JP2002361861A - Head chip and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a head chip and its manufacturing method in which manufacturing processes are reduced by easily and surely connecting electrodes inside chambers and dummy chambers and wiring lines each other, and manufacturing costs are reduced. SOLUTION: Dummy chambers 18 and chambers 17 shorter than dummy chambers 18 are opened to a surface of a substrate 16. Moreover, a wiring pattern 81 for discrete electrodes for mutually electrically connecting discrete electrodes 20b corresponding to respective chambers 17 is set to rear end parts at the opposite side to nozzle openings of the dummy chambers 18 at both sides of each chamber 17. At the same time, a wiring pattern 80 for common electrodes which communicates with each of common electrodes 20a in the chambers 17 is set to rear end parts of the chambers 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a head chip mounted on an ink jet recording apparatus applied to, for example, a printer, a facsimile and the like, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, there has been known an ink jet recording apparatus for recording characters and images on a recording medium using an ink jet head having a plurality of nozzles for discharging ink. In such an ink jet type recording apparatus, a nozzle of an ink jet head is provided on a head holder so as to face a recording medium, and the head holder is mounted on a carriage and scanned in a direction orthogonal to a transport direction of the recording medium. It has become.

FIG. 11 schematically shows an example of a head chip of such an ink jet head, and FIG. 12 shows a cross section of a main part thereof. As shown in FIGS. 11 and 12, a plurality of grooves 102 are provided in the piezoelectric ceramic plate 101, and each groove 102 is separated by a side wall 103. One end of each groove 102 in the longitudinal direction is a piezoelectric ceramic plate 10.
1 is extended to one end surface, and the other end portion does not extend to the other end surface, but gradually decreases in depth. Also,
Electrodes 105 for applying a driving electric field are formed on the opening side surfaces of both side walls 103 in each groove 102 in the longitudinal direction.

[0004] A cover plate 107 is provided with an adhesive 1 on the opening side of the groove 102 of the piezoelectric ceramic plate 101.
09. The cover plate 107 has a common ink chamber 111 serving as a concave portion communicating with the shallow other end of each groove 102, and an ink supply port 1 penetrating from the bottom of the common ink chamber 111 in a direction opposite to the groove 102.
And 12.

A nozzle plate 115 is joined to an end face of the joined body of the piezoelectric ceramic plate 101 and the cover plate 107 where the groove 102 is open.
A nozzle opening 117 is formed at a position facing each groove 102 of the nozzle plate 115.

The cover plate 107 is located on the side of the piezoelectric ceramic plate 101 opposite to the nozzle plate 115.
The wiring board 120 is fixed to the surface on the opposite side to the above. A wiring pattern 122 connected to each electrode 105 by a bonding wire 121 or the like is formed on the wiring substrate 120, and a driving voltage can be applied to the electrode 105 via the wiring pattern 122.

In the head chip configured as described above,
When ink is filled in each groove 102 from the ink supply port 112 and a predetermined driving electric field is applied to the side walls 103 on both sides of the predetermined groove 102 via the electrode 105, the side wall 103 is deformed and the inside of the predetermined groove 102 is formed. Changes the volume of the
The ink in the groove 102 is discharged from the nozzle opening 117.

For example, as shown in FIG.
In the case where ink is ejected from the nozzle opening 117 corresponding to, a positive drive voltage is applied to the electrodes 105a and 105b in the groove 102a, and the electrodes 1 facing each other are applied.
05c and 105d are grounded. This allows
A driving electric field in a direction toward the groove 102a acts on the side walls 103a and 103b, and this is
If the polarization direction is orthogonal to the direction 1, the side walls 103a and 103b are deformed in the direction of the groove 102a due to the piezoelectric thickness-shear effect, the volume in the groove 102a is reduced, the pressure is increased, and ink is ejected from the nozzle opening 117.

When conductive ink such as aqueous ink is used for such a head chip, one groove 102a
The adjacent electrodes 105a and 105b provided on the inner side walls 103a and 103b become conductive, and the potential difference disappears, so that the side walls 103a and 103b do not deform and there is a problem that ink cannot be ejected.

For this reason, every other groove that communicates with the nozzle opening and is used for discharging ink is provided, and the groove that communicates with the nozzle opening and is used for discharging ink is used as a chamber and ink is not used for discharging ink. Unfilled grooves are used as dummy chambers. Then, the electrodes provided on the inner surfaces of both side walls of the chamber are used as common electrodes having the same potential in all chambers, and the electrodes on the outer surfaces of both side walls of the chamber are used as individual electrodes for selectively driving the chamber. There has been proposed a head chip for ejecting ink by applying an electric field to the side walls on both sides of the head chip.

