JP2002326360A - Method for manufacturing liquid discharged head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid discharge head which enables liquid channels to be formed without using a dry film, is simple in processes and requires less equipment in investment. SOLUTION: On a base 1 having a discharge energy generating element 3 formed thereon, a groove 5a is worked on a base surface of a part which becomes a liquid supply port 5 later. A removable filler 14a is filled into the groove 5a by a dispenser 13. Thereafter, a resin 6 to be the liquid channels later is applied and patterned, a coating resin layer 7 to be a structural material of the head is formed and a discharge opening 8 is formed for the coating resin layer 7. The base 1 is subsequently ground or cut from a rear face to reach at least the filler 14a, whereby the liquid supply port 5b is formed. Then, the filler 14a in the groove 5a and the resin layer 6 are removed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid discharge head for discharging a liquid such as ink from a discharge port as flying droplets and attaching the liquid to a recording medium to perform print recording and image formation. .

[0002]

2. Description of the Related Art A conventional general liquid discharge head has a plurality of fine discharge ports for discharging a liquid such as ink, a liquid flow path communicating with each discharge port, and a discharge energy disposed in each liquid flow path. A discharge element having a generating element, applying a drive signal corresponding to recording information or image information to the discharge energy generating element, and applying discharge energy to the liquid in the liquid flow path corresponding to the discharge energy generating element. The liquid is ejected from the apparatus as flying droplets to perform print recording and image formation.

In a so-called side shooter type liquid discharge head which discharges liquid droplets in a direction perpendicular to the surface on which the discharge energy generating element is formed, it is necessary to provide a liquid supply port penetrating through the base. With regard to a method of manufacturing this type of liquid discharge head, a method of forming a liquid flow path with a dry film in order to form a liquid flow path in a substrate having a liquid supply through-hole formed therein is disclosed in -264957. This is because, in the method in which the resin layer serving as the liquid flow path is dissolved in a solvent and applied, the resin enters the through-hole and cannot be uniformly formed.

[0004] However, it is difficult to obtain a high resolution and an aspect ratio by a method using a dry film.
There are problems such as the dripping of the dry film into the penetrated liquid supply port.

As a method of avoiding such a problem of the dry film, there is a method proposed in Japanese Patent Application Laid-Open No. Hei 9-11479. The liquid supply port is formed by anisotropic etching without using the above.

However, this method also has problems such as long and complicated steps, a substrate limited to silicon having a specific orientation, and large capital investment.

Japanese Patent Application Laid-Open No. 10-128885 discloses that a resin having a through hole and a discharge energy generating element formed thereon is filled with a resin, and then a discharge port forming portion is formed. A method of forming a liquid supply port by cutting the applied resin from the back surface has been proposed. This will be described with reference to FIG.

(1) A resist layer 106 is formed on an Al substrate 101 in which an ink-resistant filler 114 is filled in a through-hole 105 (see FIG. 8A). (2) Coating resin 107 as orifice plate material
Is formed on the resist layer 106 (see FIG. 8B). (3) Exposing the portion other than the portion serving as the discharge port via the mask 110 (see FIG. 8C). (4) The discharge port 108 is developed (see FIG. 8D). (5) A liquid supply port 105a narrower than the through-hole 105 is formed from the back surface by cutting. At this time, the filler layer remaining on the inner wall of the through-hole 105 becomes an ink-resistant layer (FIG. 8E).
reference). (6) The resist layer 106 is removed (see FIG. 8F).

[0009]

However, the method described in the above-mentioned Japanese Patent Laid-Open Publication No. Hei 10-128985 also has the following problems.

(1) It is difficult to control the blade between the resist layers. Although the thickness of the resist layer 106 is only about 10 μm and the flatness of the ink-resistant filler 104 can be obtained, a cutting blade for forming the liquid supply port 105 a is formed by using a cutting tool for the resist layer 106. It is very difficult to control during thickness.

