JP2002359504A - Non-reciprocal circuit element and communication apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-reciprocal circuit element and a communication apparatus that ensure high reliability on connection of an electric circuit element, can change their designs with ease, and are suitable for mass production. SOLUTION: The non-reciprocal circuit element is constituted by a metal case, two permanent magnets, a center electrode assembly, a wiring board 30, matching capacitor elements C1 to C4, a resistance element R, an element mounting board 40, and so on. An adhesive resin 51 is filed between the wiring board 30 and the element mounting board 40 by using a dispenser, and the adhesive resin 51 is set. Hence, the wiring board 30 and the element mounting board 40 are bonded firmly to each other by the adhesive resin 51. Namely, the wiring board 30 and the element-mounting board 40 hold the matching capacitor elements C1 to C4 and the resistance element R, that are placed in between the boards. As the adhesive resin 51, thermosetting resin, ultraviolet curing resin, and visible light curing resign are used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-reciprocal circuit device and a communication device.

[0002]

2. Description of the Related Art A non-reciprocal circuit device described in JP-A-9-307315 has been conventionally known. As shown in FIG. 9, the non-reciprocal circuit device 200 includes a permanent magnet 207.
, Ferrite 202, center electrode plate 201, and wiring substrate 2
08, element mounting substrate 213 and matching capacitor element C
And a metal case 206 and the like.

[0003] A DC magnetic field is applied to the center electrode plate 201 by a permanent magnet 207. This center electrode plate 201
Are soldered and fixed to the wiring board 208. The matching capacitor element C is mounted on the element mounting substrate 213.
It is soldered and fixed. The wiring substrate 208 is put on the element mounting substrate 213 on which the matching capacitor element C is mounted. An electrode pattern (not shown) is formed on the lower surface of the wiring substrate 208, and is electrically connected to an electrode pattern 209 formed on the upper surface via a through hole 215. The electrode pattern formed on the lower surface of the wiring substrate 208 is soldered and fixed to the matching capacitor element C. The matching capacitor element C includes a wiring board 208 and an element mounting board 213.
Are accommodated in a concave portion 230 formed on the lower surface of the wiring substrate 208 and positioned.

[0004] Apart from this, a two-port isolator 300 as shown in FIG. 10 is also known. The isolator 300 includes two permanent magnets 309, a center electrode assembly 315, an element mounting board 340, a resistance element R, a matching capacitor element C, a metal case 305, and the like.

[0005] The center electrode assembly 315 is formed by winding center electrodes 321 and 322 composed of two conductive wires around a ferrite 320. Each center electrode 32
1, 322 is pulled out, and the electrode portion of the resistance element R,
It is electrically connected to the electrode of the matching capacitor element C. The other ends of the center electrodes 321 and 322 are connected to the ground electrode 3.
45 is electrically connected. That is, the center electrode 32
1,322 are electrically connected by drawing and soldering the ends of the matching capacitor element C and the resistance element R to the upper surface of the electrode section. The matching capacitor element C and the copper plate 330 are soldered to the ground electrode 345 and the input / output electrode 346 of the element mounting board 340.

[0006]

However, when the specification of the non-reciprocal circuit device 200 is changed, the shape and the arrangement position of the matching capacitor element C are also changed. It was necessary to change the shape and position of the recess 230 provided. In addition, even if the specifications are the same, if the arrangement of the matching capacitor element C is changed, the position of the concave portion 230 must be changed, so that the design of the wiring substrate 208 needs to be changed. Therefore, it is difficult to share the wiring substrate 208, which is one of the factors that increase the manufacturing cost. Further, with the demand for miniaturization of the non-reciprocal circuit device, the distance between the matching capacitor elements C decreases, and it becomes difficult to form the concave portion 230 in the wiring substrate 208 for each matching capacitor element C. I have.

In the case of the isolator 300, the central electrodes 321 and 322 are bent at precise positions and angles to electrically connect the matching capacitor elements C and the like, and the central electrodes 321 and 322 are used for matching. It has to be accurately arranged on the upper surface of the capacitor element C or the like. But,
The diameters of the center electrodes 321 and 322 are generally thin (representative value: 5).
0 μm), it takes time and effort to hold the center electrodes 321 and 322 at predetermined positions, and is not suitable for mass production. In addition, since the inductance and the like from the center electrode assembly 315 to the matching capacitor element C and the like change depending on the position and angle at which the center electrodes 321 and 322 are bent, there is a problem that the electrical characteristics of the isolator 300 vary greatly. .

