JP2002358607A - Magnetic head element, manufacturing method of the same and magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic head element wherein the dimensional precision in the direction of a track width on the writing magnetic gap side of an upper core is improved. SOLUTION: An upper core part 3 is made to have a multi-layer structure where a plurality of core layers 3d and 3e are deposited in film thickness direction, and the sectional shapes the core layers 3d and 3e in a film thickness direction are structured to be roughly trapezoidal. Etching is executed by the angle of a low etching rate in a track width direction of the upper core part 3 with respect to an etching surface 3f formed by being raised on the lower core layer 3e in the film thickness direction. Thus, the size of the upper core part 3 in the track width direction of the base side is made to match with the track width Tw of a recording medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head element, particularly a magnetic head element for writing and a method of manufacturing the same, and a magnetic head using the magnetic head element.

[0002]

2. Description of the Related Art A method of manufacturing a conventional magnetic head element, particularly a magnetic head element for writing, will be described with reference to FIG. First, as shown in FIG. 4A, a write magnetic gap 2 is formed to a predetermined thickness on a substrate or on a lower core 1 formed on a read magnetic head.

Next, as shown in FIG. 4B, an upper core 3 is formed on the write magnetic gap 2 to a thickness of 4 to 5 μm.

Then, as shown in FIG. 4C, a resist film 4 is formed on the upper core 3 by patterning, and the upper core 3 is irradiated with ions by using the patterned resist film 4 as a mask to perform milling. Then, the excess upper core 3 and magnetic gap 2 are etched to form the upper core 3 and magnetic gap 2 into a substantially trapezoidal shape (FIG. 4D).

The step of milling the upper core 3 and the magnetic gap 2 will be described in detail with reference to FIG.

As shown in FIG. 4C, when performing the milling process, first, ions are irradiated to the upper core 3 in an oblique direction using the resist film 4 as a mask. Excess upper core 3 exposed from (resist film 4) is etched. As a result of this etching, the side wall 3a of the upper core 3 is milled diagonally as shown by a dotted line 5a.

Next, the ion irradiation direction is changed to a lower angle direction, and the side wall 3a of the upper core 3 exposed by the etching is etched inward to form the side wall of the upper core 3 as shown in FIG. The dimension S between the bases 3a, 3a was approximated to the track width.

Next, as shown in FIG.
In the track width direction on the side of the write magnetic gap 2
The upper core 3 on the side of the magnetic gap 2 for writing is further etched by milling so as to match the track width dimension of a recording medium (not shown).

The milling process will be described in detail. As shown in FIG. 4E, when ion irradiation is performed on the inclined side surface 3b of the upper core 3 from a direction substantially perpendicular to the inclined side surface 3b, the etching rate on the inclined side surface 3b increases. When the ion irradiation is performed on the inclined side surface 3b from the parallel direction (up and down direction in the figure), the etching rate on the inclined side surface 3b decreases, and the etching amount becomes ideally zero.

Therefore, conventionally, the irradiation angle of the ion particles on the inclined side surface 3b of the upper core 3 is changed. More specifically, in the early stage of etching, etching is performed at a high etching rate angle (for example, 45 ° with respect to the substrate) to shorten the etching time, and in the final stage of etching, the accuracy of the track width (Tw) is increased. The upper core 3 was milled by changing the etching rate to an angle (for example, 5 ° with respect to the substrate). As a result, the upper core 3 is milled into a substantially trapezoidal shape. The angle of ion irradiation for determining the etching rate is determined based on the direction perpendicular to the substrate.

However, it is practically impossible to measure the degree of inclination of the side surface 3b of the upper core 3 during the milling process by the method of the prior art, and the shape 3c in which the side surface 3b of the upper core 3 rises in the film thickness direction is obtained. It is difficult to stop the milling process at the time when the upper core 3 is formed, and the inclined surface of the upper core 3 is over-etched to obtain a dimension S2 (S
1> S2) milling extra until
Alternatively, etching may be insufficient (S1 <S2).

Therefore, there is a problem that the manufacturing yield of the magnetic core whose dimension S in the track width direction on the side of the write magnetic gap 2 of the upper core 3 matches the track width of the recording medium is low.

Further, there is a problem that it is difficult to artificially control and improve the accuracy of the dimension S of the upper core 3 on the side of the write magnetic gap 2 in the track width direction.

[0014]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a magnetic head element having improved accuracy in the dimension in the track width direction on the write magnetic gap side of an upper core, a method of manufacturing the same, and a magnetic head using the magnetic head element. Is to provide.

[0015]

SUMMARY OF THE INVENTION To achieve the above object, a magnetic head according to the present invention includes a magnetic head having a lower core, a magnetic gap formed on the lower core, and an upper core formed on the magnetic gap. In the head element, the upper core is formed as a multilayer structure in which a plurality of core layers are stacked in a thickness direction.

Further, the core layer of the multilayer structure is formed in a structure having a substantially trapezoidal cross section in the thickness direction with the magnetic gap side as the base. The bottom dimension of the core layer in the track width direction is set according to the track width of the magnetic gap.

It is preferable that a protrusion of the magnetic gap be joined to a bottom side of the core layer in a track width direction. Further, it is preferable that the protrusion of the magnetic gap is formed so that its periphery is etched and rises to a middle height.

It is preferable that the protrusion of the magnetic gap has a junction with the core layer set to have a track width. Preferably, the core layer forming the upper core has an etched side surface that is continuous with a side edge of the protrusion of the magnetic gap.

Preferably, the etching side surface is formed to rise in the thickness direction. Further, it is preferable that the etching side surface includes a side surface rising in a film thickness direction where an etching rate by milling is small. Further, it is desirable that each core layer of the multilayer structure is made of the same material. It is preferable that at least one of the plurality of core layers is formed of a plating film.

