JP2002326363A - Method of manufacturing liquid jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid jet head wherein any substrate material can be chosen, a liquid passage can be formed without using a dry film, the process is simple and plant investment can be reduced. SOLUTION: A long groove 5a is formed from a side of a front face on a substrate 1 on which an ejection energy generating element 3 is formed and a liquid supply inlet 5 having a plurality of holes 5b penetrating the substrate 1 is formed thereon from the side of the rear face. After a tape 12 is stuck to each of the front and rear faces of the substrate at the liquid supply inlet 5, the liquid supply inlet 5 is filled with a bulking agent 14a having a high liquid-resistance, the bulking agent 14a is cured, it is filled with a bulking agent 14b and the bulking agent 14b is cured. After that, the tape 12 at the front face is removed, a resin 6 to be a liquid passage and a covering resin 7 to be a structural material of the head are formed on the front face of the substrate, and then an ejection hole 8 is formed thereon. After that, the bulking agents 14a, 14b applied to the liquid supply hole 5 are removed to form the liquid jet head.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid discharge head for discharging a liquid such as ink from a discharge port as flying droplets and attaching the liquid to a recording medium to perform print recording and image formation. .

[0002]

2. Description of the Related Art A conventional general liquid discharge head has a plurality of fine discharge ports for discharging a liquid such as ink, a liquid flow path communicating with each discharge port, and a discharge energy disposed in each liquid flow path. A discharge element having a generating element, applying a drive signal corresponding to recording information or image information to the discharge energy generating element, and applying discharge energy to the liquid in the liquid flow path corresponding to the discharge energy generating element. The liquid is ejected from the apparatus as flying droplets to perform print recording and image formation.

In a so-called side shooter type liquid discharge head which discharges liquid droplets in a direction perpendicular to the surface on which the discharge energy generating element is formed, it is necessary to provide a liquid supply port penetrating through the base. As a method of manufacturing a liquid discharge head of this type, a method of forming a liquid flow path in a substrate having a liquid supply through hole formed therein is disclosed in Japanese Patent Application Laid-Open No. Hei 6-2861.
No. 49, and the like. In the manufacturing method described in this publication, a dry film is used to form a liquid flow path on a substrate on which a liquid supply port is formed. This is because, in the method in which the resin layer serving as the liquid flow path is dissolved in a solvent and applied, the resin enters the through-hole and cannot be uniformly formed.

However, in the method using a dry film, (1) the film forming accuracy is lower than that of a film forming technique such as spin coating, (2) it is difficult to form a thin film of 15 μm or less, and (3) It is difficult to obtain a resolution and an aspect ratio, and there are problems such as (4) stability over time, and (5) dripping of a dry film into a penetrated liquid supply port. In addition, the publication discloses that a filler that can be removed in a subsequent step is disposed in a liquid supply port, and there is a description that a coating may be formed by a normal spin coating method, a roll coating method, or the like. There is no description at all as to whether or not to form a flat filling surface flush with the substrate surface in this manner.

In order to avoid the problem of the dry film, there is a method proposed in Japanese Patent Application Laid-Open No. 9-11479 as a method not using a dry film for forming the liquid flow path. In this method, the liquid supply port is formed by anisotropic etching.

Japanese Patent Application Laid-Open No. 10-128985 discloses that a resin having a through hole and a discharge energy generating element formed thereon is filled with a resin and then formed with a discharge port forming portion. A method of forming a liquid supply port by cutting the applied resin from the back surface has been proposed.

[0007]

However, the method using anisotropic etching described in Japanese Patent Application Laid-Open No. Hei 9-11479 has the following problems.

(1) The process is long and complicated. Since the plane is maintained only by the etching stop layer, it is necessary to form an etching stop layer in which the film stress is strictly controlled. Since anisotropic etching uses a strong alkaline solution, it is necessary to protect other parts with an etching-resistant solution during etching.

(2) The substrate is limited to silicon having a specific orientation. In the case of a serial head having a number of nozzles of several tens to several hundreds of bits, a silicon wafer is used because a driver IC can be formed on a base. For example, 12
With a 5 mm (5 inch) wafer, several hundred heads can be made. However, in the case of a long head, it is harder to mount the driver IC later than to build the driver IC into the base body due to the yield of the driver IC. At present, a silicon wafer having a size of 200 mm (8 inches) is the largest, so that a long head with a built-in driver IC of 200 mm (8 inches) or more cannot be manufactured.

