear slide table 13 is mounted on the linear slide guide 14 so as to be slidable in the front-back direction of the paper surface of FIG. 7 by a piston cylinder mechanism described later.

A headstock 5, a motor fixing plate 9 and a spindle motor 1 are mounted on the linear slide table 13. The tool spindle 6 rotatably supported by the headstock 5 is rotationally driven about an axis orthogonal to the sliding direction of the linear slide table 13 via a spindle motor 1, a pulley 2, a belt 3 and a pulley 4. A polishing disk 8a is attached to the tool spindle 6. A vibration absorber 9a is interposed between the motor fixing plate 9 and the headstock 5 and between the spindle motor 1 so that the vibration of the spindle motor 1 is not transmitted to the headstock 5 and its tool spindle 6. There is.

The rotary slide guide 30 is a rotary table 3.
1 is rotatably supported around a rotation axis. A worm wheel 32 is fixed to a shaft fixed to the rotating table 31, and the worm wheel 32 is meshed with a worm 33 which is rotationally driven by a stepping motor 34. As a result, the rotary table 31 can be rotated and positioned at an arbitrary angular position by controlling the stepping motor 34.

The bracket 11 is mounted on the rotating table 31. 10 and 11 are a top view and a side view of the rotating table 31 and the bracket 11 and their surroundings. The wafer table 12 is provided in the upper pin holes of the pair of brackets 11 so as to be tiltable around a horizontal tilt axis A by a pair of pin shafts 23. The center of tilting is the position where the vicinity of the bottom of the notch comes when the wafer W is fixed to the wafer table 12. A segment type worm wheel 24 is fixed to one of the pin shafts 23, and a worm 25 fixed to a stepping motor 26 is meshed with the worm wheel 24. With this configuration, the wafer table 12 can be tilted by a predetermined angle by controlling the rotation amount of the stepping motor 26.

The linear slide guide 14 includes slide rails 141 and 142 extending in a direction orthogonal to the tool spindle 6 (front-back direction in FIG. 7 and left-right direction in FIG. 9) and a linear slide table 13 slidable thereon. Become.
A piston rod 502 of a piston cylinder mechanism 501 is attached below the linear slide table 13. Cylinder 50 of piston cylinder mechanism 501
3 is fixed to the base 15, and the linear cylinder slide table 13 can be moved by the piston cylinder mechanism 501 in the front-back direction of the paper in FIG. 7 and in the left-right direction in FIG.

The contact force (polishing pressure) between the polishing disk 8a and the semiconductor wafer W controls the pressure of pressure oil or air (hereinafter, an example of air will be described in this embodiment) applied to the piston cylinder mechanism 501. Controlled by. In the drawing, a portion surrounded by a dotted line 650 is a portion mainly related to pressure control, and a portion surrounded by a dotted line 670 is mainly a portion related to movement of the linear slide table 13 and control of its direction.

A conduit 602 and a conduit 603 are connected before and after the cylinder 503. The two conduits 602 and 603 are connected to the respective ports of the switching valve 601. One of the remaining ports of the switching valve 601 is open to the conduit 600, and the other is open to the air as it is. Therefore, when the switching valve 601 is switched downward as shown in FIG. 9, the conduit 602 is opened to the atmosphere, and the conduit 603 is connected to the switching valve 601 and the fluid pressure source 610 via the throttle valve 651. When the switching valve 601 is switched in the opposite direction, the relationship regarding each chamber of the cylinder 503 is reversed.

A throttle valve 651 is interposed in the conduit 600, and two branch passages are formed between the throttle valve 651 and the switching valve 601. This branch path is connected to the ports of the switching valve 652 and the switching valve 662, respectively.
The remaining ports of the switching valves 652 and 662 are open to the atmosphere via the throttle valve 655 and the throttle valve 665, respectively. When switching valves 652 and 662 are in the position shown in FIG.
It is connected to the atmosphere through the throttle valve 665 and is blocked at the other position.

The switching valve 601 is operated by the actuator 604, and the switching valve 652 is operated by the actuator 653.
The position of the switching valve 662 is switched by the actuator 663. The positions of the actuators 604, 653 and 663 are controlled by the controller 605.

The operation of the mirror polishing apparatus of this embodiment will be described. First, this mirror surface processing device is set in the initial state in advance. In the initial state, the turntable 31 is at the position shown in FIG.
The wafer table 12 is positioned horizontally. At this time, the notch N of the wafer W attached to the wafer table 12 is located in front of the polishing disk 8a. Also,
The linear slide table 13 is in the retracted (left side in FIG. 9) position. When not in the initial position, piston cylinder mechanism,
The stepping motors 34, 26 are controlled by the control device 605 to be positioned at the initial position, and the polishing operation is started.

