JP2002289452A - Method for manufacturing laminated ceramic electronic component having recessed terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of chipping or cracking in recessed edges where terminal electrodes are arranged, to easily form terminal electrodes, and to prevent the generation of steps due to thicknesses of inner electrodes or the like. SOLUTION: Ceramic layers 1a, 1b are so formed as to contain a caking material W, which is decomposed when a ceramic element is fired, by an amount that corresponds to the volume of a recessed part of the ceramic element, in a same layer kept flush. The caking material W is decomposed by firing the ceramic element to form a recessed part on each end of the ceramic element, while inside conductive layers 4a, 4b are exposed to the outside of the ceramic element to form terminal electrodes on the inside faces of the recessed parts 5a, 5b. The ceramic element having no step is formed by laminating the ceramic layers 1a, 1n, each containing the caking material W, including the conductive layer 4a or 4b, in a same layer kept flush.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a ceramic body by electrically connecting internal electrodes with through-hole conductors, alternately stacking internal electrodes and ceramic layers, and forming a ceramic body. The present invention relates to a method for manufacturing a concave terminal type multilayer ceramic electronic component in which both ends are formed in a concave shape and terminal electrodes electrically connected to internal electrodes by through-hole conductors are provided in concave portions of the ceramic body.

[0002]

2. Description of the Related Art Generally, as a laminated ceramic electronic component, a concave terminal type in which a terminal electrode electrically connected to an internal electrode by a through-hole conductor is provided in a concave portion of a ceramic body is known.

In order to manufacture the multilayer ceramic electronic component, first, a ceramic green sheet is formed on a carrier film from a ceramic paste, and an internal electrode is formed on the ceramic green sheet using a conductive paste such as Pd, Ag, or Ni. And a plurality of the internal electrodes and the ceramic green sheets are alternately laminated to form a ceramic sheet laminate.

[0004] Next, a chip-shaped ceramic body is obtained through the pressing of the ceramic sheet laminate, the cutting step for each component, and the like. At the time of cutting the ceramic sheet laminate, a cutting blade having an edge shape for cutting both ends of the ceramic body in a concave shape is used.

In the final stage, the ceramic body is burned out with an organic binder or the like,
Then, a base layer of Ag, Ag-Pd, Ni, Cu, etc. is formed, and a nickel plating film and a plating film of tin or a tin-lead alloy are formed. To be provided. In the configuration of the terminal electrode, the base layer is formed by applying a conductive paste to a concave portion of each component using a roll coater.

According to the manufacturing method of the multilayer ceramic electronic component, the cutting of the component is performed by using the cutting blade and the both ends are cut into a concave shape, so that the edge of the concave portion is easily chipped or cracked, and the yield is reduced. Invite. In addition, since the base layer of the terminal electrode is formed by applying a conductive paste to each component with a roll coater, it takes time to form the base layer.

At the same time, since a ceramic sheet laminate is formed by laminating a plurality of ceramic green sheets on which internal electrodes are formed, a stepped portion is generated due to the thickness of the internal electrodes, and the pressure at the time of press bonding is unevenly applied. Deformation or misalignment of the pattern is likely to occur, resulting in a decrease in lamination accuracy, and also causes structural defects due to peeling, cracks, etc. occurring during firing.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a concave terminal type multilayer ceramic electronic component which can improve the yield by preventing the edge of the concave portion provided with the terminal electrode from being chipped or broken. And

Another object of the present invention is to provide a method of manufacturing a concave terminal type multilayer ceramic electronic component in which a base layer of a terminal electrode can be easily formed to improve productivity.

[0010] In addition, the present invention prevents the formation of a step due to the thickness of the internal electrode and the like, thereby improving the lamination accuracy, and also prevents the occurrence of structural defects such as peeling and cracks during firing. An object of the present invention is to provide a method for manufacturing a ceramic electronic component.