Further, even if a square silicon substrate of 300 mm (12 inches) or more is available, it is very difficult to obtain it because the method using anisotropic etching cannot be used unless the substrate has a specific orientation. Become.

(3) Large capital investment. Since equipment for forming an etching stop layer and equipment such as a double-sided aligner are required, capital investment becomes large.

Further, the method described in Japanese Patent Application Laid-Open No. H10-128985 has the following problems.

(1) The liquid supply port is formed by cutting the resin filled in the through-hole with a blade, and it is difficult to control the position of the blade for the cutting process. The thickness of the resist layer serving as the liquid flow path is only about 10 μm, and even if the ink-resistant filler can exhibit the flatness, a cutting blade for forming the liquid supply port is used as the resist layer. It is very difficult to control during the thickness.

(2) Fillers and filling methods are limited. Fillers and filling methods that are ink-resistant, can be filled without generating bubbles throughout the through-hole, and can flatten the filled surface are limited. Although the width of the liquid supply port is set to be as large as about 1 mm, the smaller the supply port width is, the better in terms of the number of chips and the strength of the orifice plate material.

(3) The distance between the end of the liquid supply port and the discharge energy generating element becomes longer. The shorter the distance between the end of the liquid supply port and the discharge energy generating element, the higher the discharge frequency, and generally, it is preferably about 50 μm. However, in order to leave an ink-resistant resin layer on the inner wall of the through-hole, it is required that the thickness be 10 μm or more on one side, and it is difficult to shorten the distance between the end of the liquid supply port and the ejection energy generating element.

(4) The substrate is easily deformed by stress. Since the resin is filled in the entire area of the through hole, the substrate is easily deformed due to a difference in expansion coefficient between the substrate and the resin.

Therefore, the present invention has been made in view of the above-mentioned unsolved problems of the prior art, and can be applied to any substrate, and furthermore, a liquid flow path can be formed without using a dry film. It is an object of the present invention to provide a method of manufacturing a liquid discharge head which can be performed with a simple process and requires little capital investment.

[0018]

In order to achieve the above object, a method of manufacturing a liquid discharge head according to the present invention comprises forming a liquid supply port penetrating through a base on which a discharge energy generating element is formed, and forming the liquid supply port. In a method for manufacturing a liquid ejection head for filling a filler and then forming a liquid flow path, using a filler that can be removed later as the filler, injecting a liquid filler into the liquid supply port at normal pressure, It is characterized by filling by pressure injection or pressure reduction injection, or placing a solid filler in the liquid supply port.

In the method of manufacturing a liquid discharge head according to the present invention, the liquid filler is filled in the liquid supply port after the substrate side of the liquid supply port is closed with a tape or a glass plate. After the agent is placed in the liquid supply port, it is preferable to close the substrate surface side of the liquid supply port with a tape or a glass plate.

In the method of manufacturing a liquid discharge head according to the present invention, it is preferable that after filling the solvent-dilutable filler, the liquid supply port opening on the surface side of the substrate is opened to dry the solvent of the filler. In addition, it is preferable that the hot melt type resin in a solid state is placed in the liquid supply port and then heated with the substrate surface side down. Furthermore, a solvent-soluble resin, a water-dispersed resist, or a protein can be used as the filler.

In the method of manufacturing a liquid discharge head according to the present invention, it is preferable that the surface of the base is filled with a filler having high solvent resistance, and the lower layer is filled with a filler that is easily removed by a solvent. It is preferable to form a solvent-resistant thin film on the front surface side from the back surface, and to fill the lower layer with a filler that is easily removed by a solvent.Furthermore, after filling the filler into the liquid supply port, the filling is performed. It is preferable to form a solvent-resistant thin film on the substrate surface side of the agent.

In the method of manufacturing a liquid discharge head according to the present invention, the liquid supply port has a long and narrow groove on the surface of the substrate, and the liquid supply port has a plurality of holes formed through the groove on the rear surface of the substrate. It is preferable that the opening area of the liquid supply port on the back surface side of the substrate is not more than 1/2 of the opening area on the front surface side of the substrate.

