JP2002318547A - Method of manufacturing display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the weight and thickness of a display panel without lowering productivity. SOLUTION: The display panel is formed by first performing a panel forming process step in order to manufacture the display panel, flatly shifting a pair of substrates 1 and 2 having a prescribed thickness by a prescribed amount from each other, superposing these substrates and joining a pair of the substrates 1 and 2 across a prescribed spacing in the state of providing the outer peripheries of both substrates 1 and 2 with a step ST along the outer peripheries. In succession, an outer periphery sealing process step is performed and a sealant is supplied to the step ST, by which the display panel of the interior is hermetically closed along the outer peripheries of both substrates 1 and 2. The chemical treatment process step is thereafter performed and the display panel is immersed into a liquid chemical in the state that the panel is protected by a sealant and the surfaces of the substrates 1 and 2 are removed by the specified amount by chemical reaction, thereby, the thickness is reduced. When a pair of the substrates are bonded to each other by shifting the substrates from each other, the since step ST is formed along the outer periphery this part can be stably and easily coated with a sealant by a dispenser 50, The sealant with which the step ST is coated along the same infiltrates the spacing between both substrates 1 and 2 by capillarity and the perfect outer peripheries seal can be formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a display panel. More specifically, the present invention relates to a technique for reducing the thickness and weight of a flat display panel using a glass substrate represented by a liquid crystal display or the like.

[0002]

2. Description of the Related Art Recently, demands for display panels such as liquid crystal displays for mobile applications have been increasing, and demands for thinner and lighter display panels have been increasing. In a display panel, a glass substrate occupies a large weight in terms of thickness and weight. Therefore, in order to reduce the thickness and weight of the display panel, it is necessary to reduce the thickness of the glass substrate. When focusing on a large liquid crystal display, the thickness of the glass substrate has recently been 1.1 to 0.7 m.
m. In this case, it is sufficient to simply reduce the thickness of the glass substrate and put it into the assembling process, and no major change in the production line was required. Regarding the substrate size, it is considered that a 0.7 mm thick substrate can support a display panel having a diagonal dimension of 1 m.

However, there is an increasing demand for thinner substrates for mobile applications. The target of the substrate thickness in the next stage is assumed to be 0.5 mm. When the glass substrate is thinned to 0.5 mm, the deflection increases. For example, when a glass substrate having a size of 600 mm × 700 mm is considered, it is impossible to cope with the current production technology and transport technology. Therefore, the size of the substrate is 400
It is conceivable to reconstruct the production line by reducing the size to mm × 500 mm. However, when the size of the substrate is reduced, the number of liquid crystal panels to be taken out as a final product per one sheet is reduced, so that productivity is greatly reduced. There is also an attempt to reduce the thickness of the display panel by assembling the display panel once while keeping the substrate thick, and then mechanically polishing the surface of the glass substrate. However, in this mechanical polishing method, after assembling a large-sized substrate, cutting the substrate into a plurality of panels, and then performing mechanical polishing for each panel, the productivity also decreases.

There has been an attempt to reduce the thickness of a display panel by a chemical treatment instead of a mechanical polishing method. In particular,
A display panel is assembled using the substrate that remains thick, and then a pair of substrates bonded to each other is immersed in a chemical solution, and a certain amount of the substrate surface is removed by a chemical reaction. For example, a chemical consisting of hydrofluoric acid (HF) that can etch glass,
By immersing the glass substrate, the thickness can be relatively easily reduced. According to this method, processing can be performed in a batch manner, so that a large number of substrates can be reduced in thickness at a time, and the display panel can be reduced in thickness and weight without reducing productivity.

