JP2002307179A - Device and method for laser beam machining - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for laser beam machining for drilling a work at high speed. SOLUTION: The laser beam machining device is provided with an image processing means 22 which recognizes the machining position of a work 18, the position of a recognition mark of a pallet 19, and the shape of a hole after the machining of the work, and decides the acceptability, a moving means 20 which moves the pallet on which the work is mounted, between an image processing position and a laser beam machining position. The de vice is also provided with a controller which calculates and corrects the machining position of the work on the basis of the physical relationship between the machining position of the work and the position of the recognition mark of the pallet recognized at the image processing position, and the position of the recognition mark of the pallet recognized at the machining position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus and a laser processing method capable of performing high-speed drilling on a workpiece such as an electronic circuit board.

[0002]

2. Description of the Related Art Conventionally, a laser oscillating device for outputting a laser beam has been used as a device for punching an electronic circuit board or the like.

FIG. 4 shows a conventional laser processing apparatus configured so that a fine hole can be formed on a substrate by laser irradiation. FIG. 5 shows an algorithm of a processing data processing method in the laser processing apparatus. Show. In FIG. 4, 1 is a laser oscillator, 2 is a laser beam, 3 is a reflecting mirror for changing the direction of the laser beam 2, 4 is a galvanometer which is a scanning means of the laser beam, and 5 is fθ which is a focusing means.
A lens, 6 is an XY table, 7 is a substrate positioned on the XY table 6, 8 is a camera which is a part of the image recognition means provided on the feeder side, and 9 is image recognition means provided on the unloader side Is a camera, 10 is a feeder, and 11 is an unloader.

In the conventional laser processing apparatus shown in FIG. 4, a laser beam 2 emitted from a laser oscillator 1 is
The substrate 7 is guided by the reflecting mirror 3 in the direction of the galvanometer 4 in the XY two axes, is incident on the fθ lens 5 by changing the irradiation direction by sweeping the galvanometer 4, is focused by the fθ lens 5, and is positioned by the XY table 6. At a predetermined position.

In order to correct a nonlinear distortion component due to heat or moisture caused by another process or environment of the substrate 7 before performing the above-mentioned processing, a camera which is a part of an image recognition means provided on the supply device 10 side. According to 8, the positions of all lands are detected in advance, the processing data is corrected, and accuracy is ensured. Further, the position recognition and the processing operation are performed while the substrate 7 is held on the XY table 6.

Further, the hole shape is recognized while the substrate 7 processed by the processing operation is held on the XY table 6 by the camera 9 which is a part of the image recognition means provided on the unloader 11 side. A pass / fail decision is made.

Further, when processing data is divided for each scanning range, the data is divided into the same size as the effective scanning range in which the hole diameter processing conditions can be obtained.

[0008]

However, in the above-described conventional laser processing apparatus, in order to maintain processing accuracy, position recognition, processing, and inspection of the hole shape are performed with the substrate held on an XY table. Therefore, one cycle time becomes longer, and since the processing data is corrected and divided after the position is recognized, the loss time until the start of the processing is increased.

Further, as shown in the processing data processing algorithm of FIG. 5, the processing data is subjected to position correction of the entire area, and thereafter the processing area is divided for each scanning range so that the galvano movement distance during processing is reduced. In addition, since the order in the machining area is rearranged, the data processing is performed until the machining is performed after the hole position is recognized, so that a large tact loss occurs.

The present invention has been made in view of the above-mentioned technical problems in a conventional laser processing apparatus, and has as its object to reduce the time loss while recognizing all holes and correcting the processing data, and An object of the present invention is to provide a laser processing apparatus capable of performing efficient boring with high productivity.

[0011]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention recognizes a processing position of a workpiece and a recognition mark position of a pallet, recognizes a hole shape after the processing of the workpiece, and determines pass / fail. Processing device that performs image processing and a moving device that moves a pallet on which the workpiece can be placed between the image processing position and the laser processing position. And a control device for calculating a processing position of a workpiece from the pallet recognition mark position recognized at the laser processing position and a processing position of the pallet recognition mark position. .

