JP2002344032A - Thermoelectric element array unit, manufacturing method therefor, and thermoelectric module using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a thermoelectric element array unit, in which p-type and n-type thermoelectric elements are arranged for easy manufacture. SOLUTION: P-type element fixing-fitting through-holes 33 and n-type element fitting through-holes 35 are arranged adjacent to each other on a first insulation spacer 15a, a p-type thermoelectric element 1a is inserted and fixed to each of the p-type element fixing-fitting through-holes 33 to form a first array unit 41, n-type element fixing-fitting through-holes 34 and p-type element fitting through-holes 36 are arranged adjacent to each other on a second insulation spacer 15b, and an n-type thermoelectric element 1b is inserted and fixed to each of the n-type element fixing-fitting through- holes 34 of the second insulation spacer 15b, to form a second array unit 42; and the first array unit 41 and the second array unit 42 are made to overlap with each other, the p-type thermoelectric elements 1a are inserted into the p-type element fitting through-holes 35 of the second array unit 42, and the n-type thermoelectric elements 1b are inserted into the n-type element fitting through-holes 36 of the first array unit 41, so that the p-type thermoelectric elements 1a and n-type thermoelectric elements 1b are arranged alternately adjacent to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric element array unit in which thermoelectric elements such as a Peltier element for cooling and heating by applying an electric current and a Seebeck element for generating electric power are arranged and made into a unit, and the production thereof. The present invention relates to a method and a thermoelectric module using a thermoelectric element array unit.

[0002]

2. Description of the Related Art A Peltier device generally known as a thermoelectric device is obtained by adding an element such as antimony or selenium to an intermetallic compound such as bismuth tellurium to obtain p, n.
A p-type element is formed, and the p-type and n-type elements are alternately arranged in series with an injection electrode interposed therebetween. A voltage is applied to both ends of the series element, and a current is caused to flow. This is an element that produces an effect, and FIG.
The configuration shown in FIG.

The specific configuration of a Peltier element is p,
The insulating substrates 3 and 4 made of a thin ceramic plate or the like made of alumina (Al ₂ O ₃ ) or the like having a thickness of about 0.3 to 1 mm on which electrodes 2 and the like for connecting the n thermoelectric elements 1 in series are formed. P-type and n-type bismuth having a diameter of about 0.6 to 3 mm and a length of about 0.5 to 3 mm between the electrodes 3 and 4.
A thermoelectric element 1 made of tellurium or the like is arranged. The thermoelectric element 1 and the electrodes 2 and the lead element electrodes 5 are fixed by solder or the like (not shown). In the figure, reference numeral 6 denotes a lead terminal.

Conventionally, thermoelectric elements 1 are generally manufactured by the following two methods. Ingot cutting method: Bi ₂ Te ₃ is added with an appropriate amount of an element such as selenium, antimony, etc.
Using a Bridgman furnace or the like, an ingot having a diameter of several tens of centimeters was prepared from the melt maintained at 0 ° C. as shown in FIG.
As shown in FIG. 5B, the wafer 8 is cut by a cutting means such as a dicer 9 to form the device 1 having the predetermined dimensions. The p-type and n-type elements 1 are separately manufactured by adjusting the alloy composition.

In-mold growth method: As shown in the perspective view of FIG.
0, fixed by a positioning / fixing means (not shown), and immersed in a melt 11 maintained at 700 ° C. to 900 ° C. obtained by adding an appropriate amount of elements such as selenium and antimony to Bi ₂ Te ₃ as shown in FIG. Then, by pulling up the mold 10 from the melt, a prismatic or columnar element shown in FIG. As shown in FIG. 14, the obtained element was attached to a fixing jig (not shown), and then was 0.5 to 3 m in length.
The thermoelectric element 1 is cut into a predetermined dimension of about m and incorporated into a module. The addition of selenium to Bi ₂ Te ₃ results in a p-type thermoelectric element material, and the addition of antimony to Bi ₂ Te ₃ results in an n-type thermoelectric element material.

Next, a method for assembling the thermoelectric element 1 to produce a thermoelectric module will be described. Conventionally, the following two manufacturing methods (assembly methods) have been employed. Direct assembly method: As shown in FIG. 16, a ceramic alignment jig 12 made of alumina or the like is placed on a circuit board 4 made of alumina or the like on which electrodes 2 are formed in advance and solder is formed by plating or the like. The p-type and n-type thermoelectric elements 1 cut to a predetermined size are alternately placed in the arrangement holes 13 of the alignment jig 12, and are fixed between the thermoelectric elements 1 and the electrodes 2 of the substrate 4 in a tunnel furnace. After the fixing, the alignment jig 12 is removed, the circuit board 3 is mounted on the upper side, heat treatment is performed in the same manner, and the thermoelectric module is fixed by soldering or the like.