[0011]

However, in the conventional head chip, individual electrodes in the dummy chamber are routed three-dimensionally, and a wiring pattern connected to the electrodes is formed on the piezoelectric ceramic plate by laser processing. Therefore, there is a problem in that the connected wiring is short-circuited with the wiring pattern of another electrode, and normal driving cannot be performed.

[0012] In addition, in three-dimensional routing and laser processing, there is a problem that manufacturing time and manufacturing cost increase.

In view of such circumstances, the present invention provides a head chip and a method of manufacturing the same, in which the electrodes and wiring in the chamber and the dummy chamber are easily and securely connected to reduce the number of manufacturing steps and the manufacturing cost. The task is to provide.

[0014]

According to a first aspect of the present invention, a chamber communicating with a nozzle opening and a dummy chamber not filled with ink are alternately arranged side by side on a substrate. In a head chip, electrodes are provided on both side walls of a dummy chamber, electrodes in the chamber are used as common electrodes, and electrodes in each dummy chamber are used as individual electrodes to apply a driving electric field to both side walls of each chamber. The surface of the dummy chamber and the chamber that is shorter than the dummy chamber is opened, and at the rear end of the dummy chamber on both sides of the chamber opposite to the nozzle opening, each chamber has A wiring pattern for individual electrodes for mutually conducting the corresponding individual electrodes to each other is provided, and at the rear end of the chamber. In the head chip, wherein a common electrode wiring pattern communicating with each of the common electrodes of the chamber are provided.

According to a second aspect of the present invention, in the first aspect, on the surface of the substrate where the chamber is opened, the substrate is provided across the dummy chamber in a direction orthogonal to a longitudinal direction of the dummy chamber. A head chip having a groove, wherein the wiring pattern for an individual electrode is provided in the groove.

According to a third aspect of the present invention, in the second aspect, a stepped portion on which the individual electrode wiring pattern is not provided is provided at both edges in the width direction of the groove. Characteristic head chip.

According to a fourth aspect of the present invention, in any one of the first to third aspects, a lead wiring is connected to the individual electrode wiring pattern and the common electrode wiring pattern by an anisotropic conductive adhesive. The head chip is characterized in that:

According to a fifth aspect of the present invention, in the head chip according to any one of the first to fourth aspects, the individual electrode wiring pattern and the individual electrode are integrally formed. is there.

According to a sixth aspect of the present invention, there is provided a head chip according to any one of the first to fifth aspects, wherein the ink is a conductive ink.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the substrate is formed of a piezoelectric ceramic plate, and the chamber is formed by forming a groove in the piezoelectric ceramic plate. The head chip is characterized in that:

According to an eighth aspect of the present invention, in the head chip according to the seventh aspect, the piezoelectric ceramic plate has one direction of polarization in a depth direction of the chamber.

According to a ninth aspect of the present invention, chambers communicating with the nozzle openings and dummy chambers not filled with ink are alternately arranged on the substrate, and electrodes are provided on both side walls of each chamber and the dummy chamber. In a method of manufacturing a head chip in which an electrode in the chamber is used as a common electrode and electrodes in each dummy chamber are used as individual electrodes and a driving electric field is applied to both side walls of each chamber, a resist layer is formed on one surface of the substrate. Forming a first opening in the resist layer at a position to be one end of the dummy chamber and a second opening between the one end of the chamber and the first opening, Forming the chamber and the dummy chamber on a substrate;
The electrode is formed on the inner surfaces of the chamber and the dummy chamber, and a wiring pattern for an individual electrode which is continuous with the individual electrode on the substrate exposed through the first opening and on the substrate exposed through the second opening Forming a common electrode and a continuous wiring pattern for the common electrode, and removing the resist layer.

According to a tenth aspect of the present invention, in the ninth aspect, after the step of forming the chamber and the dummy chamber, the step of orthogonally intersecting the longitudinal direction of the dummy chamber and straddling the dummy chamber. In the method for manufacturing a head chip, the step of forming a groove in which the individual electrode wiring pattern is formed and the step of forming the individual electrode wiring pattern are performed in the groove.

According to an eleventh aspect of the present invention, in the tenth aspect, after the step of forming the individual electrode wiring pattern, the edges of the groove in both sides in the width direction are cut out to form the individual electrode wiring pattern. A method of manufacturing a head chip, further comprising a step of forming a step portion from which a pattern is deleted.

According to a twelfth aspect of the present invention, in any one of the ninth to eleventh aspects, after the step of forming the electrode, the individual electrode wiring pattern and the individual electrode wiring pattern, The method for manufacturing a head chip further comprises a step of connecting a lead wiring to each of the wiring pattern and the wiring pattern for an individual electrode with an anisotropic conductive adhesive.

According to a thirteenth aspect of the present invention, in any one of the ninth to twelfth aspects, the substrate is made of a piezoelectric ceramic plate whose polarization direction is one direction toward the depth direction of the chamber. And a method of manufacturing a head chip.

