JP2002373964A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JP2002373964A JP2002373964A JP2001179868A JP2001179868A JP2002373964A JP 2002373964 A JP2002373964 A JP 2002373964A JP 2001179868 A JP2001179868 A JP 2001179868A JP 2001179868 A JP2001179868 A JP 2001179868A JP 2002373964 A JP2002373964 A JP 2002373964A
- Authority
- JP
- Japan
- Prior art keywords
- island
- lead frame
- islands
- lead
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体装置の製造に
用いられるリードフレームに関する。The present invention relates to a lead frame used for manufacturing a semiconductor device.
【０００２】[0002]
【従来の技術】樹脂モールド型半導体装置は一般的にリ
ードフレームを用いて製造される。このリードフレーム
の一例を図３から説明する。図において、１は半導体ペ
レット２をマウントする矩形状のアイランドで、一直線
上に所定の間隔で配列されている。３、４は一直線上に
配列されたアイランド１の両側に配置されたリードで図
示例では４本で一組をなし、アイランド１の一側方に配
置されたリード３は一端がアイランド１の近傍に配置さ
れ、他の側方に配置されたリード４は一端がアイランド
１に連結されている。５、６は各リード３、４の中間部
をそれぞれ連結して一体化するタイバで、各タイバ５、
６の両端部はフレームＦに連結されている。７はタイバ
５、６から対向するタイバ６、５に向かってアイランド
１、１間に延びる舌片、８は舌片７の端部側方とアイラ
ンド１とを橋絡する吊りピンを示す。このリードフレー
ムのアイランド１は半導体ペレット２の発熱を考慮して
寸法、形状が決定される。またアイランド１にマウント
された半導体ペレット２はリード３にワイヤ９を介して
電気的に接続されるが、このワイヤ９のループ形状を良
好にするため、半導体ペレット２とリード３とがほぼ面
一になるようにアイランド１とリード３の間に段差が形
成される。そのためリード４のアイランド１との連結部
及び吊りピン８は屈曲される。１０はアイランド１を含
むリードフレーム上の主要部分を被覆し、半導体ペレッ
ト２を保護する樹脂を示す。2. Description of the Related Art A resin molded semiconductor device is generally manufactured using a lead frame. An example of this lead frame will be described with reference to FIG. In the figure, reference numeral 1 denotes rectangular islands on which semiconductor pellets 2 are mounted, which are arranged at predetermined intervals on a straight line. Reference numerals 3 and 4 denote leads arranged on both sides of the island 1 arranged in a straight line. In the illustrated example, four leads form a set. One end of the lead 3 arranged on one side of the island 1 is near the island 1. , And one end of the lead 4 arranged on the other side is connected to the island 1. Reference numerals 5 and 6 denote tie bars for connecting and integrating the intermediate portions of the leads 3 and 4, respectively.
6 are connected to the frame F at both ends. Reference numeral 7 denotes a tongue extending from the tie bars 5, 6 toward the opposing tie bars 6, 5 between the islands 1, 1. Reference numeral 8 denotes a suspension pin for bridging the side of the end of the tongue 7 and the island 1. The size and shape of the island 1 of the lead frame are determined in consideration of the heat generated by the semiconductor pellet 2. The semiconductor pellet 2 mounted on the island 1 is electrically connected to the lead 3 via a wire 9. To improve the loop shape of the wire 9, the semiconductor pellet 2 and the lead 3 are almost flush. A step is formed between the island 1 and the lead 3 such that Therefore, the connecting portion between the lead 4 and the island 1 and the suspension pin 8 are bent. Reference numeral 10 denotes a resin that covers a main portion of the lead frame including the island 1 and protects the semiconductor pellet 2.
【０００３】この樹脂被覆後、樹脂１０から露呈したリ
ードフレームの不要部分、即ちタイバ５、６、吊りピン
８を切断除去し個々の半導体装置が得られる。アイラン
ド１がリード３、４とは別個のブロックを用いる場合に
はリード４や吊りピン８を長めに設定し、アイランド１
に溶接等の手段により接続することができる。After the resin coating, unnecessary portions of the lead frame exposed from the resin 10, ie, the tie bars 5, 6 and the suspension pins 8, are cut and removed to obtain individual semiconductor devices. When the island 1 uses a block separate from the leads 3 and 4, the leads 4 and the suspension pins 8 are set longer, and the island 1
Can be connected by means such as welding.