(2) Fillers and filling methods are limited. Fillers and filling methods that are ink-resistant, can be filled without generating bubbles throughout the through-hole, and can flatten the filled surface are limited. Although the width of the liquid supply port is set to be as large as about 1 mm, the smaller the supply port width is, the better in terms of the number of chips and the strength of the orifice plate material.

(3) The distance between the end of the liquid supply port and the discharge energy generating element becomes longer. The shorter the distance between the end of the liquid supply port and the discharge energy generating element, the higher the discharge frequency, and generally, it is preferably about 50 μm. However, when the resin layer (104) is left as shown in FIG.
This is necessary, and it is difficult to shorten the distance between the liquid supply port end and the ejection energy generating element.

(4) The substrate is easily deformed by stress. Since the resin is filled in the entire area of the through hole, the substrate is easily deformed due to a difference in expansion coefficient between the substrate and the resin.

Therefore, the present invention has been made in view of the above-mentioned unresolved problems of the prior art, and can form a liquid flow path without using a dry film, and is simple in the process and requires low capital investment. It is an object of the present invention to provide a method for manufacturing a liquid ejection head with a small number.

[0015]

In order to achieve the above object, a method of manufacturing a liquid discharge head according to the present invention is directed to a method of manufacturing a liquid discharge head in which a liquid supply port is formed through a base on which a discharge energy generating element is formed. In the method, a groove is formed on the surface of the base in a portion to be a liquid supply port later, the groove is filled with a removable filler, a resin layer serving as a liquid flow path is formed, and a coating resin layer serving as a structural material of a head is formed. After the formation of the coating resin layer and the formation of the discharge port, grinding or cutting is performed from the back surface of the base to the filler, and then the filler is removed.

In the method of manufacturing a liquid discharge head according to the present invention, it is preferable that the groove is filled with a filler with a dispenser.

In the method of manufacturing a liquid discharge head according to the present invention, it is preferable to form an ink-resistant layer on the inner wall of the liquid supply port after removing the filler.

[0018]

According to the liquid ejecting head manufacturing method of the present invention,
When forming the liquid supply port on the substrate on which the ejection energy generating element is formed, first, a shallow groove of 40 μm or less is formed on the surface side of the substrate, and the groove is filled with a removable filler. The dry film is formed by forming a resin to be a flow path, forming a coating resin layer to be a structural material of the head, and forming a discharge port for the coating resin layer, and then penetrating the liquid supply port from the back side of the base. The liquid flow path can be formed without using the liquid supply port.Furthermore, the height control range of the blade of the liquid supply opening is controlled by the thickness of the liquid flow path mold and the depth of the groove filled with the filler. Since the gap can be set, the allowable range of the liquid supply port processing is widened, and the control of the blade is simplified.

Further, since the groove on the surface side for filling the filler is shallow, a filler having a low solid content can be used, and the filler does not require ink resistance, and the range of the filling method is widened. , Makes filling easier. Further, since the amount of the filler is reduced, the substrate is unlikely to be deformed due to a difference in expansion coefficient from the filler.

By using an ink-resistant substrate that does not require corrosion-resistant treatment on the end face, or by forming an ink-resistant layer with a thin film even on other substrates such as Si, the liquid supply port end can be formed. -The distance between the ejection energy generating elements can be shortened, and the liquid ejection frequency can be improved.

Further, according to the present invention, it is possible to manufacture a liquid discharge head which can be applied to any substrate, has a simple process, and requires little capital investment.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

One embodiment of a method of manufacturing a liquid discharge head according to the present invention will be described with reference to FIGS.
FIG. 1 is a process diagram showing a procedure for manufacturing a liquid discharge head according to an embodiment of a method for manufacturing a liquid discharge head according to the present invention, and FIG. FIG. 3 is a longitudinal sectional view of the liquid ejection head in a state where a liquid supply port groove is formed on the surface side of the base in the embodiment;
FIG. 2B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port on the back surface side of the base is formed.

