JP2002329816A - Resin sealed type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealed type electronic component which can solve the problem raised by the conventional electronic parts that, when an electrical failure occurs, the discharge of heat generated by thermal breakage is suppressed by a sealing resin layer and the bursting location of the resin layer is not fixed even when a weak point is formed on a gas discharging case. SOLUTION: In the resin sealed type electronic component constituted by housing at least one electronic component in the case and forming the sealing resin layer in the vacant space of the case, the case and sealing resin layer are partially removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed electronic component such as a film capacitor, a ceramic varistor, or a coil in which an electronic component element is housed in a case and a sealing resin is filled in a cavity of the case. .

[0002]

2. Description of the Related Art Electronic component elements mounted on an electronic circuit board include, for example, a film capacitor, a ceramic varistor, and a coil. These electronic components are compatible with an external environment such as vibration, humidity, or corrosive atmosphere. Therefore, resin sealing is performed on the exterior. As shown in FIG. 3, for example, a metal capacitor electrode 21 is formed on both end surfaces, and a film capacitor element 23 having a lead wire 22 attached as a lead wire to the metal capacitor electrode 21 is provided in a case 24 having one opening. , And a sealing resin is injected into a void in the case 24, and the sealing resin is cured to form a sealing resin layer 25.

[0003] In general, such electronic components do not have a security device in the event of an electrical failure, and if an electrical failure occurs, a large current flows instantaneously and the electronic component is thermally damaged. Wake up. Such thermal destruction produces large amounts of combustion gases.

[0004] For this reason, in the case where a plurality of electronic components are disposed in a case sealed with a resin, when one of the electronic components fails, the failure occurs due to instantaneous thermal destruction due to a large current. The resulting gas is compressed inside the case, causing a shock to other good electronic components.

Further, the gas instantaneously generated in the case due to thermal destruction exerts a pressure on the entire inside of the case, and the gas is concentrated and discharged at a position where the gas pressure is weakest. In addition, since the internal pressure is high and the concentrated discharge is performed, it is ejected together with the filled resin. As a result, the ejected resin and gas are scattered, and there is a problem that electronic components, elements, substrates, etc. around the failed electronic component are damaged. A method has been adopted in which a weak point portion thinner than the wall thickness is formed, gas instantaneously generated in the case due to thermal destruction is concentrated there, and the case is ruptured.

However, even if the case has a weak portion in which the thickness of the case is reduced in part, the sealing resin is completely immersed in the case after the electronic component is housed in the case. Is filled and hardened, the gas instantaneously generated in the case due to thermal destruction,
The release is suppressed by the filled and cured sealing resin layer, the gas pressure does not reach the part where the thickness of the case is thinned, and the pressure concentrates on the weakest part when viewed from the generated gas and ruptures However, since the location of the rupture is not fixed, problems such as damage to other electronic components of the substrate have not been solved.

[0007]

As described above, in the conventional electronic parts, when an electrical failure occurs, even if a weak point for gas release is formed in the case, the failure is caused by thermal destruction. There has been a problem that the gas is suppressed from being released by the sealing resin layer, and the rupture location is not constant.

The present invention solves the above-mentioned problems, and provides a case where at least one electronic component element is accommodated and a sealing resin layer with a weak point, so that the case is instantaneously inserted into the case due to thermal destruction. It is an object of the present invention to provide a resin-sealed electronic component that determines a rupture position of a case that emits gas generated in the same and does not damage other electronic components forming the same circuit. .

[0009]

According to a first aspect of the present invention, at least one electronic component element is accommodated in a case, and a sealing resin is provided in a cavity of the case. An electronic component comprising a layer, wherein a part of the case and a part of the sealing resin layer are deleted.

According to the electronic component according to the first aspect of the present invention, an electrical defect occurs in the electronic component housed in the case or in the electronic component element group in which two or more electronic component elements are assembled. Even if a large amount of gas is generated due to severe destruction, part of the case and part of the sealing resin layer are deleted, so the gas pressure of the generated gas is necessarily part of the case. In addition, a part of the sealing resin layer is directed to the removed weak point, so that the rupture position of the case can be arbitrarily determined, and other electronic components forming the same circuit are not damaged.

According to a second aspect of the present invention, there is provided a step of manufacturing an electronic component element, a step of storing one or a plurality of the electronic component elements in a case, and forming a sealing resin layer in a case gap. And a step of sequentially removing a part of the case and the sealing resin layer.

According to the electronic component manufacturing method of the present invention, after the sealing resin layer is formed in the case gap, a step of partially removing the case and the sealing resin layer is provided. When a weak point is formed by removing not only the case but also a part of the sealing resin layer, when an electrical failure occurs,
Due to the structure in which a part of the case and a part of the sealing resin layer are deleted, the gas pressure of the generated gas is inevitably a part of the case and a part of the sealing resin layer deleted. Since it is directed to the weak point, the rupture position of the case can be arbitrarily determined, and a resin-sealed electronic component that does not damage other electronic components forming the same circuit can be easily manufactured. .

According to a third aspect of the present invention, in the step of removing a part of the case and the sealing resin layer, a part of the case and the sealing resin layer is removed by mechanical grinding. A method for manufacturing an electronic component according to claim 2,
By using mechanical grinding, the resin-sealed electronic component of the present application can be manufactured with high production efficiency.