First, the wafer W is placed on the wafer table 12, and the vacuum chuck means (not shown) is operated to fix the wafer W to the wafer table 12. At this position, the notch end surface Scn of the wafer W is located in front of (faces) the polishing disk 8a.

[Polishing of Notch End Surface] Then, the spindle motor 1 is driven to drive the tool spindle 6 and the polishing disk 8.
Rotate a. Further, the slurry dropping means 21 is caused to perform a dropping operation to start supplying the slurry to the surface of the polishing disk 8a.

The control device 605 switches the switching valves 652 and 662 to appropriate positions. This 2
The combination of the positions of the two switching valves determines the air pressure in conduit 600. Here, the notch end surface Scn is initially polished. The polishing of the notch end surface Scn does not require as much force as when polishing the notch bevel surface, so the two switching valves 652, 662 are made into a conductive body (open state, the switching valve is in the lower position in FIG. 9). , Conduit 600
The pressure inside is the lowest pressure that can be selected.

Next, the controller 605 and the actuator 6
04, the switching valve 601 is moved downward, and the conduit 60
The pressure air in 0 is led to the conduit 603. This introduces pressurized air into the left chamber of cylinder 503. At this time, since the conduit 602 is open to the atmosphere via the switching valve 601, the piston rod 502 starts moving rightward (FIG. 9), and thus the linear slide table 13 also starts moving rightward.

The polishing disk 8a eventually engages with the notch end surface Scn of the wafer W. Due to this engagement, the slide table cannot move further to the right, so it stops.
During this time, since the pressure in the conduit 600 is applied to the polishing disk 8a as it is, the polishing pressure at this time causes notch end surface Sc.
n is polished.

When the polishing of the notch end surface Scn is completed after an appropriate time has elapsed, the control device 605 operates the actuators 653, 663 and 604 to switch the switching valves 652, 662 and 601 to the opposite positions.
Since the switching valves 652 and 662 are closed, the conduit 600
The internal pressure rises, and this pressure is guided to the right chamber of the cylinder 503 via the conduit 602, so that the piston rod 5
02 and the linear slide table 13 move backward at high speed. It moves backward and is stopped by a stopper (not shown). Simultaneously with the start of the backward movement, the dropping operation of the slurry dropping means 21 is also stopped.

[Polishing of Notch Bevel Surface] Subsequently, the stepping motor 26 is driven to tilt the wafer table 12. The tilt angle at this time is the position where the notch bevel surface Sbn faces the polishing surface of the polishing disk 8a. In this state, the dropping operation of the slurry dropping means 21 is restarted to start supplying the slurry to the surface of the polishing disk 8a. Further, the combination of the positions (conduction and non-conduction) of the two switching valves 652 and 662 is changed to adjust the pressure in the conduit 600 to a pressure suitable for the notch bevel surface Sbn. Switching valve 6
When 01 is switched and the linear slide table 13 is moved forward, the polishing surface (tip) of the polishing disk 8a engages with the deepest part of the notch bevel surface Sbn and polishes it. At this time, since the pressure determined by the combination of the switching valves 652 and 662 is applied to the polishing portion, the tip of the polishing disk is appropriately deformed, and the innermost portion of the notch bevel surface Sbn and its vicinity are polished as shown in FIG. It

Next, the stepping motor 34 is driven to rotate the rotary table 31 around the rotary shaft B in either direction (here, the rotary table 31 is first rotated counterclockwise). Here, FIG. 12 shows the polishing disk 8
It is an expanded top view of a and a notch part of a wafer. The wafer whose innermost portion has been polished as shown by the solid line is rotated in the direction of arrow a, so that the polishing disk 8a is shown by the broken line.
One of the inclined surfaces comes into contact with one of the side regions of the notch bevel surface Sbn. Since the polishing pressure is applied to the polishing disk 8a and the tip of the polishing disk is appropriately deformed, this side region and one side of the conical surface are simultaneously polished as shown in FIG. When polishing of this region is completed after an appropriate time has elapsed, the stepping motor 34 is driven in the opposite direction to similarly polish the remaining side regions and the conical surface.

In the above example, for the sake of convenience of explanation, it is explained that polishing of the innermost portion and polishing of the side regions including both sides of the conical surface are sequentially performed each time one is completed. The table 31 can be reciprocated so as to be repeatedly rotated, so that polishing of both can proceed substantially at the same time.

After polishing the entire notch bevel surface,
The linear slide table 13 is returned to the retracted position, the rotary table 31 and the wafer table 12 are returned to the initial angular positions, and a new wafer is exchanged.

[Embodiment 2] In Embodiment 1, the polishing pressure is applied by hydraulic pressure, but Embodiment 2 is an example in which the polishing pressure is applied by a weight. Except this point, it is substantially the same as the first embodiment, and therefore the description will be limited to this point. FIG. 13 is a left side view of the notch mirror surface processing device of the second embodiment, which is a view corresponding to FIG. 9 of the first embodiment.
The same reference numerals are used for the members substantially equivalent to those in the first embodiment.

