JP2002302789A - 電解質 - Google Patents

電解質

Info

Publication number
JP2002302789A
JP2002302789A JP2001316476A JP2001316476A JP2002302789A JP 2002302789 A JP2002302789 A JP 2002302789A JP 2001316476 A JP2001316476 A JP 2001316476A JP 2001316476 A JP2001316476 A JP 2001316476A JP 2002302789 A JP2002302789 A JP 2002302789A
Authority
JP
Japan
Prior art keywords
acid
acids
copper
semiconductor wafer
ion source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001316476A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002302789A5 (https=
Inventor
Denis Morrissey
デニス・モリッセイ
Robert D Mikkola
ロバート・ディー・ミッコラ
Jeffrey M Calvert
ジェフリー・エム・カルバート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of JP2002302789A publication Critical patent/JP2002302789A/ja
Publication of JP2002302789A5 publication Critical patent/JP2002302789A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING SYSTEMS, e.g. PERSONAL CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B17/00—Fire alarms; Alarms responsive to explosion
    • G08B17/06—Electric actuation of the alarm, e.g. using a thermally-operated switch
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING SYSTEMS, e.g. PERSONAL CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B25/00—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems
    • G08B25/01—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium
    • G08B25/10—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using wireless transmission systems
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING SYSTEMS, e.g. PERSONAL CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B3/00—Audible signalling systems, e.g. audible personal calling systems
    • G08B3/10—Audible signalling systems, e.g. audible personal calling systems using electric transmission; using electromagnetic transmission
    • G08B3/1008—Personal calling arrangements or devices, i.e. paging systems
    • G08B3/1016—Personal calling arrangements or devices, i.e. paging systems using wireless transmission
    • G08B3/1025—Paging receivers with audible signalling details
    • G08B3/1033—Paging receivers with audible signalling details with voice message alert
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING SYSTEMS, e.g. PERSONAL CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B5/00—Visible signalling systems, e.g. visible personal calling systems or remote indication of seats occupied
    • G08B5/22—Visible signalling systems, e.g. visible personal calling systems or remote indication of seats occupied using electric transmission; using electromagnetic transmission
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H10W20/4421—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being copper

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Business, Economics & Management (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Materials Engineering (AREA)
  • Emergency Management (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2001316476A 2000-10-13 2001-10-15 電解質 Pending JP2002302789A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US24014200P 2000-10-13 2000-10-13
US24064300P 2000-10-16 2000-10-16
US60/240142 2000-10-16
US60/240643 2000-10-16

Publications (2)

Publication Number Publication Date
JP2002302789A true JP2002302789A (ja) 2002-10-18
JP2002302789A5 JP2002302789A5 (https=) 2005-06-30

Family

ID=26933186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001316476A Pending JP2002302789A (ja) 2000-10-13 2001-10-15 電解質

Country Status (3)

Country Link
EP (1) EP1197586A3 (https=)
JP (1) JP2002302789A (https=)
KR (2) KR20020029626A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005038088A1 (ja) * 2003-10-20 2005-04-28 Kansai Technology Licensing Organization Co., Ltd. 無電解銅めっき液及びそれを用いた配線基板の製造方法
JP2006510807A (ja) * 2002-12-16 2006-03-30 スリーエム イノベイティブ プロパティズ カンパニー 銅配線および／またはフィルムを研磨および／または洗浄する方法およびそのための組成物
JP2007016265A (ja) * 2005-07-06 2007-01-25 Adeka Corp 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
JP2008513503A (ja) * 2004-09-21 2008-05-01 バイオニューメリック・ファーマスーティカルズ・インコーポレイテッド 医薬用ジスルフィド塩
WO2011001847A1 (ja) * 2009-07-01 2011-01-06 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細銅配線埋め込み用電気銅めっき液
JP4888913B2 (ja) * 2004-11-12 2012-02-29 エントン インコーポレイテッド マイクロ電子機器における銅電気沈積方法
US11946153B2 (en) 2019-02-01 2024-04-02 Ishihara Chemical Co., Ltd. Copper or copper alloy electroplating bath

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100688766B1 (ko) * 2004-12-08 2007-03-02 삼성전기주식회사 초임계 유체를 이용한 인쇄회로기판의 동도금방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2871173A (en) * 1958-02-04 1959-01-27 Seymour Mfg Company Method of making ductile copper platings
SU1650786A1 (ru) * 1987-05-19 1991-05-23 Волгоградский инженерно-строительный институт Электролит меднени
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
WO1998027585A1 (en) * 1996-12-16 1998-06-25 International Business Machines Corporation Electroplated interconnection structures on integrated circuit chips
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
US6113771A (en) * 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
JP2000269217A (ja) 1999-03-18 2000-09-29 Kobe Steel Ltd 銅配線膜の形成方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006510807A (ja) * 2002-12-16 2006-03-30 スリーエム イノベイティブ プロパティズ カンパニー 銅配線および／またはフィルムを研磨および／または洗浄する方法およびそのための組成物
WO2005038088A1 (ja) * 2003-10-20 2005-04-28 Kansai Technology Licensing Organization Co., Ltd. 無電解銅めっき液及びそれを用いた配線基板の製造方法
JP2008513503A (ja) * 2004-09-21 2008-05-01 バイオニューメリック・ファーマスーティカルズ・インコーポレイテッド 医薬用ジスルフィド塩
JP4888913B2 (ja) * 2004-11-12 2012-02-29 エントン インコーポレイテッド マイクロ電子機器における銅電気沈積方法
JP2007016265A (ja) * 2005-07-06 2007-01-25 Adeka Corp 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
WO2011001847A1 (ja) * 2009-07-01 2011-01-06 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細銅配線埋め込み用電気銅めっき液
US11946153B2 (en) 2019-02-01 2024-04-02 Ishihara Chemical Co., Ltd. Copper or copper alloy electroplating bath

Also Published As

Publication number Publication date
EP1197586A3 (en) 2002-09-25
KR20090031539A (ko) 2009-03-26
KR100971267B1 (ko) 2010-07-20
EP1197586A2 (en) 2002-04-17
KR20020029626A (ko) 2002-04-19

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