According to the laser processing apparatus of the present invention described above, all land positions can be recognized simply by recognizing the position recognition marks provided on the pallet. Therefore, the tact loss can be greatly reduced as compared with the conventional apparatus, and the productivity can be reduced. Laser processing can be performed.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention recognizes a processing position of a workpiece and a recognition mark position of a pallet, recognizes a hole shape after the processing of a workpiece, and makes a pass / fail judgment. Image processing means for performing, and a laser processing apparatus having a moving means for moving a pallet on which a work piece can be placed between the image processing position and the laser processing position, the work piece recognized by the recognition means at the image processing position. A control device for calculating the processing position of the workpiece from the positional relationship between the processing position and the pallet recognition mark position and the pallet recognition mark position recognized at the laser processing position; Is conveyed on a pallet provided with position recognition marks, and all land positions of the workpiece are recognized by the position recognition marks provided on the pallet. High-efficiency machining by high-precision recognizing the location has an effect that enables.

According to the first aspect of the present invention, the workpiece is placed on the pallet, the pallet is moved to the image processing position, the processing position of the workpiece and the pallet recognition mark position are recognized, and the laser processing position is determined. Move the pallet to the pallet, recognize the pallet recognition mark position, and use the pallet recognition mark position recognized by the laser processing position, the workpiece processing position recognized by the image processing position, and the pallet recognition mark position. The processing position may be calculated, and the processing position of the workpiece may be irradiated with a laser to process the workpiece.

According to a third aspect of the present invention, in the laser processing, the workpiece is laser-processed by scanning a laser beam with a galvanometer, and an area in which a non-linear distortion component can be corrected in an area smaller than a laser scanable range. It is characterized by dividing the processing range of the workpiece for each, irradiating the workpiece with laser and performing laser processing, and performs these data processing before the laser processing operation. By performing only position correction in the processing area within the scanning range based on the processing data corrected by the hole position recognition, tact loss is reduced, and processing with high productivity can be performed. [Embodiment] A laser processing apparatus according to a first embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is a perspective view showing a laser processing apparatus according to a first embodiment of the present invention. In FIG. 1, 12
Is a laser oscillator, 13 is a laser beam, 14 is a reflecting mirror for changing the direction of the laser beam 13, and 15 is a laser beam 1.
3 is a galvanometer as scanning means, 16 is an fθ lens as focusing means, 17 is a processing position stage on which the laser beam 13 is focused, 18 is a substrate which is a workpiece positioned on the processing position stage 17, and 19 is a processing position stage. A pallet for restricting the movement of the substrate 18, and a position recognition mark is provided on the outer periphery of the pallet. Reference numeral 20 denotes a transport unit for the pallet 19, 21 denotes an inspection position stage, 22 denotes an image recognition unit, and 23 denotes a transport unit.

In the embodiment shown in FIG. 1, a laser beam 13 emitted from a laser
From the galvanometer 15 that scans the laser beam 13 in the X-Y2 axis from each of the fθ lenses 1
6, the light is focused by the fθ lens 16, and is irradiated to a predetermined position of the substrate 18 positioned by the processing position stage 17, and a hole having an opening diameter corresponding to the beam is processed at the irradiated position.

The substrate 18 is preliminarily placed on a pallet 19
The movement is restricted by the pallet 19 and the pallet 19 moves as a set. The pallet 19 is first moved from the supply position to the inspection position stage 21 by the transport means 20. Therefore, the image recognition means 22 recognizes all land positions and pallet recognition mark positions. Recognition marks are provided on the outer periphery of the pallet 19, and by recognizing the positions of several recognition marks by the image processing means 22, information on all land positions can be obtained.
9 recognition mark positions can be recognized. afterwards,
The pallet 19 is moved to the processing position stage 17 by the transporting means 23, the recognition position of the recognition mark of the pallet 19 is recognized on the processing position stage 17, and the pallet 19 recognized by the laser processing position stage 17 is recognized.
The control device calculates the processing position of the substrate 18 by the control device based on the recognition mark position of, the land position of the substrate 18 recognized by the inspection position stage 21 and the recognition mark position of the pallet, and obtains corrected processing data. The substrate 18 is irradiated with a laser beam based on this.

