JP2002359348A - Terminal structure of semiconductor device - Google Patents
Terminal structure of semiconductor deviceInfo
- Publication number
- JP2002359348A JP2002359348A JP2001162852A JP2001162852A JP2002359348A JP 2002359348 A JP2002359348 A JP 2002359348A JP 2001162852 A JP2001162852 A JP 2001162852A JP 2001162852 A JP2001162852 A JP 2001162852A JP 2002359348 A JP2002359348 A JP 2002359348A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- control board
- case
- control
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体装置の端子
構造に関する、The present invention relates to a terminal structure of a semiconductor device.
【０００２】[0002]
【従来の技術】パワー半導体素子と制御基板を内蔵した
半導体装置、例えば、ＩＧＢＴ（Insulated Gate Bipol
ar Transistor）モジュールなどでは、主電流用端子、
制御用端子を設け、それらの端子とパワー半導体素子の
ソース、ドレイン電極、あるいはゲート電極をそれぞれ
金属ワイヤで接続している。制御用端子と制御基板の接
続は、制御用端子を制御基板のスルーホールに挿入し、
半田等により接続している。このような制御用端子を制
御基板に半田付けする従来の構造については、例えば、
特開平１１−１６９３７号公報に記載されている。ま
た、接続用ピンを用いて制御基板と半導体素子が搭載さ
れた基板を接続する方法については、特開平６−４５５
１５号公報に記載されている。2. Description of the Related Art A semiconductor device incorporating a power semiconductor element and a control board, for example, an IGBT (Insulated Gate Bipol)
ar Transistor) module, main current terminal,
Control terminals are provided, and the terminals are connected to the source, drain, or gate electrodes of the power semiconductor element by metal wires. To connect the control terminal and the control board, insert the control terminal into the through hole of the control board,
They are connected by solder or the like. For a conventional structure in which such a control terminal is soldered to a control board, for example,
It is described in JP-A-11-16937. A method of connecting a control board and a board on which a semiconductor element is mounted using connection pins is disclosed in Japanese Patent Laid-Open No. 6-455.
No. 15 publication.
【０００３】[0003]
【発明が解決しようとする課題】制御用端子を制御基板
のスルーホールに挿入して半田付けする方法では、制御
用端子の数が多いときに、制御基板の全てのスルーホー
ルの位置を制御用端子の位置に合わせ、制御基板のスル
ーホールに制御用端子を挿入する必要があるので、位置
合わせが難しくなり作業性が悪くなる。In the method of inserting control terminals into through holes of a control board and soldering, when the number of control terminals is large, the positions of all through holes on the control board are controlled. Since it is necessary to insert the control terminal into the through hole of the control board in accordance with the position of the terminal, the alignment becomes difficult and the workability deteriorates.
【０００４】また、基板を半田により制御用端子に固定
した場合、基板及び制御用端子の熱変形により制御用端
子を固定した部分に熱応力が加わり、半田にクラックが
生じたり、配線パターンが断線する可能性がある。その
ため、例えば、制御用端子の根元の部分を湾曲させて熱
応力を吸収できるような対策を取っていた。Further, when the substrate is fixed to the control terminal by soldering, thermal stress is applied to the portion where the control terminal is fixed due to thermal deformation of the substrate and the control terminal, causing cracks in the solder and disconnection of the wiring pattern. there's a possibility that. Therefore, for example, measures have been taken such that the root portion of the control terminal can be curved to absorb thermal stress.
【０００５】また、接続用ピンを用いる方法は、接続用
ピンが多数ある場合には、制御基板を接続用ピンに挿入
するときに大きな力が必要となり作業性が悪くなる。さ
らに、従来の取り付け方法は、制御基板をケースにネジ
止め、あるいはその他の方法で固定する必要があり作業
工数が多いという問題点もあった。In the method using connection pins, when there are a large number of connection pins, a large force is required when inserting the control board into the connection pins, and the workability is deteriorated. Further, the conventional mounting method has a problem that the control board needs to be screwed to the case or fixed by other methods, and the number of work steps is large.
【０００６】本発明の課題は、制御用端子と制御基板を
簡単、かつ確実に接続できるようにすることである。ま
た、他の課題は、制御基板をケースに簡単に取り付けら
れるようにすることである。An object of the present invention is to enable simple and reliable connection between a control terminal and a control board. Another object is to enable the control board to be easily attached to the case.