[0011]

According to a first aspect of the present invention, there is provided a method of manufacturing a concave terminal type multilayer ceramic electronic component, wherein an internal electrode is electrically connected by a through-hole conductor, and the internal electrode is connected to the ceramic layer. Are alternately laminated to form a ceramic body, and both ends of the ceramic body are formed in a concave shape, and a terminal electrode electrically connected to an internal electrode and a through-hole conductor is formed in the recess of the ceramic body. A ceramic layer containing a solidified material that decomposes at the time of firing the ceramic body by the volume corresponding to the concave portion of the ceramic body in the same layer is formed, and the ceramic layer is laminated on the outermost layer. To form a ceramic body, and the solidified material is decomposed during firing of the ceramic body to form both ends of the ceramic body in a concave shape.

In the method of manufacturing a concave terminal type multilayer ceramic electronic component according to a second aspect of the present invention, a conductive layer is laminated on an inner layer side by aligning the conductive layer with a solidified material which decomposes when firing a ceramic body. The layer is exposed to the outside of the ceramic body by firing and decomposing the solidified material to form a terminal electrode.

According to a third aspect of the present invention, there is provided a method of manufacturing a concave terminal type multilayer ceramic electronic component, comprising: a base plate movable up and down; an outer frame surrounding the base plate;
A pressing die arranged to be applied to the upper side of the outer frame, and a pressing die for lowering the base plate in the frame of the outer frame, a solidified material that decomposes when firing the ceramic body and a conductive paste that forms a conductive layer. Each time printing is performed on a predetermined surface, the base plate is lowered by a pressing die in the frame of the outer frame in accordance with the thickness of the solidified material and the conductive paste, and the ceramic paste is filled in the frame of the outer frame. After the ceramic paste is dried, the base plate is raised and moved to a flat ceramic layer by pressing the base plate with a pressing die arranged on the upper side of the outer frame, and the solidified material or the conductive layer is flushed in the same layer. A ceramic body having no steps is formed by laminating the ceramic layers including the ceramic layers.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the accompanying drawings, the illustrated embodiment is used for manufacturing a multilayer chip coil among multilayer ceramic electronic components such as a concave terminal type multilayer chip coil and a chip capacitor. Have been applied.
However, the number of layers of the ceramic layers 1a, 1b,... And the number of layers, patterns, connection structures, etc. of the internal electrodes 2a, 2b,..., Through-hole conductors 3a, 3b.

In order to manufacture the multilayer ceramic electronic component, ceramic layers 1a, 1b,... Are formed from a ceramic paste P containing a ceramic powder, an organic binder, a plasticizer, a solvent and the like as a composition, and Pd, Ag, Ni, etc. , Through-hole conductors 3a, 3b, and base layers 4a, 4 of terminal electrodes.
is formed, and the recesses 5a and 5b at both ends of the ceramic body are formed by a solidified material W such as wax or hot melt resin which decomposes when the ceramic body is fired.

As the manufacturing equipment, a base plate 10 which can be moved up and down by a drive cylinder and the like, and an outer frame 11 which surrounds the base plate 10 so as to be able to move up and down are usually provided, and are decomposed at the time of firing the ceramic body. A printing plate 12 of a solidified material, a ceramic paste discharge head 13 by a coater head or the like including a squeegee, a pressing die 14 to be placed on the upper side of the outer frame 11, and a printing plate 15 of a conductive paste by screen printing or the like. When,
A push die 16 for lowering the base plate 10 from the outer frame 11 by a predetermined depth is provided for alternative movement.

Using the equipment, the ceramic layers 1a,
, Internal electrodes 2a, 2b, and through-hole conductors 3a, 3b are sequentially stacked, undercuts 5a, 5b are formed at the ends from the outermost ceramic layers 1a, 1n, and terminal electrodes are formed. The underlayers 4a and 4b
a and 5b are formed on the inner surface. Also,
By this stacking method, the occurrence of a step due to the thickness of the internal electrodes 2a, 2b is prevented, and the through-hole conductors 3a, 3b... Electrically connecting the internal electrodes 2a, 2b. Is being formed.