In this embodiment, the substrate 1 is made of SiC
The substrate 1a is used. Since the SiC substrate has ink resistance unlike the Si substrate, it is not necessary to perform an anti-corrosion treatment on an inner wall such as a liquid supply port as in the conventional example. First, as shown in FIG. 1A, a 0.8 mm thick SiC substrate 1a
A heat storage layer (not shown), a discharge energy generating element 3 such as a heating element, and a protective layer (not shown) for the discharge energy generating element 3 are formed thereon.

Next, as shown in FIG. 1 (b), a groove 5a serving as a liquid supply port on the front side is formed into a 20 μm groove by a dicer. FIG. 2A shows the processing shape in the longitudinal direction of the head at this time. The groove 5a on the front side is about 50 mm (2
Width) 150 μm, groove length 100 mm, groove depth d ₁ = 2 using a 4000 inch diameter diamond blade.
It was formed at 0 μm. FIG. 1 shows a cross section along the line AA in FIG.

Next, as shown in FIG. 1C, the filler 5a is filled in the groove 5a on the front surface with the dispenser 13. The same photoresist ODU manufactured by Tokyo Ohka as the filler (a) used as the resin (molding agent) serving as the liquid flow path
R1010A was used. However, this photoresist O
The stock solution of DUR1010A was used after being diluted with cyclohexanone because the viscosity was too high to discharge with a dispenser. Since the solid content is about 10%, 2
In order to obtain a film thickness of 0 μm, it is sufficient to apply the film to a thickness of about 200 μm, so that it can be sufficiently applied with a dispenser.

Next, the filler 14a is cured on a hot plate at 120 ° C. for 3 minutes to make the surface almost flat as shown in FIG. 1 (d).

Thereafter, as shown in FIG. 1E, a resin 6 which will later become a liquid flow path is applied to the substrate surface and patterned. As the resin 6, as described above, the same photoresist ODUR1010A manufactured by Tokyo Ohka as the filler 14a is used, and the film thickness after drying is set to 20 μm, which is the same as that of the filler.

Next, as shown in FIG. 1F, a coating resin 7 which is a structural material of the head is applied and patterned. Adeka Optomer CR manufactured by Asahi Denka Co., Ltd.
-1.0 was used. The film thickness after drying is 25 μm.

Next, as shown in FIG. 1 (g), a discharge port 8 is formed on the coating resin 7 at a portion facing the discharge energy generating element 3 by oxygen plasma etching.

Thereafter, as shown in FIG.
A liquid supply port 5b on the back surface is formed from the back surface of the iC substrate 1a to the filler 14a. This liquid supply port 5b is processed into the shape shown in FIG. 2B using a diamond blade in the same manner as the processing of the liquid supply port groove 5a on the front side. The blade width was set to 100 μm, which was smaller than that used for the liquid supply port groove 5a on the front side. The groove 5a on the front side and the liquid supply port 5b on the back side only have to communicate with each other, and there is no problem even if their widths and center positions are different as shown in FIG.

In processing the liquid supply port, in the prior art,
Although the control of the processing depth direction had to enter the range of the resin layer 6 which becomes a liquid flow path, in this embodiment, the control of the processing depth is performed between the resin layer 6 and the filler 14a. It's very easy to get in.

Next, as shown in FIG. 1 (i), the filler 14a and the resin 6 serving as a liquid flow path are removed by using a removing liquid ethyl cellosolve. Thereby, the liquid ejection head is completed.

In this embodiment, the use of an ink-resistant SiC substrate as the base material eliminates the need for corrosion-resistant treatment such as forming a protective film on the inner wall of the liquid supply port.
It is also possible to use AlN having ink resistance instead of SiC, and in this case also, it is not necessary to form a protective film at the liquid supply port.

Next, a second embodiment of the method for manufacturing a liquid discharge head according to the present invention will be described with reference to FIGS. FIG. 3 is a process diagram showing a procedure for manufacturing a liquid discharge head according to a second embodiment of the method for manufacturing a liquid discharge head according to the present invention, and FIG. 4A is a method for manufacturing a liquid discharge head according to the present invention. FIG. 11B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port groove is formed on the front surface side of the substrate in the second embodiment. FIG. FIG. 4 is a longitudinal sectional view of the ejection head.