【０００７】[0007]
【課題を解決するための手段】請求項１記載の発明は、
半導体素子と該半導体素子を制御する制御基板とケース
とからなる半導体装置において、前記ケースに第１の端
子を設け、前記制御基板に第２の端子を設け、前記第１
または第２の端子の少なくとも一方を弾性を有する部材
で構成し、該弾性を有する第１または第２の端子の少な
くとも一方により他方の端子を押圧し、前記制御基板と
前記制御用端子を接続する。According to the first aspect of the present invention,
In a semiconductor device comprising a semiconductor element, a control board for controlling the semiconductor element, and a case, a first terminal is provided on the case, a second terminal is provided on the control board, and the first terminal is provided on the control board.
Alternatively, at least one of the second terminals is formed of a member having elasticity, and the other terminal is pressed by at least one of the first and second terminals having elasticity to connect the control board and the control terminal. .
【０００８】この発明によれば、弾性を有する端子によ
り制御基板またはケースの端子を押圧することで、例え
ば、制御基板と半導体素子の制御電極を接続することが
できる。従って、制御基板と半導体素子の制御電極を接
続するために半田等を用いる必要が無く、取り付け作業
が簡単になる。また、制御用端子と制御基板の接続に半
田を用いないので、熱応力により半田部にクラック等が
発生するのを防止できる。According to the present invention, for example, the control substrate and the control electrode of the semiconductor element can be connected by pressing the terminal of the control substrate or the case with the elastic terminal. Therefore, there is no need to use solder or the like to connect the control electrode of the semiconductor element to the control board, and the mounting operation is simplified. Further, since no solder is used for connecting the control terminal and the control board, it is possible to prevent cracks or the like from occurring in the solder portion due to thermal stress.
【０００９】請求項２記載の発明は、半導体素子と該半
導体素子を制御する制御基板とケースとからなる半導体
装置において、前記ケースに第１の端子と弾性押圧機構
を設け、前記制御基板に第２の端子を設け、前記弾性押
圧機構により前記制御基板を前記ケースに押圧し、前記
第１の端子と前記制御基板の第２の端子を接続する。According to a second aspect of the present invention, in a semiconductor device comprising a semiconductor element, a control board for controlling the semiconductor element, and a case, the case is provided with a first terminal and an elastic pressing mechanism, and the control board has a first terminal and an elastic pressing mechanism. Two terminals are provided, and the control board is pressed against the case by the elastic pressing mechanism, and the first terminal and the second terminal of the control board are connected.
【００１０】この発明によれば、第１及び第２の端子と
別に弾性押圧機構を設けることで、その弾性押圧機構に
より制御基板をケースに固定するとともに第１の端子と
第２の端子を接続することができる。従って、例えば、
制御基板と半導体素子の制御電極を接続するために半田
等を用いる必要が無くなり、取り付け作業が簡単にな
る。また、制御用端子と制御基板の接続に半田を用いな
いので、熱応力により半田部にクラック等が発生するの
を防止できる。According to the present invention, by providing the elastic pressing mechanism separately from the first and second terminals, the control board is fixed to the case by the elastic pressing mechanism and the first terminal and the second terminal are connected. can do. So, for example,
There is no need to use solder or the like to connect the control substrate and the control electrode of the semiconductor element, and the mounting operation is simplified. Further, since no solder is used for connecting the control terminal and the control board, it is possible to prevent cracks or the like from occurring in the solder portion due to thermal stress.
【００１１】上記の発明において、前記第１の端子また
は前記第１の端子と前記弾性押圧機構は一体成形により
前記ケースに取り付けられるようにしても良い。また、
第１の端子または第１の端子と弾性押圧機構をケースと
別に構成し、その第１の端子または第１の端子と弾性押
圧機構をケースに取り付け、あるいは第１の端子または
弾性押圧機構が取り付けられた部材を接着等によりケー
スに取り付けるようにしても良い。In the above invention, the first terminal or the first terminal and the elastic pressing mechanism may be attached to the case by integral molding. Also,
The first terminal or the first terminal and the elastic pressing mechanism are configured separately from the case, and the first terminal or the first terminal and the elastic pressing mechanism are mounted on the case, or the first terminal or the elastic pressing mechanism is mounted on the case. The attached member may be attached to the case by bonding or the like.