Further, in order to apply a necessary DC magnetic field to the center electrode assembly 315, the center electrode assembly 315 needs to be disposed between the two permanent magnets 309. Permanent magnet 3
09 is arranged on the upper side of the matching capacitor element C and the like, so that a copper plate 330 having the same thickness as the thickness (representative thickness dimension: 0.2 to 0.3 mm) of the matching capacitor element C is arranged. The center electrode assembly 315 needs to be placed on the top. However, the relative positional relationship between the permanent magnet 309 and the center electrode assembly 315 fluctuated due to variations in the dimensions and arrangement positions of the copper plate 330, and it was difficult to obtain stable electrical characteristics.

Further, in the case of the non-reciprocal circuit element 200 and the isolator 300, the electric circuit elements such as the matching capacitor element C are fixed to the element mounting substrates 213 and 340 and the wiring substrate 208 only by soldering.
Therefore, the irreversible circuit element 2 is provided on the circuit board of the communication device.
When reflow-mounting the isolator 300, the isolator 300, and the like, the solder fixing between the matching capacitor element C and the substrates 208, 213, and 340 is temporarily re-melted by heat at the time of reflow, and the matching capacitor element C is removed. If the position of C is shifted or the matching capacitor element C is
There was a concern that it would fall out of 3,340.

An object of the present invention is to provide a non-reciprocal circuit device and a communication device which have high connection reliability of electric circuit devices, are easy to change in design, and are suitable for mass production.

[0011]

In order to achieve the above object, a nonreciprocal circuit device according to the present invention comprises: (a) a permanent magnet; and (b) a ferrite to which a DC magnetic field is applied by the permanent magnet. A center electrode assembly comprising: a plurality of center electrodes disposed on the ferrite; and (c) a center electrode assembly having a first main surface and a second main surface facing the first main surface. (D) mounting a wiring board on the first main surface;
An electric circuit element, (e) an element mounting board for mounting the electric circuit element on a surface, and (f) a metal case for housing the permanent magnet and the center electrode assembly,
(G) bonding the wiring substrate and the element mounting substrate with an adhesive resin provided between the wiring substrate and the element mounting substrate to form a second main surface of the wiring substrate and the element mounting substrate; And holding the electric circuit element disposed between the substrate and the substrate.

With the above arrangement, the electric circuit element is arranged between the wiring substrate and the element mounting substrate and is held by the wiring substrate and the element mounting substrate. It is not necessary to form a concave portion for accommodating therein. Further, since the wiring substrate and the element mounting substrate are bonded with an adhesive resin provided between the wiring substrate and the element mounting substrate, for example, the irreversible circuit element is mounted on a circuit board of a communication device. When reflow mounting, the solder that electrically connects the electric circuit element to the element mounting board or wiring board is temporarily re-melted by the heat during reflow, but the wiring board and element mounting The substrates are firmly connected by an adhesive resin. Therefore, the electric circuit element is stably sandwiched between the wiring board and the element mounting board.

The adhesive resin is preferably of a heat-curable type, an ultraviolet-curable type, or a visible light-curable type. The adhesive strength between the wiring substrate and the element mounting substrate is increased, and the vibration resistance and shock resistance can be further improved.

Further, by providing the cutout portion for resin injection at the end of the wiring substrate, it becomes easy to efficiently inject the adhesive resin with a dispenser or the like. Further, the injected resin is less likely to protrude from the end of the wiring substrate.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a nonreciprocal circuit device and a communication device according to the present invention will be described with reference to the accompanying drawings. In each of the embodiments, a lumped constant type isolator will be described as an example of a non-reciprocal circuit element, and the same components and portions will be denoted by the same reference numerals, without redundant description.

