JP2003001378A - Die device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die device capable of improving a cooling effect of a die even the die reaches a high temperature. SOLUTION: In the die device, a cavity face 12 is formed in a mobile side die 11 along a shape of a forming body, a space part 13 is provided on a back face side of the cavity face 12, and a fitting tool 15 for a mobile side die for fitting the mobile side die 11 to a die device seat 14 so as to surround the space part 13. An extrusion member 16 for separating the forming body from the cavity face 12 is fitted to a hydraulic cylinder 18 with a fitting tool for an extrusion member. A pipe 19b having a plurality of jetting nozzles 19a is inserted inside the space part 13 at the opposed position against a back face side 11a of the cavity face 12 from the fitting tool 15 and connected to a pump 21 for feeding a cooling liquid through a valve 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold device for molding a molded body of metal or resin, and more particularly to a mold device for molding a high temperature material.

[0002]

2. Description of the Related Art Die casting, die casting and low pressure casting,
Alternatively, in a mold such as resin injection molding in which a molten material is injected into a cavity formed on a mating surface of the mold to be cooled and solidified to form a predetermined molded body, a mold heated to a high temperature by the molten material. It is important to cool the mold and maintain the mold temperature properly in order to improve the quality and productivity of the product. Here, the molding process in die casting casting, die casting or low pressure casting, or resin injection molding is roughly divided into a material melting step, an injection filling step, a cooling step,
It can be divided into four steps, that is, the step of taking out the molded body.

During the filling process of the molten material melted through the melting process into the mold apparatus, it is desirable that the mold temperature is high in order to ensure the fluidity of the molten material. Further, it is advantageous that the mold temperature is high in order to improve the quality of the molded product such as the transferability of the mold surface in the molded product take-out step. But,
For example, in the aluminum alloy die casting in which the temperature of the molten material is 600 to 700 ° C., if the mold temperature is too high, the problem that the molten aluminum alloy is welded to the mold occurs. Further, in the cooling step after completion of filling, as a matter of course, the lower the mold temperature is, the shorter the time until cooling and solidification, that is, the time until it can be taken out, so that the productivity becomes high.

For this reason, development has been conventionally made to ensure the cooling performance of the mold. For example, as a method for cooling the mold, an internal cooling method is provided in which a cooling hole is provided inside the mold, and a cooling liquid is circulated through the cooling hole to cool the mold from the inside (JP-A-62-238056). Or, after ejecting the molded body from the cavity surface of the mold composed of the fixed side mold and the movable side mold by the push pin and the secondary pressure pin,
A spray gun is inserted between the fixed-side mold and the movable-side mold, and cooling of the fixed-side mold, the movable-side mold, the push pin, and the secondary pressure pin and the mold release for them are performed by spraying a release agent following air injection. An external cooling method (Japanese Patent Application Laid-Open No. 64-53751) in which the agent is applied is known.

FIG. 9 is a sectional view schematically showing a conventional mold device for blow molding, and a mold device similar to this is described in, for example, Japanese Patent Laid-Open No. 9-136325. . In the figure, a sealed chamber 3 is provided on the back side of a cavity surface 2 of a mold body 1 which is one of the paired mold bodies, and a pipe 4 penetrates the chamber 3. The pipe 4 is switchably connected via a valve to a pump 5 for feeding the cooling liquid and a boiler 6 for feeding the steam, and a predetermined amount of water or steam is supplied from the plurality of discharge ports 4a into the chamber 3. It is configured to spray evenly. Further, the chamber 3 is provided with a drain portion 7 for both drainage and deaeration, and is connected to a vacuum pump 9 via a pipe 8 and a valve.

Next, the operation of the mold apparatus configured as described above will be described. To cool the mold body 1 during blow molding, the cooling water sent by the pump 5 is discharged through the discharge port 4a.
Is injected into the chamber 3 from the vacuum pump 9 at the same time.
Is operated to reduce the pressure in the chamber 3 to a predetermined pressure. Further, in order to heat the mold body 1, high temperature steam sent from the boiler 6 is injected into the chamber 3 through the discharge port 4a.

As described above, in the mold apparatus for blow molding, it is important to control the mold temperature in the vicinity of the melting point of water, and for this purpose, cooling water and steam are separately used and controlled.

[0008]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the internal cooling method described in Japanese Patent No. 38056, there is a limit to the formation of cooling holes because it is necessary to preferentially arrange the nesting member, the extruding member, and the like inside the mold. For example, it is difficult to form a cooling hole in a thin-walled nesting member, and it is impossible to form a cooling hole in a portion where an extruding member is provided. Further, since the holes are formed in the mold, there arises a problem that the strength of the mold is lowered, so that a large number of cooling holes cannot be formed. Therefore, there is a limit in securing the cooling effect.

Further, in the external cooling method described in the above-mentioned Japanese Patent Laid-Open No. 64-53751, the mold release agent following the air injection from the spray gun directly hits the cavity surface facing the spray gun, so that the cooling effect is obtained. Although it can be expected, it is difficult to spray the release agent onto the cavity surface that is not facing the spray gun or the cavity surface that is deeply dug even if it is facing the spray gun, and the cooling effect cannot be expected so much.
Further, in the die casting in which the molten metal is molded by the above-mentioned external cooling method, for example, a mold release agent at about 20 ° C. is added at about 200 to
Since it is sprayed directly on the cavity surface of the mold at 300 ° C, the thermal shock to the mold is large, the thermal fatigue of the mold is promoted, and heat check and cracks easily occur on the mold cavity surface. Includes life related issues.

