JP2002368393A - Method for manufacturing metal wiring circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal wiring circuit board by which the metal wiring circuit board can sufficiently keeps adhesive properties with a polyimide resin film constituting a base without impairing smoothness even if a metal wiring is made to be further minute. SOLUTION: A photosensitive insulating resin solution 3a is applied to the metal wiring circuit board comprising a metal wiring pattern 2a formed on a polyimide resin film of a base 1 by an additive method or a subtractive method. At this time, the solution 3a is applied so as to coat the pattern 2a and fill a space (part where the pattern 2a is not formed). Subsequently, after the solution is dried, the resin 3 is removed by UV ray exposure or development so that the entire or required part of the pattern 2a is exposed, and the residual resin 3 is heated to be closed circular or bridged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal wiring circuit board such as a film probe (or a flat probe) used for a lighting inspection of a liquid crystal panel or the like.

[0002]

2. Description of the Related Art Conventionally, as is well known, a substrate composed of only a polyimide resin film or a metal-coated polyimide resin film (eg, a copper foil-coated polyimide resin film)
A metal wiring circuit board in which a metal wiring pattern is formed by an additive method or a subtractive method on the above-mentioned polyimide resin film such as a base material constituted by the above method is widely used in practice.

[0003] However, with the refinement of IC chips, the refinement of the line width of metal wiring and the pitch of lines or spaces is rapidly progressing, and therefore, adhesion to metal wiring may be regarded as a problem. Became.

In particular, metal wiring provided on a film probe (or flat probe) for inspection of a liquid crystal panel (LCD panel) is pressed against the metal wiring of an object to be inspected at the time of inspection. In addition, a high adhesion strength (peel strength) that can withstand scratching or separation is required.

Therefore, in order to develop a base material having a high adhesion strength capable of meeting such demands, for example, use of a glass fiber reinforced epoxy resin sheet has been studied. When lamination (or integration) is performed, unevenness of the reinforcing fibers appears on the surface of the metal foil, and the smoothness of the metal wiring is impaired.

For this reason, a metal-clad polyimide resin film free from such defects is widely used. On the other hand, a polyimide resin film has poor adhesion to metal wiring (peel strength). There is a strong demand for improvements.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks (or problems). An object of the present invention is to provide a method of manufacturing a metal wiring circuit board which can maintain the adhesion to a polyimide resin film constituting a substrate more sufficiently without impairing smoothness.

[0008]

In order to achieve the above-mentioned object, in the present invention, as one method, as described in claim 1, at least a substrate made of a polyimide resin film alone is used. Photosensitive so as to cover the metal wiring pattern of the metal wiring circuit board in which the metal wiring pattern is formed by the additive method or the subtractive method on the polyimide resin film and to fill the space where the metal wiring pattern is not formed. Apply the insulating resin solution and dry, then
After removing the photosensitive insulating resin so as to expose a necessary portion or the entire surface of the metal wiring pattern by ultraviolet exposure and development using a photomask, the remaining photosensitive insulating resin is heated and closed.

As another method, as described in claim 9, heat crosslinking is performed in place of the above-mentioned heat ring closure. It is preferable that the photosensitive insulating resin has a Tg of 200 ° C. or more after the heat ring closure or the heat crosslinking.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a substrate composed of at least a polyimide resin film alone, that is, a substrate composed only of a polyimide resin film or a laminated material composed of a polyimide resin film and a metal foil. The used substrate is used.

The above-mentioned polyimide resin film may be either a thermoplastic polyimide resin film or a non-thermoplastic polyimide resin film in the former substrate (substrate composed of a single polyimide resin film material). ,
Alternatively, a laminate of a thermoplastic polyimide resin film and a non-thermoplastic polyimide resin film may be used.

Similarly, even in the latter substrate (substrate composed of a laminate of a polyimide resin film and a metal foil), the polyimide resin film is formed of a thermoplastic polyimide resin film or a non-thermoplastic polyimide resin film. Any of them may be used, and a laminate of a thermoplastic polyimide resin film and a non-thermoplastic polyimide resin film may be used. In addition, copper foil is generally selected as the metal foil used for the latter base material, but an Al foil or the like may be selected as necessary.