【０００４】一方、導電材料からなる一枚の薄板、ある
いは連続した薄板をプレスやエッチングしてアイランド
１やリード３、４などを一体成形したものではアイラン
ド１にリード４、吊りピン８を連結した状態で屈曲成形
する必要がある。On the other hand, in the case where a single thin plate made of a conductive material or a continuous thin plate is pressed or etched to form the island 1 and the leads 3 and 4 integrally, the lead 4 and the suspension pin 8 are connected to the island 1. It is necessary to bend in the state.
【０００５】[0005]
【発明が解決しようとする課題】このようにアイランド
１やリード３、４などを一体成形したものでは最短長さ
に設定されたリード４や吊りピン８を屈曲する際に屈曲
部が引き伸ばされる。一方、リードフレームのコストを
最小化するためアイランド１の配列間隔は可及的に最短
に設定されている。When the island 1, the leads 3, 4 and the like are integrally formed as described above, the bent portion is elongated when the lead 4 or the suspension pin 8 set to the shortest length is bent. On the other hand, the arrangement interval of the islands 1 is set as short as possible to minimize the cost of the lead frame.
【０００６】そのためアイランド１、１間に配置された
吊りピン８を短くせざるを得ず、この吊りピンは屈曲時
に大きく引き伸ばされて塑性変形しアイランド１の保持
強度が低下したり、破断してアイランド１の位置決めが
できないという問題があり、特にリードフレーム材料と
して高温下で耐酸化性に優れたステンレス鋼を用いたも
のでは顕著な問題となっていた。For this reason, the suspension pins 8 disposed between the islands 1 and 1 have to be shortened, and the suspension pins are greatly stretched at the time of bending and are plastically deformed, thereby lowering the holding strength of the island 1 or breaking. There is a problem that the island 1 cannot be positioned, and this has been a remarkable problem particularly when a stainless steel having excellent oxidation resistance at high temperatures is used as a lead frame material.
【０００７】[0007]
【課題を解決するための手段】本発明は上記課題の解決
を目的として提案されたもので、半導体ペレットをマウ
ントするアイランドと、一端がアイランド近傍に配置さ
れ中間部がタイバによって連結された複数本のリードと
を、複数組みほぼ一直線上に配列し、前記アイランドは
タイバから延びる吊りピンに連結されかつ吊りピンの中
間部が屈曲されてアイランドとリードとの間に段差が形
成されたリードフレームにおいて、半導体ペレットをマ
ウントするアイランドを一直線上に所定の間隔で配列
し、前記アイランドの配列方向と交差する方向に複数本
一組のリードを延在させて各組みのリードの一端側をア
イランド近傍に配置させ、各リードの中間部をタイバに
て連結し一体化し、このタイバより前記アイランド間に
舌片を延在させ、この舌片とアイランドとを吊りピンを
介して連結し、かつ吊りピンの中間部を屈曲させてアイ
ランドとリードとの間に段差を形成し、アイランドを含
む主要部分が樹脂被覆されるリードフレームにおいて、
上記舌片上の吊りピン接続部近傍でかつ吊りピンの延在
方向と交差する方向にスリットを形成したことを特徴と
するリードフレームを提供する。SUMMARY OF THE INVENTION The present invention has been proposed for the purpose of solving the above problems, and has an island on which a semiconductor pellet is mounted and a plurality of islands having one end disposed near the island and an intermediate portion connected by a tie bar. A plurality of sets are arranged on a substantially straight line, and the island is connected to a suspension pin extending from the tie bar, and a middle portion of the suspension pin is bent to form a step between the island and the lead. The islands on which the semiconductor pellets are mounted are arranged at predetermined intervals on a straight line, and a plurality of sets of leads are extended in a direction intersecting with the arrangement direction of the islands, and one end side of each set of leads is located near the island. The leads are connected and integrated with a tie bar, and a tongue is extended from the tie bar between the islands. Linked via a pin hanging the tongue and the island, and by bending the middle portion of the suspension pin to form a step between the island and the lead, the lead frame main portion including the islands is a resin-coated,
A lead frame is provided in which a slit is formed in the vicinity of the hanging pin connection portion on the tongue piece and in a direction intersecting with the extending direction of the hanging pin.