Also in this embodiment, the substrate 1 is made of SiC
As shown in FIG. 3A, an SiC substrate 1a having a thickness of 0.8 mm was used in the same manner as in the above-described embodiment using the substrate 1a.
A heat storage layer (not shown), a discharge energy generating element 3 such as a heating element, and a protective layer (not shown) for the discharge energy generating element are formed thereon.

Next, as shown in FIG. 3B, a groove 5a serving as a liquid supply port on the front side is formed by using a diamond blade as in the above-described embodiment. In the present embodiment, and the groove depth d ₁ and 40 [mu] m. FIG. 4A shows the processing shape in the longitudinal direction of the head at this time. FIG. 3 shows a cross section along the line AA in FIG.

Next, as shown in FIG. 3 (c), the groove 5a on the front side is filled with a solvent resistant filler 14b by the dispenser 13. PVA was used as the solvent-resistant filler 14b, and filling with 10% concentration PVA and drying at 80 ° C. for 10 minutes were repeated twice, and the surface was flattened as shown in FIG. 3D.

Thereafter, as shown in FIGS. 3 (e) to 3 (g), the resin 6 serving as a liquid flow path (photoresist O
DUR1010A) coating and patterning, coating resin 7 (Adeka Optomer C manufactured by Asahi Denka Co., Ltd.) as a structural material of the head
R-1.0) is applied and patterned, and the discharge port 8 is formed by oxygen plasma etching in the same manner as in the above-described embodiment.

Next, as shown in FIG.
From the back surface of the C substrate 1a, a plurality of holes 5b having a diameter of 0.3 mm (which are liquid supply ports on the back surface) are opened in the longitudinal direction of the head by ultrasonic processing up to the filler 14b. FIG. 4B shows a cross section in the longitudinal direction at this time. In this case, the substrate is
Since only a part of the liquid supply port is penetrated, the mechanical strength is superior to that of the above-described embodiment.

Next, as shown in FIG.
The PVA as the solvent-resistant filler 14b is removed with warm water. Then, the resin 6 serving as a liquid flow path is removed by ethyl cellosolve. Thereby, the liquid ejection head is completed.

Next, a third embodiment of the method for manufacturing a liquid discharge head according to the present invention will be described with reference to FIG.
FIG. 5A is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port groove is formed on the surface side of the base in the third embodiment of the method of manufacturing the liquid discharge head according to the present invention,
FIG. 2B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port on the back surface side of the base is formed.

This embodiment is a modification of the above-described second embodiment, and differs from the second embodiment in the processing method and the shape of the liquid supply port 5b on the back surface of the substrate. And performs the same processing as shown in FIG.
In the second embodiment, the liquid supply port 5b on the back side of the substrate was formed into a cylindrical shape by ultrasonic processing from the back side (FIG. 4 (b)).
However, in this embodiment, the substrate is formed in an arc shape from the back surface side with a diamond blade to have a shape shown in FIG.
By forming the two arc-shaped liquid supply ports 5b using a diamond blade in this manner, the front surface (liquid supply port) groove 5a and the liquid supply port 5b on the back side can be processed by the same apparatus. There is an advantage that the mechanical strength of the substrate can be increased as compared with the first embodiment.

Next, a fourth embodiment of the method for manufacturing a liquid discharge head according to the present invention will be described with reference to FIGS. FIG. 6 is a process chart showing a manufacturing procedure of a liquid discharge head according to a fourth embodiment of the method of manufacturing a liquid discharge head according to the present invention, and FIG. 7A is a method of manufacturing a liquid discharge head according to the present invention. FIG. 14B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port groove is formed on the front surface side of the substrate in the fourth embodiment, and FIG. FIG. 4 is a longitudinal sectional view of the ejection head.

In this embodiment, an Si substrate 1b is used as the substrate 1, and the thickness of the substrate is 0.8 as shown in FIG.
A heat storage layer (not shown), a discharge energy generating element 3 such as a heating element, and a protective film (not shown) for the discharge energy generating element 3 are formed on a 1 mm Si substrate 1b.