Here, in order to clarify the background of the present invention,
The above-described chemical treatment method will be briefly described with reference to the drawings.
FIG. 7 shows a state where the laminate 0 is assembled by bonding two substrates. The size of the glass substrate is 600m
m × 720 mm, for example, 173 manufactured by Corning Incorporated.
7 can be used. The two glass substrates are adhered to each other by a sealant 3. The portion surrounded by the sealant 3 becomes the display area 70 of each panel. After a certain amount of thickness of the glass substrate is removed by the chemical treatment, the laminate 0 is cut for each display area 70, and finally four display panels are obtained in this example. Since the application of the sealant 3 is performed by a dispenser, it is easy to edit a program for automatic control and apply the sealant 3 along a closed pattern. The sealing agent 3 uses a thermosetting resin such as an epoxy resin.

FIG. 8 is a schematic sectional view showing the laminate after the chemical treatment. As shown in the figure, the laminate 0 has a structure in which a pair of substrates 1 and 2 are bonded together with a sealant 3.
After bonding substrates 1 and 2 made of glass,
Is immersed in a reaction tank containing HF to etch the glass surface. As a result, as shown by the dotted lines, both substrates 1,
A certain amount of thickness is removed from the surface of No. 2.

After the etching process, the panel on which the large-sized substrates are bonded is scribed and broken, and cut out into display panels 10 as shown in FIG. At this time, a part of the sealant 3 surrounding the display area 70 of the display panel 10 is cut off at the injection port. After the break, liquid crystal is injected from the injection port.

[0008]

As described above, the display panel can be relatively easily thinned by immersing the glass substrate in HF. However, when a pair of glass substrates are bonded to each other to form a laminate and then thinned by chemical etching, the outer periphery of the laminate is prevented from entering into the gaps of the laminate by capillary action, such as HF. It is necessary to protect the internal display panel by enclosing it with a sealant or the like. Therefore, a step of sealing the outer periphery of the stacked body is required prior to the etching process. In this case, a method is conceivable in which a sealant is supplied by a dispenser along the outer periphery of the substrate simultaneously with the sealing of the display panel. Alternatively, a method in which a pair of substrates are laminated to form a laminate, and the periphery thereof is sealed with an adhesive or the like may be considered.

When the sealant is formed on the outer periphery of the substrate by a dispenser simultaneously with the sealing of the display panel, the time of dispensing the sealant to the outer periphery affects the tact time and the manufacturing equipment. In order to form the outer peripheral seal without reducing the productivity, it is necessary to increase the number of dispensers, but the dispenser for forming the seal is expensive, so that the equipment cost is burdened.

When a seal for protecting the outer periphery is to be formed after bonding a pair of substrates, a sealant is applied to an end face of each substrate. It becomes a problem. The manual process increases the burden on the process. In addition, when the sealant is supplied by the dispenser, unlike the case where the sealant is applied to the surface of the substrate, it is supplied to the end surface of the substrate, so that technical difficulty is involved. Normally, the pair of substrates are overlapped with their end faces almost completely coincident. When a gap between a pair of substrates that are completely overlapped in a plan view is closed, it is extremely difficult to stably and reliably supply a sealant with a dispenser.

[0011]

SUMMARY OF THE INVENTION In view of the above-mentioned problems in the prior art, an object of the present invention is to provide a manufacturing method for realizing a lighter and thinner display panel without reducing productivity. I do. The following measures were taken to achieve this purpose. That is, according to the present invention, a method of manufacturing a display panel includes a step of forming a pair of substrates having a predetermined thickness and displacing them by a predetermined amount in a plane, and providing a step along the outer periphery of both substrates. A panel forming step of bonding the pair of substrates through a gap to form a display panel, and a peripheral sealing step of supplying a sealing agent to the step and sealing the internal display panel along the outer peripheries of both substrates. Immersing the display panel in a chemical solution while being protected by the sealant,
A chemical treatment step of removing a predetermined amount of the surface of the substrate by a chemical reaction to reduce the thickness. Preferably, in the panel forming step, the pair of substrates are overlapped with each other by a predetermined amount in a plane so that the width of the step falls within a range of 0.5 mm to 10 mm. In the outer peripheral sealing step, an ultraviolet curing sealant is applied to the step, and then the sealant is cured by irradiating ultraviolet rays to seal the internal display panel along the outer periphery of both substrates. Further, the outer peripheral sealing step includes:
After applying a sealant having a viscosity in the range of 100 cP to 10000 cP on the step, the sealant is cured to seal the internal display panel along the outer periphery of both substrates. Further, after the chemical treatment step, a polishing step of removing unnecessary projections left along the outer periphery of each substrate by polishing is included.