【００１２】上記の発明において、前記ケースに前記半
導体素子の制御電極と接続される弾性を有する第１の端
子を設け、前記制御基板に接触用パッドまたは金属端子
からなる第２の端子を設け、前記ケースの第１の端子に
より前記制御基板の接触用パッドまたは金属端子を押圧
し、前記制御基板を前記ケースに固定しても良い。In the above invention, a first terminal having elasticity connected to a control electrode of the semiconductor element is provided on the case, and a second terminal comprising a contact pad or a metal terminal is provided on the control board, The control board may be fixed to the case by pressing a contact pad or a metal terminal of the control board with the first terminal of the case.
【００１３】このように構成することで、弾性を有する
ケース側の第１の端子で制御基盤の接触用パッドまたは
金属端子を押圧することで、制御基板をケースに固定
し、かつ半導体素子の制御電極と制御基板を電気的に接
続するすることができる。上記の発明において、前記ケ
ースに溝を形成し、該溝の上面または下面より前記第１
の端子の端部を突出させ、前記制御基板を前記溝にスラ
イドさせて挿入するようにしても良い。According to this structure, the control board is fixed to the case by pressing the contact pads or the metal terminals of the control board with the first terminal on the case side having elasticity, and the semiconductor element is controlled. The electrodes and the control board can be electrically connected. In the above invention, a groove is formed in the case, and the first or second surface is formed from an upper surface or a lower surface of the groove.
The terminal of the terminal may be protruded, and the control board may be slid into the groove and inserted.
【００１４】このように構成することで制御基板をケー
スの溝に挿入したときに、制御基板の第２の端子と溝の
上面または下面より突出する第１の端子の端部を接続す
ることができる。これにより、制御基板と半導体素子の
制御電極を簡単な構造で接続することができる。With this configuration, when the control board is inserted into the groove of the case, the second terminal of the control board can be connected to the end of the first terminal projecting from the upper or lower surface of the groove. it can. Thereby, the control substrate and the control electrode of the semiconductor element can be connected with a simple structure.
【００１５】上記の発明において、前記ケースの溝の上
面及び下面より第１の端子の端部を突出させ、前記制御
基板の両面に第２の端子を設けても良い。このように構
成することで、ケースの溝の上下面より突出した第１の
端子の端部と制御基板の両面の第２の端子を接続するこ
とで、配線数を２倍にして高密度の実装を実現できる。In the above invention, an end of the first terminal may protrude from an upper surface and a lower surface of the groove of the case, and second terminals may be provided on both surfaces of the control board. With this configuration, by connecting the end of the first terminal protruding from the upper and lower surfaces of the groove of the case and the second terminals on both sides of the control board, the number of wirings is doubled, and Implementation can be realized.
【００１６】上記の発明において、前記第１の端子の上
端部を湾曲させても良い。このように構成することで、
第１の端子が制御基板の第２の端子と接触したときに、
第１の端子の湾曲した上端部が変形して制御基板を押圧
することができる。これにより、第１の端子と制御基板
の第２の端子を接続することができる。In the above invention, the upper end of the first terminal may be curved. With this configuration,
When the first terminal contacts the second terminal of the control board,
The curved upper end of the first terminal can be deformed to press the control board. Thereby, the first terminal and the second terminal of the control board can be connected.
【００１７】[0017]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照しながら説明する。図１は、本発明の実施の形態
の半導体モジュール（半導体装置）１１の要部断面図で
ある。半導体モジュール１１の底面には、複数の半導体
素子を搭載し、かつ半導体素子で発生する熱を放熱する
ための伝熱ベース板１２が設けられている。この伝熱ベ
ース板１２は、銅、アルミ等の金属板や熱伝導性の高い
セラミック基板が用いられる。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a main part of a semiconductor module (semiconductor device) 11 according to an embodiment of the present invention. On the bottom surface of the semiconductor module 11, a heat transfer base plate 12 for mounting a plurality of semiconductor elements and dissipating heat generated in the semiconductor elements is provided. As the heat transfer base plate 12, a metal plate such as copper or aluminum or a ceramic substrate having high heat conductivity is used.
【００１８】伝熱ベース板１２の上面には、絶縁層１３
と導体層１４とからなる基板１５が設けられており、そ
の基板１５の上部に複数の半導体素子１６が配置されて
いる。半導体素子１６は、例えば、ＭＯＳＦＥＴが形成
された半導体チップであり、その上面にソース、ゲート
（制御電極）２１が形成され、底面にドレインが形成さ
れている。On the upper surface of the heat transfer base plate 12, an insulating layer 13
A substrate 15 including a semiconductor layer 16 and a conductor layer 14 is provided, and a plurality of semiconductor elements 16 are arranged on the substrate 15. The semiconductor element 16 is, for example, a semiconductor chip on which a MOSFET is formed, a source and a gate (control electrode) 21 are formed on an upper surface thereof, and a drain is formed on a bottom surface.