【０００８】[0008]
【発明の実施の形態】本発明によるリードフレームは、
一直線上にアイランドを所定の間隔で配列し、各アイラ
ンドの隣接部分に延在させた舌片とアイランドとを吊り
ピンにて連結した構造のリードフレームに関し、この舌
片上の吊りピン接続部近傍に、吊りピンの延在方向と交
差する方向にスリットを形成したもので、アイランドの
一側方にリードを配列したリードフレームだけでなく、
アイランドの両側に配列したものにも本発明を適用出来
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS A lead frame according to the present invention
A lead frame having a structure in which islands are arranged at predetermined intervals on a straight line, and a tongue piece extending to an adjacent portion of each island and an island are connected by a hanging pin, and the vicinity of the hanging pin connection portion on the tongue is provided. , With slits formed in the direction intersecting with the extending direction of the suspension pins, not only the lead frame in which the leads are arranged on one side of the island,
The present invention can be applied to those arranged on both sides of the island.
【０００９】またアイランドの両側にリードを配列した
ものでは、アイランドの一側方に配置されたリードの一
端側を屈曲してアイランドと連結することができる。ま
たアイランド間に延在される舌片は、アイランドの配列
方向に沿って両側のタイバから交互に延在させることが
できる。In the case where leads are arranged on both sides of the island, one end of the lead arranged on one side of the island can be bent and connected to the island. The tongue pieces extending between the islands can be alternately extended from the tie bars on both sides along the arrangement direction of the islands.
【００１０】[0010]
【実施例】以下に本発明の実施例を図１から説明する。
図において、図３と同一物には同一符号を付し重複する
説明を省略する。本発明によるリードフレームは図３に
示すリードフレームと同様に、半導体ペレット２をマウ
ントするアイランド１を複数、一直線上に所定の間隔で
配列し、このアイランド１の両側に、図示例では４本一
組のリード３、４を配置し、各リード３、４の中間部を
タイバ５、６で連結一体化し、各タイバ５、６から交互
にアイランド１、１間に舌片７を延在させ、舌片７の端
部側方とアイランド１の間を吊りピン８で連結したもの
である。 １１は本発明の特徴部分で、舌片７の吊りピ
ン８接続部近傍に、吊りピン８の延在方向と略直交する
方向に形成したスリットを示す。FIG. 1 shows an embodiment of the present invention.
In the figure, the same components as those in FIG. 3 are denoted by the same reference numerals, and redundant description will be omitted. In the lead frame according to the present invention, similarly to the lead frame shown in FIG. 3, a plurality of islands 1 on which the semiconductor pellets 2 are mounted are arranged at predetermined intervals on a straight line. A pair of leads 3 and 4 are arranged, and the middle part of each lead 3 and 4 is connected and integrated by tie bars 5 and 6, and a tongue piece 7 is alternately extended from each tie bar 5 and 6 between the islands 1 and 1. The side of the end of the tongue piece 7 and the island 1 are connected by a suspension pin 8. Reference numeral 11 denotes a characteristic portion of the present invention, which indicates a slit formed in the vicinity of the connecting portion of the tongue piece 7 to the hanging pin 8 in a direction substantially orthogonal to the extending direction of the hanging pin 8.
【００１１】一枚の薄板から成形されたリードフレーム
では吊りピン８は余裕のある長さに設定できない。即ち
図２（ａ）に示すように屈曲成形前の吊りピン８の長さ
をａとすると、この吊りピン８を屈曲成形した後は図２
（ｂ）に示すように吊りピン８は平面視長さａを保った
まま沿面長さｂとなる。アイランド１と舌片７（リード
３、４）の間の段差をｈとすると沿面長さｂは概略、ｂ
２＝ａ２＋ｈ２となり、平面視長さａに対する沿面長さ
ｂの比（ｂ／ａ）は（１＋（ｈ／ａ）２）１／ ２とな
る。ここで段差ｈを一定長さとすると、前記比（ｂ／
ａ）は平面視長さａが小さいほど大きくなり、吊りピン
８の伸び率が大きくなる。In a lead frame formed from a single thin plate, the hanging pins 8 cannot be set to a sufficient length. That is, as shown in FIG. 2A, when the length of the suspension pin 8 before bending is defined as a, the length of the suspension pin 8 after bending is formed in FIG.