According to the present invention, when a pair of substrates are joined to each other to assemble a display panel, the two substrates are overlapped with a predetermined amount of displacement from each other and a step is provided along the outer periphery. By supplying the sealant to this step, the outer periphery can be easily sealed. When a pair of substrates are completely overlapped in a plan view without being shifted from each other, it is difficult to supply a sealant with a dispenser or the like, since the entire outer periphery is constituted by end faces. On the other hand, when a pair of substrates are bonded to each other while being displaced from each other, a step is formed along the outer periphery, so that a sealant can be stably and easily applied to this portion with a dispenser. The sealant applied along the step penetrates into the gap between the two substrates by capillary action, and can form a perfect outer peripheral seal.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic view showing a main part of a method for manufacturing a display panel according to the present invention. As shown in (A), first, a panel forming process is performed, and a pair of substrates 1 and 2 made of glass or the like having a predetermined thickness are overlapped with each other by a predetermined amount and shifted from each other in a plane. In this state, a pair of substrates 1 and 2 are joined to each other through a predetermined gap in a state in which a step ST is provided along the line to form a laminate 0 serving as a base of a display panel. The size of each of the glass substrates 1 and 2 used was 600 × 720 mm. Each of the substrates 1 and 2 uses a glass plate material 1737 manufactured by Corning. As shown, the substrates 1 and 2 are overlapped with a slight shift. The shift width ΔX in the left-right direction is, for example, 5 mm, and the shift width ΔY in the vertical direction is, for example, 5 mm. That is, the width of the step ST is 5 mm. In addition, in this panel forming process, the width of the step ST is usually 0.5 mm to 10 mm.
The pair of substrates 1 and 2 are overlapped with each other in a plane by a predetermined amount. The width of the step ST is 0.
If it is less than 5 mm, the sealant cannot be smoothly supplied in a subsequent step. Conversely, if the width of the step ST exceeds 10 mm, a portion that can be finally used as a display panel decreases, which is not preferable.

In this embodiment, when the glass substrates 1 and 2 are laminated together by 5 mm and bonded to each other, the glass substrates 1 and 2 are preliminarily adjusted so that the patterns formed on both substrates are aligned with each other.
The pattern is formed in consideration of the shift amount in each of the patterns. Specifically, a pattern such as a thin film transistor is formed on one glass substrate 1 as a pixel driving element, and a pattern of a color filter is formed on the other glass substrate 2. After a thin film transistor or the like is integratedly formed on the glass substrate 1 and a color filter or the like is formed on the glass substrate 2, a sealant is dispensed on at least one of the substrates along the shape of the panel, and the two substrates are overlapped and joined.

(B) shows an outer peripheral sealing step, in which a sealant is supplied along the step ST by, for example, a dispenser 50 to seal the internal display panel along the outer periphery of both substrates 1 and 2. The dispensing sealant
The same material as the sealant for the display panel can be used. For example, in this embodiment, a thermosetting sealant manufactured by Kyoritsu Chemical was used. As the dispenser 50, a dispenser that applies a sealant for a normal display panel can be used as it is. Although the width of the step ST is 5 mm, the sealant is dispensed at a position where the dispenser 50 is separated from the upper glass substrate 2 by, for example, 0.5 mm. 1200 mm / min from short side of glass substrate 2
Dispensing at the same speed, and then the long side is sealed at the same speed. After dispensing the two sides on one side, the laminate 0 is turned upside down and the two sides of the glass substrate 1 on the opposite side are similarly sealed. After sealing the four sides of the laminate 0, the laminate is put into an oven and cured at 150 ° C. for 2 hours.

