JP2002350797A - Optical shutter device and method of manufacturing for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical shutter device constituted to shield the light in the spacings between optical shutter chips by simple work and a method of manufacturing for the same. SOLUTION: This optical shutter device is constituted by fixing the plural optical shutter chips 10 consisting of PLZT, etc., having an electro-optic effect onto a supporting substrate 20 by means of adhesives 25. A light shielding material is injected into the spacings 15 between the respective chips 10 from an end 15a or 15b in a direction orthogonal with the juxtaposition direction (arrow X direction) of the chips 10 and the injected light shielding material is packed into the spacings 15 by capillarity. The adhesives 25 are applied onto the supporting substrate 20 so as not to close the end 15a or 15b to permit the inject thereof from the end 15a or 15b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical shutter device and a method of manufacturing the same, and more particularly, to a plurality of chips made of a material having an electro-optical effect provided with a plurality of light modulation regions for modulating light based on the action of an electric field. And a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, an optical shutter chip made of PLZT, which is a material having an electro-optical effect, is used to form an image on a photographic paper or film using a silver halide photosensitive material or an electrophotographic photosensitive member. There are provided various optical shutter devices that are arranged in a shape and control the light on and off one pixel at a time.

FIG. 6 shows an example of a conventional optical shutter device in which a plurality of chips 2 made of PLZT are arranged in a row on a support substrate 1 and drive ICs 9 are installed on both sides thereof to form a module.

In the conventional optical shutter device, since a plurality of chips 2 are arranged in a line, a minute gap 4 exists at the joint of each chip 2, and light is leaked from the gap 4. There was a problem that the material was exposed and the print quality deteriorated.

[0005] As a countermeasure, the present inventor has specifically proposed a flat electrode type chip in which drive electrodes are formed in a planar shape.
A method of injecting a light shielding material from the front surface or the back surface of the gap has been proposed (Japanese Patent Application No. 2001-4255). However, when a light shielding material is injected into the gap from the surface of the chip, the light modulation region (light shutter element) formed near the gap is prevented from being contaminated by the light shielding material. It is necessary to provide a sheet for preventing contamination in advance.
Also, in the case of injecting from the back surface of the chip, it is necessary to wipe off the light shielding material remaining on the back surface. In other words, this measure can provide the necessary light shielding to the gap, but requires complicated labor such as sticking and peeling of a contamination prevention sheet before and after the injection, and wiping off the residue.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an optical shutter device and a method for manufacturing the optical shutter device in which a gap between optical shutter chips is shielded by a simple operation.

[0007]

In order to achieve the above objects, a method of manufacturing an optical shutter device according to the present invention is directed to an electro-optical effect provided with a plurality of light modulation regions for modulating light based on the action of an electric field. In a method of manufacturing an optical shutter device in which a plurality of chips made of a material having the following are arranged in a line on a support substrate, fixing the plurality of chips on the support substrate via an adhesive, Injecting a light shielding material from the end of the gap in a direction orthogonal to the juxtaposition direction, and filling the gap with the injected light shielding material by capillary action.

In the manufacturing method having the above configuration,
The light shielding material is injected into the gap between the chips from the gap end in the direction orthogonal to the direction in which the chips are arranged, that is, from the end in the direction transverse to the gap. The injected light shielding material is filled in the gap by capillary action, and does not go around the front or back surface of the chip. Therefore, the light modulation region (light shutter element) is not contaminated with the light shielding material, and the trouble of attaching a contamination prevention sheet to the front surface or wiping the residue on the back surface can be omitted.

Further, the optical shutter device according to the present invention has a plurality of chips made of a material having an electro-optical effect provided with a plurality of light modulating regions for modulating light based on the action of an electric field in a row on a support substrate. In an optical shutter device juxtaposed,
Adhesive for fixing each chip on the support substrate is applied so as not to block the ends of the gaps between the chips in the direction orthogonal to the juxtaposition direction of the chips, so that the gaps between the chips are shielded from light. The material is filled by capillary action from an end of the gap in a direction orthogonal to the juxtaposition direction of the chips.

In the optical shutter device having the above-described structure, the adhesive for fixing each chip on the supporting substrate closes an end of the gap between the chips in a direction orthogonal to the direction in which the chips are arranged. The light-shielding material is applied to the gap between the chips from the end in the direction orthogonal to the juxtaposition direction of the chips in the gap, that is, the light-shielding material is surely applied from the end in the transverse direction to the gap. It can be injected, and the light-shielding material can easily and easily shield the edge of the chip without the light-shielding material wrapping around the front and back surfaces of the chip.

In the optical shutter device according to the present invention, in order to dispose the adhesive in the gap between the chips so as not to close the end, for example, the adhesive may be cut off at the end where the chips face each other. This is possible by using an adhesive having a viscosity that does not penetrate into the gap between the chips.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of an optical shutter device and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings.