Furthermore, in the mold apparatus described in the above-mentioned Japanese Patent Laid-Open No. 9-136325, the mold body 1 is used during blow molding.
Since the cooling liquid is fed into the chamber 3 provided on the back side of the cavity surface 2 of FIG. 1, unless the vacuum pump 9 for depressurizing the inside of the chamber 3 is provided, it is not possible to expect the cooling effect utilizing the evaporation of the cooling liquid. Can not. Further, since the chamber 3 is hermetically held, an extruding member that moves through the inside and outside of the chamber for releasing the molded body from the cavity surface 2 cannot be arranged.

Next, in the molding by die casting, the reason why the extruding member for separating (mold releasing) the molded body from the cavity surface of the mold is essential will be described. Machine tools and industrial robots sometimes use a heat sink provided with thin fins on a base plate formed of an aluminum alloy or the like in order to release heat generated by a power module or the like used for driving the machine tool or the like. This heat sink is molded by, for example, a die casting method using a mold. In the die-cast molding of a heat sink having fins on the base plate described above, because of its shape, the fin portion is molded by a movable mold, and the fin tip is extruded by using an extruding member driven by an extruding device. It is released from the mold.

In order to improve the heat dissipation characteristics of the heat sink, it is necessary to increase the density of the fins, which makes it clear that the temperature of the fin die becomes higher than that of an ordinary die cast product. When the mold becomes hot, the fin tip is extruded at a high temperature, and due to insufficient material strength, the fin tip is crushed by the extruding member and adhered to the mold, and the molded product is released from the mold. There was a problem that I could not. Further, there is a problem that productivity is significantly deteriorated when waiting for releasing from the mold until the molded body is cooled.

The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a mold apparatus capable of improving the cooling effect of the mold even when the mold has a high temperature. To aim.

[0014]

In a mold apparatus according to claim 1 of the present invention, a movable side mold which constitutes a mold together with a fixed side mold, a cavity surface formed in the movable side mold, and a back surface of the cavity surface. A cooling medium jetting means for blowing a cooling medium to the side, and an extruding member for extruding a molded body formed on the cavity surface from the back surface side of the cavity surface to separate from the cavity surface.

Further, in the mold apparatus according to the second aspect of the present invention, the movable side mold and the movable side mold which are attached to the mold apparatus pedestal through the first fixture and constitute the mold together with the fixed side mold. A cavity surface formed in the mold, a space portion formed on the back surface side of the cavity surface and surrounded by the mold device pedestal and the first fixture, and provided in the space portion so as to face the back surface side of the cavity surface, A cooling medium jetting means for blowing a cooling medium to the back side of the cavity surface, and a molded body which is mounted on the die apparatus pedestal via the second mounting tool and which is molded on the cavity surface is extruded from the back side of the cavity surface to form the cavity. It is provided with an extruding member to be separated from the surface.

Further, in the mold apparatus according to the third aspect of the present invention, an opening is provided between the movable side mold and the first fixture to partially open the space on the back side of the cavity surface. It is a thing.

Further, in the mold apparatus according to the fourth aspect of the present invention, the cooling medium jetting means is provided in the space portion so as to face the back side of the cavity surface after passing through the inside of the movable side die. .

Further, in the mold apparatus according to the fifth aspect of the present invention, the stepped portion is provided on the back side of the cavity surface of the movable side die.

Further, in the mold apparatus according to claim 6 of the present invention, the cavity side of the movable side mold is constituted by the first movable side mold having the first thermal conductivity, and the back side of the movable side mold. Is a second movable side mold having a second thermal conductivity.

Further, in the die apparatus according to claim 7 of the present invention, the first movable side die is made of an iron-based material, and the second die
The movable side mold is composed of a copper-based material.

Further, in the mold apparatus according to the eighth aspect of the present invention, a plurality of groove portions are formed on the back surface side of the cavity surface of the movable side mold.

Further, in the mold apparatus according to the ninth aspect of the present invention, the cooling medium jetting means is provided so as to face the back side of the cavity of the movable side die and the pushing member.

Further, in the mold apparatus according to the tenth aspect of the present invention, the cavity surface of which the ratio of the surface area per unit volume of the cavity surface of the movable die exceeds 0.5 is provided.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. 1 is a sectional view schematically showing a mold apparatus according to a first embodiment of the present invention. In FIG. 1, a fixed-side mold (not shown) made of an iron-based material
A cavity is provided in the mating surface of the movable side mold 11 which constitutes the mold together with the fixed side mold, and a cavity surface 12 is formed along the shape of a molded body (not shown) molded in this cavity. ing. A space portion 13 is formed on the back surface side 11a of the cavity surface 12, and a movable-side die fixture 15 for attaching the movable-side die 11 to the die apparatus pedestal 14 is provided so as to surround the space portion 13. There is. An extruding member 16 for releasing (releasing) a molded body (not shown) formed on the cavity surface from the cavity surface 12 is attached to a hydraulic cylinder 18 for extruding the extruding member 16 via an extruding member attachment 17. Has been.