[0007] Spacer assembly method: Thermoelectric element 1 is
As shown in (a), a plurality of insulating spacers 15 made of a thin ceramic or glass / epoxy resin or the like provided with through holes 14 corresponding to a predetermined number are arranged at a predetermined distance from each other, and a p-type, The n-type elements 1 are pierced alternately while keeping the rod shape, and an epoxy adhesive is applied between the through hole 14 and the thermoelectric element 1 and cured to be fixed. Thereafter, the integrated body is attached together with the spacer to a cutting jig (not shown), and the thermoelectric element 1 is cut along the cutting line 16 by a cutting means such as a dicing saw as shown in FIG. And
The thermoelectric element array unit shown in FIG.
Then, a spacer / element complex 17 in which a plurality of p-type and n-type thermoelectric elements 1 are alternately arranged and fixed is formed. After this step, the substrates 3 and 4 are arranged above and below the thermoelectric element array unit 17 by the same solder fixing method as the direct assembly method,
The thermoelectric module shown in FIG. 9B is obtained.

The thermoelectric element 1 based on Bi ₂ Te ₃ is usually difficult to make good electrical and mechanical connection by soldering directly to an electrode material made of copper or silver. Ni. In most cases, Au plating or the like is used. In this case, as shown in FIG. 10, a coating 19 for insulation for forming a plating resist or the like is provided in the intermediate portion of the thermoelectric element 1 to form a plating 19.

[0009]

In both the ingot cutting method and the in-mold growth method, a small-diameter and short thermoelectric element 1 is required.
Is cut into p and n, respectively, when plating the ends, there is a problem that a plating short-circuit easily occurs between both terminals. For this purpose, as shown in FIG. 10, one resist coating 18 for preventing the plating from adhering to the intermediate portion is surely applied, and the plating is performed so as not to impair the heat radiation characteristics of the thermoelectric element 1. Later, the coating 18 was completely removed. However, there was a problem that the process was complicated and a large number of steps were required to completely cover and remove the coating 18.

Further, many of the thermoelectric element 1 was made by mold growth method as shown in FIG. 17, in the method of gradually inserted into the through hole 14 of the insulating spacer 15, the Bi ₂ T
e ₃ alloy is extremely brittle, and because of its deformable properties to small stresses, the following elements 1 1 mm must take through holes themselves than 1.2 mm, in the element cooling surface of the thermoelectric module There is a problem that it is difficult to arrange the elements 1 at a high density, which is a condition for maintaining the heat uniformity.

Although this method has an advantage that the short-circuit phenomenon does not occur at both ends of the thermoelectric element due to the presence of the spacer 15, the application, drying and curing of an epoxy adhesive for integrating the spacer 15 and the through hole 14 are performed. And the disadvantage that it is difficult to remove the epoxy resin from the protruding portion so as not to impair the heat dissipation.

Further, in any of the methods, it is extremely troublesome to arrange the p and n elements 1 alternately by hand.
An expensive component insertion / placement machine has to be used for automation, and even in this case, there is a problem that it takes time to arrange each of them.

According to the present invention, a large number of thermoelectric elements can be easily formed without cutting or inserting each of the p and n thermoelectric elements, hardly causing plating short circuit, and without using epoxy resin or the like. Another object of the present invention is to provide a thermoelectric element array unit that can be arranged at high density, a method of manufacturing the same, and a thermoelectric module using the thermoelectric element unit.

[0014]

Means for Solving the Problems In order to achieve the above object, the present invention has the following structure to solve the problems. That is, the thermoelectric element array unit of the first invention comprises a first insulating spacer in which a plurality of p-type element fixing and fitting through holes and a plurality of n-type element fitting through holes are formed adjacent to each other; A second insulating spacer in which a plurality of joint through holes and a plurality of p-type element fitting through holes are formed adjacent to each other;
A first arrangement unit is formed by inserting and fixing a p-type thermoelectric element in each of the mold element fixing and fitting through holes, and an n-type element fixing and fitting hole in each of the second insulating spacers. Are arranged and fixed to form a second arrangement unit, and the first arrangement unit and the second arrangement unit are superposed and arranged to be a p-type thermoelectric element fixed to the first arrangement unit. The element is inserted into the through hole for fitting the p-type element of the second array unit, and the n-type thermoelectric element fixed to the second array unit is the through hole for fitting the n-type element of the first array unit. The p-type thermoelectric element and the n-type thermoelectric element are arranged alternately next to each other to solve the problem.

The thermoelectric element array unit according to a second aspect of the present invention is the thermoelectric element arrangement unit according to the first aspect of the present invention, wherein the p-type thermoelectric element and the n-type thermoelectric element include a first insulating spacer and a second insulating element. This is a means for solving the problem with a configuration that protrudes from both front and back surfaces of the conductive spacer.

Further, the thermoelectric element array unit according to the third aspect of the present invention is the same as the first or second aspect of the invention, further comprising
The insulative spacer and the second insulative spacer are arranged to overlap each other with an interval therebetween to solve the problem.