After the processing, the substrate is moved to the inspection position stage 21 by the transfer means 23, and the hole shape inspection of the substrate 18 after the processing is performed. As described above, by transporting the substrate 18 on the pallet 19 having the position recognition mark, it is possible to provide a device capable of performing high-accuracy processing in which all land positions are recognized by the position recognition mark and reducing tact loss. be able to.

FIGS. 2 and 3 show the configuration of the second embodiment of the present invention. FIG. 2 shows a method of correcting the processing data using the laser processing apparatus according to the first embodiment. Algorithm, FIG. 3 is a plan view showing a processing data area.

In FIG. 3, reference numeral 24 denotes processing data; 25, a scannable range by a galvanometer; 26, an area smaller than the scannable area 25, which is defined so as to correct nonlinear distortion components. The laser processing scans a laser with a galvanometer 15 and irradiates the substrate 18 as a workpiece with laser.
Is an area smaller than the scannable range 25 of the galvanometer, and each small area 26 in which distortion due to the influence of the previous process of the substrate 18 or non-linear distortion component due to heat or moisture caused by an environmental change can be corrected. The processing range of the substrate 18 is divided. Specifically, a scanning area 25 of 50 mm square
In contrast, the data is divided into a small area 26 of about 46.6 mm square, and has a correctable area of ± 1.7 mm.
Next, the processing order in the divided processing ranges is rearranged so as to reduce the moving distance of the laser scanned by the galvanometer, the substrate 18 is irradiated with laser, and laser processing is performed. As described above, in the present embodiment, as shown in the processing data processing algorithm in FIG. 2, the data processing is performed before the laser processing operation, and during the processing operation, the hole position corrected by the land position recognition is used. Based on the correction data,
By performing only the position correction of the processing area 24 within the scanning range 25, a processing method without tact loss can be provided.

[0022]

As described above, according to the present invention, the workpiece is transported on the pallet having the position recognition mark, and the entire land position is recognized by the position recognition mark, and the processing area is smaller than the scannable range. By dividing the data into regions and correcting the processing data within the scanning range, tact loss can be reduced and laser processing with high productivity can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a configuration of a laser processing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing an algorithm of processing data processing according to the embodiment of the present invention.

FIG. 3 is a plan view showing a processed data area with respect to a scannable range according to the embodiment of the present invention.

FIG. 4 is a perspective view showing a configuration of a laser processing apparatus according to a conventional technique.

FIG. 5 is a diagram showing an algorithm of processing data processing according to a conventional technique.

[Explanation of symbols]

 Reference Signs List 12 laser oscillator 13 laser beam 14 reflecting mirror 15 galvanometer 16 fθ lens 17 processing position stage 18 substrate 19 pallet 20 transfer means 21 inspection position stage 22 image recognition means 23 transfer means

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Izumi Nakai 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Term (reference) 4E068 AF00 CA14 CC02 CE03 DA11

Claims (3)

[Claims] 1. An image processing means for recognizing a processing position of a workpiece and a recognition mark position of a pallet, recognizing a hole shape of the workpiece after processing, and determining whether or not the workpiece is acceptable. In a laser processing apparatus having a moving means for moving a pallet between an image processing position and a laser processing position, a positional relationship between a processing position of a workpiece and a pallet recognition mark position recognized by a recognition means at the image processing position, and a laser A laser processing apparatus comprising: a control device that calculates a processing position of a workpiece from a recognition mark position of a pallet recognized at the processing position. 2. A workpiece is placed on a pallet, the pallet is moved to an image processing position, a processing position of the workpiece and a recognition mark position of the pallet are recognized, and the pallet is moved to a laser processing position. Calculate the processing position of the workpiece from the pallet recognition mark position recognized by the laser processing position, the pallet recognition mark position by the image processing position, and the pallet recognition mark position. A laser processing method comprising irradiating a processing position of a workpiece with a laser to process the workpiece. 3. The laser processing is to perform laser processing on a workpiece by scanning a laser beam with a galvanometer, and to process the workpiece for each area where a non-linear distortion component can be corrected in an area smaller than a laser scanable range. 3. The laser processing method according to claim 2, wherein the area is divided, and the workpiece is irradiated with a laser to perform laser processing.