JP2002299304A - Wet processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a water-saving type wet processing apparatus, which can reduce the consumption of wet processing liquid to 1/10 times as much as conventionally and obtain higher cleanness than conventionally. SOLUTION: This wet processing apparatus is provided with a wet-processing body 15, equipped with an introduction-side passage 5 for introducing the processing liquid 3 on one side and a discharge-side passage 6 for discharging the processing liquid 3, after wet-processing on the other and further equipped with a vibration guide member 2, which guides the processing liquid 3 introduced from the introduction-side passage 5 to a body 1 to be processed and performs the wet processing of the body 1 to be processed, while giving vibration between the introduction-side passage 5 and discharge-side passage 6, and is further provided with a position adjusting member 4, which ensures a specific gap between the vibration guide member 2 and the body 1 to be processed and holds the processing liquid 3 in the gap; and the vibration guide member 2 is equipped with a vibrator 7 on the opposite external surface of the vibration guide member 2 from the side of the body to be processed and liquid 1, which transmits the vibration from the vibrator 7 to the external surface of the vibration guide member on the side of the body to be processed is provided in the vibration guide member 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid-saving wet processing apparatus used for wet processing including cleaning, etching, development, and peeling.

[0002]

2. Description of the Related Art Conventional techniques and problems will be described from the viewpoint of cleaning in the wet processing of the surface of a substrate for a solar cell, a liquid crystal substrate, a magnetic substrate, a substrate for a plastic package and other large substrates.

Conventionally, a cleaning apparatus shown in FIG. 13 is generally used. 13A is a side view of the device, and FIG. 13B is a plan view thereof.

In this apparatus, an object to be processed (substrate) 10
Cleaning is performed by supplying another cleaning liquid such as ultrapure water, electrolytic ionic water, ozone water, hydrogen water or the like to the upper surface of the substrate 101 using the wet processing liquid supply nozzle 102 while moving 1 in the direction of arrow A, for example. Is going.

The wet processing liquid supply nozzle 102 is provided with a cleaning liquid supply chamber 104, an opening 106 for leading the cleaning liquid toward the substrate, and a cleaning liquid inlet 107 for introducing the cleaning liquid into the cleaning liquid supply chamber 104. .

Further, an ultrasonic element 116 is provided on the cleaning liquid supply chamber 104 in order to improve the cleaning effect by applying ultrasonic waves in the vicinity of the MHz band to the cleaning liquid.

A cleaning liquid such as ultrapure water, electrolytic ionic water, ozone water, hydrogen water or the like is introduced into the cleaning liquid supply chamber 104 through a cleaning liquid inlet 107 and supplied to the surface of the substrate to be cleaned through an opening 106. Perform cleaning. After cleaning with this cleaning liquid, in order to remove the cleaning liquid from the surface of the object to be cleaned,
Further, for the purpose of removing remaining particles and the like, rinsing cleaning is performed with a rinsing cleaning liquid (generally ultrapure water) using a nozzle having the same structure as the wet processing liquid supply nozzle 102 shown in FIG.

However, the conventional cleaning technique shown in FIG. 13 has the following problems. The first problem is that a large amount of a cleaning liquid or a rinse cleaning liquid is used.

For example, the substrate 101 having a size of 500 mm square is cleaned using a cleaning liquid such as electrolytic ionized water, and the particles (for example, Al ₂ O) on the substrate 101 after the cleaning with the cleaning liquid and the rinsing with the rinsing water are performed.
_In order to achieve a cleanliness level of 0.5 particles / cm ² at a residual amount of ( ₃ particles), a cleaning liquid and a rinsing liquid of about 25 to 30 L / min must be supplied. 25
The amount of ３０30 L / min is necessary to stably apply ultrasonic waves. That is, 25 to 30 L / mi
If the amount is less than n, stable application of ultrasonic waves cannot be performed, and clean cleaning cannot be achieved. At present, the reason why the use amount of the cleaning liquid is increased is as described above, but still, 25 to 30 L / m
The use amount of the liquid in about in is a result of increasing the frequency of the ultrasonic wave and decreasing the slit width of the ultrasonic cleaning nozzle, and this is the limit of the existing technology.

Second, there is a problem in cleanliness after cleaning. As described above, even if a large amount of washing water (25 to 30 L / min) is used, and the rinsing after washing is sufficiently performed, there is a limit to the degree of cleanliness that can be obtained. It is about 5 / cm ² .

When higher cleanliness (cleanness of about 0.05 / cm ² ) is required, there is a problem that conventional cleaning techniques cannot cope with the problem. Further, the degree of cleanliness varies within the same substrate, and the substrate 101 shown in FIG.
Is less clean than the part a on the traveling direction side. It has been found that the cleanliness distribution state has a problem that the cleanliness is higher at the leading end a in the traveling direction, and becomes worse toward the rear end b in the traveling direction.