[First Embodiment, FIGS. 1 to 5] FIG. 1 is an exploded perspective view of an embodiment of a nonreciprocal circuit device according to the present invention. As shown in FIG. 1, the isolator 1 includes a metal case 5, two permanent magnets 9, a center electrode assembly 13, a wiring board 30, matching capacitor elements C1 to C4, and a resistance element R.
, A copper plate 50, an element mounting board 40, and the like.

The metal case 5 has an upper wall and four side walls. The metal case 5 is formed by punching and bending a metal plate.

The two permanent magnets 9 each have a substantially rectangular shape, and are arranged so that a DC magnetic field is formed in the direction from one permanent magnet 9 to the other permanent magnet 9.

The center electrode assembly 13 intersects a substantially rectangular microwave ferrite 20 and two conductors (for example, copper wire and silver wire) coated with an insulator so that the intersection angle becomes approximately 90 degrees. And the center electrodes 21 and 22 wound around the surface of the ferrite 20. Center electrode 2
One end of each of the terminals 1 and 22 is electrically connected to the ground electrode pattern 33 of the wiring substrate 30, and the other end is connected to the input / output electrode patterns 31 and 32 of the wiring substrate 30 by a method such as soldering. Thereby, the center electrode assembly 1
3 is fixed to the wiring substrate 30.

The wiring substrate 30 has input / output electrode patterns 31, 32 and a ground electrode pattern 33 formed on an upper surface 30a of a substantially rectangular substrate. I / O electrode pattern 3
1, 32 and the ground electrode pattern 33 are
As shown in FIG. 2, it extends to the lower surface 30b through the 0 side surface.

The matching capacitor elements C1 to C4 have connection electrodes on the upper and lower surfaces. Matching capacitor element C
The upper surfaces of the matching capacitor elements C2 and C4 have the upper surfaces of the input / output electrode patterns 31 formed on the lower surface 30b of the wiring substrate 30.
Are electrically connected to each other by a method such as soldering. The copper plate 50 is provided on the lower surface 30 b of the wiring substrate 30.
Is electrically connected to the ground electrode pattern 33 formed on the substrate.

The resistance element R has a substantially rectangular shape, and has connection electrodes on the left and right sides. One of the connection electrodes is electrically connected to the input / output electrode pattern 31 formed on the lower surface 30b of the wiring substrate 30, and the other of the connection electrodes is electrically connected to the input / output electrode pattern 32 formed on the lower surface 30b. Connected. The resistance element R is mounted on the element mounting substrate 40.
Is placed on the non-electrode pattern portion 49 of FIG. That is, the ground electrode pattern 45 and the resistance element R are in an electrically non-contact state. The thickness of the resistance element R is larger than the thickness of the matching capacitor elements C1 to C4 by the thickness of the electrode of the ground electrode pattern 45 of the element mounting board 40 and soldered to the ground electrode pattern 45. Is set to be larger by the total size of the solder thickness.

The element mounting substrate 40 has a substantially rectangular shape, and includes a ground electrode pattern 45 and an input / output electrode pattern 4.
3, 44 are formed on the surface. The input / output electrode pattern 43 has the lower electrode of the matching capacitor element C3, the input / output electrode pattern 44 has the lower electrode of the matching capacitor element C4, and the ground electrode pattern 45 has the matching capacitor elements C1 and C1. The electrode on the lower surface of C2 and the copper plate 50 are electrically connected by a method such as soldering.

The above components are assembled as follows. The matching capacitor elements C1 to C4, the copper plate 50, and the resistance element R are mounted on the element mounting board 40,
It is mounted by a method such as soldering. Further, the wiring board 3 is placed on the electric circuit elements C1 to C4, 50, and R.
0 is placed and electrically connected and fixed to the electric circuit elements C1 to C4, 50, R by a method such as soldering.

Thereafter, as shown in FIGS. 3 and 4, an adhesive resin 51 is injected between the wiring substrate 30 and the element mounting substrate 40 using a dispenser or the like, and is solidified. The bonding resin 51 is formed at three locations on the periphery of the wiring substrate 30. Thereby, the wiring substrate 30 and the element mounting substrate 4
0 is firmly joined by the adhesive resin 51. That is, the wiring substrate 30 and the element mounting substrate 40 hold the matching capacitor elements C1 to C4 and the resistance element R disposed therebetween.