In the method of manufacturing a liquid discharge head according to the present invention, the holes located at both ends of the plurality of holes on the back surface side of the base of the liquid supply port are located at the same positions as the both ends of the grooves on the front surface side of the base or outside thereof. Is preferably located.

[0024]

According to the liquid ejecting head manufacturing method of the present invention,
In a method of manufacturing a liquid ejection head for forming a liquid supply port penetrating a substrate on which an ejection energy generating element is formed,
The manufacturing process can be simplified by filling the liquid supply port with a filler that can be removed later as a pre-process of forming the liquid flow path, and the liquid supply port on the substrate surface side is closed with tape, glass, or the like. By filling and curing the filler in a solid state, a flat surface can be formed on the surface side of the filler, and by filling a solvent-resistant filler on the substrate surface side of the liquid supply port. Alternatively, solvent resistance can be ensured by forming an inorganic or metal film on the surface side of the base of the filler to be filled in the liquid supply port. This makes it possible to impart resistance to the solvent and the developing solution of the liquid flow path forming agent formed on the surface side of the base of the liquid supply port, and to form the liquid flow path without using a dry film.

Further, a groove is formed from the surface of the substrate with a dicer or a slicer to form an elongated groove, and a plurality of holes are formed from the back surface to form a liquid supply port partially penetrating the substrate. Thereby, it is possible to improve the mechanical strength of the base, and by drilling holes located at both ends of the plurality of holes so as to be located at the same or outside of the end of the groove on the surface side, Filling of the liquid supply port with the filler can be sufficiently performed by filling under normal pressure.

Further, according to the present invention, it is possible to apply any kind of substrate, and to manufacture a high-strength liquid discharge head with a simple process, a small capital investment and a small capital investment.

[0027]

Embodiments of the present invention will be described below with reference to the drawings.

One embodiment of a method for manufacturing a liquid discharge head according to the present invention will be described with reference to FIGS.
FIG. 1 is a process diagram showing a manufacturing procedure of a liquid discharge head according to an embodiment of a method of manufacturing a liquid discharge head according to the present invention. FIG. 2A shows a state in which a liquid supply port is formed in the present embodiment. FIG. 2B is a longitudinal sectional view of the liquid ejection head, and FIG. 2B is a longitudinal sectional view of the liquid ejection head in a state where a liquid supply port is filled with a filler in the present embodiment;
FIG. 3C is a longitudinal sectional view of the liquid ejection head in another state in which the liquid supply port is formed in the present embodiment.

In this embodiment, a cast silicon substrate 1a is used as the base 1. As shown in FIG. 1A, a heat storage layer (not shown), a discharge energy generating element 3 such as a heating element, and a protective layer of the discharge energy generating element 3 (not shown) are formed on a 0.6 mm thick cast silicon substrate 1a. (Not shown).

Next, as shown in FIG.
A liquid supply port 5 is formed in a. In this embodiment, FIG.
As shown in (a), the liquid supply port 5a on the front surface side of the substrate is grooved by a dicer, and the liquid supply port 5b on the back side is formed at a plurality of positions by a drill. The liquid supply port 5a on the front side is approximately 5
It was formed with a width of 150 μm, a groove length of 100 mm, and a groove depth d ₁ = 0.3 mm using a diamond blade of 4000 mm in particle diameter of 0 mm (2 inches). Further, as shown in FIG. 2A, seven holes were formed in the liquid supply port 5b on the back side with a drill having a diameter of 150 μm. At this time, the holes located at both ends on the back side match the groove width of the liquid supply port 5a on the front side as shown in FIG. 2A, or the holes on the front side as shown in FIG. The liquid supply port 5a is set outside the groove width. FIG. 1 shows a cross section along the line AA in FIG.

As described above, by changing the shape of the liquid supply port 5 between the front side and the rear side, the opening area of the liquid supply port on the back side of the base is smaller than the opening area on the front side of the base.
For example, it can be reduced to 以下 or less, and almost no portion penetrates on the back side, so that even if a groove having a length of 100 mm is formed on the front side, the mechanical strength of the base can be maintained high. .