After passing through the fixture 15, the plurality of ejection nozzles 19 are inserted into the space 13 and provided in the space 13 at positions facing the cavity surface 12 of the movable mold 11.
A pipe 19b having a is connected to a pump 21 for feeding a cooling liquid through a valve 20. Jet nozzle 1
Reference numeral 9a denotes a back surface side 11a of the cavity surface 12 of the movable side mold 11.
In addition, the cooling liquid can be uniformly sprayed onto a region equivalent to the projected area of the cavity surface 12.

The movable side mold 11 and the fixture 15 may be integrally formed so that the movable side mold 11 is directly attached to the die apparatus pedestal 14. However, due to the arrangement of the pushing member 16 and the like, in the movable side mold 11 in which the movable side mold 11 and the fixture 15 are integrated, a large amount of material is removed during the manufacturing process, and there is much waste. As described above, it is preferable that the movable mold 11 and the fixture 15 are separate bodies.

Next, the operation of the mold apparatus configured as described above will be described. The molding process in die casting, die casting, low pressure casting, or resin injection molding is broadly divided into four processes of a material melting process, an injection filling process, a cooling process, and a molded product unloading process. In the injection filling step of injecting the molten material melted in the melting step into the cavity formed on the mating surface of the mold body, the movable material is heated by the molten material filled in the cavity to a high temperature, for example, 300 ° C. In order to cool the side mold 11, the cooling liquid supplied by the pump 21, for example, water is ejected from the jet nozzle 19 through the valve 20 and the pipe 19b.
a to the back side 11a of the cavity surface 12 of the movable mold 11
A predetermined amount is jetted out.

At this time, the heat capacity of the mold body and the movable side mold 1
1, the shape of the cavity surface 12, that is, the shape of the molded body, the temperature of the movable mold 11, and the like, set the amount of the cooling liquid supplied, and the cooling liquid is ejected from the nozzle 19a.
From the cavity surface 1 to the rear surface side 11a of the cavity surface 12
The cooling liquid can be uniformly sprayed onto the area equivalent to the projected area of 2. Further, in order to efficiently vaporize the cooling liquid, for example, when the mold temperature is 300 ° C., the supply amount is set so as to spray 2 to 3 liters of the cooling liquid to the mold per minute.

In the mold apparatus according to the first embodiment having the above-described structure, the heat of vaporization of the cooling liquid is effectively used, and the cooling liquid cavities from the jet nozzle 19a to the rear surface side 11a of the cavity surface 12 in the cavity. By being uniformly sprayed on a region equivalent to the projected area of the surface 12, rapid cooling without temperature unevenness can be performed even when the mold has a high temperature.

The number of jet nozzles 19a is such that when the cooling liquid can be uniformly sprayed on the back surface side 11a of the cavity surface 12 in a region equivalent to the projected area of the cavity surface 12,
One may be sufficient, and the same effect as the above is produced.

Further, as compared with the internal cooling method in which a cooling liquid is circulated through a cooling hole provided in the mold apparatus to cool the mold, a heat transfer area as wide as the projected area of the cavity is secured. As a result, the amount of cooling liquid used can be kept small, that is, the heat exchange rate can be increased.

Further, as compared with the external cooling method in which a cooling liquid is directly sprayed by a jet nozzle or the like onto a cavity surface of a mold heated to a high temperature by being heated by a molten material filled in the cavity, a mold is ejected. Cavity surface 1 immediately after filling
Since it is possible to cool the mold body by spraying the cooling liquid on the back side of No. 2, it has been clarified that the temperature rise of the mold can be suppressed and the thermal shock of the cavity surface 12 can be reduced. As a result, it is possible to suppress the heat check and the generation of cracks related to the thermal fatigue of the mold body, and it is possible to extend the life of the mold body. Specifically, in the external cooling method, when the cooling liquid was directly blown onto the cavity surface to cool the cavity surface, heat cracks were generated during product production about 10,000 times, which is shown in the first embodiment of the present invention. Like a mold machine,
By adopting a method of cooling from the back side of the cavity surface 12, it has become possible to endure about 100,000 times of product manufacturing.

In the blow molding die apparatus disclosed in Japanese Patent Laid-Open No. 9-136325, since the chamber 3 is provided in the die body 1 and a low die temperature is assumed, the cooling liquid A vacuum pump 9 that depressurizes the inside of the chamber 3 is required to ensure the effect of cooling using vaporization. In this case, since the chamber 3 is hermetically held, it is impossible to dispose an extruding member that moves through the inside and outside of the chamber for releasing the molded body from the cavity surface 2.

On the other hand, in the mold device according to the first embodiment of the present invention, since the cooling liquid can be supplied to the space 13 provided on the back side of the cavity surface 12 of the movable mold 11, the heat of vaporization of the cooling liquid can be supplied. Can be used for cooling. Furthermore, it is not necessary to keep the chamber 3 and the inside of the chamber 3 hermetically sealed, which is required in the blow molding die device.
It is possible to arrange the extruded member 16 for molding. Therefore, it is possible to manufacture a heat sink with the fins clogged as shown in FIG. 2, the productivity of the product and the life of the mold are improved, and the product cost can be reduced.