Examples of the above-mentioned non-thermoplastic polyimide resin include polyimide comprising pyromellitic anhydride (PMDA) and oxydianiline (ODA), biphenyltetracarboxylic anhydride (BTDA) and p-phenylenediamine (PDA). And a copolymer obtained from these monomers.

More specifically, as examples of commercially available non-thermoplastic polyimide resin films, "Kapton" (trade name) manufactured by Toray Dupont Co., Ltd. and "Apical" (trade name) manufactured by Kanegabuchi Chemical Industry Co., Ltd. Name), "UPILEC-S" (trade name) manufactured by Ube Industries, Ltd. and the like.

The above-mentioned non-thermoplastic polyimide resin film is often used after being processed into a metal-clad polyimide resin film substrate. For example, a copper-clad polyimide resin film substrate is processed by applying electrolytic copper plating after forming a metal base by sputtering, or a metal foil (copper foil or Al foil) is applied via a thermoplastic polyimide resin-based adhesive. Foil or the like) and processed into a metal-clad polyimide resin film base material.

Unlike the above, there is a case where a non-thermoplastic polyimide resin film is used after being processed into a base material in which a thermoplastic polyimide resin-based adhesive layer is formed in advance. "Neoflex Series-II" (trade name) manufactured by Mitsui Chemicals, Inc. as a commercial product
Is mentioned.

On the other hand, as the thermoplastic polyimide resin, pyromellitic anhydride and biphenyltetracarboxylic anhydride (BT) which are the raw materials of the above-mentioned non-thermoplastic polyimide resin are used.
DA) and monomer components such as diamines such as oxydianiline (ODA) and p-phenylenediamine (PDA), and -CH _{2 having} a small polarity and a high flexibility in the main chain.
-, -O-, -S-, -Si-, -CO- and other linking group-introduced monomers such as diamines and tetracarboxylic anhydrides, and bulky phenyl groups and alicyclic tetracarboxylic acids having a bicyclo ring Those containing monomer components such as acid anhydrides and diamines can be mentioned.

More specifically, "UPILEX-VT" (trade name) manufactured by Ube Industries, Ltd. is a representative example of a commercially available thermoplastic polyimide resin film. Further, as an example of the thermoplastic polyimide adhesive sheet, “Upitite-UPA-N” manufactured by Ube Industries, Ltd.
Type ".

In the present invention, a photosensitive insulating resin solution is applied to a metal wiring circuit board in which a metal wiring pattern has been formed on the above-mentioned substrate polyimide resin film by an additive method or a subtractive method (etching method). A typical example of such an additive method is additive electrolytic plating, and a typical example of a subtractive method is copper foil etching.

In the case of additive electrolytic plating, a thin-film electrolytic copper-clad polyimide resin film formed by sputtering / electrolytic thin-film copper plating or a thin-film electrolytic copper adhered to a polyimide resin film with a thermoplastic polyimide resin-based adhesive. A stretched polyimide resin film is used, whereby a fine line / space pattern can be formed by electrolytic plating using a plating resist.

On the other hand, in the copper foil etching method, an electrolytic copper foil-clad polyimide resin film having a relatively large film thickness is used, and the line / space is generally larger than that of the above-described additive method. However, in forming such a metal wiring pattern, the adhesive strength with the polyimide resin film forming the base material cannot be sufficiently satisfied in any case.

Therefore, in the present invention, a photosensitive insulating resin solution is applied on the entire surface of the polyimide resin film of the metal wiring circuit board and dried, and then exposed to ultraviolet light using a photomask and developed. Adhesion with the polyimide resin film by removing the photosensitive insulating resin covering the metal wiring pattern so as to expose the necessary portions or the entire surface of the metal wiring pattern, and heat-closing or heat-crosslinking the remaining photosensitive insulating resin Strength is further enhanced.