Further, in the method of manufacturing a thermoelectric element array unit according to the fourth invention, at least one pair of through holes corresponding to the plurality of through holes for fixing and fixing the p-type elements formed in the first insulating spacer. The p-type element forming laminate is formed by superposing the p-type element forming means on the front and back surfaces of the first insulating spacer so that the holes are aligned and detachably integrating the p-type element forming laminate. Is immersed in the melt of the material of the p-type element to fill the hole in the p-type element formation laminate with the melt, and then cooled and cured to form the p-type thermoelectric element in the hole of the p-type element formation laminate. Forming the first arrangement unit in which a plurality of p-type thermoelectric elements are arranged in the first insulating spacer by removing the p-type element forming means from the first insulating spacer. And a plurality of n-type elements formed on the second insulating spacer At least a pair of n-type element forming means having through holes corresponding to the through holes for fixed fitting are superposed on the front and back surfaces of the second insulating spacer so as to be detachably integrated by aligning the hole positions. Forming an element-forming laminate, immersing the element-forming laminate in a melt of an n-type element material, filling the holes in the n-type element-forming laminate with the melt, and then cooling and curing to form n Mold thermoelectric element is formed in the hole of the n-type element forming laminate, and then the n-type element forming means is removed from the second insulating spacer to form a plurality of n-type thermoelectric elements in the second insulating layer. Obtaining a second arrangement unit arranged on the conductive spacer, and stacking the obtained first and second arrangement units to form a p-type thermoelectric element fixed to the first arrangement unit. The second array unit is inserted through the p-type element fitting through hole, and the second An n-type thermoelectric element fixed to a row unit is inserted into an n-type element fitting through hole of the first array unit, and the p-type thermoelectric element and the n-type thermoelectric element are alternately arranged side by side. This configuration is a means of solving the problem.

Further, a thermoelectric module according to a fifth aspect of the present invention includes:
The thermoelectric element array unit of the first, second, or third invention is disposed between the upper and lower substrates, and an end of each thermoelectric element is connected to an electrode on each of the upper and lower substrates to form a p-type thermoelectric element. This is a means for solving the problem with a configuration in which n-type thermoelectric elements are alternately connected in series.

In the thermoelectric element array unit of the present invention,
The first arrangement unit is formed by inserting and fixing the p-type thermoelectric elements into the p-type element fixing fitting through holes of the first insulating spacer, respectively, and the n-type element fixing fitting of the second insulating spacer. The second arrangement unit is formed by inserting and fixing the n-type thermoelectric elements through the through holes, respectively, and the first arrangement unit and the second arrangement unit are arranged so as to be overlapped with each other to form the p-type thermoelectric element. And the n-type thermoelectric elements are alternately arranged side by side.

It should be noted that p fixed to the first array unit
The thermoelectric element of the type is inserted into the through hole for fitting the p-type element of the second array unit, and the n-type thermoelectric element fixed to the second array unit is the through-hole for fitting the n-type element of the first array unit. It is inserted through the hole.

As described above, the thermoelectric element array unit of the present invention is formed by overlapping the first array unit and the second array unit, and the method of manufacturing the thermoelectric element array unit of the present invention In the first and second insulating spacers, a plurality of
Mold, an n-type thermoelectric element to form the first array unit and the second
Can be manufactured separately, and the first and second array units can be formed by overlapping, so that the thermoelectric element array unit of the present invention can be easily manufactured.

In other words, in the thermoelectric element array unit of the present invention, the p-type and n-type element fixing fitting through-hole wall surfaces formed on the first and second insulating spacers respectively, and the p-type,
In fixing the n-type thermoelectric element, the thermoelectric element material in a molten state is fixed by a solidifying fixing force that solidifies, so that the use of an adhesive is unnecessary.

Therefore, in the thermoelectric element array unit of the present invention, the adhesive is applied by using the adhesive,
This eliminates the need for complicated and inefficient operations such as drying, and removes the impediment to heat dissipation caused by the adhesive, so that a high-quality thermoelectric element array unit with high reliability can be provided at low cost. The reliability and performance of the thermoelectric module using the array unit can be improved, and at the same time, the cost reduction of the productivity improvement can be achieved.

Further, the thermoelectric element array unit of the present invention comprises:
Since the first and second arrangement units can be formed in separate steps as described above, for example, compared to a case where both the p-type thermoelectric element and the n-type thermoelectric element are inserted and fixed in one insulating spacer. The thermoelectric element array unit can be easily formed.

That is, for example, p is added to one insulating spacer.
Care must be taken when inserting and fixing both the thermoelectric element and the n-type thermoelectric element, and when forming the thermoelectric element on one side in the through hole of the insulating spacer, the material of the other thermoelectric element Although it is necessary to perform masking so as not to adhere thereto, masking is not required in the present invention, and manufacture of the thermoelectric element array unit becomes easy.

After the formation of one thermoelectric element, the previously formed thermoelectric element was immersed in a melt of the material of the thermoelectric element for forming the other thermoelectric element in a masked state, thereby forming the first thermoelectric element. There is no fear of adversely affecting the thermoelectric element characteristics, and the yield of the thermoelectric element array unit can be improved.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same components as those of the conventional example will be denoted by the same reference numerals, and redundant description will be omitted or simplified. FIG. 1A shows an embodiment of a thermoelectric element array unit according to the present invention in an exploded state, and FIG. 1B shows a thermoelectric element array unit 17 of this embodiment. Is a perspective view, and FIG. 3C is a cross-sectional view taken along line AA ′ of FIG.

As shown in these figures, the thermoelectric element array unit 17 of the present embodiment comprises a first array unit 41.
And the second arrangement unit 42 are overlapped and arranged.

The first arrangement unit 41 has a thickness of 0.1 to
It has a first insulating spacer 15 (15a) made of a heat-resistant substrate such as a ceramic of about 1 mm. The first insulating spacer 15a has a diameter of, for example, as shown in FIG. 0.6 mm p-type element fixing fitting through hole 33
And a plurality of n-type element fitting through holes 35 slightly larger than 0.6 mm in diameter are formed adjacent to each other.
As shown in FIG. 1, the first arrangement unit 41 includes a through hole 33 for fixing and fitting the p-type element in the first insulating spacer 15a.
Are respectively formed by inserting and fixing a p-type thermoelectric element 1 (1a).

The second array unit 42 has a thickness of 0.1 mm.
The second is made of a heat-resistant substrate such as ceramic of about 1 to 1 mm
As shown in FIG. 6B, the second insulating spacer 15b has, for example, a through hole for fixing an n-type element having a diameter of 0.6 mm. A plurality of p-type element fitting through holes 36 each having a diameter slightly larger than 0.6 mm are formed adjacent to each other. As shown in FIG. 1, the second arrangement unit 42 includes:
The n-type thermoelectric element 1 (1b) is formed by inserting and fixing the n-type thermoelectric element 1 (1b) into the n-type element fixing fitting through hole 34 of the second insulating spacer 15b.

As shown in FIGS. 6A and 6B, in the present embodiment, the second insulating spacer 15
b is formed by turning over the first insulating spacer 15a.

As shown in FIG. 1A, when the first arrangement unit 41 and the second arrangement unit 42 are arranged in an overlapping manner, as shown in FIGS. 1B and 1C, P-type thermoelectric element 1 (1
a) is inserted into the p-type element fitting through hole 36 of the second arrangement unit 42, and the n-type thermoelectric element 1 (1 b) fixed to the second arrangement unit 42 is the n-type thermoelectric element 1 of the first arrangement unit 41. The p-type thermoelectric elements 1a and the n-type thermoelectric elements 1b are inserted into the through holes 35 for fitting the mold elements, and are arranged alternately next to each other.

In this embodiment, the diameters of the p-type thermoelectric element 1a and the n-type thermoelectric element 1b are substantially equal to each other, and therefore, the n-type thermoelectric element 1a is formed on the first insulating spacer 15a. The inner diameter of the mold element through hole 35 is slightly larger than the outer diameter of the n-type thermoelectric element 1b. With this configuration, the n-type thermoelectric element 1b fixed to the second insulating spacer 15b is connected to the first insulating spacer 1b.
The interference with contact with 5a is suppressed.

Similarly, the inner diameter of the p-type element fitting through-hole 36 formed in the second insulating spacer 15b is slightly larger than the outer diameter of the p-type thermoelectric element 1a. The p-type thermoelectric element 1a fixed to the first insulating spacer 15a is prevented from contacting and interfering with the second insulating spacer 15b.

In this embodiment, the p-type thermoelectric element 1a and the n-type thermoelectric element 1b protrude from both front and back surfaces of the first insulating spacer 15a and the second insulating spacer 15b. The first insulating spacer 15a and the second insulating spacer 15b are disposed so as to overlap with each other with an interval therebetween, and the first and second insulating spacers 15a and 15b are arranged.
It suppresses that b contacts each other and interferes.

The thermoelectric element array unit 17 of this embodiment is
Is configured as described above. Next, a method for manufacturing the thermoelectric element array unit 17 of the present embodiment will be described.

As shown in FIG. 2A, a heat-resistant upper mold 21 made of carbon or the like is arranged on the surface side of the first insulating spacer 15a. A heat-resistant lower mold 22 made of carbon or the like is arranged on the back side of the mold. The upper molding die 21 and the lower molding die 22 function as a pair of p-type element forming means having through holes 20 corresponding to the plurality of p-type element fixing and fitting through holes 33 formed in the first insulating spacer 15a. Here, the thickness of the upper molding die 21 is formed smaller than the thickness of the lower molding die 22.

