JP2003001483A - Solder and soldered article - Google Patents
Solder and soldered articleInfo
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- JP2003001483A JP2003001483A JP2002089344A JP2002089344A JP2003001483A JP 2003001483 A JP2003001483 A JP 2003001483A JP 2002089344 A JP2002089344 A JP 2002089344A JP 2002089344 A JP2002089344 A JP 2002089344A JP 2003001483 A JP2003001483 A JP 2003001483A
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- soldering
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半田ならびに半田
付け物品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to solder and soldered articles.
【０００２】[0002]
【従来の技術】従来より、電子機器や電子部品の電気的
・機械的な接続を得るために半田が用いられている。こ
の半田は、ＳｎとＰｂを主成分としたもの（以下Ｓｎ−
Ｐｂ系半田とする。）が一般的に用いられてきたが、地
球環境を考慮してＰｂを含まないＳｎを主成分とし残部
がＡｇ，Ｂｉ，Ｃｕ，Ｉｎ，Ｓｂなどからなる半田（以
下、Ｐｂフリー半田とする。）が用いられるようになっ
てきている。2. Description of the Related Art Conventionally, solder has been used to obtain electrical and mechanical connection of electronic devices and electronic parts. This solder contains Sn and Pb as main components (hereinafter Sn-
Use Pb-based solder. ) Has been generally used, but in consideration of the global environment, a solder composed of Sn that does not contain Pb as a main component and the balance of Ag, Bi, Cu, In, Sb, etc. (hereinafter referred to as Pb-free solder). ) Is being used.
【０００３】近年においてはこのＰｂフリー半田を用い
ることによって、半田付け性が良好な電気的接合部を有
する半田付け物品が製造されてきた。In recent years, by using this Pb-free solder, a soldering article having an electric joint having good solderability has been manufactured.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、Ｓｎが
主成分である半田、特にＰｂフリー半田を用いた半田付
け物品では、半田付け時に電極喰われが起こったり、高
温放置や熱エージングを行った場合に、Ｓｎの拡散によ
る電気的、機械的性質の劣化が起こるといった問題点が
あった。However, in a soldering article using a solder containing Sn as a main component, particularly Pb-free solder, when the electrode is eaten during the soldering, or when it is left at a high temperature or subjected to thermal aging. In addition, there is a problem that electrical and mechanical properties are deteriorated due to Sn diffusion.
【０００５】本発明の目的は、半田付け時または半田付
け後熱エージングを行ったときに、電極喰われや特性劣
化が生じにくいＰｂフリー半田ならびに半田付け物品を
提供することにある。It is an object of the present invention to provide a Pb-free solder and a soldering article in which electrode erosion and characteristic deterioration are less likely to occur when soldering or after heat aging after soldering.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記の課題を
解決するためにＰｂフリー半田ならびに半田付け物品を
完成するに至った。本願第１の発明のＰｂフリー半田
は、Ｃｏ０．０１〜１重量％およびＦｅ０．０１〜０．
２重量％から選ばれる少なくとも１種類と、Ｓｂ０．５
〜５重量％と、Ｓｎ９０．５重量％以上と、を含有して
なることを特徴とする。The present invention has completed a Pb-free solder and a soldered article in order to solve the above problems. The Pb-free solder of the first invention of the present application is 0.01 to 1% by weight of Co and 0.01 to 0.
At least one selected from 2% by weight and Sb0.5
.About.5 wt.% And Sn 90.5 wt.% Or more.
【０００７】また、本願第２の発明のＰｂフリー半田に
おいては、Ｃｏ０．０１〜１重量％およびＦｅ０．０１
〜０．２重量％から選ばれる少なくとも１種類と、Ａｇ
０．５〜９重量％と、Ｓｎ９０．５重量％以上と、を含
有してなることを特徴とする。Further, in the Pb-free solder of the second invention of the present application, Co 0.01 to 1 wt% and Fe 0.01
To at least one selected from 0.2 wt% and Ag
It is characterized by containing 0.5 to 9 wt% and Sn 90.5 wt% or more.
【０００８】また、本発明の半田付け物品は、溶融した
Ｓｎへ拡散しやすい遷移金属導体を有する部品を半田に
より接合してなる半田付け物品であって、半田は、上述
の第１または第２の発明のＰｂフリー半田を用いたこと
を特徴とする。Further, the soldering article of the present invention is a soldering article in which a component having a transition metal conductor that easily diffuses into molten Sn is joined by soldering, and the solder is the above-mentioned first or second. The invention is characterized by using the Pb-free solder.