A piston rod 50 of a piston / cylinder mechanism 501 is provided at the lower extension of the linear slide table 13.
2 is slidably fitted. A flange 502f is provided at the tip of the piston rod 502. When the piston rod 502 moves to the left and the flange 502f collides with the extension, the linear slide table 13
Starts moving to the left. On the contrary, piston rod 5
When 02 moves to the right, the flange 502f does not interfere with the above-mentioned extended portion, so that the piston cylinder mechanism 501 does not move the linear slide table 13.

The base 15 is provided with a pulley supporting member 703, and the pulley supporting member 703 has a pulley 7
02 is rotatably supported. One end of the wire 701 is fixed to the linear slide table 13,
After being hung on the pulley 702, the other end of the wire 701 is fixed to the weight 704.

The weight applied to the weight 704 is the weight of the wire 7
Since it is transmitted to the linear slide table 13 via 01, the linear slide table 13 always tries to move to the right. Therefore, the linear slide table 13 is moved leftward by the piston rod 502, and unless the flange 502f interferes with the extension portion, the weight 7 is moved.
Move to the right by 04.

At the time of polishing, that is, when polishing the notch end surface Scn and the notch bevel surface Sbn, when the switching valve 601 is switched to the lower side (state of FIG. 13), the fluid pressure source 610.
The air sent from is led to the left chamber of the piston cylinder mechanism 501. At this time, since the linear slide table 13 is biased rightward by the weight 704,
Following the movement of the piston rod 502, it moves to the right. When the polishing disk 8a eventually contacts the wafer W,
The piston rod 502 continues to move, but the linear slide table 13 stops moving. Therefore, the gravity of the weight 704 is applied to the polishing surface as it is, and this becomes the polishing pressure.

On the other hand, when the switching valve 601 is switched upward during backward movement, the air sent from the fluid pressure source 610 is guided to the right chamber of the piston cylinder mechanism 501, and the piston rod 502 starts moving leftward. Eventually, the flange 502f collides with the extension portion, the gravity of the weight 704 is overcome, and the linear slide table 13 moves leftward to reach the initial position. A duplicate description of the notch mirror polishing procedure is omitted. Except for the points described above, the explanation is as in Example 1.

[Third Embodiment] FIG. 14 is a top view of a main portion for explaining the third embodiment. In the first and second embodiments, the rotating table 31 is rotated by the stepping motor 34, but in the third embodiment, the rotating table 31 is rotated by the movement of the headstock 5 in the spindle axis direction. Has been done. Therefore, the stepping motor 34, the worm 33, and the worm wheel 32 found in the first and second embodiments are not provided. The rotary table 31 can freely rotate around the center x by applying a force from the outside. When the rotary table 31 is rotated, the headstock 5 is moved with the tip of the polishing disk 8a engaged with the notch.
Is moved in the spindle axis direction (for example, the direction of the right arrow), the rotary table 31 is rotated by engagement with the notch. The other structure is the same as that of the first or second embodiment, and thus this embodiment will not be described any more.

[0051]

According to the mirror polishing apparatus or the notch mirror polishing method of the present invention, the notch end surface and the notch bevel surface are polished by one polishing disk.
It is possible to eliminate the trouble of managing two polishing disks. Further, even when the notch end surface and the notch bevel surface are polished by one polishing disc as described above, the polishing load is applied only to the tip of the polishing disc as in the polishing by the self-copying operation. This has the effect of not causing a problem that the life is shortened or high polishing efficiency cannot be obtained.

[Brief description of drawings]

FIG. 1A is a plan view of a semiconductor wafer,
(B) is a partial cross-sectional view of the semiconductor wafer.

FIG. 2 is a perspective view showing the periphery of an enlarged notch N.

FIG. 3 is a perspective view showing the vicinity of an enlarged notch.

FIG. 4 is an explanatory view of a tool spindle 6 provided with two polishing disks 8a and 8b for explaining an outline of conventional notch mirror finishing.

FIG. 5 is a perspective view showing cross-hatching of the polished innermost region of the notch bevel surface Sbn.

FIG. 6 is a perspective view showing cross-hatching of a polished side region of a notch bevel surface Sbn and one side of a conical surface.

FIG. 7 is a front view showing the front surface of the notch mirror surface processing device (Example 1) of the present invention.

FIG. 8 is a top view of the notch mirror surface processing device (Example 1) of the present invention.

FIG. 9 is a left side view in FIG. 7 of the notch mirror surface processing device (first embodiment) of the present invention.

10 is a top view of the rotating table 31 and the periphery of the bracket 11. FIG.

FIG. 11 is a side view of the rotating table 31 and the periphery of the bracket 11.

