JP2002346439A - Method and device for powder spraying used for powder spraying processing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the processing efficiency of powder spraying processing, by spraying powder to a substrate using a high-pressure gas instead of using a powder spray nozzle and thus homogenizing powder concentrations in the pressurized gas, when surface treatment is carried out by spraying powder. SOLUTION: A powder feed roller 16 having dents such as grooves and holes and the like on the periphery of the roller is installed adjacent to a high- pressure gas spray nozzle 20. A powder layer 12 filled with powder so as to be in contact with a part of the periphery of the powder feed roller is set up and, by rotating the powder feed roller 16, powder filling in the dents 11 of the powder feed roller is removed from the dents 11 by the flow of gas generated around the nozzle by a high-pressure gas sprayed from the high-pressure gas spray nozzle, and is fed in the high-pressured gas and sprayed on the processing substrate. An efficient powder spraying processing can be carried out thereby.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION A powder injection processing apparatus for performing various surface treatments by spraying various powders onto a processing material using a powder injection apparatus is used, for example, alumina or silicon carbide. By spraying powder of high hardness onto the processing material such as silicon wafer, glass, ceramic, compound semiconductor, metal, etc., it cuts the workpiece and performs sandblasting to form holes and grooves in the workpiece. A typical dry etching process, in which powder such as glass beads or high-speed steel beads is sprayed onto the metal to increase the hardness of the metal surface by the impact heat of the powder colliding with the workpiece. Heat treatment, using powder such as metal powder or thermoplastic resin powder to melt the surface of the powder by the impact heat of the powder hitting the workpiece Powder deposition processing for attaching a thin film of these materials to the surface of a workpiece such as glass, ceramic, and resin, and cleaning processing for removing dirt attached to the surface of the workpiece by spraying powder on the surface of the workpiece Various processes are performed.

[0002] The present invention relates to a powder injection method and apparatus for efficiently and stably performing powder injection processing using a horizontally long nozzle in these processings using a powder injection processing apparatus.

[0003]

2. Description of the Related Art Conventionally, as a method of performing processing using a powder injection processing apparatus, for example, an abrasive is used as a powder, and the abrasive is sprayed onto a processing substrate using high-pressure air to form a partition of a plasma display. Sandblasting for performing cutting such as polishing of the surface of a silicon wafer is performed, and an apparatus as shown in FIG. 6 is used as a powder injection processing apparatus used for the sandblasting.

The powder is supplied to a powder supply device 1 together with the high-pressure gas 1.
From 0 to a powder supply pipe 28 such as a powder supply hose,
The powder and the high-pressure gas are mixed and injected onto the processing substrate 7 from the horizontally long powder injection nozzle 20 attached to the powder supply pipe 28.

[0005] The powder injected from the powder injection nozzle 20 is supplied from the hopper 33 to the main conduit 3 by the negative pressure of the dust collector 35.
4, only the powder that has been classified into a classifier 32 such as a cyclone and used for processing enters the powder tank 21, and is again supplied from the powder supply device 10 to the powder injection nozzle 20 via the powder supply pipe 28. It is injected.

[0006] Dust that has shaved the processed substrate and dust that has been crushed and cannot be used are collected in a dust collector 35.

As described above, the powder is circulated and injected from the powder injection nozzle 20, and can be processed continuously.

The powder injection nozzle 20 uses a horizontally long nozzle in order to improve the uniformity of processing. The substrate to be processed is sent slowly from left to right in the main body of the powder injection processing apparatus. It moves back and forth to process the substrate.

[0009] In the powder injection processing apparatus currently used for forming the partition of the plasma display, the moving speed of the nozzle is about 20 m per minute, and the moving speed of the processing substrate is about 200 to 400 mm per minute. is there.

[0010]

In powder injection processing in which powder is injected by high-pressure gas for processing, when the amount of powder is large relative to the amount of high-pressure gas, powder is applied on the injected powder. A phenomenon occurs in which the body is sprayed, and the processing efficiency is reduced. In addition, when the amount of the powder is reduced, the number of particles hitting the processing substrate 7 is reduced, and the processing efficiency is similarly reduced.

In order to perform efficient powder injection processing,
It is necessary that the concentration of the powder injected from the powder injection nozzle 20 be substantially the same at any location in the nozzle.

In the conventional powder injection processing apparatus, the powder injection nozzle 2 is connected to the powder injection nozzle
Since the powder is supplied to the nozzle 0, when a horizontally long nozzle is used, the powder concentration near the center of the nozzle increases, and the powder concentration decreases with distance from the center. However, there is a problem that efficient processing cannot be performed.

Since powder is supplied from the powder supply device 10 to the powder supply nozzle 20 via the powder supply tube 28, the powder is supplied from the powder supply device to the powder supply tube stably. Even when the powder flow fluctuates inside the powder supply pipe, the powder is not supplied stably inside the nozzle when the powder is injected from the powder injection nozzle, and uniform processing cannot be performed. There was a problem.

Further, the powder injection nozzle 20 used in the powder injection device changes its injection state when worn out and cannot always perform stable processing. Therefore, the nozzle tip at the tip is generally made of boron carbide having a high hardness. However, high hardness makes processing difficult and the price of the nozzle expensive, raising the processing cost of powder injection processing and making large nozzles difficult. There is a problem that it is difficult to manufacture a nozzle that can be used.

[0015]

As means for solving the above problems, as shown in FIGS. 1 and 2, a powder supply roller 16 having a concave portion such as a groove or a hole formed on the circumference of the roller, The powder layer 12 is provided so as to be in contact with a part of the circumference of the roller, the high-pressure gas injection nozzle 25 is installed close to the powder supply roller 16, and the powder supply roller 16 is rotated by a driving means such as a motor. After the powder supply roller concave portion 11 passes through the powder layer 12 to fill the powder 5 into the powder supply roller concave portion, the high pressure gas injection nozzle 25 installed close to the powder supply roller provides high pressure. Gas 1 was injected.

Since the injected high-pressure gas is injected while taking in the peripheral gas, a gas flow taking in the peripheral gas is generated near the high-pressure gas injection port 23, and this gas flow causes the gas flow to approach the high-pressure gas injection nozzle. The powder contained in the powder supply roller concave portion 11 is taken out, the powder is supplied into the injected high-pressure gas, and the powder is injected together with the high-pressure gas.

The slit width of the high-pressure gas injection port 23 of the high-pressure gas injection nozzle 25 to be injected and the powder supply roller recess 11
By adjusting the size and depth of the powder, it is possible to stably eject powder of a certain concentration, and it is suitable for processing by freely adjusting the number of revolutions of the powder supply roller 16 with an inverter or the like. It is possible to adjust the powder supply amount for supplying the injected amount of powder into the high-pressure gas.

The high pressure gas injected from the high pressure gas injection nozzle 25 without using the powder injection nozzle causes the flow of the gas to take in the surrounding gas, so that the powder supply roller recess 11 is formed.
The powder inside is taken out and taken into the high-pressure gas, so that the powder is sprayed together with the high-pressure gas onto the workpiece. Injection system that can perform stable processing because there is no powder, can reduce the processing cost of powder injection processing, and can process a large area at once because the powder injection nozzle that requires a high hardness injection nozzle tip is unnecessary Becomes possible.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a powder injection method and apparatus in powder injection processing according to the present invention will be described below with reference to the drawings.

In the powder injection processing apparatus shown in FIG.
It is sprayed toward the processing substrate 7 within 0.

The high-pressure gas injection nozzle 25 and the powder supply device 10 do not need to be inside the processing chamber 30. The high-pressure gas injection nozzle may be located outside the processing chamber and the powder may be injected into the processing chamber from the high-pressure gas injection nozzle. It may be installed inside.

The powder injected from the high-pressure gas injection nozzle is sprayed on the processing substrate 7, passes through the main conduit 34 by the negative pressure of the dust collector 35, and is connected to the dust collector 35 and the dust collector conduit 39 via a classifier such as a cyclone. Enter 32.

In the classifier 32, the powder that can be used again for processing, the powder that has been crushed and cannot be used, and the dust obtained by shaving the processed substrate are separated, and only the powder that can be used for processing is separated from the powder supply tank 21 by the classifier 32. The dust that has been crushed and cannot be used and the dust obtained by shaving the processed substrate are collected by the dust collector 35 and discarded. The powder that has entered the powder supply tank 21 enters the powder supply device 10 again, and the powder 5 is supplied from the powder supply roller 16, and the powder is injected by the high-pressure gas injection nozzle 25 to perform powder injection processing.

The method for supplying the powder into the high-pressure gas injected from the high-pressure gas injection nozzle 25 is as follows: the powder is supplied from the powder supply device 10 connected to the powder supply tank 21 as shown in FIG. The body supply device 10 includes a powder supply roller 16 having a concave portion such as a groove and a hole formed on the roller surface, and a powder layer 12 provided to be in contact with a part of the circumference of the powder supply roller 16. The concave portion 11 of the roller has, for example, a V-shaped groove formed on the circumference at a constant interval substantially in parallel with the circumference of the roller, and a V-shaped groove formed on the circumference at a constant interval substantially perpendicular to the circumference of the roller. Anything such as the one formed on the top, the one formed with a V-shaped groove in the outer periphery of the roller in a screw shape, the one formed with a large number of circular holes, the one formed with a large number of elliptical holes, etc. There is a concave recess,
It suffices if the powder is filled therein.

A high-pressure gas injection nozzle is installed close to the outer periphery of the powder supply roller 16 within 20 mm, preferably within 10 mm.

When the high-pressure gas is injected from the high-pressure gas injection nozzle 25, the flow of the high-pressure gas causes a gas flow to take in the gas around the high-pressure gas.

When the powder supply roller 16 is installed near the high-pressure gas injection port 23 of the high-pressure gas injection nozzle 25, the powder in the powder supply roller can be taken into the high-pressure gas by the gas flow. The powder is injected by the high-pressure gas injected from the high-pressure gas injection nozzle 25,
Powder injection processing can be performed on the substrate.

In order to supply the powder into the high-pressure gas, the high-pressure gas injected from the high-pressure gas injection nozzle 25 is injected at a pressure of 0.05 MPa or more, preferably 0.1 MPa or more. .

When processing the entire surface of the processing substrate 7 uniformly,
The injection width of the high-pressure gas injection nozzle 25 and the length of the powder supply roller recess 11 are made wider than the processing width of the processing substrate 7, and the slit width of the high-pressure gas injection nozzle 25, the depth of the powder supply roller recess 11, and The high-pressure gas injection nozzle 2 has a fixed size and is set so that uniform processing can be performed on any part, so that the injected powder uniformly hits the entire surface.
The processing is performed such that the processing substrate 7 is moved vertically or the processing substrate 7 is fixed and the powder supply device 10 and the high-pressure gas injection nozzle 25 are moved with respect to the wide direction of 5.

If the width of the high-pressure gas inlet 24 of the high-pressure gas injection nozzle 25 and the width of the high-pressure gas injection port 23 are made equal, a phenomenon occurs in which the end portion of the injected high-pressure gas moves inward as the distance from the nozzle increases. It is desirable that the width of the injection port 23 be set wider than the high-pressure gas introduction unit 24.

The powder supply unit may be installed on one side of the high-pressure gas injection nozzle 25 as shown in FIG. 3, or may be installed on both sides of the high-pressure gas injection nozzle 26 as shown in FIG. When the injection amount and the supply amount of the powder increase, it is desirable to install them on both sides.

From the powder layer 12 to the powder supply roller recess 11
Vibration is applied to the powder supply tank 21 and the powder supply device 10 by a vibrator 36 or the like to fill the
It is desirable to make it easier for the powder to enter the recess 11 of the powder supply roller.

The powder supply roller 16 adjusts the number of revolutions by using an inverter or the like to thereby control the powder injection nozzle 2.
It becomes possible to adjust the injection amount of the powder injected from 0.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific examples of the embodiments of the above-described powder injection method and apparatus in the powder injection processing apparatus of the present invention will be described below with reference to the drawings.

The concave portion 11 of the powder supply roller was formed with a screw-shaped groove having a depth of 0.5 mm on the roller surface. The length of the concave portion 11 of the powder supply roller was 550 mm and the outer diameter was 35 mm.

The slit width of the high-pressure gas injection nozzle 25 was 0.3 mm, and the length of the slit portion was 550 mm.

The high-pressure gas injection nozzle 25 is disposed 0.2 mm away from the outer periphery of the powder supply roller 16, and the injection port is provided in parallel with the outer periphery of the powder supply roller, with the injection port facing downward. Position is powder supply roller 1
The position was 5 mm below 6 centers.

By supplying the powder into the processing chamber 30, the powder is supplied from the processing chamber 30 into the powder supply tank 21 via the cyclone 32.

The vibrator 36 applies vibration to the powder supply tank 21 and the powder supply device 10 so that the powder can easily enter the powder layer 12 and the concave portion 11 formed on the outer periphery of the powder supply roller.

After the powder is filled in the powder layer 12 of the powder supply device 10, the powder supply roller 16 is rotated by using a motor. The powder is supplied to the flow of the high-pressure gas injected and injected from the high-pressure gas injection nozzle 25 and is injected onto the processing substrate 7 in the processing chamber.

The powder used was spherical silica having an average particle diameter of 20 μm.
The high-pressure air of Pa is injected, and the low-melting glass used for the back plate of the 20-inch plasma display is 180 μ deep.
m, pattern cutting was performed.

The formed pattern was a line pattern having a line width of 80 μm and a pitch of 320 μm. A photosensitive dry film used as a masking material for pattern formation was a dry film for sandblasting manufactured by Nippon Synthetic Chemical Industry.

[0043]

The effect of the present invention is as follows. In the conventional powder injection processing apparatus, the powder supply apparatus 10 and the powder injection nozzle 20 are separated, and the powder supply pipe 28 such as a powder supply hose is used. Since the supply device 10 and the powder injection nozzle 20 are connected, even if a certain amount of powder is sent from the powder supply device 10 to the powder injection nozzle 20, the flow of the powder is disturbed inside the powder supply pipe 28. However, the powder supply pipe and the powder injection nozzle were eliminated, and the powder supply unit and the high-pressure gas injection nozzle 25 were brought close to each other to integrate the high-pressure gas injected from the high-pressure gas injection nozzle. By supplying the powder in the powder supply section directly to the hopper, stable injection became possible.

Further, since powder is conventionally supplied from the powder supply pipe 28 to the horizontally elongated powder injection nozzle 20, the amount of powder is increased only in the central portion of the nozzle, and the powder concentration in the nozzle is uniformly controlled. However, by rotating the powder supply roller 16 having a concave portion such as a groove or a hole on the outer periphery as the powder supply portion, the powder was supplied from the high-pressure gas injection nozzle 25 close to the powder supply roller 16. In order to supply into the injected high-pressure gas, the powder to be supplied into the injected high-pressure gas by changing the size and depth of the concave portion on the outer periphery of the powder supply roller according to the width of the gap of the high-pressure gas injection nozzle 25 The powder having the optimum concentration for processing can be supplied to the high-pressure gas injection nozzle 20 by changing the number of revolutions by the inverter of the powder supply roller 16.
It is possible to uniformly supply the gas into the high-pressure gas injected from the nozzle and improve the processing efficiency.

Conventionally, since the concentration in the powder injection nozzle could not be made constant, in order to perform uniform processing, both the processing substrate 7 and the powder injection nozzle 20 were moved so as to be perpendicular to perform uniform processing. Although it was necessary, the width of the high pressure gas injection nozzle 25 and the recess 11 of the powder supply roller
By making the size and depth of the powder constant, the powder concentration in the high-pressure gas injected can be made constant, and any part injected from the high-pressure gas injection nozzle can have the same processing capability, By making the length of the high-pressure gas injection port 23 of the high-pressure gas injection nozzle and the concave portion 11 of the powder supply roller larger than the width of the processing substrate 7, the powder supply device 10
The processing substrate 7 can be uniformly processed only by moving one of the processing substrates 7 in a certain direction, and the size of the powder injection processing apparatus can be made smaller than before.
The number of driving units can be reduced as compared with the conventional case.

Also, without using the powder injection nozzle 20, the high-pressure gas injected from the high-pressure gas injection nozzle 25 takes in the surrounding gas to take out the powder in the powder supply roller concave portion 11 and take out the powder in the high-pressure gas. Since the powder is injected into the processing substrate 7 together with the high-pressure gas by taking the powder into the substrate, there is no need to use a material having high hardness such as boron carbide since there is no wear portion due to the powder, and the production of the powder injection system Inexpensive and easy to carry out, it has become possible to reduce the processing cost of powder injection processing and to manufacture a large-sized powder injection system for processing large substrates.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an outline of a powder injection device of the present invention.

FIG. 2 is an explanatory view of a cross section showing an outline of a powder supply device of the present invention.

FIG. 3 is a side sectional view showing the powder injection device according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view of an apparatus provided with two supply portions in the powder supply apparatus of the present invention.

FIG. 5 is a perspective view showing an outline of a powder injection processing apparatus using the powder injection apparatus of the present invention.

FIG. 6 is an explanatory view showing an outline of a conventional powder injection processing apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 high-pressure gas 4 high-pressure gas supply port 5 powder 6 powder + high-pressure gas 7 processing substrate 10 powder supply device 11 powder supply roller recess 12 powder layer 16 powder supply roller 17 high-pressure gas layer 19 powder take-out unit 20 Powder injection nozzle 21 powder supply tank 23 injection port 24 high-pressure gas introduction unit 25 high-pressure gas injection nozzle 26 powder injection device 27 powder level holding unit 28 powder supply tube (powder supply hose) 29 anti-vibration rubber 30 processing room Reference Signs List 31 main body of powder injection processing apparatus 32 classifier (cyclone) 33 hopper 34 main body conduit 35 dust collector 36 vibrator 39 dust collection conduit 40 nozzle driving unit

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B24C 1/00 B24C 1/00 Z 5/02 5/02 C 7/00 7/00 D H01L 21/304 601 H01L 21/304 601S F term (reference) 4D075 AA01 AA22 AA71 AA84 AA85 BB04Y BB12X BB93Y DA06 DB01 DB11 DB13 DB14 DC22 DC24 EA02 EB01 4F033 BA01 BA05 CA05 DA01 EA01 QB02Q QB05 QB12 QB05 QB02 QB05 QB12

Claims (4)

[Claims] In a powder jetting process for performing a surface treatment by spraying a mixture of a gas and a powder on a substrate with a high-pressure gas using a powder, a powder supply device and a high-pressure gas jet nozzle are used. It is characterized in that the powder supplied from the powder supply device is sprayed onto the substrate with a high-pressure gas of 0.05 Mpa or more injected from the high-pressure gas injection nozzle without using the powder injection nozzle. Powder injection method in powder injection processing. 2. The powder injection method according to claim 1, wherein the powder is filled so as to be in contact with a part of the circumference of the powder supply roller having a recess such as a groove and a hole formed on the circumference of the roller. After supplying the powder to the groove of the powder supply roller that has passed through the powder layer by rotating the powder supply roller, the high-pressure gas injection nozzle is brought closer to the powder supply roller to 20 mm or less. Then, the powder is taken out from the powder supply roller by the gas flow generated by the high-pressure gas of 0.05 Mpa or more injected from the high-pressure gas injection nozzle, and the powder is extracted from the powder supply roller by the high-pressure gas injected from the high-pressure gas injection nozzle. A powder injection device characterized by spraying on a material. 3. The high-pressure gas injection nozzle according to claim 1, wherein an arbitrary set amount of powder is injected from a high-pressure gas injection nozzle by rotating said powder supply roller at a predetermined rotation speed. A powder injection device, wherein the powder is supplied to a gas and the powder is sprayed on a substrate by a high-pressure gas injected from a high-pressure gas injection nozzle. 4. The powder injection processing according to claim 1, wherein a vibration is applied to the powder supply tank and / or the powder supply device in order to fill the powder supply roller recess with the powder. Powder supply method in powder injection processing.