According to the knowledge of the present inventor, this is because the cleaning liquid supplied from the supply nozzle 102 to the surface of the substrate 101 becomes a liquid film on the surface of the large substrate as shown in FIG. This is because particles removed once while flowing adhere to the substrate surface again.

There are also reports of techniques aiming at liquid recycling and reuse from the viewpoint of reducing wastewater treatment, and techniques of reducing the amount of water required for washing.

[0014] The conventional technique is that water to which ultrasonic waves are applied is
The liquid is ejected from the narrowed opening to wash the substrate surface and collect the liquid.

[0015] However, this technique has the following problems. Due to the narrowed mouth structure, the efficiency of degassing is low and it is difficult to reduce the cleaning liquid. If the gas is not sufficiently vented, the ultrasonic element will be damaged.

Due to the narrowed mouth structure, it is difficult to generate ultrasonic waves, and the loss of sound pressure of ultrasonic waves is large. In the structure of the narrowed mouth, the portion where the sound pressure becomes maximum depends on the size of the vibrator, but has a size of 1 cm to 3 cm.

In the narrowed mouth structure, the outlet of the mouth is in the cleaning liquid, and the ultrasonic wave is easily propagated along the flow, so that the ultrasonic wave is concentrated near the ultrasonic outlet, so that the corner portion is damaged. , Causing the generation of particles. Further, since the turbulent flow is generated near the outlet, the cleaning at that portion becomes insufficient.

Since the pressure is not balanced between the inlet and the outlet, incomplete cleaning and liquid leakage due to liquid shortage occur, leading to a decrease in the wave recovery rate.

In order to reliably remove particles,
Although high-precision processing of the cleaning water supply pipe is required, it is difficult to remove impurities in the pipe due to its difficult structure.

Also, a relatively low frequency (39 kHz to 500 kHz)
Attempts to perform ultrasonic cleaning at (kHz) would not be possible with this structure.

In another conventional technique, water to which ultrasonic waves have been applied blows out from a narrowed opening, and a surface parallel to the substrate is used as a water retaining layer to clean the surface of the substrate widely.

However, this device has the following problems. Due to the narrow mouth structure, the efficiency of degassing is low. A gas vent is provided at the upper part to increase gas venting efficiency, but a large amount of cleaning liquid comes out of the gas vent.

Because of the narrow mouth structure, the part where the sound pressure becomes maximum depends on the size of the vibrator, but it is 1 to 3 cm.
If they are too close, the cleaning effect will be significantly reduced.

In the narrowed mouth structure, the outlet of the mouth is in the cleaning liquid, and the ultrasonic wave is easily transmitted along the flow. Damage may occur, causing particles to be generated.

Since the structure of the narrowed mouth and the size of the upper gas vent are not balanced, the flow of waves coming out of the narrowed mouth cannot be controlled, so that the cleaning effect is greatly reduced.

With this technique, it is difficult to remove bubbles generated in a narrowed portion. That is, since the cleaning liquid flows out from the upper gas vent, the gas is hardly released.

Because of the combination of the narrowed mouth structure and the portion parallel to the object to be processed, high-precision processing for achieving high uniformity and high cleaning cannot be performed. Low frequency 39 kHz to 500
Use of kHz becomes extremely difficult.

The ultrasonic vibration body is positioned so as to keep a small gap from the cleaning surface of the object to be cleaned, and a medium supply pipe disposed near the ultrasonic vibration body,
The medium is discharged from the medium supply pipe, and a layer of the medium is formed between the vibration surface of the ultrasonic vibrator and the cleaning surface of the object to be cleaned, and ultrasonic waves are applied to the object to be cleaned through the layer. There is known a technique of performing ultrasonic cleaning by applying a voltage.

However, in this technique, since the cleaning liquid is discharged from the vicinity into the ultrasonic vibrator and the object to be cleaned, the flow rate thereof is controlled by a generally known ultrasonic shower cleaning method. And the amount of the cleaning liquid is close to the above. In addition, since the cleaning liquid is released into a small gap, once the liquid enters, the liquid may not flow stably due to the resistance of the liquid, etc. Since the structure is such that the cleaning liquid falls outside the system on the surface of the object to be cleaned as far as the end surface of the object to be cleaned, there is a problem that particles are likely to be reattached. Further, there is a problem that the substrate is sucked up depending on how the cleaning liquid is discharged, and comes into contact with the edge of the ultrasonic cleaning surface.

[0030]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the conventional wet processing apparatus, and can reduce the amount of the wet processing liquid used to one tenth or less of the conventional one. It is another object of the present invention to provide a water-saving wet treatment apparatus capable of obtaining high cleanliness.