FIG. 12 is an enlarged top view of a polishing disk 8a and a notch portion of a wafer.

FIG. 13 is a left side view of the notch mirror surface processing device according to the second embodiment and is a view corresponding to FIG. 9 of the first embodiment.

FIG. 14 is a top view of relevant parts for explaining a third embodiment.

[Explanation of symbols]

1 Spindle motor Two and four pulleys 3 belts 5 Headstock 6 tool spindle 9 Motor fixing plate 11 bracket 12 wafer table 13 Linear slide table 14 Linear slide guide 15 bases 21 Slurry dropping means 23 pin shaft 30 Rotating slide guide 31 rotating table 32, 24 warm wheels 33, 25 warm 34, 26 stepping motor 141, 142 Slide rail 501 piston cylinder mechanism 502 piston rod 503 cylinder 601, 652, 662 switching valve 602, 603, 600 conduit 604, 653, 663 actuator 605 Control device 610 Fluid pressure source 651,655,665 Throttle valve 670 dotted line 701 wire 702 pulley 703 pulley support member 704 weight 8a, 8b polishing disc 9a Vibration absorber 502f flange A tilt axis B rotation axis N notch W semiconductor wafer Sb bevel surface Sp pattern formation surface Wc Wafer center axis Sbn notch bevel surface Scn Notch end face

Claims (8)

[Claims] 1. A mirror polishing method for a wafer notch for mirror-finishing a notch end surface and a notch bevel surface of a wafer using the same polishing disk, wherein the polishing disk has a cross section complementary to the notch end surface. The wafer is provided with a contour shape, the wafer is tilted about a tilt axis parallel to the wafer plane, and the notch end surface is in a face-to-face position where the notch end surface faces the polishing disk, and the notch bevel surface is the polishing disk. The wafer can have a notch bevel surface directly facing attitude, and the wafer has an axis parallel to the central axis of the wafer when the wafer has the notch end surface directly facing attitude and orthogonal to the tilt axis. The wafer is rotatable about a rotation axis passing near the bottom of the notch, and the wafer is made to have a face-to-face attitude of the notch, and the polishing is performed. The notch end surface is polished by pressing the disc and the notch end surface against each other, the notch bevel surface is placed in a face-to-face position on the wafer, and the polishing disk and the notch bevel surface are pressed against each other while rotating around the rotation axis. A method for polishing a mirror surface of a wafer notch, which comprises polishing the notch bevel surface by rotating the notch bevel. 2. The wafer notch mirror polishing method according to claim 1, wherein slurry is supplied to the polishing disk. 3. A base, a linear slide guide provided on the base, a headstock guided by the linear slide guide, and a biasing of the headstock along a guide direction of the linear slide guide. And a headstock urging drive means for moving the headstock, and the headstock being provided on the headstock and rotatable about an axis in a direction perpendicular to the guide direction of the linear slide guide for polishing a wafer. A spindle to which a polishing disk can be attached, a slurry supplying means for supplying a slurry to the polishing disk, a spindle driving means for rotationally driving the spindle, and a guide for the linear slide guide provided on the base. A rotation table which is perpendicular to the direction and is orthogonal to the axial direction of the spindle as a rotation axis; Rotating table driving means for rotating the moving table to a plurality of angular positions, and tiltably provided on the rotating table with a direction perpendicular to the rotating axis direction of the rotating table as a tilt axis. And a wafer table driving means for tilting the wafer table into a plurality of angular positions, and a wafer holding means provided on the wafer table for holding a wafer. Mirror polishing device for wafer notch. 4. The wafer mirror polishing apparatus according to claim 3, wherein the headstock biasing drive means is a weight, and a wire having one end coupled to the weight and the other end coupled to the headstock. And a mirror notch polishing device for a wafer notch, which comprises a pulley for hanging the wire. 5. The wafer notch mirror polishing apparatus according to claim 3, wherein the headstock biasing drive means is a fluid actuator using pressurized air or pressure oil as a working medium. apparatus. 6. The wafer mirror polishing apparatus according to any one of claims 3 to 5, wherein the rotating table driving means and the wafer table driving means each comprise a stepping motor. Mirror polishing device for wafer notch. 7. The wafer mirror polishing apparatus according to any one of claims 3 to 6, wherein a notch end surface of the wafer is moved by a polishing disk attached to the spindle at one tilt position of the wafer table. A mirror-polishing device for a wafer notch, wherein the notch bevel surface of the wafer is polished, and the notch bevel surface of the wafer is polished at the other tilted position of the wafer table by the same polishing disk as the rotary table rotates. 8. The wafer mirror polishing apparatus according to any one of claims 3 to 7, wherein the polishing disk mounted on the spindle has a cross-sectional contour complementary to the notch end surface of the wafer. Characteristic wafer notch mirror polishing device.