Further, the method of manufacturing a magnetic head element according to the present invention is directed to a method of manufacturing a magnetic head element having a lower core, a magnetic gap, and an upper core composed of a lower core layer and an upper core layer deposited vertically. Forming the magnetic gap on the lower core, forming a lower core layer on the magnetic gap, patterning a first resist film on the lower core layer to obtain a predetermined shape. Forming the first core layer, using the patterned first resist film as a mask, milling the lower core layer, and forming an upper core layer on the magnetic gap including the lower core layer. Patterning a second resist film on the upper core layer into a predetermined shape, and using the patterned second resist film as a mask. The upper and lower core layers and milling and having a step of forming the upper core.

The milling step may be performed by irradiating the first resist film with ion particles in an oblique direction and milling the lower core layer using the first resist film as a mask. Is desirable. Further, in the milling process, the thickness of the lower core layer is set in a range of １ ／ to の of the total thickness of the lower and upper core layers deposited vertically, and the first layer for the mask is formed. The thickness of the resist film of to １ ／ of the thickness of the second resist film for the mask.
By milling with setting to 1/5 range,
It is preferable that the etching is performed by forming etching surfaces that rise in the film thickness direction on both sides of the lower core layer in the track width direction.

In the milling process, ion irradiation is performed by fixing the irradiation angle of the ion particles with respect to the upper core layer, and the upper and lower core layers are formed in a film thickness direction using the second resist film as a mask. Is desirably milled into a structure having a substantially trapezoidal shape with the bottom side being the magnetic gap side.

It is preferable that the irradiation direction of the ion particles to the upper core layer is fixed at an angle of about 5 ° with respect to the film thickness direction. It is preferable that the track width dimension of the magnetic gap is secured at a milling angle at which the etching rate of the lower core layer in the track width direction with respect to the etching surface rising in the film thickness direction of the lower core layer is low.

Further, the magnetic gap is over-etched downward in the film thickness direction at a milling angle at which the etching rate in the track width direction of the lower core layer is lower than the etching surface rising in the film thickness direction of the lower core layer. Is preferred. Further, the magnetic gap is over-etched downward in the thickness direction at a low milling angle at an etching rate in the track width direction of the lower core layer on the etching surface rising in the thickness direction of the lower core layer, and The track width of the magnetic gap joined to the bottom of the core layer may be ensured. Preferably, the lower core layer and the upper core layer are formed of the same material.

The magnetic head element according to the present invention includes a lower core, a magnetic gap formed on the lower core,
A magnetic head element having an upper core formed on the magnetic gap, wherein the upper core is formed in a structure having a substantially rectangular cross-section in a thickness direction with the magnetic gap as a base, and from the base. Rise in the film thickness direction,
It has an etching surface by milling.

The bottom dimension of the upper core in the track width direction is set according to the track width of the magnetic gap. It is preferable that a protrusion of the magnetic gap be joined to a bottom side of the upper core in a track width direction.

It is preferable that the protrusion of the magnetic gap is formed so that its periphery is etched and rises to a middle height. The protrusion of the magnetic gap has a joint portion with the upper core set to have a track width.

Preferably, the etching surface of the upper core is continuous with a side edge of the protrusion of the magnetic gap.
Further, it is preferable that the etching side surface is formed so as to rise in the film thickness direction. It is preferable that the etching side surface is a side surface rising in the film thickness direction where the etching rate by the milling process is small.

A magnetic head according to the present invention includes any one of the above-described magnetic head elements.

The method of manufacturing a magnetic head according to the present invention is a method of manufacturing a magnetic head element having a lower core, a magnetic gap, and an upper core, wherein the step of forming the magnetic gap on the lower core includes the steps of: Forming an upper core on the magnetic gap;
Patterning the resist film to form a predetermined shape; milling a surface layer of the upper core using the patterned first resist film as a mask to form a middle-high protrusion; A step of patterning a second resist film on the protruding portion to form a predetermined shape, and a step of milling the upper core using the second resist film as a mask.

The thickness of the first resist film is set in a range of 1/4 to 1/5 of the thickness of the second resist film, and the upper portion of the upper resist is formed using the patterned first resist film as a mask. It is desirable to mill the surface layer of the core to form a mid-height projection.

It is preferable that the side surface of the middle and high elevations be a side surface which rises in the film thickness direction where the etching rate by milling is small. Further, it is preferable that the dimension of the second resist film in the track width direction is set to be 1.5 to 2 times the dimension of the second resist film in the track width direction.

In addition, ion irradiation is performed by fixing the irradiation direction of the ion particles to the upper core, and the upper core is formed by using the second resist film as a mask, and the sectional shape in the film thickness direction is defined such that the magnetic gap side is the base. It is desirable to perform a milling process into a substantially rectangular structure.

Preferably, the direction of irradiation of the ion core with respect to the upper core is fixed at a direction inclined by about 5 ° with respect to the film thickness direction. Preferably, the track width dimension of the magnetic gap is secured at a milling angle at which an etching rate of the upper core in a track width direction with respect to an etching surface rising in a film thickness direction of the upper core is low.

It is preferable that the magnetic gap is over-etched downward in the film thickness direction at a milling angle at which the etching rate in the track width direction of the upper core with respect to the etching surface rising in the film thickness direction of the upper core is low.

Further, the magnetic gap is over-etched downward in the film thickness direction at a milling angle at which the etching rate in the track width direction of the upper core with respect to the etching surface rising in the film thickness direction of the upper core is reduced. It is preferable to secure a track width of the magnetic gap joined to the bottom side. Further, the thickness of the first resist film is set to １ ／ to １ ／ of the thickness of the second resist film.
Is preferably set in the range.

[0037]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a method of manufacturing a magnetic head element according to Embodiment 1 of the present invention in the order of steps.