In the present invention, the conduction of the common electrode can be ensured by the common electrode wiring pattern, and the wiring can be easily and reliably connected to the individual electrode and common electrode wiring patterns.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments.

(Embodiment 1) FIG. 1 is an exploded perspective view of a head chip unit according to an embodiment, FIG. 2 is an exploded perspective view of a head chip, and FIG. 3 is a piezoelectric ceramic plate wiring pattern portion. It is a perspective view.

As shown in FIG. 1, a head chip unit 10 of the present embodiment comprises a head chip 11 and a base plate 12 provided on one surface of the head chip 11.
And a head cover 13 provided on the other surface side of the head chip 11, and a wiring board 30 on which a drive circuit 31 for driving the head chip 11 is mounted.

First, the head chip 11 will be described in detail. As shown in FIG. 2, the piezoelectric ceramic plate 16 constituting the head chip 11 is composed of a piezoelectric ceramic plate 16 whose polarization direction is one direction toward the thickness direction. Chambers 17, which are chambers, and dummy chambers 18 not filled with ink are alternately provided, being partitioned by side walls 19.

One end in the longitudinal direction of the chamber 17 extends to one end of the piezoelectric ceramic plate 16, and the other end does not extend to the other end, and the depth is gradually reduced.

The dummy chamber 18 has, for example, an individual electrode 20b formed by oblique deposition in a known manner at an arbitrary depth such that it is not short-circuited at the bottom of the dummy chamber. , And the other end is also formed to the other end surface. That is, the dummy chamber 18 is formed along the longitudinal direction of the piezoelectric ceramic plate 16.

The chamber 17 and the dummy chamber 18 are formed on the piezoelectric ceramic plate 16 by a disk-shaped die cutter, and the portion where the depth of the chamber 17 is gradually reduced is formed by the shape of the die cutter. .

The chamber 17 and the dummy chamber 1
An electrode 20 for applying a driving electric field is formed on a side wall 19 that partitions the chamber 8 over the entire inner surface of the chamber 17 and on the opening side of the dummy chamber 18 in the longitudinal direction.

Of the electrodes 20, the electrode 20 provided on the inner surface of the chamber 17 conducts when the ink in the chamber 17 is a conductive ink such as a water-based ink. The common electrode 20a has the same potential in each chamber 17 in order to prevent the generation of bubbles and the deterioration due to the electrolysis.

The dummy chamber 18 of the electrodes 20
The electrodes 20 provided in the longitudinal direction on the opening side of the individual electrodes 20 b are individual electrodes 20 b capable of providing an independent drive signal for each chamber 17. In the present embodiment, the individual electrodes 20b are not provided on the bottom surface of the dummy chamber 18 and are separated in the dummy chamber 18.

The electrode 20 composed of the common electrode 20a and the individual electrode 20b can be formed by, for example, known oblique evaporation.

Further, on the surface of the piezoelectric ceramic plate 16 where the chambers 17 and the dummy chambers 18 are open, individual electrode wirings for electrically connecting the individual electrodes 20a on the chamber 17 side sandwiched between the adjacent dummy chambers 18 are provided. A pattern 81 and a common electrode wiring pattern 80 provided near the shallow rear end of the chamber 17 so as to be electrically connected to each common electrode 20a in the chamber 17 and not to the individual electrode wiring pattern 81 are provided. Has been.

The common electrode wiring pattern 80 and the individual electrode wiring pattern 81 are connected to the drive circuit 31 on the wiring board 30 via bonding wires 28,
The common electrode 20a is set to the same potential at the GND level by a wiring circuit (not shown) on the wiring board 30, and an independent drive signal is applied to the individual electrode 20b.

The common electrode wiring pattern 80 and the individual electrode wiring pattern 81 are formed simultaneously with the electrode 20 by covering the surface with a mask pattern such as a resist layer or a dry film when forming the electrode 20 by oblique evaporation. can do.

The surface of the piezoelectric ceramic plate 16 where the chamber 17 opens is provided with an ink chamber plate 21.
Are joined. The ink chamber plate 21 has a common ink chamber 22 serving as a recess communicating only with the shallow end of each chamber 17, and an ink supply port 23 penetrating from the bottom of the common ink chamber 22 to the opposite side to the chamber 17. And

A sealing plate 24 having a through-hole 24a in a region facing each chamber 17 is sandwiched between the common ink chamber 22 of the ink chamber plate 21 and the piezoelectric ceramic plate 16, and the common ink chamber The ink from the chamber 22 is supplied only to the chamber 17 through the through hole, and the ink is not supplied to the inside of the dummy chamber by the sealing plate 24.

As described above, since the ink is not filled in the dummy chamber 18, the individual electrodes 20b facing each other in the dummy chamber 18 can be driven individually for each chamber 17 without short-circuiting.

