JP2002314019A - Electronic component and its machining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame having improved machining speed and accuracy. SOLUTION: A lead frame 3 connected to a die pad section 2 is formed in parallel with the longitudinal direction of a lead frame 1, and a slit hole 5 is formed while the outside of the lead section 3 is being surrounded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component in which a plurality of package portions are integrally connected to a lead frame by a lead portion, and a method of processing an electronic component.

[0002]

2. Description of the Related Art Conventionally, relatively small electronic components such as transistors and diodes are subjected to a T / F (trimming and forming) process in a state where a package portion is connected to a lead frame. It is later mass-produced separately into individual electronic components. Specifically, a plurality of package portions are integrally connected to the lead frame through the lead portions. The size of this package is 2-3
mm, one side of the lead frame is 200mm to 2mm
It is a strip-shaped electronic component having a size of about 50 mm.

[0003] The above-mentioned electronic component has a T / T shown in FIGS. 7 and 8.
The package unit is carried into the F device 51, and the lead unit is sequentially bent into a gull-wing shape, a J-shape, or the like that can be mounted on a substrate while the package unit is integrated with the lead frame through the lead unit, and separated into individual pieces. You. Specifically, in the first to third press parts 52 to 54, the lead part is sequentially bent, and the lead tip part is cut in the fourth press part 55,
Electronic components are separated into individual pieces.

As shown in FIG. 9, an electronic component 56 has a strip-shaped lead frame in which a plurality of package portions 58 are formed in a line in a longitudinal direction, and is connected to a side rail 60 through a lead portion 59. Have been. The electronic components 56 are set one by one on the first press unit 52 so that the short direction is left and right, and when bending (preliminary bending) is performed, the electronic components 56 are dropped by their own weight in the longitudinal direction of the frame to be pressed by the second press unit. Sent to 53. In the second press portion 53, the pre-bent lead portion 59 is bent (sector bent), and similarly, the third press portion 54 is bent (sector bent). Finally, the lead portion 59 is cut by the fourth press portion 55 so that individual products such as transistors and unnecessary lead frames 57 are separated and collected.

[0005] The first to fourth press sections 52 to 55 are shown in FIG.
As shown in the figure, the electronic component 56 is easily dropped by its own weight.
It is arranged diagonally downward and to the right. Electronic components 56
In the first to fourth press sections 52 to 55, positioning is performed by locking a part of the side rail 60 on a locking pin provided on an inclined surface.

[0006]

However, the electronic components 56 of the type in which the package portion is arranged in one row are arranged one by one.
There is a problem that the mass productivity is low due to the / F processing, and the processing speed is slow because the press section is dropped by its own weight. In addition, in the first to fourth press sections 52 to 55, if bending is performed with the leading ends of the lead portions connected, it is difficult to handle the lead frame 57 because the width dimension of the lead frame 57 changes. The lead frame 57 is positioned on the basis of the holes formed in the lead frame 57.
And lead bending cannot be performed, and it is necessary to perform bending based on the package portion 58, and the lead portion 59
There is also a problem that the bending accuracy of the steel cannot be improved.

The package section 58 is provided with a side rail 6.
Since the bending process is performed in a state where the lead portion 59 is connected to the package portion 5 in the width direction as shown in FIG.
8 is a two-row lead frame 61 or a four-row lead frame 62 in the width direction as shown in FIG.
When it was used, it was difficult to bend while the lead portions 59 were connected.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to improve the processing speed and processing accuracy of an electronic component, and to improve the mass productivity and processability of the electronic component. Is to provide.

[0009]

To solve the above-mentioned problems, the present invention has the following arrangement. That is, in an electronic component in which a plurality of package portions are integrally connected to a lead frame by a lead portion, a plurality of package portions are provided side by side in a width direction in a frame area partitioned by section bars formed in the width direction of the lead frame. Formed so as to be parallel to the longitudinal direction of the lead frame connected to each package part, positioning holes and error detection holes provided in the side rails at a predetermined pitch in the longitudinal direction corresponding to each frame area Around the outside of the part where the tip of the lead is connected to the frame area surrounded by the section bar and the side rail, while the tip is connected to the frame area with the tip connected to the frame area. And a slit hole formed.