[0031]

A wet processing apparatus according to the present invention for solving the above-mentioned problems comprises an inlet passage for introducing the processing liquid on one side and a discharge side for discharging the processing liquid after the wet processing on the other side. A vibration which guides the processing liquid introduced from the introduction-side passage to the processing object and applies vibration to the processing object, between the introduction-side passage and the discharge-side passage, and wet-processes the processing object. A wet processing body provided with a guide member, a position adjusting member for maintaining the vibration guide member and the object to be processed in a predetermined gap, and holding a processing liquid in the gap, and providing the vibration guide member with vibration A vibrator is formed on the outer surface of the vibration guide member opposite to the object side, and the vibration from the vibrator is applied to the object side of the vibration guide member inside the vibration guide member. Tell the outside Characterized by comprising a (idle driving preventing liquid).

Another wet processing apparatus according to the present invention has a passage for introducing a processing liquid on one side, and guides the processing liquid introduced from the introduction-side passage to the object to be processed and sends it to the other side. A wet processing main body provided with a vibration guide member for wet-processing the object to be processed while applying vibration, maintaining the vibration guide member and the object to be processed in a predetermined gap, and holding the processing liquid in the gap. A position adjusting member is provided, and a discharge-side passage for discharging the processing liquid sent by the vibration guide member is provided.The vibration guide member includes a vibrator, and the vibration guide member includes a vibrator. The vibrator is formed on the opposite outer surface, and a liquid (anti-firing liquid) for transmitting vibration from the vibrator to the outer surface of the vibrating guide member on the workpiece side is provided inside the vibrating guide member. Feature

With this configuration, the processing liquid is reliably held in the gap between the surface of the object to be processed and the vibration guide member, and the surface to be processed can be wet-processed with the minimum necessary amount of the processing liquid. It becomes possible. In addition, since the processing liquid is supplied to the surface to be processed and the used processing liquid can be appropriately discharged through the discharge side passage, the surface to be processed can always be processed with fresh processing liquid. Further, re-contamination of the surface to be processed by the used processing solution can be prevented.

Further, in the wet processing apparatus according to the present invention, the vibration guide member is disposed so as to face an ultrasonic vibrator serving as an ultrasonic vibration source with the ultrasonic vibrator opposed to the ultrasonic vibrator with an anti-firing liquid. An ultrasonic vibration guide member for applying ultrasonic vibration to the surface.

According to this configuration, even if the processing liquid between the ultrasonic vibration guide member and the surface to be processed is insufficient, the idling prevention liquid is provided between the ultrasonic vibrator and the ultrasonic vibration guide member. Therefore, it is possible to reliably prevent the ultrasonic vibrator from idling.

It is preferable to use a degassed liquid as the anti-blanking liquid. By degassing, the idling prevention flow rate can be significantly reduced. Further, if a cooling mechanism is provided for the idle hit prevention liquid, the liquid can function as an idle hit prevention liquid with a smaller amount of liquid. This is because if a large number of air bubbles are present in the blanking prevention liquid, the same phenomenon as in blanking may occur. In addition, deaeration is performed by DO 2.4p by membrane deaeration.
pm or less.

Further, since the processing liquid is held by the interfacial tension in the gap between the surface to be processed and the vibration guide member, the surface to be processed can be wet-processed with the minimum necessary amount of the processing liquid, and the processing target can be surely processed. Ultrasonic vibration can be applied to the surface.

In the wet processing apparatus of the present invention, it is preferable that the processing liquid discharging member is provided with a suction device for suctioning and removing the used processing liquid from the gap.

With this configuration, since the used processing liquid is quickly discharged and removed from the surface to be processed, recontamination of the surface to be processed by the used processing liquid can be more reliably prevented.

Further, the vibration guide member to which the vibrator is attached and the object to be cleaned are substantially parallel to each other, and the cleaning liquid is inserted between the vibration guide member and the ultrasonic wave. Very low loss.

Since the cleaning liquid on which the ultrasonic wave is superimposed is not discharged with the narrowed mouth structure, there is no damage at the intersection between the vibration guide member and the cleaning liquid supply section.

The vibration guide member to which the vibrator is attached and the object to be cleaned are substantially parallel to each other, and the pressure such as interfacial tension is balanced so that the cleaning liquid enters between the members.
Can be cleaned with a very small amount of cleaning solution.

The flow rate of the cleaning liquid between the vibration guide member to which the vibrator is attached and the object to be cleaned can be controlled by balancing the pressure such as the interfacial tension of the cleaning liquid between the vibration guide member and the object to be cleaned. The cleaning effect is improved.