【００１９】ケース１７は、プラスチック等からなり、
内側に制御基板３１（図２）をスライドさせて挿入する
ための溝１８が形成されている。ケース１７には、成形
時に制御用端子１９がインサートされている。制御用端
子１９は、弾性を有する金属等の材料で構成されてお
り、その上端部１９ａは半円状に折り曲げられており、
その上端部１９ａが溝１８の下面より突出している。制
御基板３１を溝１８に挿入すると、制御基板３１の下面
の接触パッド３２が制御用端子１９の上端部１９ａと接
触し、制御用端子１９と制御基板３１が電気的に接続す
る。そのとき、制御用端子１９の半円状に形成された上
端部１９ａが変形して制御基板３１を溝１８の上面に押
圧するようになっている。制御用端子１９の下端部１９
ｂは、水平方向に折り曲げられており、下端部１９ｂと
半導体素子１６のゲート２１が金属ワイヤ２０により接
続されている。The case 17 is made of plastic or the like.
A groove 18 for slidingly inserting the control board 31 (FIG. 2) is formed inside. A control terminal 19 is inserted into the case 17 during molding. The control terminal 19 is made of a material such as metal having elasticity, and its upper end 19a is bent in a semicircular shape.
The upper end 19a protrudes from the lower surface of the groove 18. When the control board 31 is inserted into the groove 18, the contact pad 32 on the lower surface of the control board 31 comes into contact with the upper end 19a of the control terminal 19, and the control terminal 19 and the control board 31 are electrically connected. At this time, the semicircular upper end 19a of the control terminal 19 is deformed to press the control board 31 against the upper surface of the groove 18. Lower end 19 of control terminal 19
“b” is bent in the horizontal direction, and the lower end 19 b and the gate 21 of the semiconductor element 16 are connected by a metal wire 20.
【００２０】図２は、ケース１７を、図１のＡ−Ａ方向
から見たときの側面図である。なお、同図は、制御基板
３１をケース１７の溝１８に挿入した状態を示してい
る。ケース１７は、制御用端子１９がインサートされて
成形されており、溝１８に制御基板３１をスライドさせ
て挿入すると、制御基板３１の下面の接触パッド３２が
半円状の形状をした制御用端子１９の上端部１９ａと接
触し、上端部１９ａが変形しながら制御基板３１が奥に
挿入される。そして、制御基板３１の先端がケース１７
のストッパの位置まで挿入されると、接触パッド３２と
制御用端子１９が接触した状態となり、制御用端子１９
と制御基板３１に搭載されている回路が接続される。こ
のとき、制御基板３１は、制御用端子１９の上端部１９
ａにより上方に押圧され、その位置に固定される。FIG. 2 is a side view of the case 17 as seen from the direction of arrows AA in FIG. FIG. 2 shows a state in which the control board 31 is inserted into the groove 18 of the case 17. The case 17 is formed by inserting a control terminal 19 into the groove, and when the control substrate 31 is slid into the groove 18, the contact pad 32 on the lower surface of the control substrate 31 has a semicircular shape. The control board 31 is inserted into the back while the upper end 19a is in contact with the upper end 19a of the 19 and deforms. The tip of the control board 31 is
The contact pad 32 and the control terminal 19 are in contact with each other.
And the circuit mounted on the control board 31 are connected. At this time, the control board 31 is connected to the upper end 19 of the control terminal 19.
It is pressed upward by a and is fixed at that position.
【００２１】すなわち、制御基板３１を溝１８にスライ
ドさせて挿入することで、制御用端子１９の上端部１９
ａと制御基板３１の接触パッド３２が接触し、両者が電
気的に接続すると共に、制御用端子１９の上端部１９ａ
の弾性により制御基板３１が上方に押圧され、制御基板
３１がケース１７に固定される。制御用端子１９の下端
部１９ｂは金属ワイヤ２０により半導体素子１６のゲー
ト２１と接続されているので、制御基板３１の制御信号
を半導体素子１６のゲート２１に供給することができ
る。That is, the control board 31 is slid and inserted into the groove 18 so that the upper end 19 of the control terminal 19 is formed.
a and the contact pads 32 of the control board 31 are in contact with each other, and both are electrically connected.