The above-mentioned photosensitive insulating resin solution preferably has a photosensitivity before heat treatment, can be exposed to ultraviolet light and can be developed, and has a Tg of 200 ° C. or more after heat treatment. The resin may be any of a mold type and a positive type.

Examples of such a solution include a polyimide resin precursor solution, a polybenzoxazole resin precursor solution, and an acrylic resin cover coat ink. In the case of applying a polyimide resin solution or a polybenzoxazole resin precursor solution, After the ultraviolet exposure and development using a photomask, the remaining photosensitive insulating resin is heated and closed. On the other hand, when the acrylic resin cover coat ink is applied, the remaining photosensitive insulating resin is crosslinked by heating.

Thus, as the photosensitive insulating resin solution,
When applying a polyimide resin precursor solution or a polybenzoxazole resin precursor solution, and when applying an acrylic resin cover coat ink, it is common in that the photosensitive insulating resin covering the metal wiring pattern is removed. However, the structural change of the formed resin is different in the heat treatment of the remaining photosensitive insulating resin.

Examples of commercially available polyimide resin precursor solutions include "Photo Nice" (trade name), which is a photosensitive polyimide varnish manufactured by Toray Industries, Inc. of the ion bonding type, and Asahi Kasei Corporation, a covalent bonding type. Examples of commercially available polybenzoxazole resin precursor solutions that can be used in the present invention include "CRC", a positive type photosensitive coating agent manufactured by Sumitomo Bakelite Co., Ltd.
-8000 series ".

An example of commercially available acrylic resin cover coat ink is "V-259PA series" (acrylic resin having a Freon skeleton) which is a cardo-type heat-resistant permanent resist manufactured by Nippon Steel Chemical Co., Ltd. These resin solutions are applied to a base material, dried, and then subjected to exposure and development steps, followed by heat ring closure or cross-linking, whereby a heat-resistant resin having a high Tg can be obtained.

In the present invention, the selection of the photosensitive insulating resin solution is different from the selection of the non-photosensitive insulating resin solution.
The choice of resins such as epoxy-based and acrylic-based resins has expanded, and the choice of materials has increased in order to improve adhesion and reduce warpage.In addition, the photosensitive dryness required when etching non-photosensitive resin coated with polyimide resin has been increased. This is because the steps of laminating, exposing, developing, etching and peeling the film can be shortened to the steps of exposing, developing and curing.

In the present invention, as described above,
The photosensitive insulating resin covering the metal wiring pattern is removed by exposure to ultraviolet light and development using a photomask so as to expose a necessary portion or the entire surface of the metal wiring pattern. In such exposure, light of an effective wavelength is irradiated. It is preferable to use an ultra-high pressure mercury lamp type exposure machine as a mercury lamp for that purpose, and a predetermined developing machine is selected for development after exposure.

The same applies to the exposure when forming a plating mask or an etching mask. When a metal circuit pattern is formed on thin-film copper by an additive method, the photosensitive resin mask is peeled off, and the space is removed. It is necessary to soft-etch the thin-film copper in a portion, and a predetermined liquid is selected for the soft-etching.

The above-described metal wiring circuit board according to the present invention is particularly suitable as an inspection electrode substrate (so-called flat probe or film probe) used for lighting inspection of a liquid crystal panel or the like. FIG. 1 shows a plan view of such a metal wiring circuit board.

As shown in the figure, in this case, a photosensitive insulating resin 3 is applied so as to expose one end and the other end of a large number of metal wirings 2 formed at a predetermined pitch on a substrate 1. I have. At the time of inspection, the inspection electrode portion A where one end of the metal wiring 2 is exposed is pressed against the inspection object, and the connection electrode portion B where the other end of the metal wiring 2 is exposed is connected to the driving means on the power supply side. Press against

Note that the photosensitive insulating resin 3 is also applied and filled in the space portions 4 (portions where the metal wirings 2 are not formed) of the inspection electrode portions A and the connection electrode portions B. FIG. 2 (h) shows the ZZ cross section. The upper surface of the photosensitive insulating resin 3 filling the space portion 4 is located slightly below the upper surface of the metal wiring 2.