In the method of processing an electronic component, a plurality of package parts are pitch-fed to the above-described lead frame, and the tip of the lead part connected to each package part is formed in a frame area. A pre-bending step of pre-bending the lead portion supported by the side rail while being connected, a partial bending step of partially bending the pre-bent end of the lead portion, and cutting the partially bent lead end portion And separating the electronic component into individual pieces.

As another method, a plurality of package parts are pitch-fed to a lead frame by connecting electronic parts connected by the lead parts, and each frame area divided by a section bar formed in a width direction of the lead frame. A frame punching step of punching a frame portion along both side rails corresponding to the above, a step of forming a cutting line in the width direction of the frame to connect the punched holes punched out of the frame portion, and connected to each package portion. A pre-bending step of performing pre-bending of the lead portion supported by the side rail while the lead portion ends are connected with the frame area; a partial bending step of partially bending the pre-bent tip portion of the lead portion; And separating the electronic component into individual pieces by cutting the tip of the lead.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In this embodiment, a transistor will be described as an example of an electronic component, and a lead frame for manufacturing a transistor and a method for processing an electronic component using the lead frame will be described. FIG. 1 is a plan view of a lead frame, FIG. 2 is an explanatory view showing a processing process in a T / F device, and FIG.
(A) and (b) are explanatory views showing an example of a lead frame before and after bending of a lead frame, FIGS. 4 and 5 are a plan view and a front view of a T / F device, and FIG. 6 is an electronic component according to another example. It is explanatory drawing of a processing method.

First, a lead frame will be described with reference to FIG. Reference numeral 1 denotes a lead frame, and a plurality of package portions 4 are integrally connected to a strip-shaped frame main body by a lead portion 3. The package section 4 is one in which a semiconductor element (transistor element) is mounted on a die pad section and sealed with a resin (see FIG. 2). The package portions 4 are arranged one by one (five in this embodiment) in a frame area partitioned by section bars 6 formed in the width direction (transverse direction) of the lead frame 1 and in the longitudinal direction. Are also arranged at the same pitch interval, and are arranged in a matrix as a whole.

The lead 3 connected to the package 4 is formed so as to be parallel to the longitudinal direction of the lead frame 1. The leading end of the lead 3 is supported by the side rail 7 while being connected to the frame area. Further, a slit hole 5 is formed so as to surround the outside of the lead portion 3 connected to the package portion 4. Specifically, slit hole 5
Are formed in a frame area surrounded by the section bar 6 and the side rails 7 on both sides. The slit holes 5 are formed in the frame area partitioned by the section bar 6 at positions substantially symmetric with respect to the center line of the package unit 4 in the frame width direction.

Although the shape of the slit hole 5 is arbitrary, considering the narrow space and the bending stress of the lead portion 3 (absorbing the stress distortion given to another frame area by the lead bending), etc. It is formed in an L-shape (see FIG. 1) or a U-shape (see FIG. 6) including a portion formed substantially parallel to the section bar 6 and a portion formed substantially parallel to the side rail 7. preferable.

Further, positioning holes 8 are provided in side rails 7 corresponding to the frame area in which package portion 4 is formed.
And the miss detection holes 9 are provided at a predetermined pitch. The positioning hole 8 may also serve as a hole used for pitch feed (pin feed) of the lead frame 1. Also,
The mistake detection hole 9 is for preventing a mistake in setting the lead frame 1, and detects a mistake in setting by fitting a mistake detection pin (not shown) into the mistake detection hole 9. The shape of the error detection hole 9 is a round hole (see FIG. 1) or a long hole (FIG. 3).
(See Reference).

Next, a process of performing T / F processing by a T / F device using the lead frame 1 on which the above-described package portion 4 is formed will be described with reference to FIGS. 4 and 5, reference numeral 10 denotes a T / F device,
The lead frames 1 accommodated in the supply magazine 12 of the supply unit 11 are cut out one by one into the guide rails 13 and are pitch-fed to the press unit 14 using the positioning holes 8 by a known pin feed mechanism.