As a starting step, as shown in FIG. 1, a solidified material W which is decomposed at the time of firing of the ceramic body is formed on the outer frame 11 by a printing plate 12 by a volume corresponding to a concave portion provided at both ends of the ceramic body. Base plate 10 in the frame
Is printed on the plate surface and subjected to natural drying or forced drying.
After the solidified material W is dried, the base plate 10 is lowered from the upper surface of the outer frame 11 in the frame of the outer frame 11 by itself or by the press-in die 16 in accordance with the thickness of the solidified material W.

After the base plate 10 has been lowered, the surface of the base plate 10 is filled with the ceramic paste P from the discharge head 13 in the outer frame 11 as shown in FIG.
The surface is smoothed with a squeegee and subjected to a natural or forced drying treatment. After the ceramic paste is dried, the pressing die 14 is placed on the frame of the outer frame 11 in consideration of the reduction in thickness due to volatilization of the solvent component and the like, and the pace plate 10 is raised to move the ceramic from the pressing die 14. By pressing the layer 1a, the solidified material W is formed as a flat ceramic layer including the same layer in the same layer.

Next, as shown in FIG.
Is printed on the solidified material W contained in the same layer of the ceramic layer 1a by the printing plate making 15 and subjected to a natural or forced drying treatment to thereby convert the base layer 4a of the terminal electrode into a conductive layer having a predetermined pattern. Form as In printing this conductive paste E, the surface of the ceramic layer 1a is positioned flush with the frame surface of the outer frame 11 due to the upward movement of the base plate 10, so the printing plate making 14 is placed on the frame of the outer frame 11. It can be done by placing.

After drying the underlayer 5a, the ceramic layer 1
The base plate 10 is lowered in the frame of the outer frame 11 by an amount corresponding to the thickness of the base layer 4a by pressing the base plate 10a with the pressing die 16. The pressing die 16 used here has teeth 16a, 16b corresponding to the thickness of the base layer 4a, and the ceramic teeth 1a are pushed down together with the internal electrodes 2a in the frame of the outer frame 11 by the teeth 16a, 16b.

On the ceramic layer 1a lowered by the thickness of the underlayer 4a, the ceramic paste P is refilled from the discharge head 13 as shown in FIG. Apply. After the ceramic paste is dried, the base plate 10 is moved upward and pressed with a presser die 12 which is placed on the upper side of the outer frame 11 as described above, so that the base layer 4a of the terminal electrode becomes the same. A flat ceramic layer 1b is formed so as to be flush with the inside of the layer.

Next, as shown in FIG. 5, the conductive paste E is printed on the underlayer 4a by printing plate making 15,
The through-hole conductor 3a is formed into a small projection by performing a natural or forced drying treatment. The printing of the conductive paste E is performed in the same manner as described above, except that the printing plate 15 is
It can be performed by placing it on the frame. After the through-hole conductor 3a is dried, the ceramic layer 1b is pressed by the indenting die 16, and the base plate 10 is lowered within the frame of the outer frame 11 by the protrusion of the through-hole conductor 3a.

Further, as shown in FIG. 6, the ceramic paste P is filled from the discharge head 13, and the surface is leveled with a squeegee. After the drying process, the base plate 10 is moved upward and applied to the upper side of the outer frame 11. By pressing with the presser die 14 arranged, the through-hole conductor 3
a is formed in the same layer to form a flat ceramic layer 1c.

Thereafter, as shown in FIG. 7, the conductive paste E is aligned with the through-hole conductor 3a by printing plate making and printed on the ceramic layer 1c.
The internal electrode 2a is formed in the same manner as the underlayer 4a. After the internal electrode 2a is dried, the ceramic layer 1 is formed in the same manner as described above.
c is pressed by a push-in die, and the base plate is lowered by the thickness of the internal electrode 2a in the outer frame.