As shown in (b), the hanging pin 8 has the creepage length b while maintaining the length a in plan view. Assuming that the step between the island 1 and the tongue piece 7 (leads 3 and 4) is h, the creepage length b is approximately b
2 = a 2 + h 2, and the ratio of the creepage length b for the plan view length a (b / a) becomes (1+ (h / a) 2 ) 1/2. Here, assuming that the step h is a constant length, the ratio (b /
a) increases as the length a in plan view decreases, and the elongation of the suspension pin 8 increases.
【００１２】そのためステンレス鋼のように加工性の劣
る材料では大きく引き伸ばされて吊りピン８の屈曲部分
の機械的強度が低下し破断する虞があるが、本発明によ
るリードフレームでは舌片７にスリット１１を形成する
ことにより図２（ｃ）に示すように吊りピン８を屈曲さ
せる際の引っ張り力により舌片７の吊りピン８と隣接す
る部分がアイランド１側に移動してスリット１１が開く
ことにより、吊りピン８の沿面長さｂ１は平面視長さａ
を保つことができ、伸びを生じるとしてもわずかな伸び
ですむため吊りピン８の塑性変形や破断を防止して屈曲
することができる。またアイランド１が一直線上に配列
されたものでは樹脂１０は一直線上に配列された一端側
のアイランドから他端側のアイランドへ向かって樹脂１
０が供給されるが、樹脂被覆予定部に未充填やボイドを
生じることなく樹脂被覆するには、一直線上に配列され
た樹脂被覆予定部内で流動化した樹脂を蛇行させること
が望ましい。For this reason, in the case of a material having poor workability such as stainless steel, the mechanical strength of the bent portion of the suspension pin 8 may be reduced due to being greatly stretched, and it may be broken. 2C, a portion of the tongue piece 7 adjacent to the suspension pin 8 moves to the island 1 side to open the slit 11 due to a pulling force when the suspension pin 8 is bent as shown in FIG. the creepage length b 1 of the suspension pin 8 is a plan view length a
, And even if elongation occurs, only slight elongation is required, so that the suspension pin 8 can be bent while preventing plastic deformation or breakage. In the case where the islands 1 are arranged in a straight line, the resin 10 moves from the island on one end side arranged in a straight line to the island on the other end side.
Although 0 is supplied, it is desirable to meander the fluidized resin in the resin coating portions arranged in a straight line in order to perform resin coating without causing unfilled portions and voids in the resin coating portions.
【００１３】これに対して本発明によるリードフレーム
は、舌片７をアイランド１の両側に位置するタイバ５、
６から交互に延在させたから、樹脂被覆予定部の樹脂注
入口と樹脂排出口を蛇行配置でき、良好な樹脂被覆が可
能である。またアイランド１にマウントした半導体ペレ
ット２の裏面電極をリード４に接続するため、アイラン
ド１とリード４とを接続し、接続部を屈曲させたもので
は、アイランド１は接続部を回転中心として、アイラン
ド１のリード３側他端が浮き上がる虞があるが、本発明
によるリードフレームは舌片７に形成したスリット１１
により舌片７の先端部が板ばねの作用を持ち、アイラン
ド１の浮き上がりを防止することができ、半導体ペレッ
ト２のマウント作業、ワイヤ９のボンディング作業、樹
脂１０の被覆作業を良好に行なうことができる。On the other hand, in the lead frame according to the present invention, the tongue piece 7 has the tie bars 5 located on both sides of the island 1,
6, the resin inlet and the resin outlet of the portion to be coated with resin can be arranged in a meandering manner, and good resin coating is possible. In order to connect the back electrode of the semiconductor pellet 2 mounted on the island 1 to the lead 4, the island 1 is connected to the lead 4, and the connection portion is bent. There is a possibility that the other end of the lead 3 on the side of the lead 3 may be lifted.
