JP2002353397A - Semiconductor integrated circuit and mounting structure of electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve high density mounting for realizing miniaturization of portable equipment. SOLUTION: A semiconductor integrated circuit and chip parts are directly mounted on the surface of a circuit molding forming an electric circuit pattern on the surface of a resin molding. In addition, a step is formed on the circuit molding of a part mounting the adjacent semiconductor integrated circuit and the chip parts, and short-circuiting is hardly generated even when it is mounted by narrow adjacency between the steps. Thus, the semiconductor integrated circuit and the chip parts can be highly densely mounted. The useless space in the inside of the portable equipment can be eliminated by designing the structure to contrive miniaturization.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-density and space-saving mounting technique for semiconductor integrated circuits and electronic components.

[0002]

2. Description of the Related Art In recent years, the miniaturization of electronic components and semiconductor integrated circuits and the development of high-density mounting technology have been remarkable. In particular, the miniaturization of portable devices has attracted attention.

[0003] As one of the mounting methods of electronic components and semiconductor integrated circuits, an SMT (Surface Mount Tec) in which electronic components and semiconductor integrated circuits are two-dimensionally mounted on a substrate surface.
hnology) became mainstream. However, the miniaturization of mobile terminals represented by mobile phones has progressed, and it has become necessary to reduce the mounting area.

Therefore, recently, a method of reducing a gap between semiconductor integrated circuits and chip components, and a stacked IC in which semiconductor devices are stacked in a package have been developed in order to improve a packaging density. The idea is to expand the two-dimensional narrowing in three dimensions.

FIG. 6 is a cross-sectional view schematically showing a conventional build-up substrate.

The build-up substrate is roughly divided into a base layer 21
And the build-up layer 22.

[0007] The semiconductor integrated circuit 4 is formed on the build-up layer on the surface.
And chip components 3 are surface-mounted. Since the base layer is a hard wiring board of a glass epoxy laminate, it cannot be bent or processed into a complicated shape.

FIG. 7 schematically shows a sectional view of a conventional portable telephone.

A build-up board 29 on which the semiconductor integrated circuit 4 and the chip component 3 are mounted is disposed substantially at the center of the main body of the portable telephone. Since it is a rigid build-up board, the outer case of the mobile phone also becomes linear. LCD module 26, touch key 2 on top of build-up board
5. The speaker 27, the microphone 31, and the battery unit 28 are disposed below.

Since the hard build-up board 29 occupies the most inside the outer case of the mobile phone, wasteful space exists in the case, which hinders the miniaturization of the mobile phone.

This applies not only to mobile phones but also to general mobile devices.

[0012]

SUMMARY OF THE INVENTION Conventional portable devices that require further miniaturization and higher functionality in surface mounting are required.
The area for mounting semiconductor integrated circuits and electronic components is becoming limited by only the two sides of the substrate.

It is becoming difficult to dispose a circuit board on which electronic components and semiconductor integrated circuits are mounted in a small outer case, which hinders downsizing of the outer case. Further, the mobile terminal is not a simple rectangular parallelepiped, but has a complicated shape in terms of design and handling. It is very difficult to compactly store a circuit board made of a hard material in a complicated outer case.

In addition, due to the fine pitch and miniaturization of the electronic component connection terminals, the reliability of the joint has been regarded as a problem.

Accordingly, the present invention provides a mounting technique for effectively storing electronic components in a space-saving manner and reliable bonding of electronic components.

[0016]

According to the first means of the present invention, a semiconductor integrated circuit, a chip component, a semiconductor bare chip, and the like are mounted on a surface of a circuit molded body in which an electric circuit pattern is formed on a surface of a resin molded body.

This molded circuit also functions as an outer case of a portable device. By adopting this method, it is possible to improve the storage ability of an external case having a complicated shape without concern for the conventional circuit board arrangement.

Further, as a second means, the circuit molded body is three-dimensionally provided with one or more steps, and an electric circuit pattern is formed for each step. Then, a chip component such as a chip capacitor or a chip resistor or a semiconductor integrated circuit is joined to each stage to form a three-dimensional electronic component arrangement. By taking such a three-dimensional arrangement, short circuits between parts can be prevented,
When viewed in a plan view, the distance between adjacent parts can be reduced.