As shown in FIGS. 1G and 3, the magnetic head element according to the first embodiment of the present invention includes a lower core 1, a magnetic gap 2 formed on the lower core 1, 2 has an upper core 3 formed thereon with an insulating layer Z interposed therebetween, and supplies a write current to a coil C disposed insulated between the lower core 1 and the upper core 3 so that the current flows through the coil C. This is intended for a magnetic head element for writing which magnetizes the lower core 1 and the upper core 3 by energizing to perform magnetic recording on the recording medium at the magnetic gap 2.

As shown in FIG. 1G, the magnetic head element according to the first embodiment of the present invention is characterized in that the upper core 3 is formed as a multilayer structure in which a plurality of core layers are deposited in the thickness direction. It is assumed that. The first embodiment is an example in which two core layers are deposited, and the core layer 3 has a multilayer structure.
d, 3e, the sectional shape in the film thickness direction is the magnetic gap 2;
It is characterized in that it is formed in a structure having a substantially trapezoidal shape whose side is the base.

In the first embodiment, the bottom dimension of the core layer 3e in the track width direction is set corresponding to the track width dimension Tw of the magnetic gap 2, and the bottom dimension of the core layer 3e in the track width direction is set. The protrusion 2 of the magnetic gap 2
a. The protrusion 2a of the magnetic gap 2
The periphery of the magnetic gap 2 is formed by being raised to a middle height by etching, and the dimension of the joint in the track width direction with the core layer 3e is equal to the track width T.
It is set to the dimension of w.

The core layer 3e constituting the upper core 3 is
The magnetic gap 2 has an etched side surface 3f that is continuous with the side edge of the protrusion 2a. The etched side surface 3f
Are formed in the film thickness direction by milling. As described later, since the milling process is performed on the core layer 3d as the first layer and the milling process is performed on the first core layer and the second core layer, the upper inclined portion of the etching side surface 3f is etched. On the lower side of the etching side surface 3f, a side surface 3g rising in the film thickness direction where the etching rate by the milling process is small is included. Each of the core layers 3d, 3
Although e is made of the same material, any one of the core layers may be formed of a plating layer. In the embodiment of FIG. 1, the lower core layer 3e is formed of a plating layer so as to secure a track width dimension. The lower core 1 is made of a material such as CoZrTa, CoZrNb, and NiFe. Al ₂ O ₃ ,
A material such as SiO ₂ is used. The upper core 3 has Co
Materials such as ZrTa, CoZrNb, and NiFe are used.

As described above, according to the first embodiment of the present invention, the upper core 3 is formed as a multilayer structure in which the core layers 3d and 3e are deposited in the film thickness direction.
Not only can the cross-sectional shape in the film thickness direction of d and 3e be formed to have a substantially trapezoidal shape with the bottom being the magnetic gap 2 side, but also the etched side surface 3f is formed in the core layer 3e in the film thickness direction by milling. The upper core 3 is prevented from being over-etched in the track width direction by using the etched side surface 3f which rises in the film thickness direction, and the track width on the bottom side of the upper core 3 is formed. The dimension S in the direction is a track width Tw of a recording medium (not shown).
, And the dimensional accuracy of the dimension S in the track width direction on the bottom side of the upper core 3 can be improved.

Further, the upper core 3 is over-etched in the track width direction by etching at a milling angle at which the etching rate of the core layer in the track width direction with respect to the etching side surface 3f rising in the film thickness direction is low. Can be prevented artificially, and as a result, the production yield of the magnetic head element can be increased.

Further, in the first embodiment, the bottom dimension of the core layer 3e in the track width direction is set in accordance with the track width dimension Tw of the magnetic gap 2, and the core layer 3e
Since the protrusion 2a of the magnetic gap 2 is joined to the bottom in the track width direction, magnetic leakage from the magnetic gap 2 to other than the gap opposing surface can be reliably prevented,
Writing efficiency can be improved.

When the upper and lower core layers 3e and 3d are made of the same material, a step during polishing is less likely to occur between the upper and lower core layers 3e and 3d. If different materials are used for the upper and lower core layers 3e and 3d, problems such as corrosion due to the standard electrode potential difference may occur.
When d is made of the same material, this problem can be solved. When any one of the core layers 3e and 3d is formed by a plating layer using a frame plating method, there is an effect that the etching side surface 3f shown in FIG. .

In the state shown in FIG. 1, the magnetic head elements are formed in a matrix on the substrate, and the lower core 1, the magnetic gap 2, and the upper core 3 are cut into individual units from the substrate to form a magnetic product. A head is formed. This magnetic head is attached to the trailing end of a floating slider provided in a magnetic recording device such as a hard disk device (not shown), and writes recording magnetic data on a recording medium (not shown).

Next, a method of manufacturing the magnetic head element according to the first embodiment of the present invention will be described in the order of steps.

First, as shown in FIG. 1A, a write magnetic gap 2 is formed to a thickness of 0.5 to 1.5 μm on a substrate or a lower core 1 formed on a read magnetic head. Form. The write magnetic gap 2 is formed as a film using, for example, a sputtering method.

Next, as shown in FIG. 1B, a core layer 3e of the upper core 3 is formed to a thickness of 1 μm on the write magnetic gap 2. The core layer 3e is a lower layer of a multilayer structure, and a core layer 3d described later is stacked and deposited on the core layer 3e to form an upper core having a multilayer structure. The core layer 3e is formed by, for example, a method of forming a magnetic film by a sputtering method, a plating method by frame plating, or the like.

The thickness of the core layer 3e is not limited to the core layers 3d and 3e.
It is desirable to set the total thickness of the core layers 3d and 3e to 4 μm in the first embodiment, so that the total thickness of the core layers 3d and 3e is set to 4 μm. The film thickness is set to 1 μm. In the first embodiment, the core layer 3
The thickness of e is set as a thin film such as 1 μm, and a state is obtained in which an etching side surface 3f rising in the film thickness direction is formed on the side surface in the track width direction of the core layer 3e as described later.

Next, as shown in FIG. 1B, a resist film 4 is formed in a thickness of 3 to 5 μm on the core layer 3 e as a thin film, and then the resist film 4 is patterned into a predetermined shape. The resist film 4 is used as a mask when milling the core layer 3e. Further, a baking process or the like is performed on the resist film 4 after the patterning process. Further, the thickness of the resist film 4 needs to be set to a thickness that maintains a patterned shape in the process of milling the core layer 3e. The resist film 4 is formed by using a novolak resin or the like and using a spin coater.

Next, as shown in FIG. 1C, the lower core layer 3e is milled using the patterned resist film 4 as a mask. That is, ion irradiation is performed on the resist film 4 from the oblique direction with respect to the ion particles, and the lower core layer 3e is milled using the resist film 4 as a mask. Specifically, the thickness of the lower core layer 3e is set to a range of 1/4 to 1/5 of the total thickness of the upper and lower core layers 3d and 3e, and The thickness of the resist film 4 is set in the range of １ ／ to の of the thickness of the mask resist film 5 described later, and milling is performed, thereby forming the lower core layer 3 e on both sides in the track width direction. Then, an etching side surface 3f rising in the film thickness direction is formed (FIG. 1D).

Here, as described in the section of the prior art, it has been described that the amount of etching increases when the core layer 3e is obliquely irradiated with ion particles as described above. According to this description, even in the step of FIG. 1C, the side surface of the resist film 4 is etched while being inclined. This phenomenon occurs when the thickness of the core layer 3e to be milled is thick, and when the thickness of the core layer 3e to be milled is thin, the resist film 4 An experimental result was obtained in which the core layer 3e in contact with the edge was milled in the film thickness direction.

Based on this demonstration, the thickness of the lower core layer 3e was set to be equal to the lower and upper core layers 3d, 3e deposited vertically.
Is set in the range of 1/4 to 1/5 of the total film thickness of the mask resist film 4 and the film thickness of the mask resist film 4 is set in the range of 1/4 to 1/5 of the film thickness of the mask resist film 5 described later. By setting and milling, etching side surfaces 3f which rise in the film thickness direction are formed on both sides of the lower core layer 3e in the track width direction. The fact that the etching surfaces formed on both sides of the lower core layer 3e in the track width direction are the etching side surfaces 3f rising in the film thickness direction means that the irradiation direction of the ion particles can be artificially changed. This means that the amount of etching on the etching side surface 3f can be artificially set in a direction in which the etching amount on the etching side surface 3f is minimized. Core layer 3f
It is possible to secure the track width dimension Tw of the magnetic gap 2 at a milling angle at which the etching rate in the track width direction is low.

Next, as shown in FIG. 1E, after the resist film 4 is removed, the lower core layer 3 having an etched side surface 3f rising in the film thickness direction on the side surface in the track width direction.
An upper core layer 3d is formed on the magnetic gap 2 containing e. In this case, by depositing the core layers 3d and 3e on the upper and lower sides, the total film thickness of the core layers 3d and 3e is reduced.
Required film thickness. In the first embodiment, the core layer 3
The total film thickness of d and 3e is set in the range of 4 to 5 μm. The upper core layer 3d has a step including the surface 3f 'due to the etching side surface 3f (step) of the lower core layer 3e. The resist film 4 is removed by appropriately selecting an O ₂ ashing method, a resist peeling method, or the like.

Next, as shown in FIG. 1F, a resist film 5 is formed on the core layers 3d and 3e as a thick film by 12 to 20 μm.
Then, the resist film 5 is patterned and formed into a predetermined shape. The resist film 5 is used as a mask when milling the core layers 3d and 3e. The resist film 5 after the patterning process has been completed.
Is subjected to a baking process or the like. In addition, the thickness of the resist film 5 needs to be set to a thickness that maintains a patterned shape in the process of milling the thick core layers 3d and 3e.
The resist film 5 is formed of a material such as a novolak resin, and is formed using a spin coater or the like. Also, the first
By setting the dimension of the resist film 4 in the track width direction to 1.5 to 2 times the track width dimension of the second resist film 5, the lower core layer 3 formed by milling is formed.
The track width dimension (Tw) of d can be secured.

Then, using the patterned resist film 5 as a mask, the upper and lower core layers 3d, 3d
The upper core 3 is formed by milling e. That is, ion irradiation is performed while the irradiation angle of the ion particles with respect to the upper core layer 3d is fixed, and the upper and lower core layers 3d and 3e are formed by using the resist film 5 as a mask so that the cross-sectional shape in the film thickness direction is the same as that of the magnetic layer. Milling is performed to form a substantially trapezoidal structure with the gap 2 side as the base. In particular,
The irradiation angle of the ion particles with respect to the upper core layer 3d is fixed to a direction inclined by about 5 ° with respect to the film thickness direction, and milling by ion irradiation is performed. Thereby, the etching side surface 3 rising in the thickness direction of the lower core layer 3e.
At f ′, the track width Tw of the magnetic gap 2 is secured by suppressing the etching in the track width direction. The etching proceeds on the etching side surface 3f ', and eventually becomes the etching side surface 3f of the lower core layer 3e.

At the same time, the etching of the lower core layer 3e in the track width direction is suppressed at the etching side surface 3f (3f ') rising in the film thickness direction of the lower core layer 3e so that the magnetic gap 2 faces downward. Over-etch in the direction. The magnetic gap 2 is formed in a downward direction with a milling angle at which the etching rate in the track width direction of the lower core layer 3e with respect to the etching side surface 3f (3f ') rising in the film thickness direction of the lower core layer 3e. By over-etching, the track width Tw of the magnetic gap joined to the bottom of the lower core layer 3e is secured. By this milling process, the periphery of the portion where the magnetic gap 2 is joined to the lower core layer 3e is overmilled to form a protrusion 2a that rises to a middle height. In this state, the etched side surface 3f of the core layer 3e forming the upper core 3 remains in the upper core 3 in a state of rising in the film thickness direction continuously to the side edge of the protrusion 2a of the magnetic gap 2. It will be. Here, FIG.
As shown in (h), the milling process for the core layer 3d as the first layer and the milling process for the first and second core layers are performed.
The inclined portion 3g on the upper side of f is etched. Since the lower side of the etching side surface 3f includes the side surface 3f rising in the film thickness direction where the etching rate by the milling process is small, the etched side surface 3f causes the bottom side of the lower core layer 3e to have a track width direction. Can be made to match the track width Tw of the recording medium. Furthermore, the dimension in the track width direction of the protrusion 2a of the magnetic gap 2 joined to the bottom side of the lower core layer 3e can be made to match the track width Tw of the recording medium, and the accuracy can be improved.

As described above, according to the manufacturing method of Embodiment 1 of the present invention, the upper core 3 is formed as a multilayer structure by depositing the core layers 3d and 3e in the film thickness direction. Not only can the cross-sectional shape in the film thickness direction of 3d and 3e be formed in a substantially trapezoidal shape with the magnetic gap 2 side as the base, but also the etching side surface 3 can be formed on the core layer 3e.
f can be formed by milling to rise in the film thickness direction. The upper side core 3 is prevented from being over-etched in the track width direction by using the etched side surface 3f rising in the film thickness direction. The dimension S in the track width direction on the bottom side of the core 3 can be matched with the track width Tw of the recording medium (not shown), and the dimensional accuracy of the dimension S in the track width direction on the bottom side of the upper core 3 is improved. Can be done.

Further, in the milling step, the first resist film 4 is irradiated with ion particles in an oblique direction, the lower core layer 3d is milled using the first resist film 4 as a mask, and the lower core layer 3d is milled. The thickness of the layer 3d is set to １ ／ of the total thickness of the upper and lower core layers 3d and 3e.
１／1/5, and the thickness of the first resist film 4 for the mask is set to 1 of the thickness of the second resist film 5 for the mask.
By performing milling while setting the range of to １ ／, etching side surfaces 3 f rising in the film thickness direction can be formed on both sides of the lower core layer 3 d in the track width direction.

In the milling process, the irradiation angle of the ion particles on the upper core layer 3e is fixed. Specifically, the irradiation angle of the ion particles on the upper core layer 3d is set to about 5 to the film thickness direction. ° Fix in the inclined direction,
In order to perform the milling process by ion irradiation, the etching side surface 3f ′ rising in the thickness direction of the lower core layer 3e.
Thus, the etching in the track width direction can be suppressed to secure the track width Tw of the magnetic gap 2, and the etching on the etching side surface 3 f ′ is further advanced, so that the etching side surface 3 f of the lower core layer 3 e is finally formed.
It can be.

By setting the etching rate in the track width direction of the lower core layer 3e to the etching surface rising in the film thickness direction of the lower core layer 3e at a low milling angle, the track width (Tw) of the magnetic gap 2 is set. ) Dimensions can be secured.

Further, by setting the milling angle at which the etching rate in the track width direction of the lower core layer 3e with respect to the etching surface rising in the film thickness direction of the lower core layer 3e is set to a low milling angle, the magnetic gap 3 is moved downward in the film thickness direction. Over-etching can be surely performed.

Further, the etching rate of the lower core layer 3e in the track width direction with respect to the etching surface rising in the film thickness direction of the layer core layer 3e is set to a low milling angle to overetch the magnetic gap 2 in the film thickness downward direction. By doing so, the track width of the magnetic gap 2 joined to the bottom of the lower core layer 3e can be ensured.

FIG. 2 is a sectional view showing a method of manufacturing a magnetic head element according to Embodiment 2 of the present invention in the order of steps.

As shown in FIGS. 2E and 3, the magnetic head element according to the second embodiment of the present invention has a lower core 1 and a magnetic gap formed on the lower core 1 as in the first embodiment. 2 and an upper core 3 formed on the magnetic gap 2, and a write current is supplied to a coil C insulated between the lower core 1 and the upper core 3.
It is intended for a write magnetic head that magnetizes the lower core 1 and the upper core 3 by the application of the current and performs magnetic recording on the recording medium at the magnetic gap 2.

As shown in FIG. 2E, in the magnetic head element according to the second embodiment of the present invention, the upper core 3 has a substantially rectangular cross section in the thickness direction with the magnetic gap 2 as the base. It has an etched side surface 3f formed by a milling process and formed in a structure and rising from the bottom in the film thickness direction.

The bottom dimension of the upper core 3 in the track width direction is set in accordance with the dimension of the track width Tw of the magnetic gap 2. The protrusion 2a of the gap 2 is joined. The protrusion 2a of the magnetic gap 2 is formed so that the periphery thereof is etched and rises to a middle height, and the protrusion 2a of the magnetic gap 2 is formed so that the dimension of the joint with the upper core 3 is equal to the track width Tw. Dimensions are set.

The etching side surface 3f of the upper core 3
Is continuous with the side edge of the protrusion 2a of the magnetic gap 2, the etching side surface 3f is formed to rise in the film thickness direction, and the etching side surface 3f has a low etching rate by milling. It functions as a side surface rising in the film thickness direction.

As described above, according to Embodiment 2 of the present invention, the sectional shape of the upper core 3 in the thickness direction is
It is formed in a structure having a substantially rectangular shape with its side as the bottom side, and has an etching side surface 3f formed by milling on the end surface rising in the film thickness direction. This prevents the upper core 3 from being over-etched in the track width direction, and allows the dimension S in the track width direction on the bottom side of the upper core 3 to match the track width Tw of the recording medium (not shown), Dimension S in the track width direction on the bottom side of upper core 3
Dimensional accuracy can be improved.

Further, it is possible to artificially prevent the upper core 3 from being over-etched in the track width direction by using the etching side surface 3f rising in the film thickness direction.
As a result, the production yield of the magnetic head can be increased.

Further, in the second embodiment, the bottom dimension of the core layer 3e in the track width direction is set corresponding to the dimension of the track width Tw of the magnetic gap 2;
Since the protrusion 2a of the magnetic gap 2 is joined to the bottom in the track width direction of e, magnetic leakage from the magnetic gap 2 to a portion other than the gap facing surface can be reliably prevented, and the write efficiency is improved. be able to.

When the upper and lower core layers 3e and 3d are made of the same material, a step during polishing is less likely to occur between the upper and lower core layers 3e and 3d. When different materials are used for the upper and lower core layers 3e and 3d, a problem such as corrosion due to a standard electrode potential difference may occur.
This problem can be solved if e and 3d are made of the same material. When any one of the core layers 3e and 3d is formed of a plating layer using a frame plating method, it is easy to control the etched side surface 3f shown in FIG. 3, a track width dimension (Tw) of 3 can be secured.

Next, a method of manufacturing a magnetic head element according to a second embodiment of the present invention will be described with reference to FIGS.

First, as shown in FIG. 2A, a write magnetic gap 2 is formed to a thickness of 0.5 to 1.5 μm on a substrate or a lower core 1 formed on a read magnetic head. Form. The write magnetic gap 2 is formed by, for example, a method of forming a non-magnetic film by a plating method such as a sputtering method or a frame plating method. Subsequently, FIG. 2 (a)
As shown in FIG.
Is formed into a film having a thickness of 4 to 5 μm. The upper core 3 is formed by, for example, a sputtering method.

Next, as shown in FIG.
On the upper surface, a surface layer 3h made of the same material as the upper core 3 is deposited and formed. The thickness of the surface layer 3h is 1/4 to 1/4 of the thickness of the upper core 3.
It is desirable to set the thickness in the range of 1/5. In the second embodiment, the thickness of the upper core 3 is set to 4 μm, so that the thickness of the surface layer 3h is set to 1 μm. Further, in the second embodiment, the thickness of the surface layer 3h is set as thin as possible as 1 μm as quickly as possible, and rises in the thickness direction in the track width direction on the surface of the upper core 3 as described later. A state in which the etching side surface 3f is formed is obtained.

Subsequently, as shown in FIG. 2B, a resist film 6 having a thickness of 3 to 5 μm is formed on the surface layer 3h as a thin film by patterning to a size corresponding to the track width Tw. This resist film 6 is used as a mask when the surface layer 3 is milled. Further, a baking process or the like is performed on the resist film 6 after the patterning process. Further, the thickness of the resist film 6 needs to be set to a value that maintains a patterned shape in the process of milling the surface layer 3h. The resist film 6 is formed using, for example, a novolak resin and using a spin coater.

Next, as shown in FIG. 2C, the surface layer 3h is milled using the patterned resist film 6 as a mask. That is, the resist film 6 is irradiated with the ion particles in an oblique direction, and the surface layer 3h is milled using the resist film 6 as a mask. Specifically, the film thickness of the surface layer 3h is set in the range of 1/4 to 1/5 of the film thickness of the upper core 3, and the film thickness of the mask resist film 6 is set to By performing milling while setting the thickness in the range of ４ to １ ／ of the film thickness, an etching side surface 3 f having a track width Tw and rising in the film thickness direction is formed in the track width direction on the surface of the upper core 3. (FIG. 2C).

Here, as described in the section of the prior art, it has been described that the etching amount increases when the surface layer 3h is obliquely irradiated with the ion particles as described above. According to this description,
Also in the step of FIG. 2B, the side surface of the resist film 6 is etched while being inclined. This phenomenon occurs when the thickness of the surface layer 3h to be milled is a thick film, and when the thickness of the surface layer 3h to be milled is a thin film, the edge of the resist film 6 is removed. Surface layer 3 in contact with
Experimental results were obtained in which h was milled in the film thickness direction.

Based on this demonstration, the thickness of the surface layer 3h was set to be in a range of 1/4 to 1/5 of the thickness of the upper core 3, and the thickness of the mask resist film 6 was changed to a mask resist described later. Milling is performed with the film thickness set in the range of １ ／ to ５ of the film thickness of the film 7, so that the surface of the upper core 3 has a track width Tw in the track width direction and rises in the film thickness direction. The side surface 3f is formed. The fact that the etched side surface 3f formed on the upper core 3 and having the track width Tw is the etched side surface 3f rising in the film thickness direction means that:
Since the irradiation direction of the ion particles can be artificially changed, it means that the irradiation amount can be artificially set in a direction in which the etching amount on the etching side surface 3 f is minimized. It is possible to secure the track width dimension Tw of the magnetic gap 2 by suppressing the etching of the upper core 3 in the track width direction by the etching side surface 3f rising in the film thickness direction.

Next, as shown in FIG. 2D, after removing the resist film 6, a resist film 7 is formed between the etched side surfaces 3f, 3f rising in the film thickness direction on the side surfaces in the track width direction.
The resist film 7 is deposited and formed to a thickness of 2 to 20 μm.
Is patterned. The resist film 7 is used as a mask when milling the upper core 3. Further, a baking process or the like is performed on the resist film 7 after the patterning process. Further, the thickness of the resist film 7 needs to be set to a thickness that maintains the patterning shape in the process of milling the thick upper core 3. The resist film 7 is formed using, for example, a novolak resin and using a spin coater.

Then, the upper core 3 is shaped by milling the upper core 3 using the patterned resist film 7 as a mask. That is, the upper core 3 of the ion particles
Irradiation is performed with the irradiation direction 6a fixed to the upper core 3 using the resist film 5 as a mask, and the upper core 3 is milled into a structure having a substantially rectangular cross section in the thickness direction with the magnetic gap 2 side as the base. . More specifically, the irradiation direction 6a of the ion particles with respect to the upper core 3 is fixed in a direction inclined by about 5 ° with respect to the film thickness direction, and milling by ion irradiation is performed. The etching in the track width direction of the upper core 3 is suppressed by the etching side surface 3f formed so as to secure the track width Tw of the magnetic gap 2.

