JP2002533914A5 - - Google Patents

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Publication number
JP2002533914A5
JP2002533914A5 JP2000590100A JP2000590100A JP2002533914A5 JP 2002533914 A5 JP2002533914 A5 JP 2002533914A5 JP 2000590100 A JP2000590100 A JP 2000590100A JP 2000590100 A JP2000590100 A JP 2000590100A JP 2002533914 A5 JP2002533914 A5 JP 2002533914A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000590100A
Other versions
JP2002533914A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP1999/009448 external-priority patent/WO2000038109A1/en
Publication of JP2002533914A publication Critical patent/JP2002533914A/ja
Publication of JP2002533914A5 publication Critical patent/JP2002533914A5/ja
Withdrawn legal-status Critical Current

Links

JP2000590100A 1998-12-18 1999-12-03 集積回路と伝送コイルを備えるデータキャリアモジュール Withdrawn JP2002533914A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP98890373 1998-12-18
EP98890373.8 1998-12-18
PCT/EP1999/009448 WO2000038109A1 (en) 1998-12-18 1999-12-03 Data carrier module with integrated circuit and transmission coil

Publications (2)

Publication Number Publication Date
JP2002533914A JP2002533914A (ja) 2002-10-08
JP2002533914A5 true JP2002533914A5 (ja) 2007-02-01

Family

ID=8237221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000590100A Withdrawn JP2002533914A (ja) 1998-12-18 1999-12-03 集積回路と伝送コイルを備えるデータキャリアモジュール

Country Status (4)

Country Link
US (1) US6285561B1 (ja)
EP (1) EP1055192A1 (ja)
JP (1) JP2002533914A (ja)
WO (1) WO2000038109A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1052595B1 (de) * 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
ATE383621T1 (de) * 1999-08-31 2008-01-15 Nxp Bv Datenträger mit integriertem schaltkreis und übertragungsspule
AT410728B (de) * 2001-02-09 2003-07-25 Pollmann Austria Ohg Verfahren zum einbetten zumindest einer flexiblen leiterbahnfolie in kunststoff, leiterbahneneinheitsowie einbettungseinheit hiefür
JP2003101204A (ja) * 2001-09-25 2003-04-04 Nec Kansai Ltd 配線基板及び配線基板の製造方法並びに電子部品
US20050276341A1 (en) * 2004-06-14 2005-12-15 Infineon Technologies Ag Method and apparatus for transmitting and/or receiving data

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU570439B2 (en) * 1983-03-28 1988-03-17 Compression Labs, Inc. A combined intraframe and interframe transform coding system
US5386342A (en) * 1992-01-30 1995-01-31 Lsi Logic Corporation Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device
US5801440A (en) * 1995-10-10 1998-09-01 Acc Microelectronics Corporation Chip package board having utility rings
KR100201380B1 (ko) * 1995-11-15 1999-06-15 김규현 Bga 반도체 패키지의 열방출 구조
US5818102A (en) * 1995-12-29 1998-10-06 Lsi Logic Corporation System having integrated circuit package with lead frame having internal power and ground busses
FR2743649B1 (fr) * 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
DE19609134A1 (de) * 1996-03-08 1997-09-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers mit einem elektronischen Modul
DE19632115C1 (de) * 1996-08-08 1997-12-11 Siemens Ag Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls
WO1998035452A1 (en) 1997-02-10 1998-08-13 Koninklijke Philips Electronics N.V. Electronic watch comprising a watch/transponder chip
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
US5841191A (en) * 1997-04-21 1998-11-24 Lsi Logic Corporation Ball grid array package employing raised metal contact rings

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