Next, as shown in FIG. 1C, as an organic protective film 11, Himal manufactured by Hitachi Chemical Co., Ltd. was applied to a thickness of 2 μm using a microspray coater manufactured by Nordson Co., Ltd. at 250 ° C. Cure for 1 hour. Thereafter, a photoresist OFPR800 manufactured by Tokyo Ohka Co., Ltd. is applied by 4 μm using the same machine, and exposed and developed in a desired pattern. Thereafter, a high-mar pattern is performed with an asher.

In this way, by applying the high-mar and resist coating by spraying, a uniform coating film can be formed on both the front and back surfaces of the base 1 and the inner wall of the liquid supply port 5. Thereby, the inner wall of the liquid supply port 5 is also covered with the organic protective film 11, so that the use of the alkaline ink becomes possible.

Next, FIG. 1 (d) and FIG. 2 (b)
As shown in the figure, a tape 12 (a UV curable tape P-Lintec manufactured by Lintec Co., Ltd.) is inserted into the opening of the liquid supply port 5 (5a, 5b) on the front and back.
5780). At this time, as shown in FIG. 2B, the tape 12 is not attached to the two liquid supply ports 5b located at both ends on the back side. (Note that illustration of the organic protective film 11 is omitted in FIG. 2B.)
Then, the first filler 14a is dropped by the dispenser 13 on one side of the opening of the liquid supply port 5b located at both ends on the back side. At this time, since the liquid supply port 5b on the other side is in communication with the atmosphere, the dripping filler 14a gradually removes the liquid supply port 5b.
And fill with the filler 14a until the filler 14a fills the liquid supply port 5b on the other side. Since the liquid supply ports 5b located at both ends on the back side are provided at positions as shown in FIG. 2A or 2C, the liquid is filled by the normal pressure injection (normal pressure filling) as described above. The agent is supplied to the liquid supply port 5 (5a,
5b) can be sufficiently filled.

As the first filler 14a, Kuraray Co., Ltd.
PVA-105 manufactured was used. This is a resin having high solvent resistance once cured. However, once filled, the film thickness after curing is about 20 μm, which alone is too thin to function as a filler. In this embodiment, the normal pressure injection is shown. However, when the viscosity of the filler is high, the gap between the opening on the filling side and the needle of the dispenser 13 is eliminated, and the pressure injection (pressure filling) is performed. Can also.

Thereafter, as shown in FIG. 1E, the tape 12 on the back side is peeled off. At this time, the filler 14a is present near the opening of the liquid supply port 5.

Next, the filler 14a is cured by a hot plate at 80 ° C. for 10 minutes via the tape 12 on the front side. As a result, as shown in FIG. 1 (f), the filler 14 a decreases due to the evaporation of moisture, but the filler 14 a on the front side does not change its shape because it is covered with the tape 12. A 20 μm-thick solvent-resistant film is formed in contact with the tape 12.

Next, as shown in FIG. 1 (g), Tamanol E-Arakawa Chemical Industries, Ltd. was used as the second filler 14b.
100 is injected under normal pressure in the same manner as in (d) to (f) of FIG.
This is not resistant to solvents, but can maintain a sufficient volume even after drying because the resin concentration is as high as 50%. Further, since this resin has a heat resistance of 150 ° C., it does not soften even at a temperature of 120 ° C. applied in a later step.

Thereafter, the tape 12 is peeled off by irradiating the tape 12 with UV light from the surface.

Next, as shown in FIG. 1H, after a tape 12a is attached to the back surface, a resin 6 which will later become a liquid flow path is applied to the front surface side and patterned. As the resin 6, a photoresist ODUR1010A manufactured by Tokyo Ohka was used.

This photoresist (ODUR1010)
The solvent of A) is cyclohexanone, and the developing solution is MIBK. However, since the solvent-resistant filler 14a exists in the opening of the liquid supply port 5a on the surface of the substrate, the filler may be dissolved and collapsed. Absent. Further, since the tape 12b is adhered to the back surface of the base, the solvent does not enter the inside of the liquid supply port 5 and does not dissolve the filler. By doing so, a liquid flow path pattern can be formed directly above the filler 14a, and an increase in the strength of the coating resin 7 formed thereafter can be expected.