At the same time, the magnetic gap 2 is over-etched downward in the film thickness direction while suppressing the etching of the upper core 3 in the track width direction on the etching side surface 3f rising in the film thickness direction of the upper core 3. The etching of the upper core 3 in the track width direction is suppressed by the etching side surface 3 f rising in the thickness direction of the upper core 3, and the magnetic gap 2 is formed.
The track width Tw of the magnetic gap joined to the bottom of the upper core 3 is secured by overetching the magnetic core in the downward direction. By this milling process, the periphery of the portion where the magnetic gap 2 is joined to the upper core 3 is over-milled, and the protrusion 2 rises to a middle height.
a is formed. In this state, the etching side surface 3f of the upper core 3 is in contact with the protrusion 2a of the magnetic gap 2.
Is left in the upper core 3 in a state of rising in the film thickness direction continuously to the side edge of the upper core 3. Due to the etched side surface 3f, the dimension S in the track width direction of the bottom of the upper core 3 is obtained.
To the track width Tw of the recording medium,
In addition, the dimension in the track width direction of the protrusion 2a of the magnetic gap 2 joined to the bottom side of the upper core 3 can be matched with the track width Tw of the recording medium, and the accuracy can be improved.

Further, according to the manufacturing method of this embodiment, it is not necessary to form a plurality of core layers for forming the upper core in a multi-stage manner, and the upper core is formed in a required thickness in one step. And the manufacturing process can be shortened. Further, the same effect as in the manufacturing method shown in FIG. 1 can be obtained. The magnetic head element shown in FIG. 2 can be used as a magnetic head for writing as shown in FIG.

[0086]

As described above, according to the present invention, a magnetic head having improved accuracy of the dimension in the track width direction on the write magnetic gap side of the upper core and the track on the write magnetic gap side of the upper core are provided. It is possible to obtain a method of manufacturing a magnetic head that improves the accuracy of the dimension in the width direction.

[Brief description of the drawings]

FIG. 1 is a sectional view illustrating a method for manufacturing a magnetic head element according to Embodiment 1 of the present invention in the order of steps.

FIG. 2 is a cross-sectional view illustrating a method of manufacturing a magnetic head element according to Embodiment 2 of the present invention in the order of steps.

FIG. 3 is an exploded perspective view showing the magnetic head element according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a method of manufacturing a magnetic head element according to a conventional example in the order of steps.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lower core 2 Magnetic gap for writing 3 Upper core 3d, 3e Core layer 4, 5, 6, 7 Resist film

Claims (39)