According to this method as well, a high-density mounting form can be obtained for an outer case having a complicated shape.

In the third means, an uneven portion is formed in a portion having an electric circuit pattern on the surface of the circuit molded body, and an electrode terminal of the semiconductor integrated circuit is connected to the concave portion.

According to this method, the flow of the conductive bonding agent for bonding the electronic component and the electric circuit pattern is prevented, and even if the conductive bonding agent is reduced due to the fine pitch and miniaturization of the connection terminals of the electronic component, the connection generated is reduced. Eliminates defects (separation)

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below in detail with reference to FIGS.

FIG. 1 is a perspective view showing a state where a semiconductor integrated circuit 4 and a chip component 3 are surface-mounted on a circuit molded body 1 according to the present invention. The circuit molded body 1 includes a molding resin and an electric circuit pattern 2 formed on the surface thereof. The manufacturing method of the circuit molded body 1 itself is generally known, and a pattern is drawn by a photolithography method, a laser, or the like after plating the surface of the molding resin. Then, a solder or a conductive adhesive as a conductive bonding agent is applied to a specific portion of the drawn pattern, and the semiconductor integrated circuit 4 and the chip component 3 are directly mounted and bonded. Heretofore, a method has been used in which electronic components such as semiconductor integrated circuits and chip components are bonded to a circuit board, and a pattern of the circuit board and a pattern of a circuit molded body are brought into contact to establish electrical continuity.

Since the semiconductor integrated circuit 4 and the chip component 3 can be joined to the obliquely cut portion of the circuit molded body, the space inside the product can be effectively used, and the product can be downsized.

FIG. 2 is a side view showing a state immediately before the semiconductor integrated circuit 5 according to the present invention is joined to the circuit molded body 1. An electric circuit pattern 8 is formed on the surface of the circuit molded body 1, and a conductive bonding agent 9 for joining the solder ball 6 of the semiconductor integrated circuit and the electric circuit pattern 8 is supplied thereon.

Here, the conductive bonding agent 9 indicates a solder or a conductive adhesive.

In the present invention, the projection 7 is formed on the circuit molded body. By forming the protrusions 7, the flow of the conductive bonding agent 9 due to pressure and heat when bonding the semiconductor integrated circuit 5 and the circuit molded body is suppressed. Therefore, a short circuit with an adjacent pattern can be prevented.

The solder balls 6 of the semiconductor integrated circuit 5
Are arranged in the concave portions formed by forming the projections 7, so that the positioning is stable.

FIG. 3 is a cross-sectional view schematically showing a structure in which a step is provided in the circuit molded body 1 according to the present invention, and FIG. 4 is a plan view of FIG. 3 as viewed from above.

The electric circuit pattern 2 on the first surface 11, the electric circuit pattern 15 on the second surface 12,
The electric circuit pattern 16 on the third surface 13 is formed.

In each stage, a chip component 3 and a semiconductor integrated circuit 4
In joining, since there is a step between adjacent parts, an electrical short between adjacent patterns and adjacent parts is less likely to occur, so that the distance 14 between adjacent parts can be reduced to about 0.01 mm. By adopting such a structure, the distance in the Y direction in FIG. 4 can be reduced, and high-density mounting becomes possible.

FIG. 5 is a sectional view showing an example in which the high-density mounting according to the present invention is applied to a wristwatch-type portable device. In this example, three steps are provided in the circuit molded body 1, and the chip component 3 and the semiconductor integrated circuit 4 are mounted on each step. Further, the battery 34 and the LCD panel 33 are configured in the circuit molded body 1. By attaching the band portion 32 to the arm, the device becomes a portable device.

[0033]

According to the present invention, by mounting a semiconductor integrated circuit, an electronic component, and a semiconductor bare chip on the surface of a circuit molded body, the semiconductor device can be optimally arranged in a limited space such as a portable device. I can do it.