Next, as shown in FIG. 1 (i), a coating resin 7 as a structural material of the head is applied and patterned. Adeka Optomer C manufactured by Asahi Denka Co., Ltd.
R-1.0 was used. The diluting solvent is MIBK or diglyme, but since the solvent-resistant filler 14a exists in the opening of the liquid supply port 5a on the surface of the base, the filler 14a does not dissolve and sink. Also at this time, the tape 12b is stuck on the back surface in order to prevent the second filler 14b from being dissolved by the diluting solvent.

Then, as shown in FIG. 1 (j), a discharge port 8 is formed in the coating resin 7 at a position facing the discharge energy generating element 3 by oxygen plasma etching.

Thereafter, as shown in FIG. 1 (k), the resin 6 and the second filler 14b which are to be liquid flow paths are removed by using a removing liquid ethyl cellosolve.

Then, as shown in FIG.
The liquid filler head is completed by removing the first filler 14a using hot water at ℃.

In this embodiment, two kinds of fillers 14 are used.
Although a and 14b are used, the first filler 14a is dried, and the filling and drying are repeatedly performed so as to perform the next filling.

Next, a second embodiment of the method for manufacturing a liquid discharge head according to the present invention will be described with reference to FIGS. FIG. 3 is a process diagram showing a part of a manufacturing procedure according to a second embodiment of the method for manufacturing a liquid discharge head according to the present invention. FIG. 4A shows a state in which a liquid supply port is formed in the present embodiment. FIG. 2 is a longitudinal sectional view of the liquid ejection head of FIG.
FIG. 4B is a longitudinal sectional view of the liquid discharge head in a state where the liquid supply port is filled with the filler in the present embodiment.

As shown in FIG. 3A, the thickness is 0.6 m.
SiO ₂ is sputtered as a protective film 16 on the back surface of the cast silicon substrate 1a, and an ejection energy generating element 3 such as a heating element, an inorganic protective film (not shown), and an organic protective film are manufactured by Hitachi Chemical Co., Ltd. The high resistance 11 is patterned. Then, a photoresist 15 is applied on the entire surface.

Next, the liquid supply port 5 is formed as shown in FIG. That is, first, a groove is formed with a dicer from the front surface side of the base to form a liquid supply port 5a, and a liquid supply port 5b on the back side is formed by drilling at three places from the back side with respect to the groove-like liquid supply port 5a. . A cross section in the longitudinal direction of the liquid supply port at this time is shown in FIG. 4A, and FIG. 3 is a cross section along the line AA in FIG. 4A. The liquid supply port 5b on the back side only has to communicate with the liquid supply port 5a on the front side, and as shown in FIG.
The width does not need to be the same, and the centers do not have to coincide.

Next, as shown in FIG.
An SiO ₂ protective film 16 is formed on the surface a by low-temperature sputtering. At the same time, the SiO ₂ protective film 16 is formed on the inner walls of the liquid supply ports 5a and 5b. After that, the photoresist 15
Is removed. At this time, the protective film 16 is lifted off and removed.

Then, FIG. 3 (d) and FIG. 4 (b)
As shown in FIG. 7, a fluororesin tape 12 is attached to the openings of the liquid supply ports 5a and 5b on both the front and back surfaces, except for one location of the opening of the liquid supply port 5b on the back side, and vacuum is applied with the substrate surface side down. Place in chamber 17. After the inside of the vacuum chamber 17 is evacuated, the filler 14 is injected from the dispenser 13 through the opening of the liquid supply port 5b to which the tape 12 on the back side is not attached, and is sufficiently filled to fill the entire opening on the back side. Hang it down. Here, egg white (protein) was used as the filler 14. As a result, the liquid supply port 5 is sealed with the tape 12 and the filler 14. After this, the vacuum chamber 17
To the atmosphere. As a result, the inside of the liquid supply port 5 becomes vacuum and the outside becomes air, so that the filler 14 is filled inside the liquid supply port 5.

Next, when curing is performed at 100 ° C. for 1 hour,
The filler 14 hardens in a shape as shown in FIG.

