JP2002331443A - Array shape machining method and array-shaped workpiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an array shape machining method for obtaining an array- shaped workpiece accurately juxtaposed with respective array surfaces while maintaining accuracy of the making respective array surfaces. SOLUTION: In a machining method, a workpiece 1 is fixed to a main spindle 4 in a state of positioning the workpiece 1 so that a central position of the array surfaces becoming one element of an array by machining coincides with the rotational center 3 of the main spindle 4 for installing the workpiece 1, and after machining one array surface by rotating the main spindle 4, a fixation of the workpiece 1 is released, the workpiece 1 is then positioned so that the center of the array surfaces for machining coincides with the rotational center 3 of the main spindle 4, the workpiece 1 is fixed again to the main spindle 4, and spherical surface and aspheric surface arrays are machined by repeatedly machining the array surfaces by rotating the main spindle 4. This array shape machining method is characterized by using a marker 9 manufactured on the workpiece 1 so that a central position of the marker coincides with the center of the respective array surfaces when positioning the workpiece 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an array shaping method and an array shaping product, and more particularly to an array shaping method and an array shaping product for creating an array by rotating a main shaft.

[0002]

2. Description of the Related Art A conventional array shape processing method will be outlined.
In the case of processing an array of spherical and coaxial aspherical surfaces, FIG.
As shown in (1), the center of one array surface to be machined (the center of a spherical surface or an aspheric surface that newly forms one surface of the array by rotary cutting) is coincident with the rotation axis 3 of the main shaft 4. In such a state, the workpiece 1 is rotated, and the array surface 2 is processed by the tool 7.

When the processing shown in FIG. 8 is performed, FIG.
As shown in (1), first, the workpiece is fixed and the array surface No. 1 is processed in a state where the center of the array surface No. 1 and the rotation center of the main shaft coincide with each other. After the machining of the array surface No. 1 is completed, the fixing of the workpiece 1 is released, and the workpiece 1 is moved, and as shown in FIG. The work piece 1 is fixed again with the rotation axis 3 of
The array surface No. 2 is processed. In the operation of matching the rotation axis 3 of the main shaft 4 with the center axis of the array, usually, the position of the workpiece 1 is detected in the Y direction and the X direction while the position of the workpiece 1 is detected by the probe P or the like.

As a conventional technology for processing an array, for example, Japanese Patent Application Laid-Open No. H11-179601, entitled "Processing Apparatus and Its Processing Method and Optical Parts by Its Processing Method" is given.

[0005]

However, the prior art has the following problems. For example, probe P
When performing position measurement and position alignment of the workpiece 1 using
As shown in FIG. 10A, the measurement is performed by applying the probe P to the side surface of the workpiece 1. However, when the workpiece is inclined as shown in FIG. 10B, there is a problem that a measurement error occurs. .

That is, conventionally, in the positioning using the probe P, since the positioning is indirect, the accuracy of the positioning is not always high, and the positioning takes time.

In the technique disclosed in Japanese Patent Application Laid-Open No. 11-179601, since a slide table is mounted on a rotating spindle, detection by a probe is not required, so that the problem of using a probe does not occur. However, since the slide table is moved, there is a problem that the weight imbalance that causes the rotational deviation of the main shaft is increased, and the precision of the cutting process is reduced.

The present invention has been made in view of the above, and provides an array shape processing method capable of obtaining an array shape processed product in which each array surface is arranged with high accuracy while maintaining the accuracy of each array surface. The purpose is to do.

In order to achieve the above object, the array processing method according to the first aspect of the present invention provides a method for processing a spherical array or an aspherical array, which is performed by using a center position of one array surface as one element of the array. In a state where the workpiece is positioned so that the center of rotation of the spindle on which the workpiece is mounted coincides with the center of the workpiece, the workpiece is fixed to the spindle, and the spindle is rotated.
After processing the two array surfaces, release the fixation of the workpiece, align the workpiece so that the center of the array surface to be processed next coincides with the center of rotation of the spindle, and re-mount the workpiece. This is a processing method for processing a spherical or aspherical array by repeating the processing of the array surface by fixing to the main shaft, rotating the main shaft, and positioning the work, the center position of the marker on the array surface. The method is characterized in that the measurement is performed using a marker formed on a workpiece so as to coincide with the center.