The press section 14 is provided with a press die 15 having various steps for preliminary bending, partial bending (sector bending), and cutting, as described later. When lead bending and cutting are performed by the various press dies 15,
Unnecessary lead frames 1 are dropped into a scrap box 16 and separated and collected from electronic components.

Hereinafter, the processing (T / F) process of the electronic component will be described with reference to FIGS. 2 and 3 together with the configuration of each press unit. In FIG. 2, reference numeral 17 denotes a press unit for performing a pre-bending step, and the lead frame 1 is pitch-fed to the press unit 17 by a pin feed mechanism (not shown).
In the press section 17, the package 4 is clamped by the die 18 and the package holding section 19 of the lead frame 1. Then, the preliminary bending punch 20 moves downward, and performs preliminary bending of the lead portion 3 supported by the side rail 7 while the leading end of the lead portion 3 connected to the package portion 4 is connected to the frame area. The pre-bending punch 20 is moved down by a drive mechanism (not shown) and also rotates around the fulcrum 20b in a direction approaching the package holding portion 19 from both sides when the roller 20a moves while abutting on the cam surface 21. As a result, the lead portion 3 connected to the package portion 4 is preliminarily bent obliquely downward in a C shape.

Reference numeral 22 denotes a press unit for performing a partial bending process. The lead frame 1 having completed the pre-bending process is sent to the press unit 22 at a pitch by a pin feed mechanism. In the press section 22, the lead frame 1 is
The package section 4 is clamped by the package holding section 8 and the package holding section 19. Then, the partial bending punch 23 is moved downward to partially bend slightly upward while the leading end of the preliminarily bent lead portion 3 is integrally connected to the lead frame 1. The partial bending punch 23 is moved downward by a driving mechanism (not shown), and the roller 23a is
And the lead 3 is partially bent into an L-shape by rotating in a direction approaching the package holding portion 19 from both sides.

Reference numeral 24 denotes a press section for performing a separation step, and the lead frame 1 having undergone the partial bending step is pitch-fed to the press section 24 by a pin feed mechanism. In the press section 24, the lead frame 1 set on the die 25 is moved downward by the lead holder 26 so that the lead section 3 is sandwiched between the die 25 and the punch 31 on the lower die side.
Moves upward to cut the partially bent lead tip.
Then, the singulated electronic component (transistor) 30 and the lead frame 1 are separated.

Prior to the pre-bending step, FIG.
As shown in (1), it is preferable to cut the frame portion 1a for partitioning the lead portion 3 connected to the package portion 4 and the partition portion 1b for partitioning the slit hole 5 in consideration of the workability of bending the lead portion 3. That is, as shown in FIG. 3B, the lead portions 3 connected to the package portion 4 are connected in the frame width direction by the connection bars 1c, and a part of the connection bars 1c is connected to the side rails by the frame connection portions 1d. The package section 4 is supported in a state where the package section 4 is connected to the package section 7. In this state, by preliminarily bending or partially bending the lead portion 3 indicated by oblique lines of the lead frame 1, the lead portion 3 can be bent with high precision.

If the lead frame 1 is used, the lead portion 3 connected to the package portion 4 is formed so as to be parallel to the longitudinal direction of the lead frame 1, and the slit hole 5 surrounds the outside of the lead portion 3. Is formed,
Even if the lead portion 3 is bent in a state where it is supported by the side rails 7 while the leading end of the lead portion 3 is connected to the frame area, the stress distortion of the frame can be absorbed by the slit holes 5, so that the processing accuracy is improved. Can be done.
Further, the lead frame 1 is pitch-fed by pin feed in each press section, and lead bending and cutting are performed in parallel, so that the transport speed and the processing speed can be improved. In addition, according to the method of processing an electronic component using the lead frame 1, the lead portion 3 can be bent with high accuracy while a plurality of package portions 4 are connected in the frame width direction, and furthermore, it is conveyed at high speed by pin feed. Therefore, the productivity of the electronic component 30 can be improved. Further, the lead frame 1 can be reliably positioned by inserting a pin into a positioning hole 8 provided in the side rail 7 in each press section, and the processing accuracy can be improved.