Next, as shown in FIG. 6B, a groove 5a serving as a liquid supply port on the front side is formed by using a diamond blade. The (liquid supply port) groove 5a on the front side has a width 1
It was formed with a thickness of 50 μm and a depth d ₁ = 20 μm. FIG. 7A shows a cross section in the longitudinal direction of the head at this time.

Next, as shown in FIG. 6C, an organic resin protective film 15 is applied by 2 μm spray application and patterned. Note that, as the organic resin protective film 15, Himamaru manufactured by Hitachi Chemical was used. At this time, the organic resin protective film 15 is also formed on the inner wall of the groove 5a on the front side.

Next, as shown in FIG. 6D, FIG.
(C), the dispenser 13 is inserted into the groove 5a on the front side.
To fill the filler 14a. As the filler 14a, the same photoresist ODUR1010A manufactured by Tokyo Ohka as used in the liquid channel mold was used as in the first embodiment.

Thereafter, as shown in FIG.
4a is cured on a hot plate at 120 ° C. for 3 minutes,
As shown in FIG. 6E, the surface is made substantially flat.

Next, as shown in FIGS. 6F to 6H, application and patterning of a resin 6 (photoresist ODUR1010A manufactured by Tokyo Ohka), which serves as a liquid flow path, and a coating resin 7 (which serves as a structural material of a head) The application and patterning of Adeka Optomer CR-1.0 manufactured by Asahi Denka and the formation of the discharge port 8 by oxygen plasma etching are performed in the same manner as in the first embodiment described above with reference to FIGS. Do.

Next, as shown in FIG.
A liquid supply port 5b on the back side is formed from the back side of the substrate 1b with a diamond blade. The blade used had a tip with a thickness of 50 μm and became thicker toward the center of the blade. As a result, a liquid supply port 5b on the back side having a shape as shown in FIG. 6 (i) is formed. FIG. 7B shows a cross section in the longitudinal direction of the head at this time.

Next, as shown in FIG. 6 (j), the organic resin protective film (Hymal) 15 formed on the inner wall of the groove 5a on the front surface side is cut with a blade, and as shown in FIG. Since the shape 15a is torn, it is removed by dry etching.

Thereafter, as shown in FIG. 6 (k), the filler 14a and the resin 6 serving as a liquid flow path are removed with a removing liquid ethyl cellosolve.

Then, as shown in FIG.
Si from the back surface of the substrate 1b as the ink-resistant protective film 16
O ₂ is deposited in a thickness of 0.5 μm. As a result, SiO ₂ is,
A film is formed on the back surface of the Si substrate 1b, the inner wall of the liquid supply port 5b on the back surface side, and a part of the inner wall of the coating resin 7. Coating resin layer 7
The ink-resistant protective film 16 adhered to the inner wall prevents the coating resin 7 from swelling with ink. When the ink-resistant protective film 16 is formed, if the ejection energy generating element 3 is a heating element (heater), and the protective film is formed thereon, the foaming voltage changes. As the film forming method, vapor deposition or sputtering which is rich in straightness is suitable. In addition, as a material, an inorganic material such as SiN or a metal such as Ni, Au, or Ta can be used.

As described above, in the present invention, at the time of forming the liquid supply port, first, a shallow groove of 40 μm or less is formed on the surface side of the substrate, and the groove is filled with a removable filler. Forming a resin layer to be a liquid flow path, forming a coating resin layer to be a structural material of the head, and forming a discharge port for the coating resin layer, and thereafter, by penetrating the liquid supply port from the back side of the base, dry The liquid flow path can be formed without using a film.Furthermore, the height control range of the blade for the liquid supply port penetrating processing is controlled by the thickness of the liquid flow path mold and the depth of the groove filled with the filler. Since the liquid supply port can be processed in a wide range, the control of the blade can be simplified.

