JP2002520630A5 - - Google Patents
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- Publication number
- JP2002520630A5 JP2002520630A5 JP2000560611A JP2000560611A JP2002520630A5 JP 2002520630 A5 JP2002520630 A5 JP 2002520630A5 JP 2000560611 A JP2000560611 A JP 2000560611A JP 2000560611 A JP2000560611 A JP 2000560611A JP 2002520630 A5 JP2002520630 A5 JP 2002520630A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9272098P | 1998-07-14 | 1998-07-14 | |
| US60/092,720 | 1998-07-14 | ||
| PCT/US1999/015846 WO2000004582A1 (en) | 1998-07-14 | 1999-07-14 | Temperature control of electronic devices using power following feedback |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002520630A JP2002520630A (ja) | 2002-07-09 |
| JP2002520630A5 true JP2002520630A5 (US07585860-20090908-C00154.png) | 2010-03-18 |
| JP4703850B2 JP4703850B2 (ja) | 2011-06-15 |
Family
ID=22234752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000560611A Expired - Lifetime JP4703850B2 (ja) | 1998-07-14 | 1999-07-14 | 電力追従帰還作用を利用した電子装置の温度制御 |
Country Status (5)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6794620B1 (en) * | 2001-11-07 | 2004-09-21 | Advanced Micro Devices, Inc. | Feedforward temperature control of device under test |
| DE10203790A1 (de) * | 2002-01-31 | 2003-06-26 | Siemens Ag | Aktive Stabilisierung des Temperaturniveaus in Halbleiterbauelementen |
| US6825681B2 (en) | 2002-07-19 | 2004-11-30 | Delta Design, Inc. | Thermal control of a DUT using a thermal control substrate |
| US7313500B2 (en) | 2004-11-05 | 2007-12-25 | Schweitzer Engineering Labortories, Inc. | Method to increase the maximum allowable ambient temperature rating of an electronic device |
| DE102005001163B3 (de) | 2005-01-10 | 2006-05-18 | Erich Reitinger | Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung |
| US9570643B2 (en) | 2013-10-28 | 2017-02-14 | General Electric Company | System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices |
| US10514416B2 (en) | 2017-09-29 | 2019-12-24 | Advantest Corporation | Electronic component handling apparatus and electronic component testing apparatus |
| CN109932630B (zh) * | 2017-12-15 | 2021-08-03 | 朋程科技股份有限公司 | 过温度检测电路及其测试方法 |
| JP7266481B2 (ja) * | 2019-07-19 | 2023-04-28 | 東京エレクトロン株式会社 | 温度制御装置、温度制御方法、および検査装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4330809A (en) * | 1979-12-31 | 1982-05-18 | Crown International, Inc. | Thermal protection circuit for the die of a transistor |
| US4637020A (en) * | 1983-08-01 | 1987-01-13 | Fairchild Semiconductor Corporation | Method and apparatus for monitoring automated testing of electronic circuits |
| US4686627A (en) * | 1984-12-24 | 1987-08-11 | Honeywell Inc. | Electrical test apparatus |
| EP0238598B1 (en) * | 1985-09-23 | 1992-01-02 | Sharetree Systems Limited | An oven for the burn-in of integrated circuits |
| DE3536098A1 (de) * | 1985-10-09 | 1987-04-09 | Siemens Ag | Einrichtung zum ueberwachen der temperatur eines elektrischen bauelements |
| US4713612A (en) * | 1986-07-14 | 1987-12-15 | Hughes Aircraft Company | Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element |
| US5324916A (en) * | 1991-11-01 | 1994-06-28 | Hewlett-Packard Company | System and method for dynamic power compensation |
| US5287292A (en) * | 1992-10-16 | 1994-02-15 | Picopower Technology, Inc. | Heat regulator for integrated circuits |
| JPH07263526A (ja) * | 1994-03-17 | 1995-10-13 | Hitachi Ltd | ウェハチャックおよび半導体素子の冷却方法 |
| JP2986381B2 (ja) * | 1994-08-16 | 1999-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 電子チップ温度制御装置及び方法 |
| JPH09264647A (ja) * | 1996-03-27 | 1997-10-07 | Nec Corp | 電子機器冷却回路 |
| US6476627B1 (en) * | 1996-10-21 | 2002-11-05 | Delta Design, Inc. | Method and apparatus for temperature control of a device during testing |
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1999
- 1999-07-14 AU AU49917/99A patent/AU4991799A/en not_active Abandoned
- 1999-07-14 JP JP2000560611A patent/JP4703850B2/ja not_active Expired - Lifetime
- 1999-07-14 DE DE19983379T patent/DE19983379B4/de not_active Expired - Lifetime
- 1999-07-14 WO PCT/US1999/015846 patent/WO2000004582A1/en active Application Filing
- 1999-07-14 KR KR1020017000633A patent/KR100755295B1/ko not_active IP Right Cessation