More specifically, FIG. 2 (a) is a side view schematically showing a heat sink which can be manufactured by the mold apparatus according to the present invention, and FIG. 2 (b) is for convenience of explanation. Therefore, it is a plan view schematically showing a state in which a fan provided facing the heat sink is removed.
2 (a) and 2 (b), the heat sink has a curved and thin fin 22 having a high aspect ratio, for example, a thickness of 1 mm and a height of 30 mm, which is arranged on a base plate 50 at a gorge pitch, for example, about 4 mm on average. The fan 51 is provided so as to face the fins 22, and the power module 55 is provided directly on the opposite side of the fins 22 with respect to the base plate 50 or via a heat conductive grease (not shown). It is firmly fixed.

The air flow blown out from the fan 51 flows toward the fins 22, and the amount of heat generated from the power module 55 transmitted from the base plate 50 to the fins 22 is taken away by the air flow passing between the fins 22. The difference between the thin-walled, high-aspect heat sink and the general heat sink in the temperature rise of the mold is that at least the unit corresponding to the thin-walled and high-aspect part of the molded product in the cavity of the movable mold. It was found to be the ratio of the surface area of the cavity surface to the volume (surface area / unit volume). That is, in a general molded product, the ratio is about 1/5 to 1/4 or less, and although the temperature of the mold rises due to the heat transferred from the cavity surface, the heat transfer surface area is small, so that the normal mold device is used. Did not cause any problems.

However, in the example shown in FIG. 2, the ratio of the surface area per unit volume of the cavity surface of the movable side mold is 0.5, and when this ratio is 0.5 or more, the heat of the molten aluminum of the molten aluminum is increased. Is rapidly transmitted to the mold, the mold, especially in the thin portion between the fins, rises sharply and temporarily reaches a high temperature close to the melting point of aluminum. In addition, in such a molded product, since a plurality of extruding members 16 are arranged on each fin, it is not possible to provide a cooling path in the fin vicinity region in the mold where the temperature is high. On the other hand, by cooling from the back surface side 11a of the cavity surface 12, the mold can be efficiently cooled. As a result, when the molded heat sink is released from the mold and then the cooling liquid is directly sprayed onto the cavity surface 12 by the jet nozzle to cool, the thermal shock of the cavity surface 12 is large, and the heat crack occurs in about 10,000 times of product manufacturing. However, by cooling from the back surface side 11a of the cavity surface 12, the temperature rise of the mold is suppressed, the thermal fatigue of the mold is suppressed, and the product can withstand about 100,000 times of product manufacturing. be able to.

As described above, for the product in which it is impossible to provide the cooling water channel for the extruding member, the structure of the first embodiment of the present invention allows the mold to have a high temperature even if the temperature of the mold is high. A mold apparatus that can improve the cooling effect can be provided. In addition, the productivity can be improved and the life of the mold can be greatly improved to 10 times, and the industrial value of the fin by die casting can be increased.

Embodiment 2. FIG. 3 is a sectional view schematically showing a mold device according to the second embodiment of the present invention. The difference between the mold device according to the second embodiment and the mold device according to the first embodiment is that an opening 23 is provided between the movable side mold 11 and the upper part of the movable side mold fixture 15, and the cavity surface 12 is provided. Back side 11a
The space 13 is partially opened, and the pipe 19b is directly inserted into the space 13 after passing through the opened opening 23. In FIG. 3, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts, and the description thereof will be omitted.

Further, in the injection filling step of injecting the molten material melted in the melting step into the cavity, in order to cool the movable side mold 11 heated by the molten material filled in the cavity and having a high temperature, a pump 21 is used. The supplied cooling liquid is sprayed from the jet nozzle 19a through the valve 20 and the pipe 19b to the back surface side 11a of the cavity surface 12 of the movable mold 11 and to a region equivalent to the projected area of the cavity surface 12 uniformly. Ejecting only a predetermined amount.

In the mold apparatus according to the second embodiment, the heat of vaporization of the cooling liquid is effectively used, and the cooling liquid supplied from the pump 21 is supplied from the jet nozzle 19a to the rear surface side 11a of the cavity surface 12. Be sprayed on. Therefore, the jetted cooling liquid reaches the boiling point temperature, and the generated steam is discharged to the outside from the opening 23 provided in the upper portion of the fixture 15, so that the steam adheres to the movable mold 11 again. It is possible to prevent condensation. As a result, the movable side mold 1
1, rapid cooling is possible.

Here, the example in which the opening 23 is provided and opened in the upper part of the fitting 15 has been described, but the position of the opening 23 is not limited to the upper part of the fitting 15, and the vapor can be released anywhere as long as vapor can be released. Good. However, when the opening 23 is opened in the upper part of the fixture 15, the lightened steam is likely to escape.

Embodiment 3. FIG. 4 is a sectional view schematically showing a mold device according to a third embodiment of the present invention. The difference between the mold apparatus according to the third embodiment and the mold apparatus according to the first embodiment is that the cavity surface 12 of the movable side mold 31 made of an iron material is used.
The point is that a pipe 19b having a jet nozzle 19a provided in the space 13 at a position opposite to is provided so as to pass inside the movable mold 31. 4, the same reference numerals as those in FIG. 1 indicate the same or corresponding ones, and the explanation thereof will be omitted.

