JP2002528928A5 - - Google Patents

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Publication number
JP2002528928A5
JP2002528928A5 JP2000579404A JP2000579404A JP2002528928A5 JP 2002528928 A5 JP2002528928 A5 JP 2002528928A5 JP 2000579404 A JP2000579404 A JP 2000579404A JP 2000579404 A JP2000579404 A JP 2000579404A JP 2002528928 A5 JP2002528928 A5 JP 2002528928A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000579404A
Other languages
Japanese (ja)
Other versions
JP2002528928A (ja
Filing date
Publication date
Priority claimed from US09/182,570 external-priority patent/US6325706B1/en
Application filed filed Critical
Publication of JP2002528928A publication Critical patent/JP2002528928A/ja
Publication of JP2002528928A5 publication Critical patent/JP2002528928A5/ja
Pending legal-status Critical Current

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JP2000579404A 1998-10-29 1999-10-13 化学的バフ磨き中の終点検出のためのゼータ電位の使用 Pending JP2002528928A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/182,570 1998-10-29
US09/182,570 US6325706B1 (en) 1998-10-29 1998-10-29 Use of zeta potential during chemical mechanical polishing for end point detection
PCT/US1999/023662 WO2000025983A1 (en) 1998-10-29 1999-10-13 Use of zeta potential during chemical mechanical polishing for end point detection

Publications (2)

Publication Number Publication Date
JP2002528928A JP2002528928A (ja) 2002-09-03
JP2002528928A5 true JP2002528928A5 (fi) 2006-11-24

Family

ID=22669046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000579404A Pending JP2002528928A (ja) 1998-10-29 1999-10-13 化学的バフ磨き中の終点検出のためのゼータ電位の使用

Country Status (9)

Country Link
US (1) US6325706B1 (fi)
EP (1) EP1124666B1 (fi)
JP (1) JP2002528928A (fi)
KR (1) KR100637568B1 (fi)
AT (1) ATE222158T1 (fi)
AU (1) AU6297799A (fi)
DE (1) DE69902553T2 (fi)
TW (1) TW445535B (fi)
WO (1) WO2000025983A1 (fi)

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US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
US9259821B2 (en) 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
DE102016214568A1 (de) * 2016-08-05 2018-02-08 Weeke Bohrsysteme Gmbh Bearbeitungsvorrichtung und Bearbeitungsverfahren
WO2018132306A1 (en) 2017-01-10 2018-07-19 Vermeer Manufacturing Company Systems and methods for dosing slurries to remove suspended solids
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019022961A1 (en) * 2017-07-28 2019-01-31 Applied Materials, Inc. METHOD FOR IDENTIFYING AND MONITORING ROLLER ROLL POLISHING PAD MATERIALS DURING PROCESSING
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
KR20220083915A (ko) * 2020-12-11 2022-06-21 삼성디스플레이 주식회사 감지 센서를 포함하는 표시 장치 및 감지 센서 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

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