The positions of the holes 20 of the upper mold 21 and the lower mold 22 are aligned with the through holes 33 for fixing and fixing the p-type element of the first insulating spacer 15a. Then, the p-type element forming laminate 23 is formed as shown in FIG.

The p-type element forming laminate 23 is mechanically integrated with the lower mold 22, the first insulating spacer 15 a, and the upper mold 21 by using appropriate holding means (not shown). It is formed by being held so as to be disassembled, and is held by, for example, fitting a pin (not shown) into holes 32 formed at the four corners of the upper mold 21 and the lower mold 22.

Then, in a state where the p-type element forming laminated body 23 is mounted on the housing 43 having the upper opening, FIG.
As shown in FIG. 3, the p-type element forming laminate 23 is immersed in a melt bath 26 containing a melt 11 (11a) of the p-type element material.
Is filled with the melt 11a.

The housing 43 is formed of a heat-resistant material such as carbon, the melt bath 26 is formed in a box shape of, for example, graphite, and the melt 11a of the p-type element material is made of Bi ₂ Te. ₃ was heated to 700 to 800 ° C. by heating a p-type thermoelectric element material formed by dissolving Sb ₂ Te ₃ into a solid solution.
It is formed by melting.

The p-type thermoelectric element material is cooled and hardened by the subsequent pull-up cooling, and the p-type thermoelectric element 1a is p-type.
The p-type element forming laminate 23 is removed from the housing 43 by molding into the hole of the mold element forming laminate 23, and the upper mold 21 is formed.
And the lower mold 22 are removed from the first insulating spacer 15a, and as shown in FIG. 3B, the first p-type thermoelectric elements 1a are arranged on the first insulating spacer 15a.
Is obtained.

If necessary, before removing the upper mold 21 and the lower mold 22 from the first insulating spacer 15a, the both surfaces (upper surface and lower surface) of the p-type thermoelectric element 1a are polished. When plating both end surfaces of the thermoelectric element 1a, nickel plating or the like is performed after the polishing step before removing the molded lower mold 22 and the molded upper mold 21 from the first insulating spacer 15a.

Further, a second arrangement unit 42 is obtained by the following steps different from the step of obtaining the first arrangement unit 41. That is, as shown in FIG.
A heat-resistant upper mold 51 made of carbon or the like is disposed on the front side of the second insulating spacer 15b, and the heat-resistant upper mold 51 made of carbon or the like is provided on the back side of the second insulating spacer 15b. The lower mold 52 is arranged.

The upper molding die 51 and the lower molding die 52 have a pair of n-type element moldings having through holes 50 corresponding to the plurality of n-type element fixing and fitting through holes 34 formed in the second insulating spacer 15b. In this case, the thickness of the upper molding die 51 is larger than the thickness of the lower molding die 52.

The positions of the holes 50 of the upper mold 51 and the lower mold 52 are aligned with the through holes 34 for fixing and fixing the n-type element of the second insulating spacer 15b. Then, an n-type element forming laminate 24 is formed as shown in FIG.

The n-type element forming laminate 24 is mechanically integrated with the lower molding die 52, the second insulating spacer 15b, and the upper molding die 51 by using appropriate holding means (not shown). It is formed by being held so as to be disassembled, and is held by, for example, fitting a pin (not shown) into holes 38 formed at the four corners of the upper mold 51 and the lower mold 52.

Then, with the n-type element forming laminated body 24 attached to the housing 43 having the upper opening, as shown in FIG. 5A, the melt 11 (11b) of the n-type element material was accommodated. It is immersed in the melt bath 26 to fill the holes of the n-type element forming laminate 24 with the melt.

The housing 43 is formed of a heat-resistant material such as carbon, the melt bath 26 is formed in a box shape of, for example, graphite, and the melt 11b of the n-type element material is made of Bi ₂ Te. _The n-type thermoelectric element material produced by dissolving Bi ₂ Se _{3 in 3} is heated to 700 to 800 ° C.
It is formed by melting.

Then, the n-type thermoelectric element material is cooled and hardened by pull-up cooling, and the n-type thermoelectric element 1b is replaced with n-type thermoelectric element 1b.
Molded into the hole of the die element forming laminate 24 and then n
The mold element forming laminate 24 is removed from the housing 43, and the upper mold 51 and the lower mold 52 are separated from each other by the second insulating spacer 15b.
From a plurality of n, as shown in FIG.
The second arrangement unit 42 in which the mold thermoelectric elements 1b are arranged on the first insulating spacer 15b is obtained.

If necessary, before removing the upper molding die 51 and the lower molding die 52 from the second insulating spacer 15b, both surfaces (upper surface and lower surface) of the n-type thermoelectric element 1b are polished to remove the n-type thermoelectric element 1b. When plating both end surfaces of the thermoelectric element 1b, nickel plating or the like is performed after the polishing step before removing the lower mold 52 and the upper mold 51 from the second insulating spacer 15b.