Further, since the groove on the surface side for filling the filler is shallow, a filler having a low solid content can be used, and the filler does not require ink resistance, and the range of the filling method is widened. , Makes filling easier. Further, since the amount of the filler is reduced, the substrate is unlikely to be deformed due to a difference in expansion coefficient from the filler.

Further, by using an ink-resistant substrate which does not require a corrosion-resistant treatment on the end face, or by forming an ink-resistant layer with a thin film even on other substrates such as Si, the liquid supply is performed. The distance between the mouth end and the discharge energy generating element can be shortened, and the liquid discharge frequency can be improved.

[0058]

As described above, according to the present invention,
The liquid flow path can be formed without using a dry film, and the height control range of the blade for penetrating the liquid supply port is widened, and the control of the blade is simplified. In addition, since the groove on the surface side for filling the filler is shallow, a filler having a low solid content can be used, and the filler does not require ink resistance.
Further, the range of the filling method is widened, and the filling is facilitated. Further, since the amount of the filler is reduced, the substrate is less likely to be deformed due to a difference in expansion coefficient with the filler.

Further, the present invention can be applied to any type of substrate, and can manufacture a liquid discharge head with a simple process and a small capital investment.

[Brief description of the drawings]

FIG. 1 is a process diagram showing a manufacturing procedure of a liquid discharge head according to an embodiment of a method of manufacturing a liquid discharge head according to the present invention.

FIG. 2A is a longitudinal sectional view of a liquid discharge head in a state in which a liquid supply port groove is formed on a surface side of a substrate in one embodiment of a method of manufacturing a liquid discharge head according to the present invention;
FIG. 2B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port on the back side of the base is formed.

FIG. 3 shows a second example of the method of manufacturing a liquid ejection head according to the present invention.
FIG. 7 is a process chart showing a manufacturing procedure of the liquid ejection head according to the embodiment.

FIG. 4A is a longitudinal sectional view of a liquid discharge head in a state where a liquid supply port groove is formed on the surface side of a substrate in a second embodiment of the method of manufacturing a liquid discharge head according to the present invention; FIG. 2B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port on the back side of the base is formed.

FIG. 5A is a longitudinal sectional view of a liquid discharge head in a state in which a liquid supply port groove is formed on a substrate surface side in a third embodiment of the liquid discharge head manufacturing method according to the present invention; FIG. 2B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port on the back side of the base is formed.

FIG. 6 shows a fourth method of manufacturing the liquid discharge head according to the present invention.
FIG. 7 is a process chart showing a manufacturing procedure of the liquid ejection head according to the embodiment.

FIG. 7A is a longitudinal sectional view of a liquid discharge head in a state where a liquid supply port groove is formed on the surface side of a substrate in a fourth embodiment of the method of manufacturing a liquid discharge head according to the present invention; FIG. 2B is a longitudinal sectional view of the liquid discharge head in a state where a liquid supply port on the back side of the base is formed.

FIG. 8 is a process chart showing a procedure for manufacturing a liquid ejection head by a conventional method for manufacturing a liquid ejection head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 1a SiC substrate 1b Si substrate 3 Discharge energy generating element 5 Liquid supply port (through-hole) 5a (surface side) liquid supply port (groove) 5b (back side) liquid supply port 6 (to be a liquid flow path) Resin 7 Coating resin 8 Discharge port 13 Dispenser 14 (a, b) Filler 15 Organic resin protective film 16 (Ink resistant) protective film

Claims (3)

[Claims] 1. A method of manufacturing a liquid discharge head, wherein a liquid supply port is formed through a substrate on which a discharge energy generating element is formed. After filling with a removable filler, after forming a resin layer serving as a liquid flow path, forming a coating resin layer serving as a structural material of a head, and forming an ejection port for the coating resin layer, the filler is applied from the back surface of the base to the filler. A method for manufacturing a liquid discharge head, wherein grinding or cutting is performed to the last step, and thereafter, a filler is removed. 2. The method according to claim 1, wherein the groove is filled with a filler by a dispenser. 3. An ink-resistant layer is formed on the inner wall of the liquid supply port after removing the filler.
The manufacturing method of the liquid discharge head according to the above.