That is, according to the first aspect of the present invention, the positioning of the workpiece is performed using the marker formed on the workpiece so that the center position of the marker coincides with the center of the array surface. Since there is no need to apply a probe to the side surface, alignment can be performed easily. Also,
Since it is hardly affected by the inclination of the workpiece as in the measurement using a probe, accurate positioning can be performed.

According to a second aspect of the present invention, there is provided an array shape processing method, wherein a workpiece is fixed to a main shaft, and an array of spherical lenses or the like is created by repeating rotary cutting and movement of the workpiece after rotary cutting. In the array shape processing method,
With the workpiece positioned so that the center position of the workpiece to be machined into an array element by rotary cutting and the rotation center of the spindle match, the workpiece is fixed to the spindle, and the spindle is rotated. Create the elements of the array, then release the fixation of the workpiece, position the workpiece so that the center position of the workpiece to be the next element coincides with the rotation center of the spindle, and process the workpiece. This is a processing method in which an object is fixed to the main shaft again, the main shaft is rotated, and elements of the array are created, and a marker for positioning is previously placed on the work, and upon positioning, the array is formed based on the marker. The center position of the workpiece to be processed into the element and the center of rotation are matched.

That is, in the invention according to claim 2, the positioning of the workpiece is performed by using the marker formed on the workpiece such that the center position of the marker coincides with the center of the array surface. Since there is no need to apply a probe to the side surface, alignment can be performed easily. Also,
Since it is hardly affected by the inclination of the workpiece as in the measurement using a probe, accurate positioning can be performed.

According to a third aspect of the present invention, there is provided the array shape processing method according to the first or second aspect, wherein the position of the marker is set at two positions from the normal direction of the main shaft surface of the processing machine.
It is characterized in that it is detected by dimension. That is, claim 3
According to the invention, the positioning can be performed in a short time.

The array shape processing method according to claim 4 is the same as the array shape processing method according to claim 3,
The position of the marker is detected by image processing and positioning is performed. That is, the invention according to claim 4 performs detection of the marker position by image processing,
Marker position detection can be performed more accurately and automatically.

The array shape processing method according to claim 5 is the same as the array shape processing method according to claim 3,
The position of the workpiece is adjusted by moving the workpiece until the marker reaches an appropriate position while performing position detection by image processing. That is,
In the invention according to claim 5, the positioning of the workpiece can be performed in a short time.

According to a sixth aspect of the present invention, in the array shape processing method of the third aspect, when the marker is viewed from a direction in which the position of the marker is detected, the marker shape is a circle or an arc. In addition, the marker is formed on a workpiece. That is, in the invention according to claim 6, by making the marker shape such that it looks like an arc when viewed from the marker detection direction, it becomes less susceptible to the inclination and unevenness of the workpiece, and the position detection becomes difficult. Easy and accurate alignment is possible.

According to a seventh aspect of the present invention, in the array shape processing method of the sixth aspect, the marker is produced by pressing a spherical or conical indenter against the workpiece. . That is, in the invention according to claim 7, it is possible to produce the positioning marker accurately and in a short time.

The array shape processing method according to claim 8 is the array shape processing method according to any one of claims 1 to 7, wherein after the marker is marked on the workpiece, the error of the marker position is obtained. And the positioning is controlled by reflecting the value of the error. That is, in the invention according to claim 8, the position error of the manufactured marker is measured in advance, and the error value is reflected at the time of positioning the workpiece, so that the position of the marker can be accurately adjusted without the influence of the error of the marker position. Becomes possible.

An array-shaped workpiece according to a ninth aspect is characterized by being created by the array-shape processing method according to any one of the first to eighth aspects. That is, according to the ninth aspect of the present invention, an array-shaped processed product can be created with high accuracy.

[0020]

FIG. 1 is an explanatory diagram showing an example of the configuration of a processing machine for performing an array processing method of the present invention.
Here, reference numeral 1 denotes a workpiece, 2 denotes an array surface, 4 denotes a main axis of the processing machine, 3 denotes a rotation axis of the main shaft 4 of the processing machine, and 5 denotes a direction perpendicular to the pitch direction of the workpiece 1. Reference planes defining positions are shown. The workpiece 1 is moved in the pitch direction by the movement actuator 6.