FIG. 2 shows a state after the outer periphery of the laminate 0 is sealed and cured. As shown in the drawing, the dispensed sealant 5 permeates into the gap between the substrates 1 and 2 to some extent due to a capillary phenomenon with the passage of time. Because of the permeation by the capillary action, the outer peripheral seal 4 that can completely seal the outer periphery of the laminate 0 can be formed. Thereby, chemical resistance is improved.

Thereafter, as shown in FIG. 3, a chemical treatment step is performed. In other words, the laminate 0 serving as the base of the display panel is immersed in the chemical solution 17 while being protected by the sealant, and a certain amount of the surface of the substrate is removed by a chemical reaction to reduce the thickness. FIG. 3 schematically shows an etching apparatus used in the above-described chemical treatment process. As shown in the figure, the present apparatus is basically based on a container 20, which is filled with a drug solution 17. The cassette 6 on which the laminate 0 to be treated is loaded can be put into the chemical solution 17. The cassette 6 can swing up and down in the container 20 as shown by the arrow. H in the container 20
A chemical solution 17 containing hydrofluoric acid can be introduced via the F supply line 7. Also, pure water can be introduced into the container 20 via the pure water supply line 8. A waste liquid line 13 is provided at the bottom of the container 20.
Is connected, and the used chemical solution 17 can be discharged. As shown in the drawing, in the manufacturing method of the present invention, after a large substrate is bonded to form a laminate 0,
The laminate 0 is placed in the cassette 6 and immersed in the container 20 filled with the chemical solution 17 to remove a certain amount of the substrate surface.
Hydrofluoric acid (HF) is used as the chemical solution 17, and the concentration is set to 20% by weight. The size of the container 20 is 70
It is 0 mm x 700 mm wide x 900 mm high.

After one hour, the HF in the tank was discharged, the same tank was filled with pure water, and the substrate surface was rinsed. The rinsing time was 5 minutes. After performing the drying treatment, the in-plane thickness of the substrate was measured. Before the treatment, the average value is 1.410 mm and the variance is 0.016 m for 25 points in the plane.
m. After the treatment, the average value was 1.008 mm and the variance was 0.036 mm, so that in-plane uniformity without any problem as a display panel was obtained.

Further, there is no infiltration of a chemical solution into a gap between a pair of substrates bonded to each other, and no process problem occurs. After completion of the etching, the laminate is scribed and broken, and cut out for each display panel.
At this time, the used outer peripheral seal can be cut off as it is under normal scribe and break conditions. After the break, a liquid crystal display panel is obtained by injecting liquid crystal into a color display panel and attaching a polarizing plate. When an image was displayed thereon, good display without fogging, unevenness, pixel defects, etc. was obtained.

In the above-described embodiment, a thermosetting sealant is used as the outer peripheral sealant. Instead, an ultraviolet-curable sealant can be used as the outer peripheral sealant. Here, an embodiment using an ultraviolet-curable sealant manufactured by ThreeBond will be described. As in the previous embodiment described with reference to FIG. 1, an ultraviolet curable sealant was applied by a dispenser to the outer peripheral step portions of a pair of substrates that were bonded by being shifted by 5 mm. The dispensing speed is also the same condition as the previous embodiment. Thereafter, a portion to be a display panel was shielded from light, and an outer peripheral portion was irradiated with ultraviolet light by an ultraviolet irradiation device manufactured by Ushio Inc. to cure the sealant. Thereafter, as in the previous embodiment, etching was performed for 60 minutes with a chemical solution having an HF concentration of 20%. After the etching, the laminate in which the pair of substrates were joined was observed. As a result, there was no particular penetration of a chemical solution or the like, and no influence of the etching process was observed. After the etching treatment, the laminate was scribed and broken, and cut out for each display panel. At this time, the outer peripheral seal is cut off as it is under normal scribe and break conditions.
After the break, liquid crystal was injected into the display panel and a polarizing plate was attached to display an image. As a result, good display without fogging, unevenness, image defects, etc. was obtained.