The control board 31 is pressed upward by the elasticity of the control board 31, and the control board 31 is fixed to the case 17. Since the lower end 19b of the control terminal 19 is connected to the gate 21 of the semiconductor element 16 by the metal wire 20, the control signal of the control substrate 31 can be supplied to the gate 21 of the semiconductor element 16.
【００２２】図３は、ケース１７の内周の３面に溝１８
を形成した場合のケース１７の外観を示している。ケー
ス１７の上面の左側（図３に矢印で示すスライド方向か
ら見て）には、ソースと接続される主電流用端子３３が
設けられている。この場合、ケース１７の内周の３面に
溝１８が形成されているので、制御用端子１９を３つの
面に設けることができ、制御用端子１９をより自由に配
置することができ、また実装密度も高めることができ
る。FIG. 3 shows grooves 18 on three inner circumferential surfaces of case 17.
14 shows the appearance of the case 17 in the case where. A main current terminal 33 connected to the source is provided on the left side of the upper surface of the case 17 (as viewed from the sliding direction indicated by the arrow in FIG. 3). In this case, since the grooves 18 are formed on the three inner circumferential surfaces of the case 17, the control terminals 19 can be provided on the three surfaces, and the control terminals 19 can be arranged more freely. The mounting density can also be increased.
【００２３】図４は、溝１８の上面から制御用端子４１
の上端部４１ａを突出させた場合の例を示している。こ
の場合、制御基板３１の上面に接触パッドを形成し、そ
の制御基板３１を溝１８に挿入してスライドさせること
で、制御用端子４１の上端部４１ａにより制御基板３１
を溝１８の下面に押圧することができる。FIG. 4 shows the control terminal 41 from the upper surface of the groove 18.
Is shown in the case where the upper end portion 41a of the upper case 41 is protruded. In this case, a contact pad is formed on the upper surface of the control board 31, and the control board 31 is inserted into the groove 18 and slid, so that the control board 31 is controlled by the upper end 41a of the control terminal 41.
Can be pressed against the lower surface of the groove 18.
【００２４】次に、図５は、溝１８の上面及び下面から
制御用端子の端部を突出させた場合の例を示している。
この場合、制御基板３１の上下面に接触パッドを形成
し、その制御基板３１を溝１８に挿入してスライドさせ
ることで、制御用端子４１の上端部４１ａにより制御基
板３１を溝１８の下方に押圧し、同時に制御用端子５１
の上端部５１ａにより制御基板３１を溝１８の上方に押
圧して制御基板３１を固定することができる。このと
き、２つの制御用端子４１，５１を共通に使用しても良
いし、それぞれ別の制御用端子として使用しても良い。
別の制御用端子として使用する場合には、配線数を２倍
にできるので、その分高密度実装が実現できる。FIG. 5 shows an example in which the ends of the control terminals are projected from the upper and lower surfaces of the groove 18.
In this case, contact pads are formed on the upper and lower surfaces of the control board 31, and the control board 31 is inserted into the groove 18 and slid, so that the control board 31 is positioned below the groove 18 by the upper end 41 a of the control terminal 41. Press and simultaneously control terminal 51
The control board 31 can be fixed by pressing the control board 31 above the groove 18 by the upper end portion 51a of the control board 31. At this time, the two control terminals 41 and 51 may be used in common, or may be used as separate control terminals.
When used as another control terminal, the number of wirings can be doubled, so that high-density mounting can be realized.
【００２５】さらに、制御用端子１９，４１，５１の上
端部１９ａ，４１ａ，５１ａの形状は、半円状に限ら
ず、制御基板３１の接触パッド３２を押圧できるような
形状であればどのようなものでも良い。例えば、図６に
示すように制御用端子６１の上端部６１ａが板状の形状
でも良い。Further, the shape of the upper ends 19a, 41a, 51a of the control terminals 19, 41, 51 is not limited to a semicircular shape, but may be any shape that can press the contact pads 32 of the control board 31. May be something. For example, as shown in FIG. 6, the upper end 61a of the control terminal 61 may have a plate shape.
【００２６】上述した実施の形態によれば、制御基板３
１と制御用端子１９、４１，５１，６１とを半田等を用
いずに接続することができるので、熱応力により制御基
板３１の半田部のクラック、配線パターンの切断等が生
じるのを防止できる。また、半田付け等の作業が不要と
なるので組み立て作業が簡単になる。さらに、制御基板
３１をケース１７の溝１８に挿入してスライドさせるだ
けで良いので、制御基板３１の取り付け作業が簡単にな
る。According to the above-described embodiment, the control board 3
1 and the control terminals 19, 41, 51, 61 can be connected without using solder or the like, so that it is possible to prevent cracks in the solder portion of the control board 31 and cutting of the wiring pattern due to thermal stress. . Further, since the work such as soldering is not required, the assembling work is simplified. Further, since it is only necessary to insert the control board 31 into the groove 18 of the case 17 and slide it, the work of mounting the control board 31 is simplified.