As a method of supplying the cleaning liquid between the vibration guide member to which the vibrator is attached and the object to be cleaned, a method of supplying the cleaning liquid from the same direction as the moving direction of the substrate with respect to the cleaning nozzle is preferable.

As a method for putting the cleaning liquid between the vibration guide member to which the vibrator is attached and the object to be cleaned, a method in which the cleaning liquid supply unit is located at the center of the cleaning nozzle is preferable.

As a method of pouring the cleaning liquid between the vibration guide member to which the vibrator is attached and the object to be cleaned, the cleaning liquid has a constant inclination in the moving direction of the substrate with respect to the cleaning nozzle. It is preferable to supply the cleaning liquid from the outlet side, or when the inclination becomes small, to supply the cleaning liquid from the inlet side of the cleaning nozzle.

When a suction device is provided, the following may be performed. The introduction-side passage is set at the center of the wet processing main body, the discharge-side passage is formed symmetrically, a suction device is connected to the discharge-side passage, and the pressure such as the interfacial tension of the cleaning liquid between the vibration guide member and the object to be cleaned. to keep balance. This makes it possible to control the flow rate of the cleaning liquid and quickly discharge contaminants to the outside of the system, thereby improving the cleaning effect while achieving a significant reduction in the cleaning liquid.

Alternatively, the introduction-side passage is formed at one end of the wet processing main body, the discharge-side passage is formed at the other end, and the suction device is connected to the discharge-side passage of the wet processing main body. The pressure balance such as the interfacial tension of the cleaning liquid during the period is taken. Thereby, control of the flow rate of the cleaning liquid, and
Contaminants can be quickly discharged to the outside of the system, and the cleaning effect can be improved while achieving a drastic reduction of the cleaning liquid.

When the present wet processing apparatus is used for cleaning semiconductors, in particular, the size of the vibration guide member to which the vibrator is attached is made larger than the size of the object to be cleaned, and the discharge side passage is formed in the wet processing main body. If so, the inlet side passage is provided at the center of the wet processing main body, and the discharge side passage is provided at least one concentrically in the wet processing main body, and the interfacial tension of the cleaning liquid between the vibration guide member and the object to be cleaned. By controlling the pressure balance, the flow rate of the cleaning liquid can be controlled, and the contaminants can be quickly discharged out of the system. As a result, the cleaning effect can be improved while achieving a significant reduction in the cleaning liquid. It is preferable to connect a suction device to the discharge side passage.

By dividing the apparatus into several blocks, it is possible to perform high-precision processing and to perform an optimal surface treatment, and to increase the selectivity of materials to be used, thereby making it possible to use various chemicals. Become. The manufacturing process can be greatly simplified.

The control of the distance between the vibration guide member and the object to be cleaned for balancing the pressure such as the interfacial tension of the cleaning liquid between the vibration guide member and the object to be cleaned is performed by driving the position adjusting member up and down. It is done by doing. If a high-precision position detection robot is provided and the position adjustment member is driven while detecting the distance by the robot, the distance can be controlled with higher precision.

[0052]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 shows a first embodiment.

The wet processing apparatus 12 of the present embodiment includes an inlet passage 5 for introducing the processing liquid 3 on one side and a discharge passage 6 for discharging the processing liquid 3 after the wet processing on the other side. Between the passage 5 and the discharge side passage 6,
A wet processing main body 15 provided with a vibration guide member 2 for guiding the processing liquid 3 introduced from the introduction side passage 5 and performing wet processing on the processing object 1 while giving vibration, and the vibration guide member 2 and the processing object are provided. 1 is maintained in a predetermined gap, and a position adjusting member 4 for holding the processing liquid 3 in the gap is provided.

This will be described in more detail below. The wet processing apparatus 12 of the present embodiment includes the vibration guide member 2 at a position facing the processing surface 8 of the processing target substrate 1 placed on the holding table 25. The vibration guide member 2 is for applying ultrasonic waves to the surface 8 to be processed.

The vibration guide member 2 is fixed to the supporting columns 21b and 21c of the position adjusting member 4. Support column 21b,
21c are connected by a horizontal bar. 16 at the end of the horizontal bar is a balancer. A screw box 26 is provided in front of the balancer 16, and a feed screw mechanism for moving the horizontal bar up and down is provided in the screw box 26. 2
Reference numeral 1a denotes a support column for supporting the screw box 25, and the lower end thereof is fixed to a holding table. By moving the horizontal bar up and down by the feed screw mechanism, the vibration guide member 2 is moved up and down, and the vibration guide member 2 and the processing surface 8 are held so as to be able to approach and separate from each other.

During the wet processing, the gap between the vibration guide member 2 and the surface 8 to be processed is formed by using the position adjusting member 4 so that the processing liquid 3 is interposed between the surface 8 to be processed and the vibration guide member 2 by the interfacial tension. At an interval that can be held.