As the bonding resin 51, it is preferable to use a heat curing type, an ultraviolet curing type, and a visible light curing type. As the material, epoxy, silicon, phenol, urea, polyethylene, polyamide, polyimide, vinyl, etc. are used. Since these adhesives have a strong adhesive force, the vibration resistance and shock resistance of the wiring substrate 30 and the element mounting substrate 40 can be further improved.

Next, the permanent magnet 9 and the center electrode assembly 13 are mounted on the upper surface 30a of the wiring substrate 30. The center electrode assembly 13 is disposed between the two permanent magnets 9, and a DC magnetic field is applied by the two permanent magnets 9. Therefore, since the center electrode assembly 13 and the permanent magnet 9 can be arranged on the wiring substrate 30 with high positional accuracy, the relative positional relationship between the permanent magnet 9 and the center electrode assembly 13 is stabilized, and the electrical characteristics can be improved. it can. Further, the center electrode assembly 13, the matching capacitor element C1 and the electrode pattern formed on the upper surface 30a and the lower surface 30b of the wiring substrate 30 are utilized.
C4 and the resistance element R are electrically connected, so that the inductance between the electric circuit elements is more stable than the conventional configuration in which the center electrodes 321 and 322 are bent and electrically connected.

Further, the metal case 5 is covered, and is joined to the ground electrode pattern 45 of the element mounting board 40 by soldering. Thus, the isolator 1 as shown in FIG. 5 is formed.

In the isolator 1 having the above configuration, the electric circuit elements C1 to C4, R are arranged between the wiring board 30 and the element mounting board 40, and the electric circuit elements C1 C4, R are sandwiched, so that it is not necessary to form a recess for accommodating the electric circuit elements C1 to C4, R in the wiring substrate 30. Then, even if the specifications of the isolator 1 are changed and the shapes and arrangement positions of the electric circuit elements C1 to C4 and R are slightly different, only the injection amount and the arrangement position of the bonding resin 51 need be changed. As a result, the wiring substrate 30 can be shared, and the manufacturing cost of the isolator 1 can be reduced.

Further, even if the solder for electrically connecting the electric circuit elements C1 to C4, R and the boards 30, 40 is temporarily re-melted by heating, the wiring board 30 and the element mounting board are not melted. Since 40 is firmly joined by the adhesive resin 51, the electric circuit elements C <b> 1 to C <b> 4, R are stably sandwiched between the wiring board 30 and the element mounting board 40. That is, there is no fear that the positions of the electric circuit elements C1 to C4 and R are shifted and the electric circuit elements C1 to C4 and R are displaced from the substrates 30 and 40. Therefore, defects such as circuit open and circuit short can be reduced, and the electric circuit element C
An isolator 1 having high connection reliability of 1 to C4 and R can be obtained. When the solder electrically connecting the electric circuit elements C1 to C4, R and the boards 30, 40 is temporarily re-melted, for example, the metal case 5 is soldered to the element mounting board 40. Or when the isolator 1 is reflow mounted on the circuit board of the communication device.

The wiring substrate 30 and the element mounting substrate 4
Since the bonding strength of 0 is reinforced not only by the solder but also by the bonding resin 51, the vibration resistance and the shock resistance of the isolator 1 are improved.

As is clear from the above description, the matching capacitor element C1 of the isolator 1 is electrically connected between the hot side of the center electrode 21 and the ground electrode pattern 45, and is connected to the center electrode 21. Connected in parallel. Similarly, the matching capacitor element C2 is electrically connected between the hot side of the center electrode 22 and the ground electrode pattern 45, and is connected in parallel to the center electrode 22. On the other hand, the matching capacitor element C3 is electrically connected between the hot side of the center electrode 21 and the input / output electrode pattern 43, and is connected in series to the center electrode 21. Similarly, the matching capacitor element C4 is electrically connected between the hot side of the center electrode 22 and the input / output electrode pattern 44, and is connected in series to the center electrode 22.

Here, matching capacitor elements (parallel matching capacitor elements) C1 and C2 connected in parallel,
The matching capacitor elements (series matching capacitor elements) C3 and C4 connected in series usually have a dielectric constant (ε
Single plate capacitor elements with equal r) are used.