Next, another example of a method of processing an electronic component having no slit on a lead frame will be described with reference to FIG. The same members as those in FIG. 1 are denoted by the same reference numerals, and the description is used. In the present embodiment, a strip-shaped or long lead frame 1 is used as an electronic component. A plurality of package portions 4 are integrally connected to the lead frame 1 by the lead portions 3.

The package portions 4 are arranged on the lead frame 1 in the width direction (transverse direction) one row at a time (in this embodiment, five rows), and are also arranged at the same pitch in the longitudinal direction. They are arranged in a matrix as a whole.
The lead 3 connected to the package 4 is formed so as to be parallel to the longitudinal direction of the lead frame 1. still,
When the long lead frame 1 is used, the lead frame 1 is supplied from a supply reel (not shown), is pitch-fed in the direction of an arrow via a T / F device, and is taken up on a take-up reel.

The lead frame 1 is pitch-fed by a pin feed mechanism (not shown), and is set on a press section (see FIG. 6A position) for performing a frame removing step. Then, with the lead frame 1 clamped, the punch is operated to punch out the frame portion along the side rails 7 on both sides, so that holes 27 are formed on both sides in the frame width direction. Specifically, a frame portion of each frame area partitioned by a section bar 6 formed in the width direction of the lead frame 1 is punched. The holes 27 are formed at both sides of the package portion 4 (at two positions in the longitudinal direction of the side rails 7) (see the position in FIG. 6C).

Next, the lead frame 1 in which the holes 27 are formed is pitch-fed by a pin feed mechanism, and is set on a press section (see a position D in FIG. 6) for performing a frame cutting step. Here, in the state where the lead frame 1 is clamped, a cutting line 28 is formed in the frame width direction so as to connect the cutting blade to the holes 27 in the frame width direction. When the width of the section bar 6 is small, shear cutting may be used. The cutting line 28 can absorb the bending stress of the lead portion 3 (absorb the stress distortion applied to other frame areas such as the distortion of the frame due to the lead bending).

The lead frame 1 on which the cutting lines 28 are formed
Is fed by a pin feed mechanism at a pitch and set in a press section 17 for performing a preliminary bending step (see a position G in FIG. 6). Here, the lead frame 1 is clamped on the package portion 4 by the die 18 and the package holding portion 19, and the pre-bending punch 20 moves down to connect the lead portion 3 connected to the package portion 4 integrally with the lead frame 1. Perform pre-bending as it is. As a result, the lead portion 3 connected to the package portion 4 is preliminarily bent obliquely downward in a C shape (see FIG. 2). The pre-bending changes the length of the lead portion 3 in a plan view.
Is spread in a slit shape (a slit hole 29 is formed) to absorb the light.

The lead frame 1 which has completed the pre-bending step
Is fed by a pin feed mechanism at a pitch and set in a press section 22 for performing a partial bending process (see the position K in FIG. 6). Here, the lead frame 1 is clamped on the package portion 4 by the die 18 and the package holding portion 19, and the partially bent punch 23 is moved down to preliminarily bend the lead portion 3.
Is slightly bent upward while the distal end of the lead frame is integrally connected to the lead frame 1. As a result, the lead 3 connected to the package 4 is partially bent into an L-shape (see FIG. 2).

Lead frame 1 after partial bending process
Is fed by a pin feed mechanism at a pitch and set in a press section 24 for performing a cutting process (see the position N in FIG. 6).
Here, the lead frame 1 set on the die 25 is
The lead holder 26 is moved down, and the lead 3 is joined with the die 25.
After that, the punch 31 on the lower mold side moves up relatively, and the tip of the partially bent lead is cut off (see FIG. 2). Then, the singulated electronic component 30 and the lead frame 1 are separated (see the position O in FIG. 6).

Although the preferred embodiments of the present invention have been described in various ways, the present invention is not limited to the above-described embodiments, and the electronic components are not limited to transistors, but may be other electronic components such as diodes. Of course, many modifications can be made without departing from the spirit of the invention.

[0032]

According to the lead frame of the present invention, the lead portion connected to the die pad portion is formed so as to be parallel to the longitudinal direction of the lead frame, and a slit hole surrounds the outside of the lead portion. Because it is formed,
Even when the lead portion is bent in a state where the lead portion is supported by the side rail while being connected with the frame area, the stress distortion of the frame can be absorbed by the slit holes, so that the processing accuracy can be improved. . Further, the lead frame is pitch-fed by the pin feed in each press section, and the lead bending and cutting are performed in parallel, so that the transport speed and the processing speed can be improved. In addition, according to the method of processing an electronic component using a lead frame, the lead portion can be bent with high precision while a plurality of package portions are connected in the frame width direction, and can be conveyed at high speed by pin feed. The productivity of parts can be improved. Further, the lead frame can be reliably positioned by inserting a pin into a positioning hole provided in the side rail in each press section, and the processing accuracy can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a lead frame.

FIG. 2 is an explanatory diagram showing a processing process in a T / F device.

FIG. 3 is an explanatory view showing an example of a lead frame before and after bending a lead frame.

FIG. 4 is a plan view of the T / F device.

FIG. 5 is a front view of the T / F device.

FIG. 6 is an explanatory diagram of a method of processing an electronic component according to another example.

FIG. 7 is a front view of a conventional T / F device.

FIG. 8 is a right side view of a conventional T / F device.

FIG. 9 is an explanatory diagram of a conventional electronic component.

FIG. 10 is an explanatory diagram of a conventional electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 3 Lead part 4 Package part 5, 29 Slit hole 6 Section bar 7 Side rail 8 Positioning hole 9 Miss detection hole 10 T / F device 11 Supply part 12 Supply magazine 13 Guide rail part 17, 22, 24 Press part 15 Press die 16 Scrap box 18, 25 Die 19 Package holding part 20 Preliminary bending punch 20a, 23a Roller 20b, 23b Support point 21 Cam surface 23 Partial bending punch 26 Cutting punch 27 Cutout hole 28 Cutting line 30 Electronic component 31 Punch

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Toshiki Miyashita 90, Kamikakuma, Tokura-cho, Hanishina-gun, Nagano Prefecture Apic Yamada Co., Ltd. F-term (reference) 5F067 AB10 BA02 BA10 DB02

Claims (3)

[Claims] An electronic component in which a plurality of package portions are integrally connected to a lead frame by a lead portion, wherein a plurality of package portions are provided side by side in a width direction in a frame area partitioned by a section bar formed in a width direction of the lead frame. And a positioning hole and an error detection hole provided in the side rail at a predetermined pitch in the longitudinal direction corresponding to each frame area so as to be connected to each package part and to be parallel to the longitudinal direction of the lead frame. Around the outside of the part where the tip of the lead is connected to the frame area surrounded by the section bar and the side rail, and the lead is connected to the side rail with the tip connected to the frame area. An electronic component having slit holes formed on both sides. 2. Preliminary bending for feeding the electronic component according to claim 1 at a pitch and preliminarily bending the lead portion supported by a side rail while the tip of the lead portion connected to each package portion is connected by a frame area. A step of partially bending the leading end of the pre-bent lead, and a separating step of cutting the leading end of the partially bent lead to separate the electronic component into individual pieces. Processing method of electronic parts. 3. A two-sided side rail corresponding to each frame area divided by section bars formed in a width direction of the lead frame, wherein a plurality of package parts feed an electronic component connected by the lead part to the lead frame at a pitch. A frame punching step of punching a frame part along a frame, a step of forming a cutting line in the width direction of the frame to connect the punched holes punched out of the frame part, and a lead area connected to each package part to a frame area. A pre-bending step of pre-bending the lead portion supported by the side rail while being connected by a step, a partial bending step of partially bending the tip portion of the pre-bent lead portion, and cutting the partially bent lead tip portion And separating the electronic component into individual pieces.