In the case of forming the outer peripheral seal, the viscosity of the sealant is important to control because the sealant is introduced into the gap of the laminate by utilizing the capillary phenomenon. Here, the viscosity is 2000
An embodiment in which outer peripheral sealing is performed using a cP sealing agent will be described. Using the same substrate and apparatus as in the previous embodiment shown in FIG. 1, the sealant for protecting the outer periphery was an ultraviolet-curable sealant. This sealant is an ultraviolet curing agent manufactured by Kyoritsu Chemical. The viscosity of this UV-curable sealant is 20
It has been adjusted to 00 cP. After the outer peripheral seal was performed under the same conditions as in the previous embodiment, etching was performed. When the substrate was observed after the etching, there was no permeation of the chemical solution or the like into the gap, and no influence of the etching process was observed. Further, when the outer peripheral seal was observed, it was confirmed that the sealant had entered 10 mm in the gap between the substrates joined to each other on average, and that the resistance to the etching solution was more stable. Generally, in the outer peripheral sealing step, it is preferable to apply a sealant having a viscosity adjusted in a range of 100 cP to 10000 cP on the step. If the viscosity is less than 100 cP, the viscosity is too low, and it is difficult to control the application when using a dispenser. Conversely, if the viscosity exceeds 10,000 cP,
Not only is it difficult to dispense, but also the penetration into the gaps of the laminate is reduced.

After the chemical treatment step, it is preferable to remove unnecessary protrusions left along the outer periphery of each substrate by polishing. If the protrusion remains, an error occurs when the etched laminate is suction-fixed by the scribe / break device. If the projection remains, the scribe blade hits the projection, and the glass substrate is cracked. An embodiment including a polishing step for removing such unnecessary projections will be described here. Using the same substrate and apparatus as in the previous embodiment shown in FIG. 1, the outer peripheral seal was thermally cured and then etched. The etching conditions are the same as in the previous embodiment, that is, the HF concentration is 20% by weight and the immersion time is 60 minutes. Thereafter, the outer peripheral portion of the substrate was chamfered and polished by a polishing apparatus. The purpose of this is to remove protrusions remaining on the outer peripheral edge of the substrate as a result of the etching process. After chamfering and polishing, the substrate was scribed. As a result, it was confirmed that chipping around the substrate did not occur and the display panel could be cut out stably.

FIG. 4 is a schematic diagram showing a specific example of the above-mentioned polishing step. As shown in (A), the laminate 0 after the etching process has unnecessary protrusions left along its outer periphery. The protrusions are caused by burrs of the outer peripheral sealant 5 and
2 includes burrs remaining after etching. or,
Residual HF and the like adhere between the burrs and the substrate 1.
In the example shown in the drawing, the thickness of each of the substrates 1 and 2 is reduced from 0.7 mm to 0.5 mm except for peripheral protrusions by etching. Thereafter, as shown in (B), the outer peripheral end of the laminate 0 in which the pair of substrates 1 and 2 are bonded to each other is put into the polishing apparatus 30 and chamfering polishing is performed. This makes it possible to remove protrusions at the ends of the glass substrates 1 and 2 such as burrs. Also, the reaction powder can be removed by washing.