Thereafter, as shown in FIG.
Is formed in the same layer to form a flat ceramic layer 1d, and the above-described steps are repeated to form a flat ceramic layer containing the through-hole conductors in the same layer.
Further, a flat ceramic layer including the internal electrodes flush with each other in the same layer is formed in alignment with the through-hole conductor, and as shown in FIG. 1m flat ceramic layer that is flush with
And a flat ceramic layer 1n containing the solidified material W flush in the same layer.

According to the stacking method, a ceramic sheet laminate for forming a plurality of pieces is formed, and the ceramic sheet laminate is divided into parts after pressure bonding. The cutting of each part can be performed using a normal cutting blade, and thereafter, a burnout treatment of an organic binder or the like is performed.
By sintering at 00 ° C., a ceramic laminate of parts can be obtained.

In the ceramic laminate, FIG.
Since the outermost solidified material W is decomposed and erased as a result of firing as shown by, the concave portions 5a and 5b are formed by the ceramic layers 1a and 1n. Further, the decomposition and erasing of the solidified material W exposes the underlying layers 4a and 4b of the terminal electrodes to the outside. By forming a plating film of nickel and a plating film of tin or a tin-lead alloy on the underlayers 4a and 4b, it is possible to manufacture a concave terminal type laminated chip coil in which terminal electrodes are provided in concave portions of the ceramic body.

In this method of manufacturing a concave terminal type laminated chip coil, the yield of the product can be improved by preventing the edge of the concave portion where the terminal electrode is provided from being chipped or cracked, and at the same time, the conductive paste is applied to each part by a roll coater. Instead, since the base layers 4a and 4b of the terminal electrodes are formed in the stacking process, the productivity can be improved from the manufacturing process of the whole component.

In addition to the flat ceramic layers 1a, 1n including the solidified material W in the same layer, the internal electrodes 2a, 2b..., The through-hole conductors 3a, 3b. Are provided on the flat ceramic layers 1b, 1c,..., Even if the pressure bonding is performed on the ceramic sheet laminate, uneven pressure is not applied to all the layers.

Therefore, it is possible to form the ceramic sheet laminate with high precision without causing the pattern deformation and the displacement of the internal electrodes. In addition, a chip-shaped ceramic body having excellent characteristics can be obtained because structural defects are not generated due to peeling, cracks and the like occurring during firing.

[0032]

As described above, according to the method for manufacturing a concave terminal type multilayer ceramic electronic component according to claim 1 of the present invention,
A ceramic layer is formed in which the solidified material that decomposes during firing of the ceramic body is flush with the concave portion of the ceramic body in the same layer by the volume corresponding to the concave portion, and the ceramic layer is laminated on the outermost layer to form the ceramic body. In addition, the solidified material is decomposed at the time of firing the ceramic body to form both ends of the ceramic body in a concave shape, thereby preventing chipping or cracking of the edge of the concave portion where the terminal electrode is provided, thereby improving the product yield. Can be achieved.

According to the method of manufacturing a concave terminal type multilayer ceramic electronic component according to the second aspect of the present invention, the conductive layer is laminated on the inner layer side while being aligned with the solidified material that decomposes when the ceramic body is fired, The conductive layer is exposed to the outside of the ceramic body by baking and decomposing the solidified material to form a terminal electrode, and the terminal electrode is stacked without using a conductive paste applied to each part by a roll coater. Since it is formed inside, the productivity can be increased from the manufacturing process of the whole part.

According to the method of manufacturing a concave terminal type multilayer ceramic electronic component according to the third aspect of the present invention, a solidified material that decomposes when the ceramic body is fired and a conductive paste that forms a conductive layer are respectively applied to predetermined surfaces. Each time printing is performed, the base plate is lowered by a pressing die in the outer frame according to the thickness of the solidified material and the conductive paste, and the ceramic paste is filled in the outer frame, and the ceramic paste is dried. After that, the base plate is raised and pressed by a pressing die placed on the upper side of the outer frame to form a flat ceramic layer, and the solidified material or the conductive layer of the ceramic layer containing the conductive layer is flush with the same layer. By forming a ceramic body with no steps by lamination, the steps due to the thickness of the conductive layer that may cause internal structural defects can be easily eliminated. It can be prepared as to excellent.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a step of forming an outermost solidified material in a method for manufacturing a multilayer ceramic electronic component according to the present invention.