As shown in FIG. 2, such a metal wiring circuit board can be manufactured through the steps (a) to (h). First, in step (a), a metal film 5 (for example, a copper thin film) is formed on a substrate 1 (for example, a substrate composed of a single material of a polyimide resin film).
In the above, a plating resist 6 (for example,
UV curable photosensitive resin) is applied over the entire surface.

Next, in step (c), by exposing and developing the plating resist 6, the metal film 5 in the space portion (the portion where the metal wiring is not formed) is covered and the line portion (the portion where the metal wiring is formed). Then, a plating resist pattern 6a exposing the metal film 5 is formed.

Next, in a step (d), a metal wiring pattern 2a having a predetermined thickness is formed in a line portion by additive electrolytic plating (for example, electrolytic nickel plating).
Subsequently, in step (e), the plating resist pattern 6a is removed with a stripping solution (eg, alkali). Next, in step (f), the metal film 5 is etched with a soft etching solution (eg, hydrochloric acid). In the step (g), the photosensitive insulating resin solution 3a is applied over the entire surface and dried to a predetermined degree.

Next, in the step (h), the metal wiring pattern 2a is exposed by ultraviolet exposure and development using a photomask so as to expose necessary portions of the metal wiring pattern 2a (for example, the inspection electrode portion A and the connection electrode portion B). The covering photosensitive insulating resin 3 is removed, and then the remaining photosensitive insulating resin 3 is heat-closed or heat-crosslinked. FIG.
In (h), a part of the photosensitive insulating resin 3 covering the metal wiring pattern 2a is removed (an upper part of the inspection electrode portion A and the connection electrode portion B is removed), and the inspection electrode portion A and the connection electrode portion are removed. The other portion of the resin 3 is shown remaining in the space 4 between the adjacent metal wiring patterns 2a on the lower side of B.

As a method for leaving a part of the photosensitive insulating resin 3 in the space portion 4, generally, an external force is applied at the time of heating ring closing or heating crosslinking to transfer a part of the photosensitive insulating resin 3 to the space portion 4. A method of causing the fluid to flow may be used, but another method, for example, a method of performing exposure from the lower surface side of the substrate (the surface side on which the photosensitive insulating resin 3 is not applied) may be used.

FIG. 3 shows a method of manufacturing another metal wiring circuit board. In this method, in step (a), a metal film 5 (for example, a copper thin film) is formed on a base material 1 (for example, a base material composed of a laminate of a polyimide resin film 7 and a metal foil 8), Next, in a step (b), an etching resist 9 is formed on the metal film 5.
(E.g., an ultraviolet curable photosensitive resin) is applied over the entire surface.

Next, in step (c), by exposing and developing the etching resist 9, the metal film 5 in the space portion (portion where the metal wiring is not formed) is exposed and the line portion (portion where the metal wiring is formed). An etching resist pattern 9a covering the metal film 5 is formed.

Next, in the step (d), the metal film 5 is etched to form the metal wiring pattern 2a. Subsequently, in the step (e), the etching resist pattern 9a is removed.

Next, in step (f), the photosensitive insulating resin solution 3a is applied over the entire surface and dried in a predetermined manner. Then, in step (g), the metal wiring pattern 2a is exposed to ultraviolet light using a photomask and developed. Metal wiring pattern 2a so as to expose necessary portions or the entire surface
Is removed, and then the remaining photosensitive insulating resin 3 is heat-closed or cross-linked.

[0043]

[Example 1] A non-thermoplastic polyimide resin film "UPILEX-" manufactured by Ube Industries, Ltd.
S ”(size 150mm x 150mm, thickness 75μ)
m) was subjected to a film surface adhesion improving treatment (roughening treatment) in an argon gas, and then a 0.3 μm thick copper thin film (conductive layer) was formed thereon by sputtering (FIG. 2). (A)).