(Manufacturing method, see FIGS. 1 to 3) In the manufacturing method according to the present invention, as shown in FIG. 1, a plurality of optical shutter chips 10 made of PLZT are placed on a support substrate 20 in the direction of arrow X. Ends 1 which are juxtaposed in a line and are perpendicular to the juxtaposition direction (the direction of arrow X) with respect to gaps 15 between chips 10.
From 5a (or from the other end 15b), using a syringe 30 such as a dispenser or a syringe, a light shielding material, for example,
Inject black ink. As shown in FIG. 2, the injected light shielding material 16 is filled in the gap 15 by capillary action, does not go around the front and back surfaces of the chip 10, and has a light modulation area (light shutter element 1) formed on the chip 10.
1, see Fig. 3).

As shown in FIG. 3, the optical shutter element 11 is formed between a common electrode 12 formed in the center of the chip 10 and individual electrodes 13 formed on both sides, and is arranged in the main scanning direction (X). Direction) in two rows. The configuration and operation of the optical shutter element 11 are conventionally well-known, and a description thereof will be omitted.

By the way, in order to inject the light shielding material 16 into the gap 15 from the side, the end 15a or 1
It is necessary to keep the gap of 5b. Specifically, as shown in FIG. 3, it is necessary to prevent the adhesive 25 applied to the edge of the slit 21 of the support substrate 20 for fixing the chip 10 from wrapping around the end 15a or 15b. .

(First Embodiment of Optical Shutter Device, See FIG. 4) FIG. 4 shows an optical shutter device as a first embodiment. In this optical shutter device, an adhesive 25 for fixing each chip 10 on the support substrate 20 so as to straddle the slit 21 is applied to the end 15 of the gap 15 between the chips 10.
This is applied on the support substrate 20 while avoiding a and 15b.

That is, since the adhesive 25 is omitted at the portions corresponding to the ends 15a and 15b, the light shielding material 16 can be injected from the side portions of the ends 15a and 15b.

(Second Embodiment of Optical Shutter Device, see FIG. 5) FIG. 5 shows an optical shutter device as a second embodiment. In this optical shutter device, each chip 10 is connected to the supporting substrate 2.
As the adhesive 25 for fixing over the slit 21 so as to straddle the slit 21, a material having a viscosity that does not enter the gap 15 between the chips 10 is used. The adhesive 25 is also applied to portions corresponding to the ends 15a and 15b of the gap 15, but a material having a viscosity that does not penetrate the gap 15 is selected.
5b can be injected from the side portion.

The viscosity of the light shielding material 16 that can be used in the second embodiment is determined according to the size of the gap 15 and the material of the chip 10, and for example, black ink having a viscosity of 100 cps or less may be used. it can.

(Other Embodiments) The optical shutter device and the method of manufacturing the same according to the present invention are not limited to the above embodiments, but can be variously modified within the scope of the invention.

For example, a detailed configuration of an optical shutter chip,
In particular, the configuration and shape of the optical shutter element and the electrode are arbitrary. Further, as the material having the electro-optic effect, various materials other than the above-mentioned PLZT can be used.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a manufacturing method according to the present invention.

FIG. 2 is a perspective view of an optical shutter device manufactured by the method shown in FIG.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIGS. 4A and 4B show an optical shutter device according to the first embodiment of the present invention, wherein FIG. 4A is a plan view and FIG.

5A and 5B show an optical shutter device according to a second embodiment of the present invention, wherein FIG. 5A is a plan view and FIG.

FIG. 6 is a plan view showing a main part of a conventional optical shutter device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Light shutter chip 11 ... Light modulation area (light shutter element) 15 ... Gap 15a, 15b ... End part 16 ... Light shielding material 20 ... Support substrate 25 ... Adhesive

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tomohiko Masuda 2-3-13 Azuchicho, Chuo-ku, Osaka-shi, Osaka Inside Osaka International Building Minolta Co., Ltd. (72) Inventor Yuji Kamoda Azuchi-cho, Chuo-ku, Osaka-shi, Osaka 2-313 Osaka International Building Minolta Co., Ltd. F-term (reference) 2H079 AA02 AA12 BA02 CA02 DA04 GA04 KA05

Claims (4)

[Claims] 1. A method of manufacturing an optical shutter device in which a plurality of chips made of a material having an electro-optic effect and having a plurality of light modulation regions for modulating light based on the action of an electric field are arranged in a line on a support substrate. Fixing a plurality of chips on a supporting substrate via an adhesive, injecting a light-shielding material into a gap between the chips from a gap end in a direction orthogonal to a direction in which the chips are arranged, and removing the injected light-shielding material. Filling the gap by capillary action. A method for manufacturing an optical shutter device, comprising: 2. An optical shutter device in which a plurality of chips made of a material having an electro-optical effect and having a plurality of light modulation regions for modulating light based on the action of an electric field are arranged in a line on a support substrate. Adhesive is applied so as not to cover the ends of the gaps between the chips in the direction orthogonal to the juxtaposition direction of the chips, and a light shielding material is provided in the gaps between the chips. An optical shutter device, wherein the gap is filled by capillary action from an end in a direction orthogonal to the juxtaposition direction of the chips. 3. The optical shutter device according to claim 2, wherein an adhesive for fixing each chip on the support substrate is omitted at ends where the chips are opposed to each other. 4. The optical shutter device according to claim 2, wherein the adhesive for fixing each chip on the supporting substrate has a viscosity that does not enter the gap between the chips.