In the present embodiment, the order of the steps of obtaining the first arrangement unit 41 and the step of obtaining the second arrangement unit 42 is not particularly limited, and may be set as appropriate. One may be performed first, or both may be performed at the same timing.

Then, the obtained first and second arrangement units 41 and 42 are overlapped as shown in FIG.
The p-type thermoelectric element 1a fixed to the array unit 41 is inserted into the through-hole 3 for fitting the p-type element of the second array unit 42.
6, the n-type thermoelectric element 1b fixed to the second arrangement unit 42 is inserted into the n-type element fitting through hole 35 of the first arrangement unit 41, and the p-type thermoelectric element 1a and the n-type By alternately arranging the thermoelectric elements 1b adjacent to each other, the thermoelectric element array unit 17 of the present embodiment can be obtained.

The thermoelectric element array unit 17 of this embodiment is
Is manufactured by individually forming the first array unit 41 and the second array unit 42 and overlapping them as described above. The p-type and n-type thermoelectric elements 1a and 1b are Thermoelectric element array units 17 alternately and regularly arranged can be easily manufactured.

As described above, the thermoelectric element array unit 17 of this embodiment includes the first array unit 41 and the second array unit 41.
Can be formed in a separate step, so that, for example, the thermoelectric element array unit is easier than when both the p-type thermoelectric element and the n-type thermoelectric element are inserted and fixed in one insulating spacer. 17 can be formed.

That is, for example, p is added to one insulating spacer.
When inserting and fixing both the thermoelectric element 1a of the mold type and the thermoelectric element 1b of the n-type, extreme care is required. Also, when forming the thermoelectric element 1 on one side in the through hole of the insulating spacer, It is necessary to perform masking so that the material of the thermoelectric element 1 does not adhere or the like. However, in the present embodiment, the masking is unnecessary, and the manufacture of the thermoelectric element array unit 17 becomes easy.

After the formation of one thermoelectric element 1, the previously formed thermoelectric element 1 is immersed in a melt of the material of the thermoelectric element 1 for forming the other thermoelectric element in a masked state. There is no need to worry about adversely affecting the characteristics of the thermoelectric element formed in the above.

Further, the first and second arrangement units 41 and 4 constituting the thermoelectric element arrangement unit 17 of this embodiment are described.
Reference numeral 2 denotes a wall surface of the through hole 33 for fixing and fitting the p-type element and a wall surface of the through hole 34 for fixing and fitting the n-type element formed on the first and second insulating spacers 15a and 15b.
Since the fixing of a and 1b is performed by the solidification fixing force that solidifies the thermoelectric element material in a molten state, the use of an adhesive is not required.

Therefore, the thermoelectric element array unit 17 of this embodiment is free from complicated and inefficient operations such as application and drying of an adhesive by using an adhesive, and heat dissipation by the adhesive. Since the obstructive factors are also removed, a highly reliable and high-quality thermoelectric element array unit 17 can be provided at low cost, and the reliability and performance of the thermoelectric module using the thermoelectric element array unit 17 can be improved. Cost reduction of productivity improvement can be achieved.

FIG. 7 shows a method of forming a thermoelectric module using the thermoelectric element array unit 17 of this embodiment. As shown in FIG. The thermoelectric module is obtained by disposing the electrode 2 on the substrate side and soldering the electrode-plated portions of the thermoelectric elements 1 (1a, 1b) on the substrate side.

At this time, as shown in FIG. 8A, the lead terminals 6 are connected to the two lead terminal electrodes 5 formed at the corners of the substrate 4, respectively, and thereafter, as shown in FIG. )
As shown in FIG. 3, the substrate 3 is provided on the thermoelectric element array unit 17, and as shown in FIG.
An end of (1a, 1b) is connected to electrodes on the upper and lower substrates 3 and 4 to obtain a thermoelectric module of the present invention in which p-type thermoelectric elements 1a and n-type thermoelectric elements 1b are alternately connected in series. .

The present invention can adopt various embodiments without being limited to the above embodiments. For example, in the above embodiment, the p-type and n-type thermoelectric elements 1 (1a,
Although the method of plating conductors on both end surfaces of 1b) has been described, when a material having good solder connectivity is used as the material of the thermoelectric element 1 (1a, 1b), this plating step can be omitted. It is.

[0063]

The thermoelectric element array unit according to the present invention has a first
Of the first and second insulating spacers as in the method of manufacturing a thermoelectric element array unit according to the present invention. In the hole, a plurality of p-type and n-type thermoelectric elements are respectively formed, and the first arrangement unit and the second arrangement unit are separately manufactured, and can be formed by overlapping.
It can be easily manufactured.