According to a fourth aspect of the present invention, in the step of removing a part of the case and the sealing resin layer, a part of the case and the sealing resin layer is removed by a heat press. Item 2. The method for manufacturing an electronic component according to Item 2, wherein the resin-sealed electronic component of the present application can be manufactured with high production efficiency by using a heat press.

[0015]

The invention according to claim 1 is an electronic component comprising at least one electronic component element housed in a case and a sealing resin layer formed in a cavity of the case.
An electronic component, wherein a part of the case and a part of the sealing resin layer are deleted.

In the electronic component according to the first aspect,
Even if an electrical failure occurs in the electronic components housed in the case or in the electronic component group assembled with two or more electronic components, and a large amount of gas is generated due to thermal breakdown due to excessive current, a part of the case And because the weak point portion is provided in which a part of the sealing resin layer is deleted, the gas pressure of the generated gas is necessarily directed to the weak point portion, and the rupture position of the case can be determined arbitrarily, There is no damage to other electronic components forming the same circuit.

Here, the case can be appropriately selected from a resin case, a metal case, and the like, and the shape can be appropriately selected from a square (box), a round (column), and the like.

As a place where the weak point is provided, for example, in the case of a square case, at least one or more of the corners of the square case, a part or all of at least one or more ridges, or at least one or more of the ridges A part of the surface can be considered.

According to a second aspect of the present invention, there is provided a step of manufacturing an electronic component element, a step of storing one or a plurality of the electronic component elements in a case, and forming a sealing resin layer in a case gap. A method of manufacturing an electronic component, which sequentially includes a step of partially removing the case and the sealing resin layer, wherein the case and the case are formed after the step of forming the sealing resin layer in the case gap. By providing a step of removing a part of the sealing resin layer, the weak point portion can be easily formed.

According to a third aspect of the present invention, in the step of removing a part of the case and the sealing resin layer, a part of the sealing resin layer is removed by mechanical grinding. A method for manufacturing an electronic component according to claim 2, wherein the resin-sealed electronic component of the present invention can be manufactured with high production efficiency by using mechanical grinding.

According to a fourth aspect of the present invention, in the step of removing a part of the case and the sealing resin layer, a part of the sealing resin layer is removed by a heat press. Item 12. A method for manufacturing an electronic component according to Item 2,
By using a heat press, the resin-sealed electronic component of the present application can be manufactured with high production efficiency.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component according to the present invention will be described with reference to the drawings. 1 and 2 are a sectional view and a perspective view showing an example of the present invention. Metallicon electrodes 1 are formed on both end surfaces, and an electronic component element 3 having a lead wire 2 attached to the metallikon electrode 1 is placed in a bottomed rectangular case 4 made of resin. Housed as derived from Thereafter, a sealing resin is injected into a void portion in the bottomed rectangular case 4 in which the electronic component element 3 is stored, and the sealing resin is cured to form a sealing resin layer 5. Further, the corner portion of the bottomed rectangular case 4 is cut down to a part of the inner sealing resin layer 5 using a rotary polishing machine to form a weak point portion 6 to obtain a finished product.

According to the electronic component according to the above embodiment, even when an electrical defect occurs in the electronic component element 3 and thermal breakdown occurs due to an excessive current and a large amount of gas is generated, the gas pressure of the generated gas is inevitable. It is directed to the weak point 6, and the rupture position of the case can be arbitrarily determined, so that other electronic components forming the same circuit are not damaged.

Here, in the above embodiment, the weak point is formed by mechanical grinding using a rotary polishing machine, but the weak point can be formed by heat pressing or the like. Further, the place where the weak point is provided is not limited to the corner of the case, but may be appropriately set such as a part of a ridge of the case, a part of a bottom surface or a side surface of the case. In that case, by suitably selecting a forming method such as mechanical grinding when forming a weak point at the corner or ridge of the case, and heat pressing when forming a weak point on a part of the surface, easily. Weak points can be formed.

[0025]

As described above, according to the present invention, the gas instantaneously generated in the resin case due to an electrical failure is easily released, and the rupture position of the case for releasing the generated gas is determined. It is possible to provide an electronic component that is determined and does not damage other electronic components forming the same circuit.

The present invention relates to a weak portion provided in a resin-sealed electronic component and a method of manufacturing the same, and the shape and size of the resin-sealed electronic component, a method of manufacturing the electronic component itself, and the like are appropriately determined. Can be selected.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic component according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metallicon electrode 2 Lead wire 3 Electronic component element 4 Square case with bottom 5 Resin layer for sealing 6 Weak point

Claims (4)

[Claims] 1. An electronic component comprising at least one electronic component element housed in a case and a sealing resin layer formed in a case gap, wherein a part of the case and the sealing resin layer are provided. An electronic component, wherein a part of the electronic component is deleted. 2. A step of manufacturing an electronic component element, a step of housing one or more of the electronic component elements in a case, and forming a sealing resin layer in a case gap, and the case and the sealing. A process for sequentially removing a part of the resin layer for electronic components. 3. The method according to claim 2, wherein in the step of removing a part of the case and the sealing resin layer, a part of the case and the sealing resin layer is removed by mechanical grinding. Electronic component manufacturing method. 4. The method according to claim 2, wherein in the step of removing a part of the case and the sealing resin layer, a part of the case and the sealing resin layer is removed by a heat press. Manufacturing method of electronic components.