Thereafter, the same processing as the processing shown in FIG. 1H and thereafter in the first embodiment is performed. However, the albumen used as a filler is removed by leaving the mixture in a solution of pepsin in hydrochloric acid at 40 ° C. for 5 hours and then exposing it to peptidase for 5 hours.

Next, a third embodiment of the method for manufacturing a liquid discharge head according to the present invention will be described with reference to FIGS. FIG. 5 is a process chart showing a part of a manufacturing procedure of a liquid discharge head according to a third embodiment of the method of manufacturing a liquid discharge head according to the present invention, and FIG. FIG. 3B is a longitudinal sectional view of the liquid discharge head in a state where a solid filler is placed on the liquid discharge head. FIG. It is sectional drawing of a longitudinal direction.

This embodiment is different from the above-described second embodiment in that a solvent-resistant hot-melt resin is used as a filler for filling the liquid supply port 5.

FIGS. 5 (a) to 5 (c) correspond to FIGS. 3 (a) to 3 (c).
(C), and thereafter, as shown in FIG. 5 (d) and FIG. 6 (a), a solvent-resistant hot-melt resin 14c as a filler is liquefied in a solid state. It is placed inside the supply port 5. Terpene phenol resin was used as the hot melt resin 14c.

Next, the glass plate 1 coated with a water repellent on its surface
8 is placed on a hot plate 19 as shown in FIG. 5 (e) and FIG. 6 (b).
At 0 ° C., the hot melt resin 14c was melted, and FIG.
(F), a flat filling layer is formed in the opening on the front side of the liquid supply port 5.

The terpene phenol resin used as the hot melt resin 14c is inferior in solvent resistance. If the resin 6 serving as a liquid flow path is applied as it is, the terpene phenol resin is dissolved by the solvent of the resin 6, so that the Aluminum film 2 on the surface
0 is sputtered and patterned so as to leave only the periphery of the liquid supply port 5.

Thereafter, the same processing as the processing shown in FIG. 1H and thereafter in the first embodiment is performed. However, phosphoric acid was used to remove the aluminum film 20. In this embodiment, the aluminum film is used, but an inorganic film such as SiO ₂ or SiN can be used.

Next, a fourth embodiment of the method for manufacturing a liquid discharge head according to the present invention will be described with reference to FIGS. FIG. 7 is a process diagram showing a part of a procedure for manufacturing a liquid discharge head according to a fourth embodiment of the method for manufacturing a liquid discharge head according to the present invention. FIG. 8 shows a state in which a liquid supply port is formed in the present embodiment. FIG. 4 is a longitudinal sectional view of the liquid ejection head of FIG.

In this embodiment, the substrate 1 is made of SiC
Using the substrate 1b, as shown in FIG.
A heat storage layer (not shown), a discharge energy generating element 3 such as a heating element, and a protective film (not shown) are formed on a 6 mm SiC substrate 1b, and an organic protective film 11 is patterned.

Next, as shown in FIG. 7B, a penetrating liquid supply port 5 is formed. FIG. 8 shows a longitudinal section of the liquid supply port 5 at this time. FIG. 7 is a sectional view taken along line AA in FIG.
The cross section along the line is shown.

Next, as shown in FIG. 7C, a tape 12 (UV-curable tape P-5780 manufactured by Lintec Corporation) is attached to the liquid supply port 5 on the surface of the substrate, and thereafter, FIG. As shown in FIG. 5, an aluminum film 20 is sputtered from the back side.

Then, the filler 14 is injected into the liquid supply port 5 in the same manner as in FIG. 1G in the first embodiment. As the filler 14, Tamanol E-100 manufactured by Arakawa Chemical Industry Co., Ltd., which has no solvent resistance but high fillability, is filled at normal pressure.

Thereafter, the same processing as the processing shown in FIG. 1H and thereafter in the first embodiment described above is performed. Then, the aluminum film 20 on the inner surface of the liquid supply port 5 finally left.
Is etched with phosphoric acid. As a result, the inner wall of the liquid supply port 5 is exposed to the ink without the protective film, but is not corroded by the ink because the SiC of the base has excellent corrosion resistance.