As a result, the tip of the tongue piece 7 has the function of a leaf spring, and the floating of the island 1 can be prevented, and the mounting work of the semiconductor pellet 2, the bonding work of the wire 9, and the coating work of the resin 10 can be performed well. it can.
【００１４】尚、タイバ５、６の両端部はフレームＦに
接続され、この部分にはアイランドの外端が位置する
が、このアイランド外端１ａを支持する吊りピン８ａ部
分は、スリット１１によって区画された舌片７と吊りピ
ン８とがなす形状を図示例のようにＴ字状にしてもよい
し、アイランド１、１間に位置する舌片７と吊りピン８
とがなすＬ字状としてもよい。Both ends of the tie bars 5 and 6 are connected to the frame F, and the outer end of the island is located in this portion. The hanging pin 8a supporting the outer end 1a of the island is partitioned by the slit 11. The shape formed by the tongue piece 7 and the suspension pin 8 may be T-shaped as shown in the illustrated example, or the tongue piece 7 and the suspension pin 8 located between the islands 1 and 1 may be used.
The shape may be an L shape.
【００１５】[0015]
【発明の効果】以上のように本発明によれば吊りピンを
塑性変形させたり破断させることなく屈曲成形すること
ができ、アイランド１の位置ずれや傾きを防止でき、良
好な樹脂被覆ができる。As described above, according to the present invention, the suspension pin can be bent and formed without plastic deformation or breakage, the displacement and inclination of the island 1 can be prevented, and good resin coating can be achieved.
【図１】 本発明の実施例を示すリードフレームの要部
平面図FIG. 1 is a plan view of a main part of a lead frame showing an embodiment of the present invention.
【図２】 吊りピンの屈曲状態を示す要部断面図FIG. 2 is a cross-sectional view of a main part showing a bent state of a hanging pin.
【図３】 本発明の前提となる従来のリードフレームを
示す要部平面図FIG. 3 is an essential part plan view showing a conventional lead frame as a premise of the present invention.
１ アイランド ２ 半導体ペレット ３、４ リード ５、６ タイバ ７ 舌片 ８ ピン １０ 樹脂 １１ スリット Ｆ フレーム Reference Signs List 1 island 2 semiconductor pellet 3, 4 lead 5, 6 tie bar 7 tongue piece 8 pin 10 resin 11 slit F frame
Claims (4)
を一直線上に所定の間隔で配列し、前記アイランドの配
列方向と交差する方向に複数本一組のリードを延在させ
てかつ各リードの一端側をアイランド近傍に配置させる
とともに各リードの中間部をタイバにて連結し一体化
し、このタイバより前記アイランド間に延在させた舌片
とアイランドとを吊りピンを介して連結し、かつ吊りピ
ンの中間部を屈曲させてアイランドとリードとの間に段
差を形成し、アイランドを含む主要部分が樹脂被覆され
るリードフレームにおいて、 上記舌片上の吊りピン接続部近傍でかつ吊りピンの延在
方向と交差する方向にスリットを形成したことを特徴と
するリードフレーム。An island for mounting a semiconductor pellet is arranged at a predetermined interval on a straight line, a set of plural leads is extended in a direction intersecting the arrangement direction of the islands, and one end of each of the leads is arranged. It is arranged near the island, and the middle part of each lead is connected and integrated with a tie bar, and the tongue piece extended between the islands and the island are connected from the tie bar via a hanger pin. In a lead frame in which a main part including the island is covered with a resin by bending the portion to form a step between the island and the lead, in the vicinity of the connecting portion of the hanging pin on the tongue and intersecting with the extending direction of the hanging pin. A lead frame, wherein a slit is formed in a direction in which the lead frame moves.
ランドの両側に配置されたことを特徴とする請求項１に
記載のリードフレーム。2. The lead frame according to claim 1, wherein the leads and tie bars connecting the leads are arranged on both sides of the island.
一端側が屈曲されてアイランドと連結されたことを特徴
とする請求項２に記載のリードフレーム。3. The lead frame according to claim 2, wherein one end of the lead arranged on one side of the island is bent and connected to the island.