Next, as a plating resist,
UV curable photosensitive resin "P" manufactured by Tokyo Ohka Co., Ltd.
MER-N ”(trade name) applied to a thickness of 25 μm (FIG. 2)
(Refer to (b)), and a plating resist pattern (see FIG. 3) that covers the copper thin film in the space portion (portion where the metal wiring is not formed) by exposure and development and exposes the copper thin film in the line portion (portion where the metal wiring is formed). Line width is 15μ
m, and the width of the space portion is 50 μm) (FIG. 2).
(C)).

Then, a nickel circuit pattern having a thickness of about 10 μm was formed in the line portion by electrolytic nickel plating (see FIG. 2D), and the UV-curable photosensitive resin applied to the space portion was removed with alkali. (See FIG. 2E). As a result, the line width becomes 15 μm.
m, and a metal wiring having a space width of 50 μm was obtained.

Next, the copper thin film in the space portion is soft-etched with a thin hydrochloric acid so that the upper line width of the line portion is
As a result, a metal wiring pattern having a flat surface with a width of 50 μm was obtained (see FIG. 2F).

Next, "Photo Nice UR5400" (trade name) which is a photosensitive polyimide resin precursor solution manufactured by Toray Industries, Inc. was applied to the metal wiring circuit board to a thickness of 15 μm by a roll coater and leveled. rear,
It was dried at 80 ° C. (see FIG. 2 (g)).

Next, exposure was performed with an ultra-high pressure mercury lamp exposure machine using a photomask, and the entire surface was exposed from the back surface.
Next, the test electrode portion A and the connection electrode portion B are formed by developing with a dedicated developer to expose the metal wiring, and the remaining photosensitive polyimide resin precursor is further formed using a vacuum press furnace at 400 ° C. The solution was closed by heating.

In the metal wiring circuit board thus obtained, since the photosensitive polyimide resin is completely filled in the spaces, the adhesion of the metal wiring to the polyimide resin film of the base material is extremely low. It is suitable as an inspection electrode substrate (so-called flat probe) used for lighting inspection of a liquid crystal panel, and the electrode (metal wiring 2) does not peel even if the number of inspections exceeds 10,000.

Example 2 A polyimide resin surface of a single-sided copper-clad product of “UPISEL-N” (trade name) having a size of 100 mm × 100 mm manufactured by Ube Industries, Ltd.
μm stainless steel foil was bonded by thermocompression bonding (Fig. 3
(See (a)). Such “Iupisel-N” is a thermoplastic polyimide resin film made by the company and has a thickness of 25 μm.
"UPILEX-VT" is provided with a 12 μm-thick electrolytic copper foil on one side.

Next, "NIT225" (trade name) which is a UV-curable photosensitive resin film having a thickness of 25 μm manufactured by Nichigo Morton Co., Ltd. was attached to the copper foil surface (FIG. 3B). Exposure and development to form an etching resist pattern that covers the copper thin film in the line portion (the portion where the metal wiring is to be formed) and exposes the copper thin film in the space portion (the portion where the metal wiring is not formed). It was formed (see FIG. 3C). The width of the line portion was 25 μm, and the width of the space portion was 35 μm.

Next, after the copper thin film in the space portion was etched with a cupric chloride etching solution (see FIG. 3D), the resist pattern for etching was removed to form a copper wiring pattern (FIG. 3E). reference). The obtained metal wiring has an upper line width of 18 μm and a lower line width of 30 μm.
μm, the variation in the upper and lower line widths is small, and
The surface was a smooth surface without irregularities.

Next, "V-259PA" (trade name), which is a photosensitive acrylic resin cover coat ink manufactured by Nippon Steel Chemical Co., Ltd., was applied to the metal wiring circuit board with a roll coater, and the coating was performed at 110 ° C. for 10 minutes. It was dried (see FIG. 3 (f)).

Next, the copper wiring pattern is exposed by irradiating ultraviolet rays using a photomask and developing and removing with a dedicated liquid (see FIG. 3 (g)).
The remaining photosensitive acrylic resin cover coat ink was heated and cross-linked using a vacuum press furnace of No.