In the above embodiments, cast silicon or SiC is used as the substrate, but any substrate such as single crystal silicon or Al or the like can be used as in the prior art.
In the case of a substrate made of Al or the like, a high-precision liquid supply port can be formed by using a diamond tool instead of a diamond blade.

As described above, in the present invention, when the liquid supply port formed in the previous step of forming the liquid flow path is filled with a removable filler, the liquid supply port on the surface of the substrate is made of tape, glass or the like. By filling and curing the filler while closing with
A flat surface can be formed on the surface side of the filler. In the case of a solvent-dilutable filler, the sealing of the tape surface is maintained, and the lower surface is opened after opening the lower surface, so that the substrate can be dried from the rear surface and the flatness of the substrate surface can be maintained. In the case of a hot-melt type filler, it is possible to maintain the flatness on the substrate surface side by curing the tape with the tape surface down.

Further, by filling a solvent-resistant filler on the substrate surface side of the liquid supply port, or by vacuum-forming an inorganic or metal film on the substrate surface side of the filler filled in the liquid supply port. And solvent resistance can be ensured. This makes it possible to impart resistance to the solvent and the developing solution of the liquid flow path forming agent formed on the surface side of the base of the liquid supply port, and to form the liquid flow path without using a dry film.

Further, an elongated groove is formed by dicing the surface of the substrate with a dicer or a slicer, and a plurality of holes are formed from the back surface to form a liquid supply port partially penetrating the substrate. Thereby, it is possible to improve the mechanical strength of the base, and by drilling holes located at both ends of the plurality of holes so as to be located at the same or outside of the end of the groove on the surface side, Filling of the liquid supply port with the filler can be sufficiently performed by filling under normal pressure.

If patterning of the liquid flow path above the liquid supply port is not necessary, the same resist as the liquid flow path type agent can be used as the filler. Further, a coating type resist is used as the liquid channel type agent, but it goes without saying that a dry film can be used as in the conventional case.

[0071]

As described above, according to the present invention,
In a method of manufacturing a liquid ejection head for forming a liquid supply port penetrating a substrate on which an ejection energy generating element is formed,
The manufacturing process can be simplified by filling the liquid supply port with a filler that can be removed later as a pre-process of forming the liquid flow path, and the liquid supply port on the substrate surface side is closed with tape, glass, or the like. By filling and curing the filler in a solid state, a flat surface can be formed on the surface side of the filler, and by filling a solvent-resistant filler on the substrate surface side of the liquid supply port. Alternatively, solvent resistance can be ensured by forming an inorganic or metal film on the surface side of the base of the filler to be filled in the liquid supply port. This makes it possible to impart resistance to the solvent and the developing solution of the liquid flow path forming agent formed on the surface side of the base of the liquid supply port, and to form the liquid flow path without using a dry film.

Further, a groove is formed from the surface of the base with a dicer or the like to form an elongated groove, and a plurality of holes are formed from the back side to form a liquid supply port partially penetrating the base. The mechanical strength of the base can be improved, and the holes provided at both ends of the plurality of holes are formed so as to be located at the same or outside of the ends of the grooves on the surface side, so that the liquid supply can be performed. The filling of the filler into the mouth can be sufficiently performed by normal pressure filling.

Further, according to the present invention, a liquid discharge head which can be applied to any substrate, has a simple process, requires little capital investment, and has high strength can be manufactured.

[Brief description of the drawings]

FIG. 1 is a process diagram showing a manufacturing procedure of a liquid discharge head according to an embodiment of a method of manufacturing a liquid discharge head according to the present invention.

FIG. 2A is a longitudinal sectional view of a liquid discharge head in a state where a liquid supply port is formed in one embodiment of a method of manufacturing a liquid discharge head according to the present invention, and FIG. FIG. 7 is a longitudinal sectional view of the liquid discharge head in a state where the liquid is filled with a filler, and FIG. 7C is a longitudinal sectional view of the liquid discharge head in another state in which a liquid supply port is formed.

FIG. 3 shows a second example of the method of manufacturing a liquid ejection head according to the present invention.
FIG. 7 is a process chart showing a part of a manufacturing procedure according to the example of FIG.