FIG. 2 is an explanatory view showing a step of forming a ceramic layer containing the solidified material flush in the same layer following the step of forming the solidified material of FIG. 1;

FIG. 3 is an explanatory view showing a step of forming a base layer of a terminal electrode subsequent to the step of forming a ceramic layer of FIG. 2;

FIG. 4 is an explanatory view showing a step of forming a ceramic layer including the terminal electrode underlayer in the same layer following the step of forming the terminal electrode underlayer of FIG. 3;

FIG. 5 is an explanatory view showing a step of forming a through-hole conductor following the step of forming the ceramic layer of FIG. 4;

FIG. 6 is an explanatory view showing a step of forming a ceramic layer including the through-hole conductors flush with each other in the same layer following the step of forming the through-hole conductor of FIG. 5;

FIG. 7 is an explanatory view showing a step of forming internal electrodes connected by through-hole conductors subsequent to the step of forming the ceramic layer in FIG. 6;

FIG. 8 is an explanatory view showing a step of forming a ceramic layer including internal electrodes connected by through-hole conductors in the same layer, following the step of forming the ceramic layer in FIG. 7;

FIG. 9 is an explanatory view showing the internal structure of a ceramic body obtained by repeating the steps of FIGS. 1 to 8;

FIG. 10 is an explanatory view showing a multilayer ceramic electronic component manufactured by the method according to the present invention.

[Explanation of symbols]

 P Ceramic paste E Conductive paste W Solidified material 1a, 1b Ceramic layer 2a, 2b Internal electrode 3a, 3b Through hose conductor 4a, 4b Conductive layer (base layer of terminal electrode) 5a, 5b Concave portion 10 Base plate 11 Outer frame 12 Printing plate making of solidified material 13 Discharge head of ceramic paste 14 Holding type 15 Printing plate making of conductive paste 16 Push-in type

Claims (3)

[Claims] An internal electrode is electrically connected by a through-hole conductor, and an internal electrode and a ceramic layer are alternately laminated to form a ceramic body, and both ends of the ceramic body are concavely recessed. In the method of manufacturing a concave terminal type multilayer ceramic electronic component in which a terminal electrode electrically connected to an internal electrode and a through-hole conductor is formed in a concave portion of the ceramic body, a solidified material that decomposes when the ceramic body is fired is formed. A ceramic layer is formed in the same layer by a volume corresponding to the concave portion of the ceramic body, and the ceramic layer is laminated on the outermost layer to form a ceramic body. Wherein the ceramic element is decomposed at the time of firing to form both ends of the ceramic body in a concave shape. 2. A terminal electrode, wherein a conductive layer is laminated on an inner layer side in alignment with a solidified material which decomposes during firing of a ceramic body, and the conductive layer is exposed to the outside of the ceramic body by firing decomposition of the solidified material. The method of manufacturing a concave terminal type multilayer ceramic electronic component according to claim 1, wherein 3. A ceramic, comprising: a base plate capable of moving up and down, an outer frame surrounding the base plate, a presser die disposed on the upper side of the outer frame, and a presser die for lowering the base plate within the frame of the outer frame. Each time a solidified material that decomposes during firing of a body and a conductive paste that forms a conductive layer are printed on a predetermined surface, the base plate is pressed into the outer frame according to the thickness of the solidified material and the conductive paste. While being lowered by the mold, the ceramic paste is filled in the frame of the outer frame, and after the ceramic paste is dried, the base plate is moved upward and pressed by the pressing die placed on the upper side of the outer frame, and the flat ceramic is pressed. A ceramic body having no steps is formed by forming a layer and laminating ceramic layers including the solidified material or the conductive layer in the same layer in the same layer. Concave-terminal multilayer ceramic electronic component manufacturing method according to claim 2, characterized in that the the like.