The size of the ink chamber plate in which the common ink chamber is formed is such that the rear end of the piezoelectric ceramic plate 16 is exposed so that the individual electrode connection wiring pattern and the common electrode wiring pattern of the piezoelectric ceramic plate are exposed. It is shorter than the rear end.

Here, in this embodiment, each chamber 17
Are divided into groups corresponding to inks of black (B), yellow (Y), magenta (M), and cyan (C), and four common ink chambers 22 and four ink supply ports 23 are provided. Has been.

The ink chamber plate 21 can be formed of a ceramic plate, a metal plate, or the like. However, in consideration of deformation after bonding with the piezoelectric ceramic plate 16, a ceramic plate having an approximate coefficient of thermal expansion is used. Is preferred.

A nozzle plate 25 is joined to an end face of the joined body of the piezoelectric ceramic plate 16 and the ink chamber plate 21 where the chamber 17 and the dummy chamber 18 are open. A nozzle opening 26 is formed at a position facing the nozzle chamber 25, and the dummy plate 18 is formed by the nozzle plate 25.
Is sealed.

In this embodiment, the nozzle plate 25 is
The area of the end face where the chamber 17 and the dummy chamber 18 of the joined body of the piezoelectric ceramic plate 16 and the ink chamber plate 21 are open is larger. The nozzle plate 25 is formed by forming a nozzle opening 26 in a polyimide film or the like using, for example, an excimer laser device. Although not shown, a water-repellent film having a water-repellent property is provided on the surface of the nozzle plate 25 facing the print target in order to prevent ink from adhering.

In the present embodiment, a nozzle support plate 27 is disposed around the end of the joined body of the piezoelectric ceramic plate 16 and the ink chamber plate 21 where the chamber 17 and the dummy chamber 18 are open. I have. The nozzle support plate 27 is joined to the outside of the joined body end surface of the nozzle plate 25 to stably hold the nozzle plate 25.

As described above, in the present embodiment, the chamber 17 of the piezoelectric ceramic plate 16 and the dummy chamber 1
8 is connected to the chamber-side individual electrode 20b of the adjacent dummy chamber 18 and the drive circuit 3
Bonding wire 28 to which the drive signal from 1 is applied
Are connected to the common electrode 20a in the chamber 17 and the common electrode wiring pattern 80 to which the bonding wires 28 connected to the same potential on the wiring board 30 are connected. This eliminates the need for three-dimensional processing and the like, and can reduce manufacturing costs. The common electrode wiring pattern 80 and the individual electrode wiring pattern 81 are connected to the common electrode 20a and the individual electrode 2 respectively.
Ob can be formed at the same time as the formation of Ob, so that the number of manufacturing steps can be reduced and manufacturing cost can be reduced.

Here, a method for manufacturing the head chip 11 of the present embodiment will be described in detail. FIG. 4 is a perspective view showing a method of manufacturing a piezoelectric ceramic plate wiring pattern portion.

First, as shown in FIG. 4A, a resist having a first opening 91 at a position where the common electrode wiring pattern 80 and the individual electrode wiring pattern 81 are formed on one surface of the piezoelectric ceramic plate 16. A layer 90 is formed.

The method of forming the resist layer 90 having the first opening 91 is not particularly limited. For example, a dry film having the first opening 91 may be attached. The first opening 91 may be provided by patterning.

Next, as shown in FIG. 4B, a chamber 17 and a dummy chamber 18 are formed in the piezoelectric ceramic plate 16. In this embodiment, the resist layer 90 is formed by a disk-shaped die cutter from the side. That is, the piezoelectric ceramic plate 1 is
6 was ground together with the resist layer 90, thereby forming a chamber 17 and a dummy chamber 18, and a second opening 92 corresponding to the chamber 17 and the dummy chamber 18 in the resist layer 90.

Next, as shown in FIG. 4C, an electrode layer 95 serving as the electrode 20 is formed on the exposed surface of the piezoelectric ceramic plate 16 on the resist layer 90 side and on the resist layer 90.

In this embodiment, the electrode layer 95 is formed, for example, by obliquely vapor-depositing the piezoelectric ceramic plate 16 from the resist layer 95 side. By this oblique deposition, the electrode layer 95 is formed on the entire surface of the resist layer 90 and on the exposed surface of the piezoelectric ceramic plate 16 facing the first opening 91 of the resist layer 90. Also,
The chamber 17 is also formed on the side surfaces of the first and second openings 91 and 92 of the resist layer 90 and further formed shallowly.
And over the entire length of the inner surface of the dummy chamber 18 on the opening side of the dummy chamber 18.