【００２７】本発明は、上述した実施の形態に限らず、
例えば、以下のような構成でも良い。 （ａ）制御用端子１９、４１，５１，６１の形状は、先
端部１９ａ，４１ａ，５１ａ、６１ａが半円状、板状の
ものに限らず、制御基板３１の接触パッド３２等と接触
できる形状であれば、どのような形状でも良い。 （ｂ）ケース１７側の制御用端子１９が弾性を有するも
のに限らず、制御基板３１側に弾性を有する端子を設
け、ケース１７側の制御用端子１９、４１，５１，６１
は弾性を有しない形状のものを使用しても良い。あるい
は、制御基板３１と制御用端子１９、４１，５１，６１
の双方が弾性を有するようにしても良い。また、制御用
端子１９、４１，５１，６１、あるいは制御基板３１の
端子とは別に、制御基板３１をケース１７に固定するた
めの弾性機構を設けても良い。この具体的な構造として
は、例えば、半円状の金属板が溝１８の上下何れか、ま
たは両方に位置するようにケース１７内に制御用端子１
９、４１，５１，６１とは別部材としてインサート成形
する。 （ｃ）制御用端子１９は、ケース１７と一体に成形した
ものに限らず、制御用端子１９をケース１７と別に構成
し、制御用端子１９をケース１７の取り付け穴に挿入
し、あるいは制御用端子１９が取り付けられた部品をケ
ース１７に接着等により固定しても良い。 （ｄ）制御用端子１９と接続するための制御基板３１の
下面或いは上面の接触部は、導体パターン等により形成
する接触パッドに限らず、金属端子を制御基板に半田付
け、あるいは機械的に取り付けても良い。 （ｅ）制御用端子１９は、ケース１７の左右の溝１８に
設けるものに限らず、左側、右側、あるいは奥側の溝１
８にのみ制御用端子１９を設けても良い。 （ｆ）制御基板３１をケース１７に固定する方法は、溝
１８に制御基板３１をスライドさせて挿入する方法に限
らず、従来と同様にネジ等を用いて固定しても良い。こ
の場合でも、制御用端子１９と制御基板３１を半田等を
用いずに且つピン挿入作業無しに接続できるので、熱応
力による半田のクラック、配線パターンの切断等を防止
でき、又作業性を向上できるという効果が得られる。 （ｇ）半導体装置は、伝熱ベース１２を有する構造のも
のに限らず、樹脂等のケースに半導体素子が搭載された
基板を取り付けたものでも良い。 （ｈ）半導体素子１６は、ＭＯＳＦＥＴに限らずバイポ
ーラトランジスタ、サイリスタ等でも良い。 （ｉ）本発明は、大電力用の半導体モジュール以外にも
適用できる。 （ｊ）制御基板３１をケース１７の溝１８に挿入する構
造に限らず、例えば、図７（Ａ）に示すように、ケース
１７に溝１８の代わりに段部７２を設け、上方からイン
サート電極７１の上端部７１ａの弾性押圧機構により制
御基板３１を押圧支持するようにしても良い。あるい
は、図７（Ｂ）に示すようにケース１７に溝１８や段部
７２は設けず、上下共インサート電極７３，７４の上端
部７３ａ、７４ｂの弾性押圧機構のみで制御基板３１を
押圧支持するようにしても良い。The present invention is not limited to the above embodiment,
For example, the following configuration may be used. (A) The shapes of the control terminals 19, 41, 51, 61 are not limited to those having the semicircular or plate-like tips 19a, 41a, 51a, 61a, and can be in contact with the contact pads 32 of the control board 31, etc. Any shape may be used as long as it has a shape. (B) The control terminals 19 on the case 17 are not limited to those having elasticity. Elastic terminals are provided on the control board 31 side, and the control terminals 19, 41, 51, and 61 on the case 17 side are provided.
May have a shape having no elasticity. Alternatively, the control board 31 and the control terminals 19, 41, 51, 61
May have elasticity. Further, an elastic mechanism for fixing the control board 31 to the case 17 may be provided separately from the control terminals 19, 41, 51, 61 or the terminals of the control board 31. As a specific structure, for example, the control terminal 1 is placed in the case 17 so that the semicircular metal plate is located above or below the groove 18 or both.