FIG. 4A is a longitudinal sectional view of a liquid discharge head in a state where a liquid supply port is formed in a second embodiment of the liquid discharge head manufacturing method according to the present invention, and FIG. FIG. 4 is a longitudinal sectional view of the liquid discharge head in a state where a supply port is filled with a filler.

FIG. 5 shows a third example of the method for manufacturing a liquid discharge head according to the present invention.
FIG. 7 is a process chart showing a part of a manufacturing procedure according to the example of FIG.

FIG. 6A is a longitudinal sectional view of a liquid discharge head in a state where a solid filler is placed in a liquid supply port in a third embodiment of the method of manufacturing a liquid discharge head according to the present invention. FIG. 4B is a longitudinal sectional view of the liquid discharge head in a state in which a solid filler in the liquid supply port is dissolved.

FIG. 7 shows a fourth method of manufacturing the liquid discharge head according to the present invention.
FIG. 7 is a process chart showing a part of a manufacturing procedure according to the example of FIG.

FIG. 8 shows a fourth method of manufacturing the liquid discharge head according to the present invention.
FIG. 5 is a longitudinal sectional view of a liquid ejection head in a state where a liquid supply port is formed in the example of FIG.

[Explanation of symbols]

 Reference Signs List 1 base 1a cast silicon substrate 1b SiC substrate 3 discharge energy generating element 5 liquid supply port (through hole) 5a (surface side) liquid supply port (groove) 5b (back side) liquid supply port 6 (liquid flow path) ) Resin 7 Coating resin 8 Discharge port 11 Organic protective film 12 Tape 13 Dispenser 14 (a, b, c) Filler 15 Photoresist 16 Protective film 17 Vacuum chamber 18 Glass plate 19 Hot plate 20 Aluminum film

Claims (10)

[Claims] 1. A method for manufacturing a liquid discharge head, comprising: forming a liquid supply port penetrating through a substrate on which a discharge energy generating element is formed, filling the liquid supply port with a filler, and thereafter forming a liquid flow path. In the above, using a filler that can be removed later as the filler, a liquid filler is filled into the liquid supply port by normal pressure injection, pressure injection, or reduced pressure injection, or a solid filler is filled in the liquid supply port. A method for manufacturing a liquid discharge head, comprising mounting the liquid discharge head. 2. A liquid filler is filled in the liquid supply port after closing the substrate surface side of the liquid supply port with a tape or a glass plate, or the solid filler is placed in the liquid supply port. 2. The method according to claim 1, wherein the surface of the base of the liquid supply port is closed with a tape or a glass plate. 3. The liquid ejection device according to claim 1, wherein after filling the solvent-dilutable filler, an opening of a liquid supply port on the surface side of the substrate is opened to dry the solvent of the filler. Head manufacturing method. 4. The method for manufacturing a liquid discharge head according to claim 1, wherein a hot melt resin in a solid state is placed in the liquid supply port and then heated with the substrate surface side down. 5. The method according to claim 1, wherein the filler is a solvent-soluble resin, a water-dispersed resist, or a protein. 6. The method according to claim 1, wherein the surface of the substrate is filled with a filler having high solvent resistance, and the lower layer is filled with a filler which can be easily removed with a solvent. Of manufacturing a liquid ejection head. 7. The method according to claim 1, wherein a solvent-resistant thin film is formed on the front surface side of the base from the back surface, and a lower layer is filled with a filler which is easily removed with a solvent. The manufacturing method of the liquid discharge head according to the above. 8. The method according to claim 1, wherein after filling the filler into the liquid supply port, a solvent-resistant thin film is formed on the surface of the base of the filler. The manufacturing method of the liquid discharge head according to the above. 9. The substrate surface of the liquid supply port is an elongated groove, and a plurality of holes penetrating the groove are formed in the liquid supply port on the rear surface side of the substrate. The method according to any one of claims 1 to 8, wherein an opening area is equal to or less than 1/2 of an opening area on a surface side of the substrate. 10. The liquid supply apparatus according to claim 1, wherein holes located at both ends of the plurality of holes on the back surface side of the base are located at the same positions as or outside the ends of the grooves on the front surface side of the base. 10. The method for manufacturing a liquid discharge head according to item 9.