Further, in the injection filling step of injecting the molten material melted in the melting step into the cavity, in order to cool the movable side mold 31 heated by the molten material filled in the cavity and having a high temperature, the pump 21 is used. The supplied cooling liquid is sprayed from the jet nozzle 19a through the valve 20 and the pipe 19b to the rear surface side 31a of the cavity 12 of the movable mold 31 so that the cooling liquid is uniformly distributed in a region equivalent to the projected area of the cavity surface 12. Ejecting only the amount.

In the mold apparatus according to the third embodiment, the heat of vaporization of the cooling liquid is effectively used, and the cooling liquid supplied from the pump 21 passes through the inside of the movable mold 31 to the pipe 19b. After being heated by the movable side mold 31 that has been heated to a high temperature while passing through, the spray nozzle 19a sprays it onto the back surface side 31a of the cavity surface 12. As a result, the time taken for the jetted cooling liquid to reach the boiling point temperature is shortened, so that the effect of boiling heat transfer can be effectively utilized.

When the pipe 19b does not pass through the inside of the movable mold 31, the temperature of the cooling liquid, for example, water, which has come out from the jet nozzle 19a, is about 20 ° C., and the temperature of the movable mold 31 is up to 100 ° C. Flows in the direction of gravity while exchanging heat on the surface. In this case, before the water reaches the boiling point temperature, the movable mold 3
There is a problem that a film of the cooling liquid is formed on the surface of No. 1 one after another, which hinders efficient heat exchange. However, when the pipe 19b passes through the inside of the movable mold 31 as in the third embodiment, the cooling water that has passed through the inside of the movable mold 31 is heated to, for example, 90 ° C. immediately before boiling, Side mold 1
The vaporization heat can be taken from the movable side die 31 at the moment when the movable side die 31 comes into contact with the surface of No. 1, and the movable side die 31 can be rapidly cooled.

Fourth Embodiment FIG. 5 is a sectional view schematically showing a mold apparatus according to Embodiment 4 of the present invention. The difference between the mold apparatus according to the fourth embodiment and the mold apparatus according to the first embodiment is that the cavity surface 12 of the movable-side mold 41 made of an iron material is used.
The step-shaped portion 41b is provided on the back side 41a of the. 5, the same reference numerals as those in FIG. 1 indicate the same or corresponding ones, and the explanation thereof will be omitted.

Further, in the injection filling step of injecting the molten material melted in the melting step into the cavity, the pump 21 is used to cool the movable side mold 41 which is heated by the molten material filled in the cavity and has a high temperature. A predetermined amount of the supplied cooling liquid is evenly distributed from the jet nozzle 19a through the valve 20 and the pipe 19b to the region of the stepped portion 41b provided on the back side 41a of the cavity 12 of the movable mold 41. It's gushing.

The effect of forming the stepped portion 41b has three points. As a first point, the heat exchange area is increased by forming the step-shaped portion 41b on the back surface side of the cavity 12 of the movable mold 41. For example, 10mm wide on the entire back side
By forming a groove having a step with a depth of 10 mm, the surface area is doubled, and the cooling capacity is doubled accordingly.

As a second point, a cooling liquid, for example,
It has an effect that water can be efficiently evaporated. That is, when no stepped portion is formed on the back surface side of the cavity surface, all the water is successfully evaporated even if the cooling water is sprayed from the nozzle to the movable mold heated to about 200 ° C. It is difficult to do so, and considering the stability during production, it is necessary to supply an excessive amount of cooling water. In this case, the cooling water that cannot be completely evaporated flows on the back side of the cavity surface of the movable side mold and is drained from the lower part of the space 13. For example, the temperature of the movable mold 11 is 200
When water of 3 liter / min is flowed in an area of 0.5 square meters at 70 ° C., about 70% of the water is discharged without being evaporated, whereas by forming the stepped portion 41b on the surface particularly horizontally, Water that cannot be evaporated instantaneously also stays in the stepped portion 41b and evaporates, and cooling can be performed with a smaller amount of water.

Further, as a third point, a temperature distribution is generated in the movable side mold 41 corresponding to the product shape, but when the temperature of the movable side mold 41 is largely different at the position of the product, for example, the center and the end, A product defect may occur at a low temperature, for example, defective filling or wrinkling may occur due to molten aluminum immediately solidifying. On the other hand, when the step-shaped portion 41b is formed in a substantially horizontal direction, the cooling water sprayed on the sufficiently cooled surface moves at high speed along the step-shaped portion 41b without evaporating, and evaporates at the high temperature portion. To do. As a result, almost all of the supplied cooling water amount can be evaporated, high-speed cooling can be performed, and the movable side mold 41 can be used.
It is possible to make the temperature uniform, that is, to stably manufacture the product.

It should be noted that the stepped portion 41b is only required to be capable of increasing the surface area, and more preferably, the stepped portion is formed so that the residence time of the cooling liquid becomes longer, that is, intersects with the direction of gravity. If the shape is such that the mold can withstand the strength, there is no problem. For example, the steps may be tapered or arcuate, or a part or the whole of the steps may be formed obliquely.

Embodiment 5. FIG. 6 is a sectional view schematically showing a mold device according to a fifth embodiment of the present invention. The difference between the mold apparatus according to the fifth embodiment and the mold apparatus according to the first embodiment is that the cavity 12 side of the movable side mold 51 is constituted by the first movable side mold 51a made of an iron-based material, and the rear side. 51c first
Of the second movable side mold 51a made of a material having a thermal conductivity different from that of the second movable side mold 51a, for example, a copper-based material. For example, the second movable side mold 51b is screwed to the first movable side mold 51a. It is fixed at. 6, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts, and the description thereof will be omitted.