That is, according to the thermoelectric element array unit of the present invention, the p-type and n-type thermoelectric elements can be formed by molding, respectively, so that the p-type and n-type thermoelectric elements are individually cut and arranged. Therefore, it is possible to eliminate problems such as an incorrect element arrangement and brittle breakage of the element when handling the element arrangement, and the like. Productivity is high, as production can be completed in less time.

Further, according to the thermoelectric element array unit of the present invention, it is possible to arrange the thermoelectric elements having a small diameter at a high density, and when the thermoelectric elements are used for a thermoelectric module, uniform cooling and cooling can be achieved.
Since a heating effect is obtained, it is effective as a temperature control module such as a communication laser diode.

Further, according to the thermoelectric element array unit of the present invention, the end processing such as plating of the end face of the thermoelectric element is easy, and the coating processing on the peripheral surface between the ends of the thermoelectric element is performed at the time of the plating processing. This eliminates the need for removing the coating after plating.

Further, in the thermoelectric element array unit of the present invention, the melt directly contacts the element fixing and fitting through holes of the first and second insulating spacers, and the minute projections (in the inner surface of the element fixing and fitting through holes) are formed. The melted element material penetrates into the inner wall surface of the hole) and the element material is solidified by subsequent cooling, thereby fixing the p-type and n-type thermoelectric elements to the first and second insulating spacers. Since it is possible to solidify and fix each of the fitting through holes, it is not necessary to use an adhesive or the like for fixing the thermoelectric element and the insulating spacer. The step of removing the protruding portion of the agent can also be omitted.

Further, according to the thermoelectric element array unit of the present invention, the length of the thermoelectric element can be shortened as compared with the direct growth method, so that the time of the element forming step can be shortened.

Further, since the thermoelectric element array unit of the present invention forms the first and second array units in different steps as described above, for example, a p-type thermoelectric element and an n-type The thermoelectric element array unit can be formed more easily than when both of the thermoelectric elements are inserted and fixed.

That is, for example, p is added to one insulating spacer.
Care must be taken when inserting and fixing both the thermoelectric element and the n-type thermoelectric element, and when forming the thermoelectric element on one side in the through hole of the insulating spacer, the material of the other thermoelectric element Although it is necessary to perform masking so as not to adhere, etc., in the thermoelectric element array unit of the present invention, masking is not required, and manufacture of the thermoelectric element array unit becomes easy.

Further, in the thermoelectric element array unit of the present invention, after forming one thermoelectric element, in a state where the thermoelectric element is masked, a melt of the material of the thermoelectric element is formed for forming the other thermoelectric element.
By dipping the previously formed thermoelectric element, there is no need to worry about adversely affecting the characteristics of the previously formed thermoelectric element,
The yield of the thermoelectric element array unit can be improved.

Further, according to the thermoelectric element array unit of the present invention, the p-type thermoelectric element and the n-type thermoelectric element are projected from the front and back surfaces of the first insulating spacer and the second insulating spacer. In addition, the projecting region of the thermoelectric element can be easily connected to circuits on the upper and lower substrates to obtain a thermoelectric module.

Further, in the thermoelectric element array unit according to the present invention, according to the structure in which the first insulating spacer and the second insulating spacer are arranged so as to overlap with each other with an interval therebetween, the first insulating spacer is provided with the first insulating spacer. Interference between the spacer and the second insulating spacer can be suppressed.

Further, according to the method for manufacturing a thermoelectric element array unit of the present invention, a thermoelectric element array unit exhibiting the above-described excellent effects can be obtained without fail.

Further, according to the thermoelectric module of the present invention, the thermoelectric module is constituted by using the thermoelectric element array unit of the present invention exhibiting the above-mentioned excellent effects, so that the production is easy, the yield is high, and the uniformity is improved. It is possible to realize an excellent thermoelectric module suitable for temperature control of a communication laser diode or the like that can obtain a cooling / heating effect.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of an embodiment of a thermoelectric element array unit according to the present invention.

FIG. 2 is an explanatory view showing a manufacturing process of a first array unit constituting the thermoelectric element array unit of the embodiment.

FIG. 3 is an explanatory view showing a manufacturing process subsequent to FIG. 2 for the first array unit.

FIG. 4 is an explanatory view showing a manufacturing process of a second array unit constituting the thermoelectric element array unit of the embodiment.

FIG. 5 is an explanatory view showing a manufacturing step subsequent to FIG. 4 for the second array unit.

FIG. 6 is a plan view of a first insulating spacer and a second insulating spacer constituting the thermoelectric element array unit of the embodiment.

FIG. 7 is an explanatory view showing an assembled state of a thermoelectric module using the thermoelectric element array unit of the embodiment, omitting lead terminals.

FIGS. 8A and 8B are explanatory views showing a thermoelectric module using the thermoelectric element array unit of the embodiment in a state where lead terminals are attached, and an exploded sectional view of the thermoelectric module;

FIG. 9 is an explanatory diagram of an example of an assembled state of a thermoelectric module using a thermoelectric element array unit.