In the metal wiring circuit board thus obtained, a part of the photosensitive acrylic resin flows into the space portion during the pressing and the space portion is completely filled with the photosensitive alkali resin. The adhesion of the metal wiring to the polyimide resin film of the substrate was very high.

Example 3 "UPILEX-V" is a thermoplastic polyimide resin film having a thickness of 25 μm and a size of 100 mm × 100 mm manufactured by Ube Industries, Ltd.
"T" (trade name) is heated and laminated on one side with electrolytic copper foil having a thickness of 3 µm, and "Upilex-S" (trade name) is a non-thermoplastic polyimide resin film with a thickness of 5 µm manufactured on the other side. ) Were bonded by heating.

Next, "NIT225" (trade name), a 25-μm-thick UV-curable photosensitive resin film manufactured by Nichigo Morton Co., Ltd., was adhered onto the electrolytic copper foil, and exposed and developed. Then, a resin coating pattern was formed in which the copper thin film in the line portion (the portion where a circuit was to be formed) was exposed and the copper thin film in the space portion (the portion where no circuit was formed) was coated. The width of the line portion is 25μ.
m, and the width of the space portion was 35 μm.

Next, a copper wiring pattern having a thickness of 10 μm is formed on the line portion by additive electrolytic plating.
Further, when a nickel plating having a thickness of 2 μm was applied thereon, the wiring had an upper line width of 24 μm and a lower line width of 25 μm. Next, after the applied UV-curable photosensitive resin was peeled off with an alkali, the copper thin film was etched with a soft etching solution to form a copper wiring pattern from which the copper thin film was removed. Such a copper wiring pattern had an upper line width of 22 μm and a lower line width of 24 μm, had small variations in the upper and lower line widths, and had a smooth surface with no irregularities.

Next, “CRC-8000” (trade name), a positive photosensitive polybenzoxazole resin precursor cover coat ink manufactured by Sumitomo Bakelite Industry Co., Ltd., was applied and dried to form a copper wiring pattern of 5 μm. And the space was filled.

Next, while irradiating ultraviolet rays using a photomask and developing and removing with a dedicated solution to expose the copper wiring pattern, the remaining photosensitive polybenzoxazole resin is used using a vacuum press furnace at 320 ° C. The precursor cover coat ink was heated and closed.

The metal wiring circuit board obtained as described above has low hygroscopicity due to the characteristics of polybenzoxazole resin, good dimensional stability during use, high adhesion strength, heat cycle test and high temperature high temperature. Excellent performance was also exhibited in the humidity test, and the contacts and copper wiring did not peel off.

[0062]

As described above, according to the present invention, even if the metal wiring is further refined, the smoothness of the metal wiring is not impaired, and the polyimide resin film constituting the base material is not damaged. And a method for manufacturing a metal wiring circuit board capable of maintaining sufficient adhesion with the liquid crystal panel, in particular, an inspection electrode substrate (flat probe or film probe) suitable for use in a lighting inspection of a liquid crystal panel or the like.

[Brief description of the drawings]

FIG. 1 is a plan view of a metal wiring circuit board.

FIG. 2 is a view showing manufacturing steps (a) to (h) of a metal wiring circuit board.

FIG. 3 is another manufacturing process (a) to metal wiring circuit board.
It is a figure showing (g).