[Claims] 1. A magnetic head element having a lower core, a magnetic gap formed on the lower core, and an upper core formed on the magnetic gap, wherein the upper core is formed by forming a plurality of core layers. A magnetic head element formed as a multilayer structure laminated in a thickness direction. 2. The magnetic head element according to claim 1, wherein the core layer of the multilayer structure is formed to have a substantially trapezoidal cross section in a thickness direction with the magnetic gap side as a base. Characteristic magnetic head element. 3. The magnetic head element according to claim 2, wherein a bottom dimension of the core layer in a track width direction is set corresponding to a track width dimension of the magnetic gap. 4. The magnetic head element according to claim 3, wherein a protrusion of the magnetic gap is joined to a bottom side of the core layer in a track width direction. 5. The magnetic head element according to claim 4, wherein the protrusion of the magnetic gap is formed so that its periphery is etched and rises to an intermediate height. 6. The magnetic head element according to claim 4, wherein the protrusion of the magnetic gap has a junction with the core layer set to a track width. element. 7. The magnetic head element according to claim 1, wherein the core layer forming the upper core has an etched side surface continuous with a side edge of the protrusion of the magnetic gap. A magnetic head element comprising: 8. The magnetic head element according to claim 7, wherein the etched side surface is formed to rise in a film thickness direction. 9. The magnetic head element according to claim 7, wherein the etched side surface includes a side surface rising in a film thickness direction at which an etching rate by milling is small. 10. The magnetic head element according to claim 1, wherein each core layer of the multilayer structure is made of the same material. 11. The magnetic head element according to claim 1, wherein at least one of the plurality of core layers is formed of a plating film. 12. A method of manufacturing a magnetic head element having a lower core, a magnetic gap, and an upper core composed of a lower core layer and an upper core layer deposited vertically, wherein the magnetic gap is formed on the lower core. Forming; forming a lower core layer on the magnetic gap; patterning a first resist film on the lower core layer to form a first resist film into a predetermined shape; Milling the lower core layer using the first resist film as a mask, forming an upper core layer on the magnetic gap including the lower core layer, forming a second core layer on the upper core layer. Patterning a resist film to form a predetermined shape; and milling the upper and lower core layers using the patterned second resist film as a mask. Forming the upper core by using the above method. 13. The method of manufacturing a magnetic head element according to claim 12, wherein, in the milling step, the first resist film is irradiated with ion particles in an oblique direction, and the first resist film is used as a mask. A method for manufacturing a magnetic head element, wherein the method is performed by milling the lower core layer. 14. The method of manufacturing a magnetic head element according to claim 12, wherein in the milling process, the thickness of the lower core layer is set to 1 / (the total thickness of the lower and upper core layers deposited vertically). 4-1
/ 5, and the thickness of the first resist film for the mask is set to one of the thickness of the second resist film for the mask.
The milling process is performed in a range of ４ to １ ／ to form an etching surface that rises in the film thickness direction on both sides of the lower core layer in the track width direction. Of manufacturing a magnetic head element. 15. The method for manufacturing a magnetic head element according to claim 12, wherein the milling is performed by irradiating ions while fixing an irradiation angle of ion particles to the upper core layer.
Characterized in that the magnetic layer is formed by milling the upper and lower core layers into a substantially trapezoidal structure in which the cross-sectional shape in the film thickness direction has the bottom side as the bottom side, using the resist film as a mask. Manufacturing method of head element. 16. A method for manufacturing a magnetic head element according to claim 15, wherein the direction of irradiation of the ion particles to the upper core layer is fixed at an angle of about 5 ° with respect to the film thickness direction. Of manufacturing a magnetic head element. 17. The method of manufacturing a magnetic head element according to claim 15, wherein an etching rate in a track width direction of the lower core layer is lower than an etching surface rising in a film thickness direction of the lower core layer. A method of manufacturing a magnetic head element, wherein a track width of the magnetic gap is secured by a milling angle. 18. The method for manufacturing a magnetic head element according to claim 14, 15, or 16, wherein an etching rate in a track width direction of the lower core layer with respect to an etching surface rising in a film thickness direction of the lower core layer. Wherein the magnetic gap is over-etched downward at a low milling angle in the film thickness direction. 19. The method for manufacturing a magnetic head element according to claim 14, 15, or 16, wherein an etching rate in a track width direction of the lower core layer with respect to an etching surface rising in a film thickness direction of the lower core layer. Characterized in that the magnetic gap is over-etched downward at a low milling angle in the thickness direction to secure a track width of the magnetic gap joined to the bottom of the lower core layer. . 20. The method for manufacturing a magnetic head element according to claim 12, wherein the lower core layer and the upper core layer are formed of the same material. 21. A magnetic head element having a lower core, a magnetic gap formed on the lower core, and an upper core formed on the magnetic gap, wherein the upper core has a sectional shape in a film thickness direction. Is formed in a substantially rectangular structure having the magnetic gap as a base, and has an etched surface formed by milling and rising from the base in a film thickness direction. 22. The magnetic head element according to claim 21, wherein a bottom dimension of the upper core in a track width direction is set corresponding to a track width dimension of the magnetic gap. 23. The magnetic head element according to claim 21, wherein a protrusion of the magnetic gap is joined to a bottom of the upper core in a track width direction. 24. The magnetic head element according to claim 21, wherein the protrusion of the magnetic gap is formed so that its periphery is etched and rises to a middle height. 25. The magnetic head element according to claim 21, wherein the protrusion of the magnetic gap has a junction with the upper core set to a track width. element. 26. The method of claim 21, 22, 23, 24 or 25.
The magnetic head element according to claim 1, wherein the etched surface of the upper core is continuous with a side edge of the protrusion of the magnetic gap. 27. A magnetic head element according to claim 21, wherein said etched side surface is formed to rise in a film thickness direction. 28. The magnetic head element according to claim 21, wherein the etching side surface is a side surface rising in a film thickness direction at which an etching rate by milling is small. 29. A magnetic head comprising the magnetic head element according to any one of claims 1 to 10 or 21 to 28. 30. A method of manufacturing a magnetic head element having a lower core, a magnetic gap, and an upper core, wherein: forming the magnetic gap on the lower core; and forming an upper core on the magnetic gap. Patterning a first resist film on the upper core to form a predetermined shape; milling a surface layer of the upper core using the patterned first resist film as a mask; A step of forming a protrusion; a step of patterning a second resist film on the intermediate-height protrusion to form a predetermined shape; and milling the upper core using the second resist film as a mask. And a method for manufacturing a magnetic head element. 31. The method for manufacturing a magnetic head element according to claim 30, wherein the thickness of the first resist film is set in a range of １ ／ to の of the thickness of the second resist film. And manufacturing a magnetic head element by milling the surface layer of the upper core using the patterned first resist film as a mask. 32. The method of manufacturing a magnetic head element according to claim 30, wherein the side surface of the middle-height protrusion is formed on a side surface rising in a film thickness direction where an etching rate by milling is small. Of manufacturing a magnetic head element. 33. The method according to claim 30, wherein the dimension of the second resist film in the track width direction is 1.5 times or more the dimension of the second resist film in the track width direction.
A method for manufacturing a magnetic head element, wherein the magnetic head element is set to a range twice as large. 34. The method of manufacturing a magnetic head element according to claim 30, wherein the ion irradiation is performed while fixing the irradiation direction of the ion particles to the upper core, and the upper core is formed using the second resist film as a mask. Is milled into a structure having a substantially rectangular shape whose cross-sectional shape in the film thickness direction has the bottom side as the magnetic gap side. 35. The method of manufacturing a magnetic head element according to claim 34, wherein the irradiation direction of the ion particles to the upper core is fixed in a direction inclined by about 5 ° with respect to the film thickness direction. Manufacturing method of head element. 36. The method for manufacturing a magnetic head element according to claim 34, wherein an etching rate in a track width direction of the upper core with respect to an etching surface rising in a film thickness direction of the upper core is at a low milling angle. A method for manufacturing a magnetic head element, wherein a track width of a magnetic gap is secured. 37. The method of manufacturing a magnetic head element according to claim 34, 35 or 36, wherein a milling angle of an etching rate in a track width direction of the upper core with respect to an etching surface rising in a film thickness direction of the upper core is low. Wherein the magnetic gap is over-etched in a film thickness downward direction. 38. The method of manufacturing a magnetic head element according to claim 34, 35 or 36, wherein the etching rate in the track width direction of the upper core with respect to the etching surface rising in the film thickness direction of the upper core is low. And over-etching the magnetic gap in a film thickness downward direction to secure a track width of the magnetic gap joined to a bottom side of the upper core. 39. The method of manufacturing a magnetic head element according to claim 30, 31, 32, or 34, wherein the thickness of the first resist film is set to １ ／ to 1 of the thickness of the second resist film. A method of manufacturing a magnetic head element, wherein the magnetic head element is set in a range of / 5.