FIG. 10 is an explanatory diagram of a conventional example in which both ends of a thermoelectric element are plated.

FIG. 11 is an explanatory diagram of an assembly state of a general thermoelectric module.

FIG. 12 is a diagram illustrating the production of a thermoelectric element by an in-mold growth method.

FIG. 13 is an explanatory diagram of a step of growing a thermoelectric element by an in-mold growth method.

FIG. 14 is an explanatory view of cutting a material of a grown thermoelectric element to form a thermoelectric element of a predetermined length.

FIG. 15 is an explanatory diagram of a method for manufacturing a thermoelectric element by an ingot cutting method.

FIG. 16 is an explanatory view of a method of directly assembling a thermoelectric module.

FIG. 17 is an explanatory diagram of a spacer assembling method of the thermoelectric module.

[Explanation of symbols]

 1, 1a, 1b Thermoelectric element 15, 15a, 15b Insulating spacer 17 Thermoelectric element arrangement unit 21, 51 Molded upper mold 22, 52 Molded lower mold 23, 24 Element formation laminate 41 First arrangement unit 42 Second arrangement unit

Claims (5)

[Claims] 1. A first insulating spacer in which a plurality of p-type element fixing and fitting through holes and a plurality of n-type element fitting through-holes are formed adjacent to each other, a first n-type element fixing and fitting through hole and a p-type element fitting. A second insulating spacer in which a plurality of joint through holes are arranged adjacent to each other, and a p-type thermoelectric element is inserted and fixed in each of the p-type element fixing fitting through holes of the first insulating spacer. A first arrangement unit is formed, and an n-type thermoelectric element is inserted and fixed in each of the n-type element fixing and fitting through holes of the second insulating spacer to form a second arrangement unit. One array unit and the second
The p-type thermoelectric element, which is arranged and superimposed on the first arrangement unit and is fixed to the first arrangement unit, is inserted into the p-type element fitting through-hole of the second arrangement unit, and is inserted into the second arrangement unit. The fixed n-type thermoelectric element is inserted into the n-type element fitting through hole of the first array unit, and the p-type thermoelectric element and the n-type thermoelectric element are alternately arranged side by side. A thermoelectric element array unit. 2. The p-type thermoelectric element and the n-type thermoelectric element are of the first type.
2. The thermoelectric element array unit according to claim 1, wherein the thermoelectric element array unit protrudes from both front and back surfaces of the insulating spacer and the second insulating spacer. 3. The thermoelectric element array unit according to claim 1, wherein the first insulating spacer and the second insulating spacer are arranged so as to overlap with each other with an interval therebetween. 4. A method for forming at least one pair of p-type element forming means having through holes corresponding to a plurality of through-holes for fixing and fitting p-type elements formed in a first insulating spacer by adjusting the positions of the holes. A p-type element forming laminate is formed by superposing on the front and back surfaces of the insulating spacer 1 and detachably integrating the same, and the p-type element forming laminate is immersed in a melt of the material of the p-type element to form a p-type element. A hole is filled in the melt of the die element forming laminate, then cooled and cured to form a p-type thermoelectric element in the hole of the p-type element forming laminate, and then the p-type element forming means From the first insulating spacer to obtain a first arrangement unit in which a plurality of p-type thermoelectric elements are arranged in the first insulating spacer; and a plurality of p-type thermoelectric elements arranged in the second insulating spacer. At least one pair provided with through holes corresponding to the through holes for fixing the n-type element. The n-type element forming means is superposed on the front and back surfaces of the second insulating spacer so as to be removably integrated by aligning the positions of the holes, thereby forming an n-type element forming laminate. The hole of the n-type element forming laminate is filled with the melt by dipping in the melt of the material of the n-type element, and then cooled and cured to form the n-type thermoelectric element in the hole of the n-type element forming laminate. And then removing the n-type element forming means from the second insulating spacer to obtain a second arrangement unit in which a plurality of n-type thermoelectric elements are arranged on the second insulating spacer. And the obtained first and second arrangement units are overlapped and the p-type thermoelectric element fixed to the first arrangement unit is inserted into the through hole for fitting the p-type element of the second arrangement unit. Then, the n-type thermoelectric element fixed to the second array unit is connected to the first array unit. Method for manufacturing a thermoelectric element array unit, characterized in that by inserting the n-type element fitted through hole knit alternately arranging side by side the thermoelectric elements of the n-type and the p-type thermoelectric elements. 5. The thermoelectric element array unit according to claim 1, 2 or 3, wherein the thermoelectric element array unit is disposed between upper and lower substrates, and an end of each thermoelectric element is connected to an electrode on each of the upper and lower substrates. p
A thermoelectric module in which thermoelectric elements of n-type and n-type thermoelectric elements are alternately connected in series.