JP2002352710A - Manufacturing method of light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a light-emitting device, which is capable of effectively reducing fault phenomena such as light emission nonuniformity and waste of gas consumption at plural stages of a conventional sealing process for very small light-emitting devices, and also effectively miniaturizing the light-emitting device. SOLUTION: In this manufacturing method of a light-emitting device, a pair of electrodes 4, 5, of which the edges are disposed at a prescribed space, are formed in a material 3 having transparency for the wavelength of a laser beam 2, and the laser beam 2 irradiates the center between the electrodes 4 and 5, and a gap 7 is installed there.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a light emitting device by laser processing.

[0002]

2. Description of the Related Art Typical light emitting devices include lamps such as fluorescent lamps and sodium lamps, and light emitting devices for plasma displays. As one of the key technologies for manufacturing these devices, there are a sealing technique at a degree of vacuum enough to perform a discharge and a sealing technique for gases such as He and Xe necessary for light emission. Specifically, after vacuuming the inside of a light emitting device that seals a gas with a vacuum pump, and then applying heat to the inner wall that has been vacuumed to melt and seal the light emitting device, or a light emitting device such as air. This is a technique in which a gas already existing in the inside is expelled, the inside of the light emitting device is filled with a gas necessary for light emission, and then heat is applied to the inner wall filled with the gas to melt and seal the light emitting device.

[0003]

This conventional process has the problem of discharge or residual air inside the light emitting device. For example, when the inside of a plurality of light-emitting devices is very small, such as a plasma display, and particularly when the inside of a plurality of light-emitting devices is filled with a gas necessary for light emission at a time, the distance from a gas inlet, and the structure inside the discharge and light-emitting devices. As a result, unevenness occurs in the amount of air remaining inside each light emitting device, and as a result, unevenness also occurs in the amount of gas required for light emission. Further, in the conventional process, a plurality of complicated steps such as a step of purging a gas already existing inside the light emitting device such as air, a step of filling the inside of the light emitting device with a gas necessary for light emission, a step of sealing a necessary gas, and the like. Need. Further, it takes time to fill a gas necessary for light emission, and a gas for purging a gas already existing inside the light emitting device is required, which is wasteful in manufacturing.

[0004]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention is directed to a material having a pair of electrodes having ends provided at a predetermined interval therein and having a transparency to a wavelength of a processing laser. The center between the pair of electrodes is irradiated with a laser to provide a gap between the electrodes.

As a result, it is possible to reduce waste in manufacturing and significantly shorten the manufacturing time of the light emitting device.

[0006]

FIG. 1 is a view showing a method of manufacturing a light emitting device according to a first embodiment of the present invention. A laser beam 2 is applied between an electrode 4 and an electrode 5 of a workpiece 3. 3 shows a laser processing process for irradiation. FIG. 2 is a schematic view showing a state where a gap 7 is formed between the electrode 4 and the electrode 5 of the workpiece 3 after the laser processing, and a voltage is applied to the electrode to generate a discharge 8.

Here, the principle that a laser is focused inside a material that is transparent to the wavelength of the laser and a void is generated will be described. This phenomenon is a phenomenon in which ablation occurs inside the workpiece 3. That is, although the energy density is only at a level that cannot be processed on the surface, the energy density needs to exceed the processing threshold value inside. Further, in order to cause ablation inside, a laser having a wavelength that is basically low in laser absorption is used as a material. Therefore, it is necessary to increase energy inside the workpiece 3.
In a glass material such as general soda glass, the threshold of the energy density for processing on the surface is 1/1 of the internal threshold.
0, and in order to prevent processing on the back surface,
It is known that it is necessary to lower the internal threshold value to about の.

In FIG. 1, a laser 5 having a wavelength of 5
32 nm, pulse energy 2 mJ, pulse width, 78 n
Using the second harmonic of a Q-switched YAG laser, which is s, the light was condensed by the condenser lens 1 with a spot diameter of 50 μm. The main component of the laser transmitting material is silicon
Soda glass having a composition of oxygen and sodium is used for the workpiece 3. Tough pitch copper was used as the electrode material of the workpiece 3, and a space between the electrodes 4 and 5 of 50 μm was provided inside the glass so that a copper wire could be drawn from the inside of the glass to the outside.

When a portion between the electrode 4 and the electrode 5 is a processing portion 6 and the second harmonic of the Q-switched YAG laser is processed under the above-described laser processing conditions, a gap 7 having a size of about 50 μm is formed. The gap 7 irradiates the processing section 6 with the second harmonic of the Q-switched YAG laser, and the workpiece 3 of the processing section 6 absorbs the energy of the laser 2, thereby rapidly increasing the temperature of the processing section 6. It is considered that a sublimation phenomenon occurs, and a pressure due to the sublimation of the workpiece 3 is applied to form the void 7. In other words, although it is considered that molecules such as oxygen constituting glass exist inside the void 7, it is reported that the state of vacuum is high. In this state, when a voltage was applied between the electrode 4 and the electrode 5 as shown in FIG. 2, a discharge 8 was generated in the space 7. In this example,
A voltage of 25 V is applied between the electrode 4 and the electrode 5. This means that the voltage required to cause a discharge at room temperature and atmospheric pressure is one.
It referred to being 5000V with respect to cm.

FIG. 3 is a view showing a method of manufacturing a light emitting device according to a second embodiment of the present invention, in which a laser beam is applied between an electrode 4 and an electrode 5 of a workpiece 3 by laser processing. Shows the process.

FIG. 3 differs from FIG. 1 in that electrodes 4 and 5
Are each 5 μm longer, and this interval is 4 μm.
The point is 0 μm.

In this state, when the laser 2 is irradiated on the processing portion 6 between the electrode 4 and the electrode 5 under the above-described conditions, a gap 7 having a size of about 50 μm is formed. At this time, the ends of the electrodes 4 and 5 are processed by the laser, and exist as copper vapor in the voids 7. Therefore, when a voltage of 25 V was applied between the electrodes, green light emission was observed.

As described above, the manufacturing process of the light emitting device can be simplified, and the manufacturing time can be greatly reduced.

[0014]

As described above, according to the present invention, the conventional processing method is very small, and it is difficult to fill a plurality of light emitting devices at once with a gas required for light emission by a difficult sealing technique. Because a light emitting device is formed by forming a gap inside the workpiece, air and other gases do not remain inside the light emitting device from the outside, so that a constant light emission is obtained and a defect phenomenon such as unevenness occurs. To eliminate. In addition, as a disadvantage of the process, there are a plurality of complicated steps such as a step of purging gas already existing inside the light emitting device such as air, a step of filling the inside of the light emitting device with a gas necessary for light emission, a step of sealing a necessary gas, and the like. It is not necessary and can be integrated into one process.

Further, there is a possibility that further miniaturization of the light emitting device is expected.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a manufacturing process of a light emitting device according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a discharge of a light emitting device according to the present invention.

FIG. 3 is a schematic diagram of a manufacturing process of a light emitting device according to a second embodiment of the present invention.

[Explanation of symbols]

 2 Processing laser 3 Workpiece 4 Electrode (anode) 5 Electrode (cathode) 7 Void

Claims (3)

[Claims] 1. A pair of electrodes whose ends are provided at predetermined intervals are provided inside, and a laser is irradiated to the center between the pair of electrodes made of a material that is transparent to the wavelength of a processing laser. A method for manufacturing a light emitting device, wherein a gap is provided between the electrodes. 2. The method for manufacturing a light-emitting device according to claim 1, wherein the electrode is processed simultaneously when the gap is provided, and the electrode material is gasified and sealed in the gap. 3. The method of manufacturing a light emitting device according to claim 1, wherein the laser irradiation is performed at a processing threshold value or less on the front and back surfaces of the material and at a processing threshold value or more inside the material.