Further, a processing liquid inlet passage 5 for supplying the processing liquid 3 to the gap between the surface 8 to be processed and the vibration guide member 2 and a processing liquid discharge passage 6 for discharging and removing the used processing liquid are provided. The processing liquid is supplied from the processing liquid introduction side passage 5 to the gap between the processing target surface 8 and the vibration guide member 2 so as to be filled with the processing liquid, and the used processing liquid is discharged and removed using the processing liquid discharge side passage 6. An introduction member 22 is connected to an entrance of the introduction-side passage 5, and a discharge member 23 is connected to an exit of the discharge-side passage 6.

(Embodiment 2) A second embodiment will be described with reference to FIG.

In the wet processing apparatus of the present embodiment, the vibration guide member 2 and the introduction-side passage 5 and the discharge-side passage 6 are formed separately from each other. In FIG. 2, illustration of the position adjusting member is omitted.

With this configuration, the vibration guide member 2 and the introduction-side passage 5 and the discharge-side passage 6 can be individually processed. As the material of the vibration guide member 2, stainless steel, quartz, or the like is suitable for efficient transmission of ultrasonic waves. The material of the introduction-side passage 5 and the discharge-side passage 6 is free from contamination and excellent in workability. Therefore, materials such as PVC, PFA, PTFE, and PEEK are suitable. By processing these individually, high-precision processing is possible. Further, when the vibration surface is damaged, it is possible to appropriately replace only the damaged portion without replacing the whole. Other points are the same as in the first embodiment.

(Embodiment 3) Next, a third embodiment will be described with reference to FIG.

In the wet processing apparatus of the present embodiment, a discharge-side passage is formed in the wet processing apparatus, and a suction device 9 composed of a pump is connected to the discharge-side passage 6. The illustration of the position adjusting member is omitted.

The used processing liquid is forcibly discharged and removed from the gap through the discharge side passage 6 by using the suction device 9.

Since the processing liquid can be forcibly discharged as described above, the used processing liquid can be discharged more quickly, and the cleaning with higher cleanliness can be performed.
Further, the pressure in the gap between the vibration guide member 2 and the workpiece 1 can be adjusted by adjusting the suction pressure of the suction device 9. Other points are the same as in the first embodiment.

(Fourth Embodiment) A fourth embodiment will be described with reference to FIG. This embodiment is an embodiment for preventing a so-called idling of the vibrator.

That is, in this embodiment, the vibration guide member 2
A vibrator 7 is formed on the outer surface opposite to the workpiece 1 side, and a liquid for transmitting vibration from the vibrator 7 to the outer surface of the vibration guide member 2 on the workpiece 1 side is provided inside the vibration guide member 2. I have.

That is, the wet processing apparatus 12 of the present embodiment
In the above, the vibration guide member 2 is always idled between the ultrasonic vibrator 7 serving as an ultrasonic vibration source and the ultrasonic vibration guide member 13 for applying ultrasonic vibration to the processing surface 8 of the processing target 1. The prevention liquid 11 is provided.

In FIG. 4, the vibration guide member 2
And the idling prevention liquid storage member 20 are integrally formed. That is, the bottom side of the concave storage member 20 that stores the idling prevention liquid 11 also serves as the vibration guide member 2.
When the bottom side of the storage member 20 and the vibration member 2 are separated from each other, the ultrasonic wave propagation efficiency is deteriorated. However, when the vibration member 2 is also used as described above, the propagation efficiency is good, and a high cleaning effect is obtained. Can be achieved. Other points are the same as in the first embodiment.

(Fifth Embodiment) A fifth embodiment will be described with reference to FIG.

The wet processing apparatus of the present embodiment is provided with an introduction path 5 for introducing the processing liquid 3 on one side, and the processing liquid 3 introduced from the introduction path 5 to the workpiece 1 while guiding the processing liquid 3 to the other side. A wet processing main body 15 having a vibration guide member 2 for wet-treating the workpiece 1 while applying liquid to the workpiece and applying vibration thereto is provided, and the vibration guide member 2 and the workpiece 1 are provided.
Are maintained at a predetermined gap, a position adjusting member (not shown) for holding the processing liquid 3 in the gap is provided, and a discharge side passage 6 for discharging the processing liquid 3 sent by the vibration guide member 2 is provided. .

The discharge side passage 6 is formed on the bottom of a drain container 35 provided around the object 1.

That is, in this embodiment, the wet processing main body 15 is provided with the introduction-side passage 5 but is not provided with the discharge-side passage. Therefore, the treated liquid 3 after the treatment flows out to the drain container 35 from the peripheral side surface of the gap formed by the vibration guide member 2 and the surface of the object 1 to be treated,
Is discharged out of the system of the wet processing apparatus from the discharge side passage 6 formed on the bottom surface of the wet processing apparatus.