9, 41, 51 and 61 are insert-molded as separate members. (C) The control terminal 19 is not limited to the one molded integrally with the case 17. The control terminal 19 is formed separately from the case 17, and the control terminal 19 is inserted into a mounting hole of the case 17, or the control terminal 19 is formed. The component to which the terminal 19 is attached may be fixed to the case 17 by bonding or the like. (D) The contact portions on the lower surface or upper surface of the control board 31 for connection with the control terminals 19 are not limited to contact pads formed by conductor patterns or the like, but metal terminals are soldered or mechanically attached to the control board. May be. (E) The control terminals 19 are not limited to those provided in the left and right grooves 18 of the case 17, but may be provided on the left, right, or back grooves 1.
The control terminal 19 may be provided only at 8. (F) The method of fixing the control board 31 to the case 17 is not limited to the method of sliding the control board 31 into the groove 18 and inserting the control board 31 into the groove 18. Even in this case, since the control terminals 19 and the control board 31 can be connected without using solder or the like and without inserting a pin, cracks in the solder and disconnection of the wiring pattern due to thermal stress can be prevented, and workability is improved. The effect that it can be obtained is obtained. (G) The semiconductor device is not limited to the structure having the heat transfer base 12, but may be a device in which a substrate on which a semiconductor element is mounted is attached to a case such as a resin. (H) The semiconductor element 16 is not limited to a MOSFET but may be a bipolar transistor, a thyristor, or the like. (I) The present invention can be applied to devices other than high-power semiconductor modules. (J) The structure is not limited to the structure in which the control board 31 is inserted into the groove 18 of the case 17. For example, as shown in FIG. The control board 31 may be pressed and supported by the elastic pressing mechanism of the upper end 71 a of the control board 71. Alternatively, as shown in FIG. 7B, the case 17 is not provided with the groove 18 or the step 72, and the control board 31 is pressed and supported only by the elastic pressing mechanism of the upper ends 73a, 74b of the upper and lower insert electrodes 73, 74. You may do it.
【００２８】[0028]
【発明の効果】本発明によれば、半導体素子の制御端子
と制御基板とを簡単な構造で、かつ確実に接続できるの
で取り付け作業が簡略化され、接続の安定性も得られ
る。また、例えば、制御基板をケースの溝にスライドさ
せて挿入し、一方の端子で他方の端子を押圧して制御基
板をケースに固定することができるので、制御基板の取
り付け作業が簡単になる。According to the present invention, the control terminal of the semiconductor element and the control board can be securely connected to each other with a simple structure, so that the mounting operation is simplified and the connection stability is obtained. Also, for example, the control board can be fixed to the case by sliding the control board into the groove of the case and pressing the other terminal with one terminal to fix the control board to the case.
【図１】半導体装置の要部断面図である。FIG. 1 is a cross-sectional view of a main part of a semiconductor device.
【図２】半導体装置の内部側面図である。FIG. 2 is an internal side view of the semiconductor device.
【図３】ケースの内周の３面に溝を形成した場合のケー
スの外観を示す図である。FIG. 3 is a view showing the appearance of the case when grooves are formed on three inner circumferential surfaces of the case.
【図４】制御用端子の一例を示す図である。FIG. 4 is a diagram showing an example of a control terminal.
【図５】制御用端子の一例を示す図である。FIG. 5 is a diagram illustrating an example of a control terminal.
【図６】制御用端子の一例を示す図である。FIG. 6 is a diagram illustrating an example of a control terminal.
【図７】制御用端子の一例を示す図である。FIG. 7 is a diagram illustrating an example of a control terminal.
１１ 半導体装置 １２ 伝熱ベース板 １５ 基板 １６ 半導体素子 １７ ケース １８ 溝 １９、４１，５１，６１，７１，７３，７４ 制御
用端子 ３１ 制御基板 ３２ 接触パッドReference Signs List 11 semiconductor device 12 heat transfer base plate 15 substrate 16 semiconductor element 17 case 18 groove 19, 41, 51, 61, 71, 73, 74 control terminal 31 control substrate 32 contact pad
Claims (8)
基板とケースとからなる半導体装置において、 前記ケースに第１の端子を設け、前記制御基板に第２の
端子を設け、前記第１または第２の端子の少なくとも一
方を弾性を有する部材で構成し、該弾性を有する第１ま
たは第２の端子の少なくとも一方により他方の端子を押
圧し、前記第１の端子と前記制御基板の第２の端子を接
続することを特徴とする半導体装置の端子構造。1. A semiconductor device comprising a semiconductor element, a control board for controlling the semiconductor element, and a case, wherein a first terminal is provided on the case, and a second terminal is provided on the control board. At least one of the second terminals is formed of a member having elasticity, and the other terminal is pressed by at least one of the first and second terminals having elasticity. A terminal structure of the semiconductor device, wherein the terminals are connected.