イバからアイランドの配列方向に交互に延在されたこと
を特徴する請求項１に記載のリードフレーム。4. The lead frame according to claim 1, wherein the tongues are alternately extended from tie bars arranged on both sides of the island in an array direction of the island.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001179868A JP2002373964A (en) | 2001-06-14 | 2001-06-14 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001179868A JP2002373964A (en) | 2001-06-14 | 2001-06-14 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002373964A true JP2002373964A (en) | 2002-12-26 |
Family
ID=19020369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001179868A Ceased JP2002373964A (en) | 2001-06-14 | 2001-06-14 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002373964A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003046051A (en) * | 2001-07-30 | 2003-02-14 | Nec Corp | Lead frame, semiconductor device and resin-molding method therefor |
| JP2010258289A (en) * | 2009-04-27 | 2010-11-11 | Sanyo Electric Co Ltd | Method of manufacturing semiconductor device |
| CN108831874A (en) * | 2018-08-07 | 2018-11-16 | 广东气派科技有限公司 | The encapsulating structure of integrated circuit |
| CN110223967A (en) * | 2019-05-30 | 2019-09-10 | 无锡红光微电子股份有限公司 | Tri- base island packaging frame of DFN-6L |
-
2001
- 2001-06-14 JP JP2001179868A patent/JP2002373964A/en not_active Ceased
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003046051A (en) * | 2001-07-30 | 2003-02-14 | Nec Corp | Lead frame, semiconductor device and resin-molding method therefor |
| JP4611579B2 (en) * | 2001-07-30 | 2011-01-12 | ルネサスエレクトロニクス株式会社 | Lead frame, semiconductor device and resin sealing method thereof |
| JP2010258289A (en) * | 2009-04-27 | 2010-11-11 | Sanyo Electric Co Ltd | Method of manufacturing semiconductor device |
| CN108831874A (en) * | 2018-08-07 | 2018-11-16 | 广东气派科技有限公司 | The encapsulating structure of integrated circuit |
| CN110223967A (en) * | 2019-05-30 | 2019-09-10 | 无锡红光微电子股份有限公司 | Tri- base island packaging frame of DFN-6L |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5825081A (en) | Tape carrier and assembly structure thereof | |
| US6303985B1 (en) | Semiconductor lead frame and package with stiffened mounting paddle | |
| US6650020B2 (en) | Resin-sealed semiconductor device | |
| EP0247644A1 (en) | Integrated circuit die-to-lead frame connection using an intermediate bridging member | |
| US5233131A (en) | Integrated circuit die-to-leadframe interconnect assembly system | |
| JP3016658B2 (en) | Lead frame, semiconductor device and method of manufacturing the same | |
| JP2002373964A (en) | Lead frame | |
| JPH1056124A (en) | Lead frame and bottom lead semiconductor package | |
| US20040251528A1 (en) | Electric power semiconductor device | |
| JP3350352B2 (en) | Supporting base of semiconductor device having wiring pattern | |
| JP3614476B2 (en) | Flexible wiring parts | |
| US7304371B2 (en) | Lead frame having a lead with a non-uniform width | |
| JPH11121680A (en) | Lead frame and semiconductor device | |
| JP2000294045A (en) | Flat ribbon cable | |
| JPS6143436A (en) | Bonding process | |
| JPS63306648A (en) | Lead frame for semiconductor device and manufacture thereof | |
| JP2002373965A (en) | Lead frame | |
| US5731962A (en) | Semiconductor device free from short-circuit due to resin pressure in mold | |
| JPH0621293A (en) | Axial lead frame | |
| JP3180947B2 (en) | Lead frame assembly for semiconductor device | |
| JP2002100723A (en) | Semiconductor device | |
| JP3036597B1 (en) | Lead frame for semiconductor device | |
| JP3320370B2 (en) | Thermal head | |
| JP2000294716A (en) | Lead frame | |
| JPS63107125A (en) | Semiconductor device and manufacture thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041008 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050419 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050509 |
|
| A045 | Written measure of dismissal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A045 Effective date: 20050926 |