In this embodiment, since the discharge side passage is not provided in the wet processing main body 15, the pressure control is performed only on the processing liquid introduction side, and there is an advantage that the apparatus structure and mechanism are simplified. ing. The other points are the same as in the first embodiment.

(Embodiment 6) A sixth embodiment will be described with reference to FIG.

The wet processing apparatus according to the present embodiment
Is moved in the direction of arrow A in the drawing while facing the vibration guide member 2.

With this configuration, it is possible to perform wet processing that can obtain uniform cleanliness over the entire surface of a large workpiece. Other points are the same as in the fifth embodiment.

(Embodiment 7) A seventh embodiment will be described with reference to FIG.

The wet processing apparatus 12 of the present embodiment
A mechanism is provided in the gap between the vibration guide member 2 and the surface 8 to be processed, for rotating the substrate 1 while maintaining the state where the processing liquid 3 is held at the interfacial tension.

With this configuration, a large-sized workpiece can be processed by the small-sized wet processing apparatus 12.

The substrate 1 is placed on the mounting portion 42 of the substrate holder 41.
The rotating shaft 40 is provided on the bottom surface of the substrate holder 41.

The introduction passage 5 is formed at the center of the vibration guide member 2. A plurality (7a, 7b) of vibrators are provided symmetrically with respect to the introduction-side passage 5.

Reference numeral 4 denotes a position adjusting member.
Is adjusted up and down so that the processing liquid 3 in the gap between the vibration guide member 2 and the processing target surface 8 can be held at the interfacial tension. By rotating the rotation shaft 40, the substrate 1 is rotated, the processing liquid is introduced into the gap from the introduction-side passage 5, and ultrasonic waves are applied to the processing liquid 3 by the vibrator 7.

The processing liquid introduced into the gap cleans the surface 8 to be processed and is discharged from the peripheral side face of the gap by centrifugal force.

(Eighth Embodiment) An eighth embodiment will be described with reference to FIG.

The wet processing apparatus 12 of the present embodiment is the most suitable form in the case where the vibration surface of the vibration guide member 2 is wider than the processing surface 8 of the substrate 1.

The substrate 1 is placed and held on the placing portion 42 of the holder 41, and a step is provided inside the placing portion 42. Since the height of the step is the same as the thickness of the substrate, the upper surface of the mounting portion 42 and the surface 8 to be processed of the substrate 1 are flush with each other.

Therefore, the processing liquid 3 flows smoothly from the inside of the gap to the outside of the gap. Therefore, the entire surface of the substrate 1 can be uniformly processed.

(Embodiment 9) The following embodiment will be described with reference to FIG.

This embodiment is an example in which the processing liquid introduction side passage 5 and the discharge side passage 6 are formed separately from the vibration guide member 2 and are provided with the idling prevention liquid 11.

In this example, the vibration guide member 2 has a concave shape, and a member 50 is provided on a side surface thereof. The introduction side passage 5 is formed in the member 50.

In this embodiment, the bottom surface of the vibration guide member 2 and the bottom surface of the member 50 are flush.

(Embodiment 10) The following embodiment will be described with reference to FIG.

This embodiment is an example in which the processing liquid introduction side passage 5 and the discharge side passage 6 are formed separately from the vibration guide member 2 and are provided with the idling prevention liquid 11.

The basic structure is the same as the example shown in FIG. 9, but in this example, the bottom surface of the vibration guide member 2 and the bottom surface of the member 50 are not flush, and the bottom surface of the member 50 is It is lowered by H from the bottom.

H is preferably about 0 to 3 mm.
Other points are the same as those in the embodiment shown in FIG.

(Embodiment 11) The following embodiment will be described with reference to FIG.

This embodiment is an example in which the processing liquid introduction side passage 5 and the discharge side passage 6 are formed separately from the vibration guide member 2, and are provided with the idling prevention liquid 11.

The basic structure is the same as the example shown in FIG. 10. The bottom surface of the vibration guide member 2 and the bottom surface of the member 50 are not flush, and the bottom surface of the member 50 is lower than the bottom surface of the vibration guide member 2 by H. is there.

In this embodiment, however, a peripheral wall 52 is provided around the bottom surface of the vibration guide member 2. The bottom surface of the peripheral wall 52 is flush with the bottom surface of the member 50.

(Embodiment 12) FIG. 12 shows the following embodiment.

In this embodiment, a gas supply system 53 for replacing the processing liquid 3 between the introduction-side passage 5 and the discharge-side passage 6 with a gas is used.
have.