As described in claims 2 and 3,
By providing irregularities on the surface of the circuit molded body and dropping the solder balls and external connection terminals of the semiconductor integrated circuit into the concaves, positional displacement when the semiconductor integrated circuit is mounted can be prevented, and stable bonding can be performed.

In addition, since the conductive bonding agent for bonding the solder balls and the terminals to the electric circuit pattern does not easily flow to the adjacent pattern, an electric short-circuit failure is unlikely to occur.

As described in claims 4 and 5,
When providing steps on the circuit molded body and joining chip components or semiconductor integrated circuits on the electric circuit pattern on each step,
The steps are different, and adjacent parts do not cause an electrical short between the steps. Therefore, when viewed from the top, the distance between adjacent components can be reduced, so that high-density mounting is realized, and unnecessary space in the case is eliminated, and the size of the portable device can be further reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view showing an embodiment of a mounting structure of a first semiconductor integrated circuit and an electronic component according to the present invention.

FIG. 2 is an explanatory sectional view showing an embodiment of a mounting structure of a semiconductor integrated circuit according to the present invention.

FIG. 3 is an explanatory sectional view showing an embodiment of a mounting structure of a second semiconductor integrated circuit and an electronic component according to the present invention.

FIG. 4 is an explanatory top view showing an embodiment of a mounting structure of a second semiconductor integrated circuit and an electronic component according to the present invention.

FIG. 5 is an explanatory sectional view showing an embodiment in which the mounting structure according to the present invention is applied to a wristwatch-type portable device.

FIG. 6 is an explanatory sectional view showing an example of a conventional mounting structure of a semiconductor integrated circuit and an electronic component.

FIG. 7 is an explanatory view schematically showing a cross-sectional view of a mobile phone manufactured by a conventional mounting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit molded object 2 Electric circuit pattern 3 Chip component 4 Semiconductor integrated circuit 5 Semiconductor integrated circuit (BGA, CSP) 6 Solder ball 7 Projection part 8 Electric circuit pattern 9 Bonding agent 11 First stage surface 12 Second stage surface 13 Third-stage surface 14 Distance between adjacent components 15 Second-stage surface electric circuit pattern 16 Third-stage surface electric circuit pattern 21 Base layer 22 Build-up layer 23 Through hole 24 Interlayer wiring pattern 25 Touch key 26 LCD module 27 Speaker 28 Battery Unit 29 Build-up Board 30 Antenna 31 Microphone 32 Band

Claims (5)

[Claims] 1. A circuit molded product having an electric circuit pattern formed on a surface of a resin molded product, wherein a semiconductor integrated circuit, a chip component, a semiconductor bare chip, and the like are mounted on the surface of the circuit molded product. Electronic component mounting structure. 2. In a circuit molded body having an electric circuit pattern formed on a surface of a resin molded body, an uneven portion is formed in a portion having an electric circuit pattern on a surface of the circuit molded body, and an electrode terminal of a semiconductor integrated circuit is formed in the concave portion. A semiconductor integrated circuit and an electronic component mounting structure characterized by a structure in which are connected. 3. In a circuit molded body having an electric circuit pattern formed on a surface of a resin molded body, an uneven portion is formed in a portion having an electric circuit pattern on a surface of the circuit molded body, and a conductive bonding agent is held in the concave portion. A semiconductor integrated circuit and an electronic component mounting structure, wherein an electrode terminal of the semiconductor integrated circuit and an electric circuit pattern are connected via a conductive bonding agent. 4. In a circuit molded body in which an electric circuit pattern is formed on a surface of a resin molded body, when the circuit molded body is viewed from a cross-sectional direction, there is a difference in height between arrangements of adjacent electric circuit patterns on the surface of the circuit molded body. A mounting structure for a semiconductor integrated circuit and an electronic component, wherein a mounting step is formed in one or more steps. 5. A mounting structure of a semiconductor integrated circuit and an electronic component, wherein a chip component or a semiconductor integrated circuit is arranged on one or more steps of the circuit molded body according to claim 4.