[Explanation of symbols]

 1: base material 2: metal wiring 2a: metal wiring pattern 3: photosensitive insulating resin 3a: photosensitive insulating resin solution 4: space portion 5: metal film 6a: resist pattern for plating 7: polyimide resin film 8: metal foil 9a : Resist pattern for etching A: Inspection electrode B: Connection electrode

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masanori Akita 1-1-45 Oe, Otsu City, Shiga Prefecture Inside Toray Engineering Co., Ltd. (72) Inventor Shuichi Motochika 1-1-45 Oe, Otsu City, Shiga Prefecture No. Toray Engineering Co., Ltd. (72) Inventor Daisuke Takase 1-145 Oe, Otsu City, Shiga Prefecture Toray Engineering Co., Ltd. 72) Inventor Hideo Uehara 1-103-45 Yoshinodai, Kawagoe-shi, Saitama Prefecture Inside Ray Tech Co., Ltd. (72) Inventor Jun Suzuki 1-103-45 Yoshinodai 1, Kawagoe-shi, Saitama Prefecture F-term in Ray Tech Co., Ltd. (Reference) 5E314 AA27 AA33 BB06 BB13 CC01 DD07 FF06 GG12 GG17

Claims (16)

[Claims] 1. A method for coating a metal wiring pattern of a metal wiring circuit board having a metal wiring pattern formed by an additive method or a subtractive method on at least the polyimide resin film of a substrate made of a polyimide resin film alone. A photosensitive insulating resin solution is applied so as to fill a space where the metal wiring pattern is not formed, and dried, and then a necessary portion or the entire surface of the metal wiring pattern is exposed by ultraviolet light exposure and development using a photomask. A method for manufacturing a metal-wiring circuit board, comprising: removing the photosensitive insulating resin so as to expose the same; and heating and closing the remaining photosensitive insulating resin. 2. The method according to claim 1, wherein the base material is made of a thermoplastic polyimide resin film alone or a non-thermoplastic polyimide resin film alone. 3. The method according to claim 1, wherein the substrate is made of a laminate of a thermoplastic polyimide resin film and a non-thermoplastic polyimide resin film. 4. The method according to claim 1, wherein the substrate is made of a laminate of a polyimide resin film and a metal foil. 5. The method according to claim 4, wherein the polyimide resin film is made of a thermoplastic polyimide resin film alone or a non-thermoplastic polyimide resin film alone. 6. The method according to claim 4, wherein the polyimide resin film is made of a laminate of a thermoplastic polyimide resin film and a non-thermoplastic polyimide resin film. 7. The metal wiring circuit board according to claim 1, wherein the photosensitive insulating resin solution has a Tg of 200 ° C. or more after the heat ring closure. Production method. 8. The method according to claim 7, wherein the photosensitive insulating resin solution is a polyimide resin precursor solution or a polybenzoxazole resin precursor solution. 9. A method for coating a metal wiring pattern of a metal wiring circuit board in which a metal wiring pattern is formed by an additive method or a subtractive method on at least the polyimide resin film of a substrate composed of a polyimide resin film alone. A photosensitive insulating resin solution is applied so as to fill a space where the metal wiring pattern is not formed, and dried, and then a necessary portion or the entire surface of the metal wiring pattern is exposed by ultraviolet light exposure and development using a photomask. A method for manufacturing a metal-wiring circuit board, comprising: removing the photosensitive insulating resin covering the metal wiring pattern so as to expose the same; and heating and crosslinking the remaining photosensitive insulating resin. 10. The method according to claim 9, wherein the base material is made of a thermoplastic polyimide resin film alone or a non-thermoplastic polyimide resin film alone. 11. The method according to claim 9, wherein the base material is made of a laminate of a thermoplastic polyimide resin film and a non-thermoplastic polyimide resin film. 12. The method according to claim 9, wherein the base material is made of a laminate of a polyimide resin film and a metal foil. 13. The method according to claim 12, wherein the polyimide resin film is made of a thermoplastic polyimide resin film alone or a non-thermoplastic polyimide resin film alone. 14. The method according to claim 12, wherein the polyimide resin film is formed of a laminated material of a thermoplastic polyimide resin film and a non-thermoplastic polyimide resin film. 15. The metal wiring circuit board according to claim 9, wherein the photosensitive insulating resin liquid has a Tg of 200 ° C. or more after the heat crosslinking. Production method. 16. The ink according to claim 15, wherein the photosensitive insulating resin liquid is an acrylic resin cover coat ink.
3. The method for manufacturing a metal wired circuit board according to 1.