In this example, the gas supply system is configured as follows. That is, a pipe is connected to the inlet of the introduction-side passage 5, and this pipe is connected via the three-way valve 60, one to the processing liquid source and the other to the gas source.

When the vibration guide member 2 is separated from the workpiece 1 after the processing of the workpiece 1 with the processing liquid 3, the workpiece 1 may be attracted to the vibration guide member 2.

In this example, after the treatment of the object 1 is completed, the three-way valve 60 is connected to the gas source side, and the gas is introduced into the introduction side passage 5.
From the vibration guide member 2 and the workpiece 1.
As described above, by introducing gas into the gap between the vibration guide member 2 and the workpiece 1, the vibration guide member 2 can be easily separated from the workpiece 1. Further, the surface of the processing object 1 can be easily dried by the gas.

[0106]

EXAMPLE A cleaning performance was evaluated using a wet processing apparatus shown in FIG. For comparison, FIG.
The cleaning power was also evaluated for the apparatus (commercially available MS shower nozzle) shown in (1).

The evaluation conditions for the detergency are as follows. Object to be processed As the object to be processed, (1) On a glass substrate
Prepare a substrate on which Cr is deposited and (2) a Si wafer
Was. Compulsory contamination of substrate For substrate (1), Al₂O₃Liquid with dispersed particles
And dilute it to 5 L with ultrapure water (concentration).
Degree: 1.0 × 10⁴/ Ml), and the solution of (1)
After immersing the substrate for 1 second, take it out, immerse again for 1 second, and rinse
And dried. For the substrate of (2), PSL (poly
Styrene latex standard particles) (diameter: 0.309 μm)
Liquid in which particles are dispersed (concentration: 6.1 × 10¹¹Pieces / mL)
Was collected in an amount of 113 μL, and the collected liquid was added to 0.5% DHF (diluted).
Diluted with hydrofluoric acid) to 5 L. Contamination of the substrate, 3
Immersion for 10 minutes, rinsing and drying for 10 minutes. Cleaning conditions-Example-Cleaning solution: UPW (ultra pure water), cleaning solution flow rate: 0.5 L /
min Distance between vibration surface and substrate surface: 3 mm Ultrasonic wave: 950 kHz, 300 W (power density = about 5
W / cm²  : Vibrator size = about 40mm x about 160mm) ・ Washing time: 10sec

[0108] Pure water generally refers to raw water that is subjected to primary coagulation and sedimentation, sand filtration, activated carbon filtration, reverse osmosis membrane, two-bed, three-column ion exchanger, mixed-bed ion exchanger, precision filter, etc. It is water (primary pure water) obtained by treatment with a pure water treatment system.

Generally, ultrapure water is defined as the above pure water being further added for 2 hours.
The secondary pure water treatment system is the water obtained by the treatment with the secondary pure water treatment system, and the pure water stored in the pure water tank is irradiated with an ultraviolet ray irradiation device, a mixed-bed polisher, and an ultrafiltration device as follows. And secondary treatment using a membrane treatment device such as a reverse osmosis membrane device to remove as much as possible fine particles, colloidal substances, organic metals, anions and the like remaining in the pure water, and wet the object to be treated. Ultrapure water (secondary pure water) suitable for processing. The water quality of ultrapure water (secondary pure water) is shown in Table 1. In the present invention, the pure water and the ultrapure water are collectively referred to as pure water.

[0110]

[Table 1]

Conventional example Cleaning liquid: UPW (ultra pure water) Cleaning liquid flow rate: 10 L / min (10 L / min is
・ Distance between nozzle tip and substrate surface: 8mm ・ Ultrasonic wave: 950kHz, 300W (power density = about 5)
W / cm² : Transducer size = about 40mm x about 160m
m) ・ Washing time: 10 sec measurement ・ Al₂O₃Particle measuring device: PI1100FP (QCO) particle measurement
Machine 0.5 μm or more was counted.・ PSL (0.309μm) particle measuring device: WIS (manufactured by Canon Inc.) particle measurement
Estimated by counting 0.3 μm or more of the standard equipment The number of particles before and after forced contamination and after cleaning
It measured and evaluated the detergency. The results are shown in Table 2 (Al₂O₃
Particle contamination) and Table 3 (PSL particle contamination).

[0112]

[Table 2]

[0113]

[Table 3]

As shown in Tables 2 and 3, in the present embodiment, the cleaning power was much better than that of the conventional example although the cleaning liquid amount was about 1/20 of that of the conventional example. .

In the case of the wet processing apparatus according to the other embodiment, the cleaning effect in the embodiment of FIG. 5 is reduced to substantially the same level as that of the conventional example, but the same result as in the embodiment is obtained in other respects.