Reference numeral 7 denotes a processing tool, and reference numeral 9 denotes a positioning marker which is a mark for positioning the workpiece 1. The detection of the positioning marker 9 is performed by the marker position detecting device 8. Although a cutting tool is attached in the figure, depending on the mode of use, for example, as shown in FIG. 2, the grinding may be performed by attaching a grinding tool. In FIG. 2, reference numeral 11 denotes a grinding wheel, 12 denotes a grinding wheel spindle, and 13 denotes a tool stand.

FIG. 3 shows how the array is machined. The left side of the figure shows the operation of the main shaft 4 and the actuator 6 of the machine, and the right side shows the work 1 in an enlarged manner. In addition,
FIG. 3A shows that after processing the elements up to the third array surface, the workpiece 1 is aligned so that the center position of the fourth array surface coincides with the rotation axis 3 of the main shaft 4 of the processing machine. FIG. The workpiece 1 is moved in the pitch direction by the movement actuator 6. The direction perpendicular to the array is defined by the reference plane 5.

After the fourth center point of the array surface is matched with the rotating shaft 3 of the main shaft 4 of the processing machine, the moving actuator 6 is retracted to a position where it does not interfere with the main shaft 4 of the processing machine. 4 is rotated to perform the fourth processing on the array surface (see FIG. 3B). After finishing the fourth processing on the array surface, the spindle 4 is stopped in a state where the workpiece 1 can be moved, and the positioning is performed so that the next processing on the fifth array surface can be performed (FIG. 3).
(C)). The processing of the array surface 2 is performed by repeating the above steps.

FIG. 4 shows the state of the tool and the marker detecting device at the time of machining and at the time of detecting the marker position. FIG.
(A) shows a state in which the tool 7 comes near the center of the main shaft 4 of the processing machine. In this state, machining is performed by moving the tool in the vertical and horizontal directions in the figure while rotating the main shaft. FIG. 4B shows a marker position detecting device 8.
Is moved to the rotation center 3 of the main shaft 4. When the marker position detecting device 8 is moved to a specific position, the marker center detecting device 8 can determine at which position of the rotation center 3 of the main shaft of the processing machine is detected by the marker position detecting device 8. In advance, make adjustments in advance.

FIG. 5 shows the relationship between the array surface 2 and the markers. The positioning marker is manufactured such that the center of the array surface 2 ′ to be processed and the center of the positioning marker 9 coincide with each other. FIG. 6 is an explanatory diagram showing a state in which the position of the workpiece 1 is adjusted using the marker position detecting device 8. The left side of FIG. 6 shows the state of movement of the workpiece 1, and the right side of FIG. 6 shows image information input to the marker position detecting device 8. In this case, it is assumed that the marker position detecting device 8 has come to the position shown in FIG.

FIG. 6A shows a state where the marker position detecting device 8 is moved to the measurement position after processing the n-th array. In this case, the center of the array coincides with the rotation center of the main shaft of the processing machine. FIG. 6B shows a state where the workpiece 1 is moved in the pitch direction. FIG. 6C shows a state in which the center of the (n + 1) th array marker 9 and the rotation center of the main shaft of the processing machine coincide.

The workpiece 1 is moved to the state shown in FIG.
Perform position adjustment. At this time, the position may be automatically adjusted by analyzing the image from the marker position detecting device 8 and feeding it back to the actuator 6. After the completion of the alignment, the workpiece 1 is fixed and processing is performed.

FIG. 7 is a view showing a state in which a positioning marker is formed on the workpiece 1. The indenter 10 is accurately positioned in advance with respect to the position reference 0 of the workpiece 1, and n The location (Wn,
By moving the indenter to h) and pressing the indenter against the workpiece, the marker shape is produced at an accurate position. This operation is performed for the center positions of all the arrays.

[0029]

As described above, according to the present invention,
Since the alignment of the workpiece is performed using the marker on the workpiece, there is no need to apply a probe to the workpiece, and the alignment can be performed easily. In addition, since no probe is used, it is hardly affected by the inclination of the workpiece, so that accurate positioning can be performed.