Further, in the injection filling step of injecting the molten material melted in the melting step into the cavity, the pump 21 is used to cool the movable side mold 51 which is heated by the molten material filled in the cavity and has a high temperature. The supplied cooling liquid is ejected from the jet nozzle 19a through the valve 20 and the pipe 19b to the rear surface side 51c of the cavity surface 12 of the movable side mold 51 including the first movable side mold 51a and the second movable side mold 51b. In addition, a predetermined amount of the cooling liquid is sprayed uniformly on a region equivalent to the projected area of the cavity surface 12.

For example, if the temperature on the cavity side is set to 200 ° C. to secure the molding quality and the temperature on the back side is controlled to 100 ° C. at which vaporization heat can be effectively utilized, the temperature difference is 1
It becomes 00 ° C. On the other hand, in order to secure the strength as a mold, the thickness of the movable side mold needs to be about 50 mm or more. In such a case, a material with high thermal conductivity may be used to increase the heat transport amount, but aluminum and copper materials cannot withstand the stress during molding, and there is a problem that the material reacts with the molded body. . In addition, a tungsten alloy, which is a high-strength material, is expensive and has problems such as poor workability.

However, the cooling liquid is jetted to the back surface side 51c of the cavity surface 12 of the movable side mold 51 including the first movable side mold 51a made of the iron-based material and the second movable side mold 51b made of the copper-based material. By doing so, it is possible to solve the above-mentioned problems and to increase the amount of heat transport and perform rapid cooling.

If there is thermal resistance at the fixed interface, the cooling effect is reduced, so it is preferable to coat at least one mold with a soft metal such as silver or tin.

If the second movable mold 51b made of copper is used so as to contact the extruding member 16, the extruding member 16b may not be extruded due to thermal strain.
It is preferable to use an iron-based material having the same thermal characteristics as the cavity side for the first movable mold 51a that contacts with the cavity.

Sixth Embodiment FIG. 7 is a sectional view schematically showing a mold device according to a sixth embodiment of the present invention. The difference between the mold apparatus according to the sixth embodiment and the mold apparatus according to the first embodiment is that the cavity surface 12 of the movable side mold 61 made of an iron material is used.
This is that a plurality of groove portions 61b are provided in a region equivalent to the projected area of the cavity surface 12 on the back side 61a.
6, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts, and the description thereof will be omitted.

Further, in the injection filling step of injecting the molten material melted in the melting step into the cavity, in order to cool the movable side mold 61 heated by the molten material filled in the cavity and having a high temperature, the pump 21 is used. The supplied cooling liquid is sprayed from the spray nozzle 19a through the valve 20 and the pipe 19b to the groove 61b provided on the back surface side 61a of the cavity surface 12 of the movable mold 61 uniformly by a predetermined amount. is doing.

For example, if the temperature of the cavity surface 12 is set to 200 ° C. to secure the molding quality and the temperature of the back surface side is controlled to 100 ° C. at which vaporization heat can be effectively utilized, the temperature difference becomes 100 ° C. On the other hand, in order to secure the strength as a mold, the thickness of the movable side mold needs to be about 50 mm or more.
In such a case, in order to increase the heat transport amount, a plurality of groove portions 61b are formed on the back surface side, and for example, a depth of 2 is provided on the back surface side.
By providing the groove portion 61b of 0 mm, the portion closer to the cavity surface 12 can be cooled to about 100 ° C. That is, by providing such a groove 61b, the temperature of the movable die 61 can be ensured, and the temperature gradient in the movable die 61 can be increased while utilizing the rapid heat dissipation due to the heat of vaporization to increase the heat transport amount. It becomes possible.

Further, when the distance from the cavity surface 12 of the movable side mold 61 to the back surface side 61a is about 50 mm, it takes several tens of seconds until the high temperature material is injected and the heat is transferred to the back surface. The time of 10 seconds is not a time in which the tact time for producing the product is generally about 1 minute, and thus the reaction of heating and cooling every 1 minute can be instantaneously reacted. For this reason, even if the manufacturing tact time changes due to a problem in manufacturing the product, there is a problem that the mold temperature becomes unstable when the cooling liquid amount is changed. On the other hand, in the mold apparatus according to the fifth embodiment, by providing the groove portion 61b, the movable side mold 61 is
It is possible to increase the temperature gradient in the movable-side die 61 while securing the temperature of 1, while utilizing the rapid heat dissipation by the vaporization heat, and to increase the heat transport amount. As a result, the response time is shortened, and the movable side mold 1 is controlled by controlling the cooling liquid amount.
It becomes easy to manage the temperature of 1.

Regarding the shape of the groove, it is necessary to form a plurality of groove portions 61c so that the movable die 61 can withstand the stress generated at the time of manufacture. Particularly, the groove shape corresponding to the temperature distribution of the movable die 61 is required. The high temperature part may be formed densely and the low temperature part may be formed sparsely.

Embodiment 7. FIG. 8 is a sectional view schematically showing a mold device according to a seventh embodiment of the present invention. The difference between the mold apparatus according to the seventh embodiment and the mold apparatus according to the first embodiment is that the cooling liquid ejection nozzle 19a faces the back surface side 11a of the cavity 12 of the movable mold 11 and the pushing member 16. It is a point provided. In FIG. 8, FIG.
The same reference numerals indicate the same or equivalent, and the description thereof will be omitted.

Further, in the injection filling step of injecting the molten material melted in the melting step into the cavity, in order to cool the movable side mold 11 heated by the molten material filled in the cavity and having a high temperature, a pump 21 is used. A predetermined amount of the supplied cooling liquid is directly supplied from the jet nozzle 19a to the back side 11a of the cavity surface 12 of the movable mold 11 and the plurality of extruding members 16 via the valve 20 and the pipe 19b. It's gushing.

The extruding member 16 allows the product to pass through the cavity surface 12
Although it is used for releasing from the mold, if the releasing force exceeds the reference value, the extruding member 16 may be damaged. This phenomenon is
Basically, it is not seen in general products, but for example
This may occur when manufacturing a high-performance heat sink product in which a large number of fins having a complicated shape like this are erected. The reason for this is that when the product is not sufficiently cooled at the point where the extrusion member 16 and the product come into contact with each other,
This is because the mold release force sharply increases due to the deformation of the product.

In order to prevent this, it is necessary to positively cool the extruding member 16 and cool the portion of the product which is in contact with the extruding member. According to this Embodiment 7,
Since the cooling liquid ejection nozzle 19a is provided so as to face the back surface side 11a of the cavity surface 12 of the movable mold 11 and the pushing member 16, it is possible to directly blow the cooling liquid to the back surface side 11a and the pushing member 16. As a result, the extruding member 16 is particularly cooled, and the above problem can be solved.

[0068]

Since the present invention is constructed as described above, it has the following effects.

According to the mold apparatus of the first aspect of the present invention, the cooling medium is provided to the movable side mold which constitutes the mold together with the fixed side mold, the cavity surface formed in the movable side mold, and the rear surface side of the cavity surface. By providing the cooling medium jetting means for spraying and the extruding member for extruding the molded body to be molded on the cavity surface from the back surface side of the cavity surface and separating from the cavity surface, the heat of vaporization of the cooling liquid can be effectively used, and the mold is Even when the temperature becomes high, rapid cooling without temperature unevenness becomes possible. Further, since the cooling medium is blown to the back side of the cavity surface, the temperature of the die can be suppressed by cooling the die, and the thermal shock on the cavity surface can be reduced. The thermal fatigue of the main body can be suppressed.

According to the mold apparatus of the second aspect of the present invention, the movable side mold and the movable side mold which are attached to the mold apparatus pedestal via the first attachment and constitute the mold together with the fixed side mold. A cavity surface formed in the side mold, a space portion formed on the back surface side of the cavity surface and surrounded by the mold device pedestal and the first fixture, and provided in the space portion so as to face the back surface side of the cavity surface. , A cooling medium jetting means for blowing a cooling medium to the back surface side of the cavity surface, and a molded body that is mounted on the die device pedestal via the second mounting tool and is molded on the cavity surface from the back surface side of the cavity surface. By providing the extruding member that separates from the cavity surface, the heat of vaporization of the cooling liquid can be effectively used, and even when the temperature of the mold becomes high, rapid cooling without temperature unevenness becomes possible. Further, since the cooling medium is blown to the back side of the cavity surface, the temperature of the die can be suppressed by cooling the die, and the thermal shock on the cavity surface can be reduced. The thermal fatigue of the main body can be suppressed.

Further, according to the mold apparatus of the third aspect of the present invention, an opening is provided between the movable side mold and the first fixture to partially open the space on the back side of the cavity surface. By doing so, the cooling medium sprayed from the cooling medium jetting means to the back surface side of the cavity surface reaches the boiling point temperature, and the generated steam is discharged to the outside from the opening, so that the steam adheres to the movable side mold again. To prevent condensation, which is why
The movable side mold can be rapidly cooled.

Further, according to the mold apparatus of the fourth aspect of the present invention, the cooling medium jetting means is provided in the space after facing the back side of the cavity surface after passing through the inside of the movable side die. After the temperature of the cooling medium is raised by the movable side mold that has been heated while passing through the inside of the movable side mold, the cooling medium is blown from the cooling medium jetting means to the back side of the cavity surface, and as a result, the jetted cooling medium is heated to the boiling point temperature. Since it takes less time to reach, the effect of boiling heat transfer can be effectively utilized, and rapid cooling of the die becomes possible.

Further, according to the die apparatus of the fifth aspect of the present invention, heat exchange is performed by providing a stepped portion formed in the horizontal direction on the back side of the cavity surface of the movable side die. The area can be increased, and among the cooling media blown to the stepped portion on the back side of the cavity surface, the cooling medium that cannot be evaporated instantaneously also stays in the stepped portion and evaporates, which causes the heat of vaporization of the cooling liquid. Since it can be effectively used, cooling can be performed with a smaller amount of water. Further, the cooling medium sprayed on the sufficiently cooled surface moves along the stepped portion without being evaporated and can be evaporated at the high temperature portion, so that it can be cooled at high speed and the temperature of the movable side mold Can be made uniform.