[0116]

According to the wet processing apparatus of the present invention, the amount of the wet processing liquid used can be reduced to 1/10 or less of the conventional one, and the processing efficiency is higher than the conventional one, for example, the high cleaning in the cleaning process. It is possible to gain a degree.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a wet processing apparatus according to a first embodiment.

FIG. 2 is a sectional view of a wet processing apparatus according to a second embodiment.

FIG. 3 is a sectional view of a wet processing apparatus according to a third embodiment.

FIG. 4 is a cross-sectional view of a wet processing apparatus according to a fourth embodiment.

FIG. 5 is a cross-sectional view of a wet processing apparatus according to a fifth embodiment.

FIG. 6 is a cross-sectional view of a wet processing apparatus according to a sixth embodiment.

FIG. 7 is a cross-sectional view of a wet processing apparatus according to a seventh embodiment.

FIG. 8 is a sectional view of a wet processing apparatus according to an eighth embodiment.

FIG. 9 is a cross-sectional view of a wet processing apparatus according to a ninth embodiment.

FIG. 10 is a sectional view of a wet processing apparatus according to a tenth embodiment.

FIG. 11 is a sectional view of a wet processing apparatus according to an eleventh embodiment.

FIG. 12 is a sectional view of a wet processing apparatus according to a twelfth embodiment.

FIG. 13 is a cross-sectional view of a wet processing apparatus according to a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 workpiece, 2 vibration guide member, 3 treatment liquid, 4 position adjustment member, 5 introduction side passage, 6 discharge side passage, 7 ultrasonic vibrator, 8 surface to be treated, 9 suction device, 11 idle discharge prevention liquid, Reference Signs List 12 wet treatment device, 13 ultrasonic vibration guide member, 15 wet treatment main body, 20 storage member, 21a, 21b, 21c support column, 22 introduction member, 23 discharge member, 25 holder, 26 screw box, 30 substrate transport member, 35 drain container, 40 rotating shaft, 41 substrate holder, 42 mounting part, 50 members, 52 peripheral wall, 53 gas supply system, 60 three-way valve, 101 workpiece (substrate), 102 wet processing liquid supply nozzle, 104 cleaning liquid supply Chamber, 105 cleaning liquid, 106 opening, 107 cleaning liquid inlet, 116 ultrasonic element.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenichi Mimori 3-31, Meido, Izumi-ku, Sendai City, Miyagi Prefecture Inside Frontech Co., Ltd. (72) Inventor Tadahiro Omi 2 Yonegabukuro, Aoba-ku, Sendai City, Miyagi Prefecture. 3-11-1301 (72) Inventor Yasuhiko Kasama 3-31 Akimitsu, Izumi-ku, Sendai, Miyagi Prefecture F-Tech Co., Ltd. F-term (Reference) 3B201 AA02 AA03 AB42 BB03 BB72 BB77 BB85 BB92 BB93 CC01 CC11 5F043 AA02 AA40 BB27 DD12 DD19 GG10

Claims (3)

[Claims] A first passage for introducing a treatment liquid on one side and a discharge passage for discharging the treatment liquid after the wet treatment on the other side; and a passage between the introduction passage and the discharge passage. A wet processing main body having a vibration guide member for guiding the processing liquid introduced from the introduction-side passage to the workpiece and applying a vibration to the workpiece while applying vibration thereto; and providing the vibration guide member with the vibration guide member. The processing object is maintained at a predetermined gap, and a position adjusting member for holding the processing liquid in the gap is provided.The vibration guide member includes a vibrator, and the vibration guide member includes a vibrator. The vibrator is formed on the opposite outer surface, and a liquid for transmitting vibration from the vibrator to the outer surface of the vibration guide member on the workpiece side is provided inside the vibration guide member. Characterized by a web Processing apparatus. 2. An apparatus according to claim 1, further comprising an introduction passage for introducing the processing liquid on one side, and feeding the processing liquid introduced from the introduction passage to the object to be processed while feeding the processing liquid to the other side and applying vibration. A position adjustment member for providing a wet processing main body having a vibration guide member for wet processing the object to be processed while maintaining the vibration guide member and the object to be processed in a predetermined gap and holding the processing liquid in the gap; And a discharge-side passage for discharging the processing liquid sent by the vibration guide member. The vibration guide member includes a vibrator, and is opposite to the object side of the vibration guide member. The vibrator is formed on an outer surface of the vibrator, and a liquid (anti-flush prevention liquid) for transmitting vibration from the vibrator to the outer surface of the vibration guide member on the side of the workpiece is provided inside the vibration guide member. Feature Ett processing apparatus. 3. The wet processing apparatus according to claim 1, wherein the idle hit prevention liquid is a degassed liquid.