Further, according to the present invention, since the marker position is detected two-dimensionally, the position can be adjusted in a short time. Further, by detecting the marker position by image processing, the marker position can be detected more accurately and automatically. Furthermore, while performing position detection,
By positioning the workpiece, accurate positioning can be performed in a short time.

Further, by utilizing the present invention, an accurate array shape can be produced. In addition, by performing molding according to the manufactured array shape, a highly accurate array element can be obtained at low cost.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an example of a configuration of a processing machine that performs an array processing method of the present invention.

FIG. 2 is an explanatory diagram when a grinding tool is attached.

FIG. 3 shows a state of processing of an array.
The right side is an explanatory diagram showing the operation of the main shaft and the actuator of the processing machine in an enlarged manner on the workpiece.

FIG. 4 is a diagram showing a state of a tool and a marker detection device at the time of machining and at the time of marker position detection.

FIG. 5 is a diagram showing a relationship between an array surface and a marker.

FIG. 6 is an explanatory diagram showing a state where a workpiece is aligned using a marker position detection device.

FIG. 7 is a diagram showing a state in which a positioning marker is marked on a workpiece.

FIG. 8 is an explanatory diagram illustrating a conventional array processing method.

FIG. 9 is an explanatory diagram illustrating a conventional array processing method.

FIG. 10 shows a case of positioning using a conventional probe.
FIG. 9 is an explanatory diagram showing a state in which a measurement error occurs when a workpiece is tilted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Workpiece 2 Array surface 3 Rotation axis 4 Main shaft 5 Reference surface 6 Actuator 7 Tool 8 Marker position detecting device 9 Marker

Continuing from the front page (72) Inventor Zhang Army 1-3-6 Nakamagome, Ota-ku, Tokyo F-term in Ricoh Co., Ltd. 3C029 AA02 AA03 3C045 CA18 DA01 3C049 AA04 BA07 CB01 CB04

Claims (9)

[Claims] In processing a spherical array or an aspherical array, a workpiece is processed such that a center position of one array surface which is one element of the array coincides with a rotation center of a main shaft on which the workpiece is mounted. In the positioned state, the workpiece is fixed to the spindle, and the spindle is rotated to perform processing on one array surface. Then, the workpiece is unlocked, and then the center of the array surface to be processed and the spindle are aligned. Align the workpiece so that the center of rotation coincides with the workpiece, fix the workpiece on the spindle again, rotate the spindle, and repeatedly process the array surface to process the spherical and aspherical arrays An array shape processing method, wherein a workpiece is positioned using a marker produced on the workpiece such that the center position of the marker coincides with the center of the array surface. 2. An array shape processing method for creating an array of spherical lenses or the like by fixing a workpiece to a main shaft and repeating the rotary cutting and the movement of the workpiece after the rotary cutting, the method comprising: With the work piece positioned so that the center position of the work piece to be processed into the element and the center of rotation of the main spindle coincide, the work piece is fixed to the main spindle, and the main spindle is rotated to create an array element. After that, release the fixation of the workpiece, and position the workpiece so that the center position of the workpiece to be the next element coincides with the rotation center of the spindle. This is a processing method for creating elements of an array by fixing and rotating the main shaft. Markers for positioning are placed on the workpiece in advance,
An array shape processing method comprising: matching a center position and a rotation center of a workpiece to be processed into an array element based on a marker at the time of positioning. 3. The array shape processing method according to claim 1, wherein the position of the marker is detected two-dimensionally from a direction normal to the main shaft surface of the processing machine. 4. The array shape processing method according to claim 3, wherein the position of the marker is detected and positioned by image processing. 5. While performing position detection by image processing,
5. The array shape processing method according to claim 4, wherein the workpiece is positioned by moving the workpiece until the marker reaches an appropriate position. 6. The marker according to claim 3, wherein the marker is formed on a workpiece so that when the marker is viewed from a direction in which the position of the marker is detected, the shape of the marker is a circle or an arc. Array shape processing method. 7. The array shape processing method according to claim 6, wherein the marker is produced by pressing a spherical or conical indenter against the workpiece. 8. The method according to claim 1, wherein after the marker is produced on the workpiece, an error of the marker position is measured, and the position is controlled by reflecting the error value. The array shape processing method described in the above. 9. An array shape processed article created by the array shape processing method according to any one of claims 1 to 8.