Further, according to the mold apparatus of the sixth aspect of the present invention, the cavity side of the movable side mold is constituted by the first movable side mold having the first thermal conductivity, and the rear surface of the movable side mold. By configuring the side with the second movable side mold having the second thermal conductivity, the amount of heat transport from the cavity surface can be increased, and as a result, the mold can be rapidly cooled.

According to the mold apparatus of claim 7 of the present invention, the first movable side mold is made of an iron-based material and the second movable side mold is made of a copper-based material. It is possible to increase the amount of heat transport from the cavity surface and withstand the stress during molding.

Further, according to the die apparatus of the eighth aspect of the present invention, by forming a plurality of groove portions on the back side of the cavity surface of the movable side die, the portion near the cavity surface can be cooled. As a result, it is possible to increase the amount of heat transport by increasing the temperature gradient in the movable mold, so that the movable mold can be rapidly cooled.

According to the mold apparatus of the ninth aspect of the present invention, the cooling medium jetting means is provided so as to face the back side of the cavity of the movable mold and the pushing member, whereby the back side and the pushing member are provided. Can be positively cooled, and as a result, it is possible to sufficiently cool the portion of the molded body that is in contact with the extruded member, so that a rapid increase in the release force due to the deformation of the molded body by the extruded member is suppressed. it can.

According to the mold apparatus of the tenth aspect of the present invention, the mold surface is provided with a cavity surface having a ratio of the surface area per unit volume of the cavity surface of the movable mold of more than 0.5. However, since the cooling from the back side of the cavity surface is effective, the application of this cooling means that can efficiently cool the mold becomes effective.
The cooling effect of the mold can be improved and the life of the mold can be extended.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of a mold device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an example of a molded body molded by the mold device according to the present invention.

FIG. 3 is a schematic sectional view of a mold device according to a second embodiment of the present invention.

FIG. 4 is a schematic sectional view of a mold device according to a third embodiment of the present invention.

FIG. 5 is a schematic sectional view of a mold apparatus according to Embodiment 4 of the present invention.

FIG. 6 is a schematic sectional view of a mold apparatus according to a fifth embodiment of the present invention.

FIG. 7 is a schematic sectional view of a mold device according to a sixth embodiment of the present invention.

FIG. 8 is a schematic sectional view of a mold device according to a seventh embodiment of the present invention.

FIG. 9 is a view showing another conventional mold device.

[Explanation of symbols]

11, 31, 41, 51, 61 Movable side mold 11a, 31a, 41a, 51c, 61a Rear side 12 Cavity surface 13 Space 14 Mold device base 15 Movable side attachment 16 Extruded member 17 Extrusion member attachment 19a, 19b Cooling medium ejection means 23 opening 41b Step shape part 51a First movable side mold 51b Second movable side mold 61b groove

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) B22D 18/04 B22D 18/04 Q B29C 33/04 B29C 33/04 45/73 45/73 (72) Invention Person Kaoru Watanuki 2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo Sanryo Electric Co., Ltd. F term (reference) 4E093 NA01 NB05 NB09 4F202 AA49 CA11 CB01 CK41 CM02 CN05 CN13 CN21

Claims (10)

[Claims] 1. A movable-side mold that constitutes a mold together with a fixed-side mold, a cavity surface formed in the movable-side mold, a cooling-medium ejection unit that blows a cooling medium to the back side of the cavity surface, and the cavity surface. A mold apparatus comprising: an extruding member that extrudes a molded body to be molded from the back surface side of the cavity surface and separates it from the cavity surface. 2. A movable side die, which is attached to a die apparatus pedestal via a first attachment and constitutes a die together with a fixed side die, a cavity surface formed in the movable side die, and a back surface of the cavity surface. Formed on the side, surrounded by the die base and the first fixture, provided in the space facing the back side of the cavity surface, and cooled to the back side of the cavity surface. The cooling medium jetting means for blowing the medium, and the second on the die apparatus pedestal
And a push-out member which is attached via the fixture and pushes out a molded body to be molded on the cavity surface from the back side of the cavity surface and separates from the cavity surface. 3. The mold apparatus according to claim 2, wherein an opening is provided between the movable mold and the first fixture to partially open a space on the back side of the cavity surface. 4. The mold apparatus according to claim 2, wherein the cooling medium jetting means is provided inside the space after facing the back side of the cavity surface after passing through the inside of the movable side mold. 5. The mold apparatus according to claim 1, wherein a step-shaped portion is provided on the back side of the cavity surface of the movable side mold. 6. The cavity side of the movable side die is constituted by a first movable side die having a first thermal conductivity, and the back side of the movable side die is a second movable side having a second thermal conductivity. The mold apparatus according to any one of claims 1 to 5, wherein the mold apparatus comprises a side mold. 7. The mold apparatus according to claim 6, wherein the first movable mold is made of an iron-based material, and the second movable mold is made of a copper-based material. 8. The mold apparatus according to claim 1, wherein a plurality of grooves are formed on the back surface side of the cavity surface of the movable side mold. 9. The mold apparatus according to claim 1, wherein the cooling medium jetting means is provided so as to face the back side of the cavity of the movable side mold and the pushing member. 10. The mold apparatus according to claim 1, wherein a cavity surface having a ratio of surface area per unit volume of the cavity surface of the movable side mold is more than 0.5 is provided. .