Thereafter, by removing (lifting off) the resist layer 90, the electrode layer 95 remaining on the inner surface of the chamber 17 becomes the common electrode 20a and the electrode remaining on the inner surface of the dummy chamber 18 as shown in FIG. The layer 95 becomes the individual electrode 20b. The electrode layer 95 formed on the surface of the piezoelectric ceramic plate 16 exposed by the first opening 91 of the resist layer 90 is connected to the common electrode wiring pattern 8.
0 and the individual electrode wiring pattern 81.

As described above, the electrode 20 including the common electrode 20a and the individual electrode 20b and the common electrode wiring pattern 8
0 and the wiring pattern 81 for individual electrodes are simultaneously formed, so that the common electrode 20a and the wiring pattern 80 for common electrodes, and the individual electrode 20b and the wiring pattern 81 for individual electrodes are formed.
Can be formed so as to be easily and surely conducted. Further, of the individual electrodes 20 b formed on the inner surface of the adjacent dummy chamber 18, the chamber 17 sandwiched between
Since the individual electrodes 20b on the side can be easily and reliably conducted on the piezoelectric ceramic plate 16, the wiring circuit on the wiring board 30 can be simplified.

Further, as described above, the common electrode wiring pattern 80 and the individual electrode wiring pattern 81 are
By patterning, the alignment of the common electrode wiring pattern 80 and the individual electrode wiring pattern 81 is facilitated, and the manufacturing process can be simplified.

Thereafter, the ink chamber plate 21 is bonded to the surface of the piezoelectric ceramic plate 16 on the side where the common electrode wiring pattern 80 and the individual electrode wiring pattern 81 are formed, so that the sealing plate 24 is sandwiched therebetween. And a nozzle plate 25 on one end face where the dummy chamber 18 is opened.
To join. Next, the outer surface of the nozzle plate 25, the piezoelectric ceramic plate 16 and the ink chamber plate 21
The head chip 11 is completed by joining the nozzle support plate 27 to the joined body.

Hereinafter, the head chip unit 10 of this embodiment using such a head chip 11 will be described. FIG. 5 is a perspective view showing an example of a manufacturing process of the head chip unit.

As shown in FIGS. 1 and 5, the head chip unit 10 of the present embodiment comprises a common electrode wiring pattern 80 and an individual electrode wiring pattern formed on the piezoelectric ceramic plate 16 constituting the head chip 11. 81
Is bonded to the bonding wire 28 by wire bonding.

A nozzle support plate 27 of a joined body of the piezoelectric ceramic plate 16 and the ink chamber plate 21 is provided.
At the rear end side, an aluminum base plate 12 on the piezoelectric ceramic plate 16 side and an ink chamber plate 2
The head cover 13 on one side is assembled. The base plate 12 and the head cover 13 are connected to the base plate 1
2 the locking shaft 1 of the head cover 13 in the locking hole 12a.
3a are fixed by engaging with each other, and they hold the joined body of the piezoelectric ceramic plate 16 and the ink chamber plate 21 therebetween. The head cover 13 includes the ink chamber plate 2
An ink introduction path 29 communicating with each of the one ink supply ports 23 is provided.

As shown in FIG. 5A, a wiring substrate 30 is fixed on the base plate 12 protruding from the rear end of the piezoelectric ceramic plate 16. Here, a drive I for driving the head chip 11 is provided on the wiring substrate 30.
A drive circuit 31 having C is mounted, and the drive circuit 31 and the bonding wires 28 are connected by wire bonding. Thus, the head chip unit 10 of FIG. 5B is completed.

Such a head chip unit 10
The head unit 70 is formed by being assembled to a tank holder that holds the ink cartridge.

FIG. 6 shows an example of this tank holder. The tank holder 60 shown in FIG. 6 has a substantially box shape with one side opened, and is capable of detachably holding an ink cartridge. Further, on the upper surface of the bottom wall, there is provided a connecting portion 61 for connecting to an ink supply port which is an opening formed in the bottom of the ink cartridge. The connecting portion 61 is provided for each ink of each color of black (B), yellow (Y), magenta (M), and cyan (C), for example. An ink channel (not shown) is formed in the communication portion 61, and a filter 6
2 are provided. The ink flow paths formed in the connecting portion 61 are formed so as to communicate with the back side of the bottom wall, and each ink flow path is not shown in the flow path substrate 63 provided on the back side of the tank holder 60. It communicates with a head connection port 64 opened on the side wall of the flow path substrate 63 via the ink flow path. The head connection port 64 is opened on the side surface of the tank holder 60, and a head chip unit holding portion 65 for holding the above-described head chip unit 10 is provided at the bottom of the side wall. The head chip unit holding portion 65 includes a substantially U-shaped surrounding wall 66 surrounding the drive circuit 31 provided on the wiring board 30, and a base plate 12 of the head chip unit 10 in the surrounding wall 66. Further, an engaging shaft 67 that engages with the locking hole 12b provided in the wiring board 30 is provided upright.

Therefore, the head chip unit 10 is mounted on the head chip unit holding section 65, and the head unit 70 is completed. At this time, the ink introduction path 29 formed in the head cover 13 is connected to the head connection port 64 of the flow path substrate 63. As a result, the ink introduced from the ink cartridge through the connecting portion 61 of the tank holder 60 is introduced into the ink introduction path 29 of the head chip unit 10 through the ink flow path in the flow path substrate 63, and the common ink chamber 22 and the chamber 17 are filled.

The head unit 70 thus formed is used, for example, mounted on a carriage of an ink jet recording apparatus. FIG. 7 schematically shows an example of this use mode.

As shown in FIG. 7, the carriage 71 is mounted on a pair of guide rails 72a and 72b so as to be movable in the axial direction. The carriage 71 is provided at one end of the guide rail 72 and is connected to the carriage drive motor 73. Pulley 7
4a and a pulley 74b provided on the other end side, and are conveyed via a timing belt 75 stretched. On both sides of the carriage 71 in a direction orthogonal to the transport direction, a pair of transport rollers 76 and 77 are provided along guide rails 72a and 72b, respectively. These transport rollers 76 and 77 transport the recording medium S below the carriage 71 in a direction orthogonal to the transport direction of the carriage 71.

The above-mentioned head unit 70 is mounted on the carriage 71, and the above-mentioned ink cartridge can be detachably attached to the head unit 70.

According to such an ink jet recording apparatus, the carriage 71 is scanned in the direction perpendicular to the feeding direction while feeding the recording medium S, whereby characters and images are printed on the recording medium S by the head chip 11. Can be recorded.

(Embodiment 2) FIG. 8 is a perspective view of a piezoelectric ceramic plate wiring pattern portion 16A according to Embodiment 2. FIG.

As shown in the figure, the piezoelectric ceramic plate 16A of the present embodiment has the chamber 17 in a direction orthogonal to the longitudinal direction of the chamber 17 on the surface where the chamber 17 opens.
A jumper groove 93 is formed straddling the end of the jumper.

The individual electrode wiring patterns 81 A for mutually connecting the individual electrodes 20 b on the chamber 17 side sandwiched between the individual electrodes 20 b in the adjacent dummy chamber 18 are provided on the inner surface of the jumper groove 93. Has been.

Although not shown, the anisotropic conductive adhesive (A) is applied to the common electrode wiring pattern 80 and the individual electrode wiring pattern 81A on the piezoelectric ceramic plate 16A.
A flexible cable connected to the drive circuit 31 via the CF) is connected.

As described above, the wiring patterns 81A for individual electrodes are used.
Is provided on the inner surface of the jumper groove 93, even if the flexible cable is connected by an anisotropic conductive adhesive, it is possible to prevent a short circuit of the flexible cable.

Here, a method for manufacturing such a piezoelectric ceramic plate 16A will be described in detail. FIG. 9 is a perspective view of a head chip showing a method for manufacturing a piezoelectric ceramic plate wiring pattern portion according to the second embodiment.

First, as shown in FIG. 9A, a first opening 91A is formed at a position on the piezoelectric ceramic plate 16A to be the common electrode wiring pattern 80 and at a position to be a part of the individual electrode wiring pattern 81A. Resist layer 90A having
Is provided on the piezoelectric ceramic plate 16A.

Next, as shown in FIG. 9B, a chamber 17 and a dummy chamber 18 are formed in the piezoelectric ceramic plate 16A, and a jumper groove 93 is formed.

The chamber 17 and the dummy chamber 18 can be formed by a disk-shaped die cutter in the same manner as in the first embodiment, and the second position is formed at a position of the resist layer 90A facing the chamber 17 and the dummy chamber 18. Opening 92 is formed.

The jumper groove 93 is also formed by simultaneously grinding the resist layer 90A with a disk-shaped die cutter as in the case of the chamber 17 and the dummy chamber 18. As a result, a third opening 94 is formed in the resist layer 90A at a position facing the jumper groove 93.

Next, as shown in FIG. 9C, the electrode layer 9 is formed by oblique deposition on the surface of the piezoelectric ceramic plate 16A exposed on the resist layer 90A side and on the resist layer 90A.
5 is formed.

In the formation of the electrode layer 95 by the oblique deposition, the electrode layer 95 is formed in all regions on the resist layer 90A, and the first openings 91A of the resist layer 90A are formed.
Is formed on the exposed surface of the piezoelectric ceramic plate 16A opposed to. As in the first embodiment, the electrode layer 95 is formed on the side surface on the opening side of the chamber 17 in the longitudinal direction, on both side surfaces of the dummy chamber 18, and further, on the inner surface of the jumper groove 93. Layer 95 is formed.

At this time, the electrode layer 95 in the chamber 17 and the electrode layer 95 in the jumper groove 93 are formed integrally and continuously, and the electrode layer 95 in the dummy chamber 18 and the electrode layer of the first opening 91A are formed. 95 are integrally formed continuously.

Thereafter, by removing the resist layer 90A, the electrode layer 95 remaining on the inner surface of the chamber 17 becomes the common electrode 20a and the electrode layer 95 remaining on the inner surface of the dummy chamber 18 is formed as shown in FIG. Individual electrode 20b
And the electrode layer 95 in the jumper groove 93 becomes the individual electrode wiring pattern 81A.

The electrode layer 95 formed on the surface exposed by the first opening 91A of the piezoelectric ceramic plate 16A remains on the piezoelectric ceramic plate 16A to form the common electrode wiring pattern 80 and the individual electrode wiring. It becomes a part of the pattern 81A.

In the present embodiment, the individual electrode wiring pattern 81A is formed over the entire inner surface of the jumper groove 93. However, the present invention is not limited to this. A step where the individual electrode wiring pattern 81A is not formed may be provided at the edge in the longitudinal direction. Such an example is shown in FIG. FIG. 10 is a perspective view showing another example of the piezoelectric ceramic plate wiring pattern portion according to the second embodiment.

The piezoelectric ceramic plate 16B shown in FIG. 10A is formed by obliquely depositing the electrode 20 and the common electrode wiring pattern 80 on the piezoelectric ceramic plate 16A.
After forming the individual electrode wiring pattern 81A, the edge of the jumper groove 93 is ground with a disc-shaped die cutter or the like wider than the width of the jumper groove 93 to provide a stepped portion 93a. .

The step 93a is formed by the resist layer 9
Wiring pattern 8 for individual electrode before or after removing 0A
There is no particular limitation as long as it is after forming 1A.

The piezoelectric ceramic plate 16C shown in FIG. 10B has a tapered step 93b formed at the edge of the jumper groove 93, and is similar to the step 93a shown in FIG. 10A. Wiring pattern 81A for individual electrodes
It may be formed after forming.

The step portion 93a or 93b allows the common electrode wiring pattern 80 and the individual electrode wiring pattern 8 to be formed.
When a flexible cable is connected to 1A via an anisotropic conductive adhesive, a short circuit between the individual electrode wiring pattern 81A in the jumper groove 93 and the flexible cable connected to the common electrode wiring pattern 80 is reliably prevented. can do.

(Other Embodiments) As described above, Embodiments 1 and 2
However, the present invention is not limited to such a configuration.

In Embodiments 1 and 2 described above, the chamber 17 is formed by forming grooves in the piezoelectric ceramic plates 16, 16A, 16B, and 16C. However, the present invention is not limited to this. The chambers may be defined by juxtaposing side walls made of.

[0095]

As described above, according to the present invention, a wiring pattern for an individual electrode, which electrically connects individual electrodes corresponding to respective chambers on a substrate, and a wiring pattern for a common electrode, which is electrically connected to each of the common electrodes, on the substrate. By providing
Dimensional processing and the like are not required, and manufacturing costs can be reduced. Further, by forming the wiring pattern at the same time as the electrodes, alignment of the wiring pattern becomes easy, and conduction between the wiring pattern and the electrodes can be easily and reliably achieved.

Furthermore, when the flexible cable is connected via an anisotropic conductive adhesive, the wiring pattern surface and the jumper pattern surface of the individual electrode are arranged on different planes, so that the short circuit of the connected flexible cable is ensured. Can be prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a head chip unit according to Embodiment 1 of the present invention.

FIG. 2 is a perspective view of a head chip according to Embodiment 1 of the present invention.

FIG. 3 is a perspective view of a piezoelectric ceramic plate wiring pattern portion according to the first embodiment of the present invention.

FIG. 4 is an essential part perspective view showing a manufacturing step of a piezoelectric ceramic plate wiring pattern portion according to Embodiment 1 of the present invention;

FIG. 5 is a perspective view showing a step of assembling the head chip unit according to the first embodiment of the present invention.

FIG. 6 is a perspective view illustrating an assembling process of the head unit according to the first embodiment of the present invention.

FIG. 7 is a schematic perspective view of the ink jet recording apparatus according to the first embodiment of the present invention.

FIG. 8 is a perspective view of a piezoelectric ceramic plate wiring pattern portion according to Embodiment 2 of the present invention.

FIG. 9 is an essential part perspective view showing a manufacturing step of a piezoelectric ceramic plate wiring pattern portion according to Embodiment 2 of the present invention;

FIG. 10 is a main part perspective view showing another example of a piezoelectric ceramic plate wiring pattern portion according to Embodiment 2 of the present invention.

FIG. 11 is a perspective view showing an outline of a head chip according to a conventional technique.

FIG. 12 is a cross-sectional view illustrating an outline of a head chip according to a conventional technique.

FIG. 13 is a cross-sectional view showing an outline of a head chip according to a conventional technique.

[Explanation of symbols]

Reference Signs List 10 head chip unit 11 head chip 12 base plate 13 head cover 16, 16A, 16B, 16C piezoelectric ceramic plate 17 chamber 18 dummy chamber 19 side wall 20 electrode 20a common electrode 20b individual electrode 21 ink chamber plate 22 common ink chamber 23 ink supply port 24 sealing Stop plate 24a Through hole 25 Nozzle plate 26 Nozzle opening 28 Bonding wire 30 Wiring board 31 Drive circuit 60 Tank holder 70 Head unit 80 Common electrode wiring pattern 81, 81A Individual electrode wiring pattern 90, 90A Resist layer 93 Jumper groove 93a, 93b Step 95 Electrode layer

Claims (13)

[Claims] 1. A chamber communicating with a nozzle opening and a dummy chamber not filled with ink are alternately arranged on a substrate, electrodes are provided on both side walls of each chamber and the dummy chamber, and the electrodes in the chamber are shared. In a head chip which applies a driving electric field to both side walls of each chamber as electrodes and electrodes in each dummy chamber as individual electrodes, the dummy chamber and the chamber shorter than the dummy chamber are formed on the surface of the substrate. At the rear end of the dummy chamber on both sides of the chamber opposite to the nozzle opening on both sides of the chamber, there are provided individual electrode wiring patterns for electrically connecting the individual electrodes corresponding to each chamber to each other. At the rear end of the chamber, a common electrode arrangement communicating with each of the common electrodes in the chamber is provided. A head chip wherein the pattern is provided. 2. A surface of the substrate on which the chamber is open has a groove provided across the dummy chamber in a direction orthogonal to a longitudinal direction of the dummy chamber, and the wiring pattern for the individual electrode is formed on the surface of the substrate. 2. The head chip according to claim 1, wherein the head chip is provided in the groove. 3. The head chip according to claim 2, wherein a step portion on which the individual electrode wiring pattern is not provided is provided at an edge portion on both sides in the width direction of the groove. 4. The wiring pattern for an individual electrode and the wiring pattern for a common electrode, wherein a lead wiring is connected by an anisotropic conductive adhesive.
4. The head chip according to any one of items 1 to 3, 5. The head chip according to claim 1, wherein said individual electrode wiring pattern and said individual electrode are integrally formed. 6. The head chip according to claim 1, wherein the ink is a conductive ink. 7. The head chip according to claim 1, wherein the substrate is formed of a piezoelectric ceramic plate, and the chamber is formed by forming a groove in the piezoelectric ceramic plate. . 8. The head chip according to claim 7, wherein the polarization direction of the piezoelectric ceramic plate is one direction toward a depth direction of the chamber. 9. A substrate, wherein chambers communicating with nozzle openings and dummy chambers not filled with ink are alternately arranged on the substrate, electrodes are provided on both side walls of each chamber and the dummy chamber, and the electrodes in the chambers are shared. A method of manufacturing a head chip in which a driving electric field is applied to both side walls of each chamber as electrodes and electrodes in each dummy chamber as individual electrodes, wherein a resist layer is formed on one surface of the substrate, and the resist layer is formed on the resist layer. Forming a first opening continuous with a position to be one end of the dummy chamber and a second opening between each end of the chamber and the first opening; and forming the chamber and the dummy in the substrate. Forming a chamber, forming the electrodes on inner surfaces of the chamber and the dummy chamber, and forming the electrodes by the first opening. Forming a wiring pattern for an individual electrode continuous with the individual electrode on the substrate and a wiring pattern for a common electrode continuous with the common electrode on the substrate exposed through the second opening; Removing the layer. 10. After the step of forming the chamber and the dummy chamber, a groove in which the wiring pattern for the individual electrode is formed is formed so as to be orthogonal to the longitudinal direction of the dummy chamber and to straddle the dummy chamber. The method according to claim 9, wherein in the step of forming the wiring pattern for the individual electrode, the wiring pattern is formed in the groove. 11. After the step of forming the wiring pattern for an individual electrode, a step of forming a deleted step portion of the wiring pattern for an individual electrode by notching edges on both sides in a width direction of the groove is further provided. The method for manufacturing a head chip according to claim 10, further comprising: 12. An anisotropic conductive adhesive is applied to each of the common electrode wiring pattern and the individual electrode wiring pattern after the step of forming the electrode, the individual electrode wiring pattern, and the individual electrode wiring pattern. 12. The method of manufacturing a head chip according to claim 9, further comprising a step of connecting a lead-out wiring by the method. 13. The method of manufacturing a head chip according to claim 9, wherein said substrate is formed of a piezoelectric ceramic plate whose polarization direction is one direction toward a depth direction of said chamber. .