基板とケースとからなる半導体装置において、 前記ケースに第１の端子と弾性押圧機構を設け、前記制
御基板に第２の端子を設け、前記弾性押圧機構により前
記制御基板を前記ケースに押圧し、前記第１の端子と前
記制御基板の第２の端子を接続することを特徴とする半
導体装置の端子構造。2. A semiconductor device comprising a semiconductor element, a control board for controlling the semiconductor element, and a case, wherein the case has a first terminal and an elastic pressing mechanism, and the control board has a second terminal, The terminal structure of a semiconductor device, wherein the control board is pressed against the case by the elastic pressing mechanism, and the first terminal is connected to a second terminal of the control board.
接続される弾性を有する第１の端子を設け、前記制御基
板に接触用パッドまたは金属端子からなる第２の端子を
設け、前記ケースの第１の端子により前記制御基板の接
触用パッドまたは金属端子を押圧し、前記制御基板を前
記ケースに固定することを特徴とする請求項１記載の半
導体集積回路のA first terminal having elasticity connected to a control electrode of said semiconductor element is provided on said case; a second terminal comprising a contact pad or a metal terminal is provided on said control board; 2. The semiconductor integrated circuit according to claim 1, wherein the first terminal presses a contact pad or a metal terminal of the control board to fix the control board to the case.
溝の上面または下面より前記第１の端子の端部を突出さ
せ、前記制御基板を前記溝にスライドさせて挿入するこ
とを特徴とする請求項１，２または３記載の半導体装置
の端子構造。4. A sliding groove is formed in the case, an end of the first terminal is projected from an upper surface or a lower surface of the groove, and the control board is slid into the groove and inserted. 4. The terminal structure of a semiconductor device according to claim 1, 2 or 3.
１の端子の端部を突出させ、前記制御基板の両面に第２
の端子を設けたことを特徴とする請求項１，２，３また
は４記載の半導体装置の端子構造。5. An end of the first terminal protrudes from an upper surface and a lower surface of a groove of the case, and a second terminal is provided on both surfaces of the control board.
5. The terminal structure for a semiconductor device according to claim 1, wherein said terminal is provided.
記弾性押圧機構は一体成形により前記ケースに取り付け
られることを特徴とする請求項１、２，３，４または５
記載の半導体装置の端子構造。6. The apparatus according to claim 1, wherein said first terminal or said first terminal and said elastic pressing mechanism are attached to said case by integral molding.
2. The terminal structure of the semiconductor device according to claim 1.
記弾性押圧機構は前記ケースと別に構成され、前記ケー
スに取り付けられることを特徴とする請求項１、２，
３，４，５または６記載の半導体装置の端子構造。7. The device according to claim 1, wherein the first terminal or the first terminal and the elastic pressing mechanism are formed separately from the case, and are attached to the case.
7. The terminal structure of a semiconductor device according to 3, 4, 5, or 6.
を特徴とする請求項１，３，４，５，６または７記載の
半導体装置の端子構造。8. The terminal structure for a semiconductor device according to claim 1, wherein an upper end of said first terminal is curved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001162852A JP2002359348A (en) | 2001-05-30 | 2001-05-30 | Terminal structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001162852A JP2002359348A (en) | 2001-05-30 | 2001-05-30 | Terminal structure of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002359348A true JP2002359348A (en) | 2002-12-13 |
Family
ID=19005913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001162852A Withdrawn JP2002359348A (en) | 2001-05-30 | 2001-05-30 | Terminal structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002359348A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006186144A (en) * | 2004-12-28 | 2006-07-13 | Daikin Ind Ltd | Power module and air-conditioner |
-
2001
- 2001-05-30 JP JP2001162852A patent/JP2002359348A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006186144A (en) * | 2004-12-28 | 2006-07-13 | Daikin Ind Ltd | Power module and air-conditioner |
| JP4513560B2 (en) * | 2004-12-28 | 2010-07-28 | ダイキン工業株式会社 | Power module and air conditioner |
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