FIG. 5 is a schematic perspective view showing an example of a display panel manufactured according to the present invention. This example is a liquid crystal display device formed by bonding a pair of substrates. As shown, the display device has a panel structure including a pair of insulating substrates 1 and 2 and an electro-optical material 103 held between the two substrates. As the electro-optic substance 103, a liquid crystal material is used. The pixel array section 104 is provided on the lower insulating substrate 1.
And a drive circuit unit are integrated. The drive circuit section is divided into a vertical drive circuit 105 and a horizontal drive circuit 106. A terminal 107 for external connection is formed at the upper end of the peripheral portion of the insulating substrate 1. The terminal 107 is a wiring 108
Are connected to the vertical drive circuit 105 and the horizontal drive circuit 106 via the. A row-shaped gate wiring 109 and a column-shaped signal wiring 110 are formed in the pixel array unit 104. A pixel electrode 111 and a thin film transistor TFT for driving the pixel electrode 111 are formed at the intersection of the two wires. The gate electrode of the thin film transistor TFT is connected to the corresponding gate line 109, the drain region is connected to the corresponding pixel electrode 111, and the source region is connected to the corresponding signal line 110. The gate wiring 109 is connected to the vertical drive circuit 105, while the signal wiring 110 is connected to the horizontal drive circuit 106.

FIG. 6 is a schematic partial sectional view showing another example of the display panel manufactured according to the present invention. In this example, an electroluminescent display device is manufactured using a glass substrate. When etching this panel, it is preferable to immerse it in HF and etch the glass substrate in a state where the pixel portion is protected by another substrate in advance. In this embodiment, an organic electroluminescent element OLED is used as a pixel. As shown, OLE
D is obtained by sequentially stacking the anode A, the organic layer 210 and the cathode K. The anode A is separated for each pixel, and is made of, for example, chromium and is basically light-reflective. The cathode K is commonly connected between the pixels, and has a laminated structure of, for example, an extremely thin metal layer 211 and a transparent conductive layer 212, and is basically light transmissive. When a forward voltage (about 10 V) is applied between the anode A and the cathode K of the OLED having such a configuration, carriers such as electrons and holes are injected, and light emission is observed. OLE
The operation of D is considered to be light emission by excitons formed by holes injected from the anode A and electrons injected from the cathode K.

On the other hand, a thin film transistor TFT for driving an OLED is composed of a gate electrode 201 formed on a glass substrate 2 and a gate insulating film 223 superposed on the upper surface thereof.
And the gate electrode 201 via the gate insulating film 223.
And a semiconductor thin film 205 overlaid on the top. The thin film transistor TFT includes a source region S, a channel region Ch, and a drain region D that serve as a path for a current supplied to the OLED. The channel region Ch is located just above the gate electrode 201. The thin film transistor TFT having the bottom gate structure is covered with an interlayer insulating film 207, on which a wiring electrode 209 and a drain electrode 220 are formed. On these, the OLED described above is formed via another interlayer insulating film 291. The anode A of the OLED is electrically connected to the thin film transistor TFT via the drain electrode 220.

[0027]

As described above, according to the present invention, when a pair of glass substrates constituting a display panel are attached to each other, a predetermined amount of the substrate surface is removed by etching to reduce the thickness of the display panel. When a pair of substrates are bonded to each other, a step is provided along the outer periphery by overlapping the substrates by shifting them by a predetermined amount in a plane. By supplying the sealant along the step, the outer peripheral seal for protecting the inner panel from the etching process can be formed relatively easily. In particular, by employing an ultraviolet curing type as the sealant, it is possible to continuously perform dispensing of the sealant and the curing treatment thereof in an in-line treatment, and high productivity can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating a method for manufacturing a display panel according to the present invention.

FIG. 2 is a schematic partial plan view showing a method for manufacturing a display panel according to the present invention.

FIG. 3 is a schematic cross-sectional view illustrating a method for manufacturing a display panel according to the present invention.

FIG. 4 is a schematic view illustrating a method for manufacturing a display panel according to the present invention.

FIG. 5 is a perspective view showing a liquid crystal display panel manufactured according to the present invention.

FIG. 6 is a partial sectional view showing an electroluminescent display panel manufactured according to the present invention.