【０００９】また、本発明の半田付け物品においては、
遷移金属導体は、Ｃｕ，Ａｇ，Ｎｉ，Ａｕ，Ｐｄ，Ｐ
ｔ，Ｚｎの単体もしくはそれらの合金のうち少なくとも
１種類を用いることを特徴とする。Further, in the soldering article of the present invention,
Transition metal conductors are Cu, Ag, Ni, Au, Pd, P
It is characterized by using at least one of t and Zn alone or their alloys.
【００１０】[0010]
【発明の実施の形態】以下本発明の実施の形態について
説明する。本願第１の発明のＰｂフリー半田は、Ｃｏお
よびＦｅから選ばれる少なくとも１種類と、Ｓｂと、Ｓ
ｎと、を含有する組成である。また、本願第２の発明の
Ｐｂフリー半田は、ＣｏおよびＦｅから選ばれる少なく
とも１種類と、Ａｇと、Ｓｎと、を含有する組成であ
る。そして、本発明の半田付け物品は、溶融したＳｎへ
拡散しやすい遷移金属導体を有する部品を半田により接
合してなる半田付け物品であって、半田は、上述した第
１または第２の発明のＰｂフリー半田を用いる。このよ
うな組成により、半田付け性、接合強度が良好であると
ともに、十分な耐電極喰われ性を有する半田付け物品を
提供することが可能となる。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. The Pb-free solder of the first invention of the present application is at least one selected from Co and Fe, Sb, and S.
n is included in the composition. The Pb-free solder of the second invention of the present application has a composition containing at least one kind selected from Co and Fe, Ag, and Sn. The soldering article of the present invention is a soldering article in which a component having a transition metal conductor that easily diffuses into molten Sn is joined by solder, and the solder is the above-mentioned first or second invention. Pb-free solder is used. With such a composition, it becomes possible to provide a soldering article which has good solderability and bonding strength and has sufficient resistance to electrode erosion.
【００１１】すなわち、微少量添加されたＣｏ，Ｆｅが
導体と半田の接合界面に偏析層を形成し、導体の溶融半
田中への拡散を防ぎ、電極喰われを防止するためであ
る。That is, Co and Fe added in a small amount form a segregation layer at the bonding interface between the conductor and the solder, prevent the conductor from diffusing into the molten solder, and prevent erosion of the electrode.
【００１２】上記Ｃｏの添加量を全体１００重量％のう
ち０．０１〜１重量％としたのは、Ｃｏの添加量が０．
０１重量％未満の場合には耐電極喰われ性が劣化するか
らである。一方、Ｃｏの添加量が１重量％を超える場合
には液相線温度が上昇し、溶融特性を阻害するからであ
る。なお、より好ましいＣｏ添加量は０．０１〜０．５
重量％の範囲であり、特にＣｏ添加量が０．５重量％の
ときが好ましい。The amount of Co added is set to 0.01 to 1% by weight of the total 100% by weight because the amount of Co added is 0.1%.
This is because if it is less than 01% by weight, the resistance to electrode erosion deteriorates. On the other hand, if the addition amount of Co exceeds 1% by weight, the liquidus temperature rises and the melting characteristics are impaired. A more preferable amount of Co added is 0.01 to 0.5.
It is in the range of wt%, and particularly when the amount of Co added is 0.5 wt%.
【００１３】上記Ｆｅの添加量を全体１００重量％のう
ち０．０１〜０．２重量％としたのは、Ｆｅの添加量が
０．０１重量％未満の場合には耐電極喰われ性が劣化す
るからである。一方、Ｆｅの添加量が０．２重量％を超
える場合には液相線温度が上昇し、溶融特性を阻害する
からである。なお、より好ましいＦｅ添加量は０．０１
〜０．１重量％の範囲であり、特にＦｅ添加量が０．１
重量％のときが望ましい。The amount of Fe added is set to 0.01 to 0.2% by weight of the total 100% by weight, because the resistance to electrode erosion is low when the added amount of Fe is less than 0.01% by weight. Because it deteriorates. On the other hand, if the addition amount of Fe exceeds 0.2% by weight, the liquidus temperature rises and the melting characteristics are impaired. The more preferable amount of Fe added is 0.01
Is 0.1 to 0.1% by weight, and particularly, the amount of Fe added is 0.1
It is desirable when the content is wt%.
【００１４】上記Ｓｂの添加量を全体重量１００重量％
のうち０．５〜５重量％としたのは、Ｓｂの添加量が
０．５重量％未満の場合には、強度改善効果が小さいか
らである。一方、Ｓｂの添加量が５重量％を超える場合
には、伸びが低下することによって熱衝撃性や加工性が
阻害されるからである。The total amount of Sb added is 100% by weight.
Of these, 0.5 to 5% by weight is used because the effect of improving strength is small when the amount of Sb added is less than 0.5% by weight. On the other hand, when the amount of Sb added exceeds 5% by weight, thermal shock resistance and workability are impaired due to the decrease in elongation.
【００１５】上記Ａｇの添加量を全体重量１００重量％
のうち０．５〜９重量％としたのは、Ａｇの添加量が
０．５重量％未満の場合には強度改善効果が小さいから
である。一方、Ａｇの添加量が９重量％を超える場合に
は、過剰のＡｇ3Ｓｎ金属間化合物が析出することによ
る接合強度低下と、半田液相線温度が上昇することによ
る溶融特性が阻害されるからである。The total amount of Ag added is 100% by weight.
Of these, 0.5 to 9% by weight is used because the strength improving effect is small when the amount of Ag added is less than 0.5% by weight. On the other hand, when the addition amount of Ag exceeds 9% by weight, the bonding strength is lowered due to the precipitation of an excessive Ag 3 Sn intermetallic compound and the melting characteristics are hindered due to the rise of the solder liquidus temperature. Because.
【００１６】本発明でいう溶融したＳｎへ拡散しやすい
遷移金属導体の組成としては、Ｃｕ，Ａｇ，Ｎｉ，Ａ
ｕ，Ｐｄ，Ｐｔ，Ｚｎの単体などが代表的である。な
お、これらの遷移金属の合金、例えばＡｇ／Ｐｄ，Ａｇ
／Ｐｔ等でもよい。より好ましくは、Ｃｕ，Ａｇ，Ｎｉ
の単体もしくはその合金である。このような電極喰われ
しやすい導体を有する物品に用いても、半田付け性、接
合強度を維持しつつ電極喰われ抑制が可能となる。The composition of the transition metal conductor which is easily diffused into the molten Sn according to the present invention is Cu, Ag, Ni, A.
A simple substance such as u, Pd, Pt, or Zn is typical. An alloy of these transition metals, for example, Ag / Pd, Ag
It may be / Pt or the like. More preferably Cu, Ag, Ni
Is a simple substance or an alloy thereof. Even when it is used for an article having such a conductor that easily erodes an electrode, it is possible to suppress erosion of the electrode while maintaining solderability and bonding strength.
【００１７】上記遷移金属導体には必要に応じてガラス
フリットや種々の添加剤（金属酸化物など）が添加され
るが、導電成分である金属組成が上記のような組成であ
れば同様の効果が得られることは勿論である。また、半
田組成として、作業温度を下げる目的でＢｉ，Ｉｎ等の
低融点金属を添加した場合も同様の効果が得られる。Glass frit and various additives (such as metal oxides) are added to the above-mentioned transition metal conductor as needed, but the same effect can be obtained if the metal composition as the conductive component is as described above. Of course, The same effect can be obtained when a low melting point metal such as Bi or In is added as the solder composition for the purpose of lowering the working temperature.
【００１８】ここで、本発明においては、半田組成とし
て上記成分以外に不可避不純物を含むものであってもよ
い。不可避不純物としては、半田を製造するときに混入
する元素もしくは元々入っていた元素、例えばＰｂ，Ｂ
ｉ，Ｃｕ，Ｎａなどが挙げられる。In the present invention, the solder composition may contain inevitable impurities in addition to the above components. The unavoidable impurities include elements that are mixed in when solder is manufactured or elements that are originally contained, such as Pb and B.
i, Cu, Na and the like are included.
【００１９】本発明の半田付け物品は、例えば、主成分
のＳｎに上記添加成分を溶解させたＰｂフリー半田をボ
ール状に加工し、半田ボ−ルを部品上あるいは基板上に
載せてフラックスを塗布した後、大気中で所定の温度に
加熱して部品の導体を接合することにより容易に作製す
ることが可能である。In the soldering article of the present invention, for example, Pb-free solder in which the above-mentioned additional component is dissolved in Sn as a main component is processed into a ball shape, and the solder ball is placed on a component or a substrate to apply a flux. After coating, it can be easily manufactured by heating to a predetermined temperature in the atmosphere and joining the conductors of the components.
【００２０】なお、一般的には半田付け性向上のために
Ｎ2雰囲気で半田付けすることが多いが、本発明ではＣ
ｏ、Ｆｅの添加量が少ないため、大気中で半田付けする
ことが可能である。Generally, in order to improve solderability, soldering is often performed in an N 2 atmosphere, but in the present invention, C is used.
Since the amounts of o and Fe added are small, it is possible to perform soldering in the atmosphere.
【００２１】本発明の半田付け物品とは、接合される部
品そのものと、部品の導体同士を電気的、機械的に接合
した半田接合部とを含めた全体を意味するものであり、
さまざまな形態があるが、例えば、部品搭載基板に形成
された導体と部品に形成された導体を電気的、機械的に
接続させるために半田付けさせたものや、電子部品素子
と端子を電気的、機械的に接続させるために半田付けさ
せたものや、電子部品素子の電極同士を電気的、機械的
に接続させるために半田付けさせたものなどが代表的で
ある。The soldered article of the present invention means the whole including the parts themselves to be joined and the solder joints where the conductors of the parts are joined electrically and mechanically,
There are various forms. For example, the conductor formed on the component mounting board and the conductor formed on the component are soldered to connect them electrically or mechanically, or the electronic component element and terminal are electrically connected. Typical examples include those soldered for mechanical connection, those soldered for electrically and mechanically connecting electrodes of electronic component elements.
【００２２】上記部品搭載基板としては、例えば、ガラ
スエポキシ製のプリント基板やフェノール製のプリント
基板、アルミナなどのセラミック基板、金属の表面にセ
ラミック等の絶縁膜を有する基板などが挙げられる。さ
らに、上記導体としては、プリント基板等の配線回路、
電子部品の端子電極、リード端子などが挙げられる。Examples of the component mounting substrate include a glass epoxy printed circuit board, a phenolic printed circuit board, a ceramic substrate such as alumina, and a substrate having an insulating film such as ceramic on a metal surface. Furthermore, as the conductor, a wiring circuit such as a printed circuit board,
Examples thereof include terminal electrodes of electronic parts and lead terminals.
【００２３】このようにして作製された本発明のＰｂフ
リー半田ならびに半田付け物品は、半田付け性、接合強
度が良好であり、かつ、優れた耐電極喰われ性を有して
いるため、半田付け温度を自由に設定することが可能で
作業性に優れたものとなる。また、Ａｇ等の高価な電極
喰われ抑制元素の添加量を少なくすることが可能とな
る。次に、本発明を実施例に基づき、さらに具体的に説
明するが、本発明はかかる実施例のみに限定されるもの
ではない。The Pb-free solder and the soldered article of the present invention thus manufactured have good solderability and bonding strength, and have excellent resistance to electrode erosion. The attachment temperature can be freely set, resulting in excellent workability. Further, it becomes possible to reduce the amount of addition of an expensive element that suppresses the consumption of electrodes such as Ag. Next, the present invention will be described more specifically based on Examples, but the present invention is not limited to such Examples.
【００２４】[0024]
【実施例】表１に本実施例で用いる半田組成を示す。な
お、比較例の組成も表１に併せて示す。EXAMPLES Table 1 shows the solder composition used in this example. The composition of the comparative example is also shown in Table 1.
【００２５】[0025]
【表１】 [Table 1]
【００２６】さらに表１に示したＰｂフリー半田につい
て、半田付け時の耐電極喰われ性、半田付け性の評価結
果を表２に示す。Further, with respect to the Pb-free solder shown in Table 1, evaluation results of resistance to electrode erosion during soldering and solderability are shown in Table 2.
【００２７】[0027]
【表２】 [Table 2]
【００２８】ここで、半田付け時の耐電極喰われ性評価
は静電容量変化法で測定をおこなった。Ｃｕ電極（膜厚
３μｍ）或いはＡｇ電極（膜厚２０μｍ）を印刷焼成し
た単板コンデンサを半田に浸漬し、浸漬前後の静電容量
の差分値をとり、浸漬前の静電容量に対する前記差分値
を求めて電極の残存率を算出した。評価を行った半田付
け温度は表２に示す。Ｃｕ電極は１０秒間浸漬後の容量
変化、Ａｇ電極は喰われ易いので３秒間浸漬後の容量変
化を測定した。表２に「半田付け後の電極面積残存率」
として示す。Here, the resistance to electrode erosion during soldering was evaluated by the capacitance change method. A single-plate capacitor having a Cu electrode (thickness 3 μm) or an Ag electrode (thickness 20 μm) printed and baked is dipped in solder, and the difference value of the capacitance before and after the immersion is taken to obtain the difference value with respect to the capacitance before the immersion. Then, the residual rate of the electrode was calculated. The soldering temperatures evaluated are shown in Table 2. The Cu electrode was measured for capacitance change after immersion for 10 seconds, and the Ag electrode was easily eaten, so the capacitance change after immersion for 3 seconds was measured. Table 2 "Remaining electrode area after soldering"
Show as.
【００２９】Ｃｕ電極において、実施例２、３、７およ
び８は電極残存率が９５％以上であり、いずれも非常に
良好な耐電極喰われ性を示した。また、代表的なＰｂフ
リー半田である比較例１〜２では、電極残存率が９０％
以下であり、耐電極喰われ性に問題が見られた。With respect to the Cu electrode, Examples 2, 3, 7 and 8 had an electrode residual rate of 95% or more, and all exhibited very good resistance to electrode erosion. Further, in Comparative Examples 1 and 2 which are typical Pb-free solders, the electrode residual rate is 90%.
Below, there was a problem with the resistance to electrode erosion.
【００３０】実施例１、実施例４は７７〜８５％の電極
残存率であり他の実施例より電極喰われ抑制効果が小さ
いが、これは有効元素の添加量が少ないためである。た
だしいずれの組成も、半田付け条件次第では使用可能な
レベルである。In Examples 1 and 4, the electrode residual rate was 77 to 85%, and the effect of suppressing electrode erosion was smaller than in the other Examples, but this is because the amount of the effective element added was small. However, both compositions are at usable levels depending on the soldering conditions.
【００３１】また、実施例５〜６も他の実施例より耐電
極喰われ効果が小さいが、これはＦｅの電極喰われ抑制
効果が他の元素より小さいためである。ただしいずれの
組成も、半田付け条件次第では使用可能なレベルであ
る。Also, in Examples 5 to 6, the effect of resisting electrode erosion is smaller than in the other Examples, but this is because the effect of suppressing the electrode erosion of Fe is smaller than that of other elements. However, both compositions are at usable levels depending on the soldering conditions.
【００３２】またＡｇ電極においてもＣｕと類似の傾向
があり、いずれの場合も比較例と比較すると本発明の添
加元素が電極食われ抑制に効果があった。The Ag electrode also has a tendency similar to that of Cu, and in any case, the additive element of the present invention was effective in suppressing electrode erosion as compared with the comparative example.
【００３３】半田付け性については、半田広がり率（Ｊ
ＩＳＺ３１９７に準拠）を用いて評価をおこなった。実
施例１、２、４および７については、いずれも半田広が
り率が７０％以上であり、非常に良好な半田付け性であ
った。また比較例１〜３についても、いずれも半田広が
り率が７０％以上であり、非常に良好な半田付け性であ
った。Regarding solderability, the solder spread ratio (J
Evaluation was carried out using (according to ISZ3197). In each of Examples 1, 2, 4 and 7, the solder spreading ratio was 70% or more, and the solderability was very good. Further, also in Comparative Examples 1 to 3, the solder spread rate was 70% or more, and the solderability was very good.
【００３４】実施例３、実施例６は半田広がり率が低下
しているが、これは有効元素の添加量が多いために液相
温度が上昇し、半田の流動性が阻害されたためである。In Examples 3 and 6, the solder spreading rate was lowered, but this is because the liquid phase temperature was increased and the fluidity of the solder was hindered due to the large amount of the effective element added.
【００３５】[0035]
【発明の効果】このように本発明の半田付け物品を用い
れば、半田接合部において半田付け性が良好であるとと
もに、優れた耐電極喰われ性を備えることが可能であ
る。また、この耐電極喰われ性は、半田付け時の電極喰
われにとどまらず、半田付け後の半田付け物品の高温放
置時の電極喰われについても抑制可能である。As described above, by using the soldering article of the present invention, it is possible to have good solderability at the solder joint portion and excellent resistance to electrode erosion. The resistance to electrode erosion is not limited to electrode erosion during soldering, and can also be suppressed when the soldered article after soldering is left at high temperature.
【００３６】また、Ｐｂフリー半田で課題となっている
電極喰われを抑制できるため、半田のＰｂフリー化がよ
り実用的となり、環境にやさしい製品を提供することが
可能になる。Further, since it is possible to suppress the electrode erosion, which is a problem with Pb-free solder, it is possible to make the solder Pb-free, and it is possible to provide an environment-friendly product.
Claims (4)
０１〜０．２重量％から選ばれる少なくとも１種類と、
Ｓｂ０．５〜５重量％と、Ｓｎ９０．５重量％以上と、
を含有してなることを特徴とする、Ｐｂフリー半田。1. 0.01 to 1% by weight of Co and Fe0.
At least one selected from 01 to 0.2% by weight,
Sb 0.5 to 5 wt%, Sn 90.5 wt% or more,
Pb-free solder, characterized in that it contains
０１〜０．２重量％から選ばれる少なくとも１種類と、
Ａｇ０．５〜９重量％と、Ｓｎ９０．５重量％以上と、
を含有してなることを特徴とする、Ｐｂフリー半田。2. 0.01 to 1% by weight of Co and Fe0.
At least one selected from 01 to 0.2% by weight,
Ag 0.5 to 9 wt% and Sn 90.5 wt% or more,
Pb-free solder, characterized in that it contains
体を有する部品を半田により接合してなる半田付け物品
であって、前記半田は、請求項１または２に記載のＰｂ
フリー半田を用いたことを特徴とする、半田付け物品。3. A soldering article in which a component having a transition metal conductor that easily diffuses into molten Sn is joined by soldering, wherein the solder is Pb according to claim 1 or 2.
A soldering article characterized by using free solder.
ｉ，Ａｕ，Ｐｄ，Ｐｔ，Ｚｎの単体もしくはそれらの合
金のうち少なくとも１種類を用いることを特徴とする請
求項３に記載の半田付け物品。4. The transition metal conductor is Cu, Ag, N.
The soldering article according to claim 3, wherein at least one of i, Au, Pd, Pt, and Zn alone or an alloy thereof is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089344A JP3700668B2 (en) | 2002-03-27 | 2002-03-27 | Solder and soldered articles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089344A JP3700668B2 (en) | 2002-03-27 | 2002-03-27 | Solder and soldered articles |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01614298A Division JP3684811B2 (en) | 1998-01-28 | 1998-01-28 | Solder and soldered articles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003001483A true JP2003001483A (en) | 2003-01-08 |
| JP3700668B2 JP3700668B2 (en) | 2005-09-28 |
Family
ID=19193475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002089344A Expired - Lifetime JP3700668B2 (en) | 2002-03-27 | 2002-03-27 | Solder and soldered articles |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3700668B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8823245B2 (en) | 2009-11-20 | 2014-09-02 | Epcos Ag | Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material |
| WO2015125855A1 (en) * | 2014-02-24 | 2015-08-27 | 株式会社弘輝 | Lead-free solder alloy, solder material, and joined structure |
| US10002845B2 (en) | 2014-10-17 | 2018-06-19 | Fuji Electric Co., Ltd. | Lead-free soldering method and soldered article |
-
2002
- 2002-03-27 JP JP2002089344A patent/JP3700668B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8823245B2 (en) | 2009-11-20 | 2014-09-02 | Epcos Ag | Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material |
| WO2015125855A1 (en) * | 2014-02-24 | 2015-08-27 | 株式会社弘輝 | Lead-free solder alloy, solder material, and joined structure |
| CN106061669A (en) * | 2014-02-24 | 2016-10-26 | 株式会社弘辉 | Lead-free solder alloy, solder material, and joined structure |
| JPWO2015125855A1 (en) * | 2014-02-24 | 2017-03-30 | 株式会社弘輝 | Lead-free solder alloy, solder material and joint structure |
| US9764430B2 (en) | 2014-02-24 | 2017-09-19 | Koki Company Limited | Lead-free solder alloy, solder material and joined structure |
| EP3112080A4 (en) * | 2014-02-24 | 2017-11-29 | Koki Company Limited | Lead-free solder alloy, solder material, and joined structure |
| US10002845B2 (en) | 2014-10-17 | 2018-06-19 | Fuji Electric Co., Ltd. | Lead-free soldering method and soldered article |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3700668B2 (en) | 2005-09-28 |
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