In the two-port non-reciprocal circuit device (isolator 1), it is mainly the parallel matching capacitor elements C1 and C2 that determine the center frequency of the electrical characteristics. For example, if the required center frequency becomes lower, the capacitance of the parallel matching capacitor elements C1 and C2 increases. In such a case, the parallel matching capacitor elements C1,
If the dielectric constant of C2 is equal to that of series-matching capacitor elements C3 and C4, the size of parallel-matching capacitor elements C1 and C2 becomes large, and it may not be possible to store them in isolator 1 of about 3 mm square. Therefore, by increasing the permittivity of the parallel matching capacitor elements C1 and C2, the parallel matching capacitor elements C1 and C2 can be reduced to a size that can be accommodated in the isolator 1. As a result, it is possible to cope with a low frequency of several hundred MHz which cannot be coped with by the conventional technology.

Explaining using specific numerical values, the dielectric constant of the parallel matching capacitor elements C1 and C2 is, for example, about 110
And the dielectric constants of the series-matching capacitor elements C3 and C4 are set to about 90. As a result, the size (length × width × thickness) of the parallel matching capacitor elements C1 and C2 is about 0.5 mm.
8.times.0.5.times.0.2 mm, the capacitance is about 2.2 pF. The size of the series matching capacitor elements C3 and C4 is about 0.7 × 0.5 × 0.2 mm, and the capacitance is about 1.6 pF
Becomes By setting the dielectric constant of the parallel matching capacitor elements C1 and C2 to about 110, the capacitor element size can be reduced, and the isolator 1 having a predetermined size can be used.
Can be stored inside.

Further, for example, a single-plate capacitor element is formed by a single large ceramic substrate provided with thick film electrodes on the upper and lower sides.
It is manufactured by setting the vertical and horizontal dimensions so as to obtain a desired capacitance, and cutting out with a dicer or the like. Due to such a manufacturing method, burrs of small thick-film electrodes are likely to occur around the single-plate capacitor element. Therefore, when the single-plate capacitor element is soldered to the peripheral edge portion, the thick film electrode is easily peeled off from the peripheral edge portion after the soldering. Therefore, when the single-plate capacitor element is joined by soldering, the amount of solder is controlled so as not to fill the peripheral edge portion with the solder. However, when the size of the capacitor element is reduced, when soldering is performed in a region excluding the peripheral edge portion, the solder bonding area becomes extremely small, the solder bonding strength is weakened, and the reliability of the isolator 1 is reduced. . Therefore, reduce the dielectric constant,
Properly increasing the size of the capacitor element is extremely important from the viewpoint of improving reliability. Also, if the size of the capacitor element is small, it is difficult to control the amount of solder at the time of soldering, and the upper and lower electrodes of the capacitor element are likely to be short-circuited by solder. However, by appropriately increasing the size of the capacitor element, it becomes easier to control the amount of solder when soldering,
Short-circuiting due to solder hardly occurs. Therefore, a highly reliable isolator 1 can be provided.

In the two-port isolator 1, series matching capacitor elements C3 and C4 are used for impedance matching because of the circuit configuration, and are required as compared with the parallel matching capacitor elements C1 and C2. Capacitance is small. Accordingly, increasing the capacitor element size by making the dielectric constant of the series matching capacitor elements C3 and C4, which tend to have a smaller capacitance, smaller than the dielectric constant of the parallel matching capacitor elements C1 and C2 is as described above. Very effective for a reason.

Explaining using specific numerical values, the permittivity of the parallel matching capacitor elements C1 and C2 is set to, for example, about 40, and the permittivity of the series matching capacitor elements C3 and C4 is set to about 6. Thereby, the size (length × width × thickness) of the parallel matching capacitor elements C1 and C2 is about 0.5 ×
0.45 × 0.2 mm, the capacitance is about 0.6 pF. The size of the series matching capacitor elements C3 and C4 is about 0.5 × 0.45 × 0.2 mm, and the capacitance is about 0.12.
pF. By setting the dielectric constant of the series matching capacitor elements C3 and C4 to about 6, the element size can be increased appropriately.

Further, the parallel matching capacitor element C
And dielectric constant of C2 and capacitor elements C3 and C for series matching
By making the dielectric constants of the capacitor elements C4 different from each other, the sizes of the capacitor elements C1 to C4 can be made substantially the same regardless of the required frequency band. As a result, other internal components in the isolator 1 can be shared, the cost can be reduced by purchasing common components at a time, and the low-cost isolator 1 can be provided. Further, regardless of the frequency band, the capacitor element C1
When the sizes of C4 to C4 are substantially the same, the amount of solder at the time of soldering can be controlled to be constant, the amount of solder can be easily managed, and defective soldering can be reduced. In addition, common use of parts and common use of solder amount can unify production equipment, jigs and tools, and manufacturing conditions, thereby increasing production efficiency.

[Second Embodiment, FIGS. 6 and 7] The isolator of the second embodiment is the same as the isolator 1 of the first embodiment, except that a cutout for resin injection is provided at the end of the wiring substrate 30. It is similar to the one. 6 and 7
Shows an assembly in which the wiring substrate 30 and the element mounting substrate 40 used in the isolator of the second embodiment are joined with the bonding resin 51.

At the two corners on the left side and the center on the right side of the wiring substrate 30, cutout portions 36 for resin injection are formed. Therefore, the tip of the dispenser is cut obliquely from above the wiring substrate 30 into the resin injection notch 36.
And the adhesive resin 51 can be injected between the wiring substrate 30 and the element mounting substrate 40. That is,
The resin injection notch 36 facilitates the operation of injecting the bonding resin 51 by the dispenser, and allows an appropriate amount of the bonding resin 51 to be injected accurately and quickly, thereby reducing the number of steps and stabilizing the quality. Isolator 1
Can be obtained.

Further, even if the injection amount of the adhesive resin 51 is slightly larger than an appropriate amount, the excess resin can be absorbed in the space formed by the cutout portion 36 for resin injection. The adhesive resin 51 does not easily protrude from the end. Therefore, the metal case 5 is less likely to be caught by the protruding adhesive resin 51, and the metal case 5 and the element mounting board 40 are easily joined.

[Third Embodiment, FIG. 8] In the third embodiment,
A mobile phone will be described as an example of the communication device according to the present invention.

FIG. 8 is an electric circuit block diagram of the RF portion of the mobile phone 120. In FIG. 8, 122 is an antenna element, 123 is a duplexer, 124 and 126 are transmission-side power amplifiers, 125 is a transmission-side interstage bandpass filter, 127 is a transmission-side mixer, 128 is a reception-side low-noise amplifier, and 129 is a reception-side amplifier. Side-stage bandpass filter, 130
Is a receiving mixer, 131 is an isolator, 132 is a voltage controlled oscillator (VCO), and 133 is a local band-pass filter.

Here, as the isolator 131, the isolators 1 of the first and second embodiments can be used. By mounting the isolator 1, a low-cost and highly reliable mobile phone can be realized.

[Other Embodiments] The present invention is not limited to the above-described embodiment, but can be modified into various structures within the scope of the present invention. For example, the center conductor is not limited to a conductor (having a substantially circular cross section), but may be, for example, a metal foil (having a flat cross section). The shape of the center electrode assembly is not limited to a rectangular shape, but may be any shape such as a cylindrical shape or a deformed square shape. Further, the shape of the permanent magnet may be, for example, a circular shape, a triangular shape with rounded corners, or the like, in addition to the rectangular shape.

In addition to the isolator, the present invention can be applied to various non-reciprocal circuit devices such as a circulator.

[0048]

As is apparent from the above description, according to the present invention, the wiring substrate and the element mounting substrate are bonded with the bonding resin, and the electric circuit is formed by the wiring substrate and the element mounting substrate. Since the element is held, it is not necessary to form a recess for accommodating the electric circuit element in the wiring substrate. Therefore, even if the specification of the non-reciprocal circuit element is changed and the shape and the arrangement position of the electric circuit element are slightly different, it is only necessary to change the injection amount and the arrangement position of the adhesive resin. As a result, the wiring substrate can be shared, and the manufacturing cost of the non-reciprocal circuit device can be reduced.

Further, even if the solder for electrically connecting the electric circuit element and the wiring and element mounting substrate is temporarily re-melted by heating, the wiring substrate and the element mounting substrate are bonded. Since the electric circuit element is firmly joined by the resin, the electric circuit element is stably held between the wiring board and the element mounting board. That is, there is no fear that the position of the electric circuit element shifts or the electric circuit element comes off the wiring and element mounting substrate. Therefore, it is possible to reduce problems such as circuit open and circuit short, and to obtain a non-reciprocal circuit device having high connection reliability of the electric circuit device.

Further, the center electrode assembly is connected to the first substrate of the wiring board.
Since it is mounted on the main surface and electrically connected, the electric path from the center electrode to the electric circuit element is constituted by an electrode pattern formed on the wiring substrate. Therefore, the inductance from the center electrode assembly to the electric circuit element is stabilized, and the electric characteristics of the non-reciprocal circuit element and the communication device can be stabilized.

The use of a heat-curable resin, an ultraviolet-curable resin, or a visible light-curable resin as the adhesive resin increases the adhesive strength, and can further improve the vibration resistance and the shock resistance.

Since the cutout portion for resin injection is provided at the end of the wiring substrate, the adhesive resin can be injected efficiently using a dispenser or the like. Further, the injected resin is less likely to protrude from the end of the wiring substrate. As a result, defective bonding between the metal case and the element mounting board can be reduced, and the yield rate can be increased.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a non-reciprocal circuit device according to the present invention.

FIG. 2 is a perspective view of the wiring substrate shown in FIG. 1 as viewed from a lower surface side.

FIG. 3 is a plan view of the non-reciprocal circuit device shown in FIG. 1 after a partial assembly.

4 is a front view of the non-reciprocal circuit device shown in FIG. 3 after a partial assembly.

FIG. 5 is an assembly perspective view of the non-reciprocal circuit device shown in FIG. 1;

FIG. 6 is a plan view showing another embodiment of the non-reciprocal circuit device according to the present invention after a partial assembly.

7 is a front view of the non-reciprocal circuit device shown in FIG. 6 after a partial assembly.

FIG. 8 is a block diagram showing one embodiment of a communication device according to the present invention.

FIG. 9 is an exploded perspective view of a conventional non-reciprocal circuit device.

FIG. 10 is an exploded perspective view of another conventional non-reciprocal circuit device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Isolator (non-reciprocal circuit element) 5 ... Metal case 9 ... Permanent magnet 13 ... Center electrode assembly 20 ... Microwave ferrite 21, 22 ... Center electrode 30 ... Wiring board 30a ... Wiring board upper surface 30b ... Wiring Lower surface of substrate 36 Notch for resin injection 40 Element mounting substrate 50 Copper plate 51 Adhesive resin C1 to C4 Matching capacitor element (electric circuit element) R ... Resistor element (electric circuit element)

Claims (5)

[Claims] A center electrode assembly comprising: a permanent magnet; a ferrite to which a DC magnetic field is applied by the permanent magnet; and a plurality of center electrodes disposed on the ferrite; a first main surface; A wiring substrate having a second main surface opposed to a surface, wherein the center electrode assembly is mounted on the first main surface, an electric circuit element, and an element mounting for mounting the electric circuit element on the surface Substrate, and a metal case for housing the permanent magnet and the center electrode assembly, wherein the wiring substrate and the element mounting are provided with an adhesive resin provided between the wiring substrate and the element mounting substrate. A non-reciprocal circuit device, comprising: bonding a substrate to hold the electric circuit element disposed between a second main surface of the wiring substrate and the element mounting substrate. 2. The non-reciprocal circuit device according to claim 1, wherein the adhesive resin is one of a heat curing type, an ultraviolet curing type, and a visible light curing type. 3. A notch for resin injection is provided at an end of the wiring board.
3. The non-reciprocal circuit device according to 1. 4. The non-reciprocal circuit device according to claim 1, comprising a plurality of said electric circuit elements, wherein at least one of said electric circuit elements is a capacitor. 5. A communication device comprising the non-reciprocal circuit device according to claim 1.