FIG. 7 is a schematic plan view showing a conventional display panel manufacturing method.

FIG. 8 is a schematic cross-sectional view illustrating a conventional display panel manufacturing method.

FIG. 9 is a schematic plan view showing a conventional method for manufacturing a display panel.

[Explanation of symbols]

0: laminated body, 1: glass substrate, 2: glass substrate, 4: outer peripheral seal, 5: sealing agent, 17.
..Chemical solution, 30 polishing apparatus, 50 dispenser, ST step

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05B 33/04 H05B 33/04 33/10 33/10 33/14 33/14 A (72) Inventor Takagi Yasu 50, Ogawa-Kamifunaki, Higashiura-cho, Chita-gun, Aichi Prefecture Est. Elcidi Co., Ltd. (72) Inventor Hiroaki Matsuoka 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Tomita Hiroshi 50, Ogawakamifunaki, Higashiura-cho, Chita-gun, Aichi F-term (reference) 2H089 KA01 LA42 MA03Y NA42 NA44 NA45 NA52 NA53 NA55 PA15 QA02 QA11 TA01 2H090 JB02 JC01 JC14 JD13 LA03 3K007 AB18 BA06 BB01 BB01 BB01 BB01 CA01 CB01 DA01 DB03 EB00 FA02 5G435 AA17 AA18 BB05 BB12 CC09 HH14 HH20 KK05 KK10

Claims (20)

[Claims] 1. A pair of substrates having a predetermined thickness are superimposed on each other by a predetermined amount and shifted from each other in a plane, and a step is provided along the outer periphery of both substrates. A panel forming step of forming a display panel by bonding, an outer peripheral sealing step of supplying a sealant to the step, and sealing the inner display panel along the outer peripheries of both substrates, and a state protected by the sealant And d) immersing the display panel in a chemical solution, and removing a predetermined amount of the surface of the substrate by a chemical reaction to reduce the thickness. 2. The display panel according to claim 1, wherein in the panel forming step, the pair of substrates are overlapped with each other in a plane by a predetermined amount so that the width of the step falls within a range of 0.5 mm to 10 mm. Manufacturing method. 3. The outer peripheral sealing step comprises applying an ultraviolet curing sealant to the step, and then irradiating ultraviolet rays to cure the sealant to seal the internal display panel along the outer periphery of both substrates. A method for manufacturing a display panel according to claim 1. 4. The peripheral sealing step has a viscosity of 100 c.
2. The method for manufacturing a display panel according to claim 1, wherein a sealant prepared in the range of P to 10,000 cP is applied to the step and then cured to seal the internal display panel along the outer periphery of both substrates. 5. The method for manufacturing a display panel according to claim 1, further comprising a polishing step of removing unnecessary projections left along the outer periphery of each substrate by polishing after the chemical treatment step. 6. A pair of substrates having a predetermined thickness are superimposed on each other by a predetermined amount and shifted from each other in a plane, and a step is provided along the outer periphery of both substrates. A panel forming step of forming an empty panel by joining, a sealing agent is supplied to the step, and an outer peripheral sealing step of sealing the inner panel along the outer periphery of both substrates; and a state protected by the sealing agent The panel is immersed in a chemical solution, and a chemical treatment step is performed to remove a certain amount of the surface of the substrate by a chemical reaction to reduce the thickness. A method of manufacturing a liquid crystal display panel, comprising: 7. The liquid crystal display according to claim 6, wherein in the panel forming step, the pair of substrates are overlapped with each other by a predetermined amount so that the width of the step falls within a range of 0.5 mm to 10 mm. Panel manufacturing method. 8. The outer peripheral sealing step comprises applying an ultraviolet-curable sealing agent to the step, irradiating ultraviolet rays to cure the sealing agent, and sealing the inner panel along the outer periphery of both substrates. Item 7. The method for manufacturing a liquid crystal display panel according to Item 6. 9. The method according to claim 9, wherein the peripheral sealing step has a viscosity of 100 c.
7. The method for manufacturing a liquid crystal display panel according to claim 6, wherein a sealant prepared in the range of P to 10,000 cP is applied to the step and then cured to seal the inner panel along the outer periphery of both substrates. 10. The liquid crystal display panel according to claim 6, further comprising a polishing step of removing unnecessary projections left along the outer periphery of each substrate by polishing after said chemical treatment step and before said injection step. Manufacturing method. 11. A substrate having a predetermined thickness and having the electroluminescent element formed thereon is superposed on the other substrate for protection by displacing the other substrate by a predetermined amount and extending along the outer periphery of both substrates. In a state where a step is provided, a panel forming step of forming an electroluminescent display panel by bonding both substrates through a gap, and supplying a sealant to the step to allow an internal electroluminescent display panel to be provided on the outer periphery of both substrates. An outer peripheral sealing step of sealing along the outer peripheral surface, and a chemical treatment step of immersing the electroluminescent display panel in a chemical solution in a state protected by the sealing agent and removing a certain amount of the surface of the substrate by a chemical reaction to reduce the thickness. For producing an electroluminescent display panel. 12. The panel forming step according to claim 1, wherein the two substrates are overlapped with each other by a predetermined amount so that the width of the step falls within a range of 0.5 mm to 10 mm.
2. A method for manufacturing an electroluminescent display panel according to item 1. 13. The outer peripheral sealing step comprises applying an ultraviolet-curable sealing agent to the step, and then irradiating ultraviolet rays to cure the sealing agent so that the inner electroluminescent display panel is formed along the outer periphery of both substrates. The method for manufacturing an electroluminescent display panel according to claim 11, wherein the panel is hermetically sealed. 14. The method according to claim 14, wherein the peripheral sealing step has a viscosity of 100.
12. The method for manufacturing an electroluminescent display panel according to claim 11, wherein a sealant prepared in a range of cP to 10,000 cP is applied to the step, and then cured to seal the inner electroluminescent display panel along the outer periphery of both substrates. . 15. The method for manufacturing an electroluminescent display panel according to claim 11, further comprising a polishing step of removing unnecessary projections left along the outer peripheries of both substrates after said chemical treatment step by polishing. 16. A pair of substrates having a predetermined thickness and processed for a liquid crystal display panel, a bonding member for bonding the pair of substrates through a predetermined gap to form an empty panel, What is claimed is: 1. A liquid crystal display panel comprising a liquid crystal filled in a panel, wherein said panel overlaps said pair of substrates by a predetermined amount and is superimposed on each other to form a step along the outer periphery of both substrates. A sealing agent is supplied to the step, the inner panel is sealed along the outer periphery of both substrates, and the panel is immersed in a chemical solution in a state protected by the sealing agent, and the substrate is chemically reacted. A liquid crystal display panel having a reduced thickness by removing a certain amount of surface. 17. The panel according to claim 1, wherein the width of the step is 0.5 m.
17. The liquid crystal display panel according to claim 16, wherein a pair of substrates are overlapped with each other by a predetermined amount so as to be within a range of m to 10 mm. 18. The panel is characterized in that an ultraviolet-curable sealant is applied to the step, and then the sealant is cured by irradiating ultraviolet rays, and is sealed along the outer periphery of both substrates. The liquid crystal display panel according to claim 16, wherein 19. The panel is characterized in that a sealant having a viscosity in the range of 100 cP to 10000 cP is applied to the step, then cured and hermetically sealed along the outer periphery of both substrates. The liquid crystal display panel according to claim 16. 20. The panel according to claim 1, wherein a predetermined amount of the surface of the substrate is removed by a chemical reaction to reduce the thickness, and then unnecessary projections remaining along the outer periphery of the substrate are removed by polishing. 17. The liquid crystal display panel according to claim 16, wherein: